JPH06244462A - Optical fiber module - Google Patents

Abstract

PURPOSE:To facilitate the setting of the conditions of a wiring and workability, and to obtain an optical fiber module having reliability for a prolonged term by making a sectional area on the side, where a pin is projected into a box body, wider than that on the side, where the pin is projected to the outside. CONSTITUTION:A plurality of pins 17 are arranged in two rows while holding a metallic substrate 6. A sectional area on the side, where the pins 17 are projected into a box body 10, is widened. Consequently, the absorption of vibrations in the pins 17 and the vibrations of the pins 17 are prevented even when ultrasonic bonding is used, and wire bonding by ultrasonic bonding can be employed to the pins 17. Since no soldering is conducted, the difficulty of operation due to the connection of wires to the pins having a fine diameter by soldering is eliminated, thus preventing the damage of a component resulting from the difficulty of operation, then improving reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an optical fiber module using a pin package.

[0002]

2. Description of the Related Art FIG. 2 is a partial cross-sectional perspective view showing the structure of a conventional optical fiber module. Conventionally, various devices for optically coupling a light emitting element or a light receiving element with an optical fiber have been proposed. Practical application has been achieved, and as a typical example of a conventional coupling device of a light emitting element and an optical fiber,
There is an optical fiber module using a pin package as shown in FIG.

In the figure, 1 is a laser diode (L
D) and other light emitting elements, 2 is a heat sink that radiates heat generated by the light emitting element 1, and 3 is an LD header in which the light emitting element 1 and the heat sink 2 are bonded. Reference numeral 4 is a light receiving element for monitoring, and 5 is a thermistor resistance (hereinafter referred to as a thermistor) for temperature detection.

Reference numeral 6 is a metal substrate on which the LD header 3, the light receiving element 4 and the thermistor 5 are attached.
The D header 3 is fixed by solder in order to improve heat dissipation. An electronic cooling element 7 cools heat generated from the light emitting element 1, and is fixed to the metal substrate 6 by soldering.

Reference numeral 8 denotes a lens holder, and 9 denotes a lens which is attached to the lens holder 8 by soldering, press fitting, or the like, and focuses the light from the light emitting element 1. After adjusting the optical axes of the light emitting element 1 and the lens 9, The lens holder 9 is welded and fixed to the metal substrate 6 with a YAG laser or the like. 10 is an electronic cooling element 7 inside
Is a case that is attached by soldering and houses and protects the light emitting element 1, the light receiving element 4, the lens 9, and the like.

Reference numeral 11 denotes a rod-shaped pin which penetrates the casing 10 from the outside to the inside. FIG. 3 shows a conventional pin 10 and a light emitting element 1.
FIG. 2 is a partial cross-sectional perspective view of an optical fiber module showing a connection state of each component such as LD header 3, light receiving element 4, thermistor 5, thermoelectric cooling element 7, the pin 11 and the gold-plated wire 1.
Wired at 2. Here, this gold-plated wire 12 and pin 1
To connect with 1, wrap the gold-plated wire 12 around the pin 11,
This is done by soldering.

Reference numeral 13 is an optical fiber, 14 is a ferrule for fixing the optical fiber, and 15 is a housing 10 and a ferrule 1.
After adjusting the optical axis of each of the metal sleeves for holding No. 4, they are welded and fixed by a YAG laser or the like. A rubber hood 16 protects the ferrule 14 and the optical fiber 13.
The conventional optical fiber module is configured as described above, and the light from the light emitting element 1 is condensed by the lens 9, and the condensed light is applied to the optical fiber 13 to be optically coupled, and the optical fiber 13 is connected. Is transmitted.

[0008]

However, in the above-mentioned conventional optical fiber module, the diameter of the pin 11 projecting inside the housing 10 for wiring with the outside is as shown in FIG. 3 (b). Since it is generally as thin as φ0.45mm, each part such as LD header 3, light receiving element 4 and pin 1
In the wiring by the gold-plated wire 12 between 1 and 1, the connection between the gold-plated wire 12 and the pin 11 must be performed by winding the gold-plated wire 12 around the pin 11 and soldering it.
The temperature condition is unstable because soldering is done for each pin, and the workability is poor because a gold-plated wire is wound around the pins. In this way, due to the unstable temperature condition and poor workability, each component However, there is a problem that it is unreliable.

Further, since each component and the gold-plated wire are also fixed by soldering, