JPH06249915A - Contact and positioning apparatus of qfp-type ic with ic socket - Google Patents

Abstract

PURPOSE:To provide an apparatus wherein a QFP-type IC is conveyed to, positioned precisely with, and brought into contact with an IC socket. CONSTITUTION:A state that a hand 2 has sucked a QFP-type IC and that the IC has been brought normally into contact with an IC socket 3 is confirmed by a monitor camera 4. A reference subject 6 is imaged by an image processing camera 5A, and it is stored in a memory 7A as first positional data. The QFP- type IC 1 is imaged by an image processing camera 5B, and it is stored in a memory 7B as second positional data. The QFP-type IC 1 is moved onto the image processing camera 5B, third positional data which has been imaged by the image processing camera 5B is compared with the second positional data in the memory 7B, first correctional data is computed, the QFP-type IC 1 is moved onto the IC socket 3, fourth positional data which has been imaged by the image processing camera 5A is compared with the first positional data in the memory 7A, second correctional data is computed, the first correctional data and the second correctional data are compared, and the hand 2 is corrected to a normal position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device for carrying a QFP type IC and bringing it into contact with an IC socket. A machine in which the contact / positioning device of the present invention is incorporated has, for example, an auto handler, an IC socket is connected to an IC tester, and the IC is electrically tested.

[0002]

2. Description of the Related Art Next, the structure of a contact / positioning device according to the prior art will be described with reference to FIG. 1 in FIG. 8 is a QFP type I
C and 3 are IC sockets, 5A and 5B image processing cameras,
9A is an X stage, 9E is a Y stage, 10 is a positioning table, and 12 is a hand.

In FIG. 8, a Y stage 9E is mounted on an X stage 9A, and a motor 2A, a cylinder 10B and an image processing camera 5A are arranged on the Y stage 9E. The table 21 has an IC socket 3 and an image processing camera 5B.
The positioning table 10 is arranged.

The image processing camera 5A is connected to the memory 17A of the image processing unit 17, and the image processing camera 5B is connected to the comparison calculation unit 17B of the image processing unit 17. Image processing unit 1
7 is connected to the device operation control unit 8, and the mechanism operation control unit 8 is connected to the motors 2A, 9C and 9D.

FIG. 9 is a plan view of FIG. In FIG. 9, X
The stage 9A is connected to the ball screw 9F. When the motor 9C coupled to the ball screw 9F rotates, the X stage 9A is guided by the linear guide 9G and moves in the X axis direction.

The Y stage 9E is arranged on the X stage 9A, and the Y stage 9A is connected to the ball screw 9H.
When the motor 9D connected to the ball screw 9H rotates, Y
The stage 9D is guided by the linear guide 9J and moves in the Y-axis direction.

FIG. 10 is an enlarged cross-sectional view of the main part of FIG. In FIG. 10, the hand 12 is attached to the motor 2A,
The hand 12 has a suction pad 2B at its tip, and the suction pad 2B adsorbs or desorbs the QFP type IC1. Motor 2
A is a pulse motor, for example, and rotates the hand 12 by a minute angle θ on the XY plane. The cylinder 11 is, for example, an air cylinder, and the piston rod of the cylinder 11 is connected to the hand 12 to move the hand 12 up and down. Further, the IC socket 3 held on the table 21 is connected to the IC tester 30, and the IC tester 30 uses the IC socket 3
The QFP type IC1 that comes into contact with is electrically tested.

Next, the operation of FIG. 8 will be described. The positioning table 10 shown in FIG. 8 is for positioning the QFP type IC 1 carried by a hand (not shown) before bringing it into contact with the IC socket 3. The positioning table 10 has a structure in which a concave portion slightly larger than the outer shape is formed in conformity with the outer shape of the QFP type IC 1, so that the QFP type IC 1 can be easily inserted. It should be noted that an application similar to the positioning table 10
It is described in the specification of 4-66261.

The image processing camera 5A is for recognizing the image of the IC socket 3 attached to the table 21 from above, and the image processing camera 5B is the QFP type IC 1 attached to the hand 12 as shown in FIG. Is for recognizing the image from below.

FIG. 11 is an enlarged plan view of the IC socket 3 of FIG. The IC socket 3 is, as shown in FIG.
A cylindrical mark 3A is press-fitted on a diagonal line. The mark 3A indicates the positional relationship with the contactor 3B by the image processing camera 5
It is for recognition by A, and the ground color of mark 3A is
The ground color of the IC socket 3 and the image processing camera 5A are changed so that they can be distinguished from each other. The mark 3A can be recognized by the image processing camera 5A, and the center of gravity G of the IC socket 3 can be calculated from the image processing data. The contact 3 of FIG.
B is connected to the IC tester 30 of FIG.

Next, the operation of FIG. 8 will be described with reference to the flowchart of FIG. In step 301, the image processing camera 5A moves onto the IC socket 3, and step 302
Then, mark 3 of IC socket 3 with image processing camera 5A
A is recognized, and the center of gravity G of the IC socket 3 is calculated.

At step 303, the hand 12 is moved onto the positioning table 10, and at step 304, the hand 12 descends to adsorb the QFP IC 1 placed on the positioning table 10. In step 305, the hand 12 is the QFP type I.
In the state where C1 is adsorbed, it moves onto the image processing camera 5B.

In step 306, the image processing camera 5
B images the QFP type IC1, and the center of gravity G of the QFP type IC1
Then, the rotation angle θ of the motor 2A is calculated. Step 30
In step 7, the X stage 9A and the Y stage 9E are moved so that the center of gravity G of the IC socket 3 obtained in step 302 and the center of gravity G of the QFP type IC 1 obtained in step 307 coincide with each other. The hand 12 is rotated until the rotation angles of the QFP type IC 1 match.

In step 308, the hand 12 is lowered by the cylinder 11, the QFP type IC 1 is brought into contact with the IC socket 3, and a series of operations is completed.

Next, the control system of FIG. 8 will be described. In FIG. 8, the video data 5C captured by the image processing camera 5A is sent to the image processing unit 17, the position data of the IC socket 3 is calculated, and the position data is written in the memory 17A. The video data 5D picked up by the image processing camera 5B is sent to the comparison calculation unit 17B, and the position data of the QFP type IC 1 is calculated. The comparison calculation unit 17B reads the position data of the IC socket 3 from the memory 17A, and the QFP type IC
The position data of No. 1 is compared and calculated, and the correction data is sent to the mechanism operation control unit 8.

The drive control unit 8 commands the number of rotations of the motors 2A, 9C, 9D from the correction data. Motor 2A
For example, when a pulse motor is used for 9C and 9D, the number of drive pulses required for correction is given to the motors 2A, 9C, and 9D to determine the XY coordinates and the rotation angle θ of the hand 12.

[0017]

The QFP type IC has a strong tendency to have a large number of pins and a narrow pitch. Therefore Q
When aligning the FP type IC with the IC socket, more precise alignment is required. In the alignment device of FIG. 8, since the mark 3A is driven into the IC socket 3 as shown in FIG. 11, there is a problem that the distance L between the mark 3A and the contact 3B varies depending on the precision of driving the mark 3A. Further, in FIG. 8, the QFP is used by the image processing camera 5B.
Since the QFP type IC1 is moved onto the IC socket 3 after the position correction amount of the type IC1 is obtained, it is necessary to precisely feed the hand in the XY directions.

According to the present invention, the state in which the QFP type IC is adsorbed by the hand and normally contacted with the IC socket is confirmed by the monitor camera, and the reference object is imaged by the first image processing camera in the above state. The first position data is stored in the first memory, the QFP IC is imaged by the second image processing camera in the above state, and the second position data is stored in the second memory. Moving to the second image processing camera, the third position data captured by the second image processing camera is compared with the second position data in the second memory to calculate the first correction data. , QFP type IC was moved to the IC socket, and the fourth image was taken by the first image processing camera.
Position data of the first memory is compared with the first position data of the first memory to calculate the second correction data, and the first correction data and the second correction data are combined so that the hand is in the normal position and the IC socket is in the normal position. It is an object of the present invention to provide a contact / positioning device for an IC socket of a QFP type IC that slightly rotates a hand or corrects a position in the X direction and the Y direction so that the hand comes into contact with the IC socket.

[0019]

In order to achieve this object, according to the present invention, the QFP type IC1 placed on the positioning table 10 is adsorbed by the hand 2 and conveyed to the IC socket 3 to transfer the QFP type IC1 to the IC. QF in contact with socket 3
In the contact / positioning device for electrically testing the P-type IC1, a monitor camera 4 for checking the contact state between the lead of the QFP-type IC1 and the contactor of the IC socket 3, an image processing camera 5A moving with the hand 2, and an image. The reference object 6 imaged by the processing camera 5A and the positioning table 10
The image processing camera 5B, which is arranged between the IC socket 3 and the IC socket 3, and which picks up the holding position of the QFP type IC 1 adsorbed to the hand 2, is connected to the image processing camera 5A, and the QFP type I
The memory 7A for storing the position of the reference subject 6 in a state where the C1 normally contacts the IC socket 3 and the image processing camera 5B are connected to the hand 2 while the QFP type IC1 normally contacts the IC socket 3. Adsorbed QFP type IC1
When the hand 2 moves onto the image processing camera 5B, the comparison operation unit 7C causes the image processing camera 5B to capture an image by the QFP type I.
When the information on the holding state of C1 is input, the information on the holding state is compared with the normal state of the memory 7B, the first correction data is calculated, and when the hand 2 moves onto the IC socket 3,
Information of the reference subject 6 to be imaged by the image processing camera 5A is input to the comparison calculation unit 7C, the information of the reference subject 6 is compared with the holding position of the memory 7A, and the second correction data is calculated and compared. The arithmetic unit 7C synthesizes the first correction data and the second correction data to finely rotate the hand 2 or correct the position of the hand 2 in the X and Y directions.

[0020]

Next, the structure of the contact / positioning device according to the present invention will be described with reference to FIG. 1, 2 is a hand, 4 is a monitor camera, 6 is a reference subject, 7 is an image processing unit, and 9B is Y.
The stage is the same as the stage shown in FIG. Figure 1
Then, the image processing camera 5A is the memory 7 of the image processing unit 7.
It is connected to A and to the comparison operation unit 7C of the image processing unit 7. The image processing camera 5B is a memory 7B of the image processing unit 7.
And the comparison calculation unit 7C of the image processing unit 7.

FIG. 2 is a plan view of FIG. 1 and corresponds to FIG. 9 of the prior art. In FIG. 2, the reference subject 6 is mounted on the table 20, and the reference subject 6 is arranged near the IC socket 3. On the reference subject 6, an identification mark 6C similar to the mark 3A of FIG. 11 is arranged. Also,
The monitor camera 4 is arranged near the IC socket 3 and
The contact state between the lead of the FP type IC 1 and the contactor 3B of the IC socket 3 is confirmed.

FIG. 3 is an enlarged cross-sectional view of an essential part of FIG. 1 and is a view corresponding to FIG. 10 of the prior art. In FIG. 10, the hand 2 and the image processing camera 5A are arranged on the Y stage 9 from the left side of the drawing.
Although it was placed at E, in FIG. 3, from the left side of the figure,
The image processing camera 5A and the hand 2 are arranged on the Y stage 9B.

Next, the operation of the hand 2 will be described with reference to FIG. FIG. 4 is a diagram in which the image processing camera 5B captures an image of the state in which the hand 2 adsorbs the QFP type IC 1. Figure 4
2C is a recognition mark displayed on the lower surface of the hand 2. When the image of FIG. 4 is input from the image processing camera 5B, the image processing unit 7 recognizes the positions of the two marks 2C on the hand 2. Next, the midpoint P0 of the two marks 2C is calculated and used as the center of the hand 2. Find the distance m between the midpoint P0 of the hand 2 and the center P1 of the QFP type IC1, and set the distance m to Q.
It is the correction amount when the FP type IC 1 is brought into contact with the IC socket 3.

Next, the operation according to the present invention will be described with reference to the flow charts of FIGS. FIG. 5 is a flowchart of initial setting of the device according to the present invention, and FIG. 6 is a flowchart when the device according to the present invention is in operation.

In step 101 of FIG. 5, the positioning table 1
The QFP type IC 1 placed at 0 is attracted by the hand 2, and in step 102, the QFP type IC 1 is moved to the hand 2 IC socket 3 while holding the QFP type IC 1. In step 103, the cylinder 11 is driven and the hand 2 is lowered.

In step 104, the monitor camera 4 sets Q
The contact state between the lead of the FP type IC 1 and the contactor 3B of the IC socket 3 is confirmed. In step 105, the QFP type IC
If the lead 1 and the contactor 3B are not aligned in the normal state, the process proceeds to step 106. Step 106
Then raises hand 2 and in step 107 hand 2
Is slightly rotated or moved in the X direction or the Y direction, and returns to the previous stage of step 103.

In step 105, if the lead of the QFP type IC 1 and the contactor 3B are aligned in a normal state, the process proceeds to step 108. In step 108, the image processing camera 5A images the reference subject 6 with the lead and the contactor 3B positioned, and the mark 6 of the reference subject 6 is detected.
The image position of C is stored in the memory 7A.

At step 109, the hand 2 is raised, and at step 110, the QFP type IC 1 is moved onto the image processing camera 5B. In step 111, the QFP type IC for the center of the hand 2 by the image processing camera 5B.
The relative position of the center of 1 is calculated and stored in the memory 7B, and the initial setting is completed.

Next, the procedure during operation will be described with reference to the flowchart of FIG. In step 201 of FIG. 6, the QFP IC 1 placed on the positioning table 10 is sucked by the hand 2. In step 202, the hand 2 moves onto the image processing camera 5B. In step 203, the QFP IC 1 is imaged by the image processing camera 5B, and information on the holding state is input to the comparison calculation unit 7C. Step 204
Then, the comparison calculation unit 7C reads the information of the normal position from the memory 7B, compares it with the information of the holding state,
The correction data of is calculated.

In step 205, the hand 2 moves onto the IC socket 3. In step 206, the image processing camera 5A images the reference subject 6 and inputs the image pickup information to the comparison calculation unit 7C. In step 207, the comparison calculation unit 7C reads the information of the normal position from the memory 7A, compares the information with the imaging information, and calculates the second correction data of the hand 2. In step 208, the comparison operation unit 7C combines the first correction data and the second correction data, and sends the combined correction data to the mechanism operation control unit 8.

In step 209, the mechanism operation control section 8 commands the number of rotations of the motors 2A, 9C and 9D to rotate or move the hand 2. In step 210, hand 2
Down to bring the QFP type IC 1 into contact with the IC socket 3 to end a series of operations.

[0032]

EXAMPLE FIG. 7 is an external view of an example of the X stage 9A and the Y stage 9B. A high resolution pulse motor is used for the motors 2A, 9C and 9D, and the linear guide 9
A dovetail groove type linear guide is used for G-9J.
The cylinder 11 is an air cylinder.

[0033]

According to the present invention, the state in which the QFP IC is adsorbed by the hand and normally contacted with the IC socket is confirmed by the monitor camera, and the reference subject is imaged by the first image processing camera in the above state. Stored in the first memory as the first position data, the QFP IC in the above state is imaged by the second image processing camera, and stored in the second memory as the second position data. The IC is moved onto the second image processing camera, and the third position data captured by the second image processing camera is compared with the second position data in the second memory to obtain the first correction data. The second correction data is calculated by moving the QFP IC to the IC socket and comparing the fourth position data captured by the first image processing camera with the first position data in the first memory. To calculate the first correction data and the second correction data. To synthesize, IC hand is in the normal position
Since the hand is finely rotated or the position is corrected in the X direction and the Y direction so as to come into contact with the socket, the correction accuracy is higher than the position correction of the hand with the identification mark attached to the IC socket. Further, the correction accuracy of the X stage and the Y stage is improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a contact / positioning device according to the present invention.

FIG. 2 is a plan view of FIG.

3 is an enlarged cross-sectional view of a main part of FIG.

FIG. 4 is a diagram illustrating an operation of the hand 2.

FIG. 5 is a flow chart of the initialization of the device according to the invention.

FIG. 6 is a flow chart when the device according to the present invention is in operation.

FIG. 7 is an external view of an X stage 9A / Y stage 9B according to an embodiment.

FIG. 8 is a configuration diagram of a contact / positioning device according to a conventional technique.

9 is a plan view of FIG. 8. FIG.

10 is an enlarged cross-sectional view of a main part of FIG.

11 is an enlarged plan view of the IC socket 3 of FIG.

FIG. 12 is a flowchart illustrating the operation of FIG.

[Explanation of symbols]

 1 QFP type IC 2 hand 2C mark 3 IC socket 4 monitor camera 5A image processing camera 5B image processing camera 6 reference subject 7A memory 7B memory 7C comparison operation unit 10 positioning base

Claims (2)

[Claims] 1. A QFP type IC placed on a positioning table (10)
Adsorb (1) with the hand (2), convey it onto the IC socket (3), bring the QFP type IC (1) into contact with the IC socket (3),
In the contact / positioning device for electrically testing the QFP type IC (1), the monitor camera (4) for checking the contact state between the lead of the QFP type IC (1) and the contact of the IC socket (3), and the hand (2 ) With the first image processing camera (5
A) and a reference subject imaged by the first image processing camera (5A)
A second image processing camera (6), which is arranged between the positioning table (10) and the IC socket (3), and which captures an image of the holding position of the QFP type IC (1) sucked by the hand (2) ( 5B) and the first image processing camera (5A) are connected, and a QFP type IC
Connect the first memory (7A) that stores the position of the reference subject (6) to the second image processing camera (5B) while (1) normally contacts the IC socket (3), and connect the QFP Type IC
Hold hand (1) in normal contact with IC socket (3).
It is equipped with a second memory (7B) that stores the normal holding state of the QFP type IC (1) adsorbed on (2), and the hand (2) moves onto the second image processing camera (5B). Then, the comparison calculation unit (7C) receives the information on the holding state of the QFP type IC (1) imaged by the second image processing camera (5B), and the holding state information is stored in the second memory (7B). ), The first correction data is calculated, and when the hand (2) moves onto the IC socket (3), the comparison operation unit (7C) causes the first image processing camera (5A) to move. The information of the reference subject (6) in
Information is compared with the holding position of the first memory (7A) and the second
Comparing the first correction data and the second correction data, the comparison calculation unit (7C) combines the first correction data and the second correction data to finely rotate the hand (2) or correct the position in the X and Y directions. Characterized by QFP
Contact / positioning device for IC socket of type IC. 2. The hand (2) has an identification mark (2C) diagonally opposed to the bottom surface thereof, and the identification mark (2C) is imaged by a second image processing camera (5B) to obtain the hand (2C). 3. The IC of the QFP type IC according to claim 1, wherein the center of
Contact / positioning device for sockets.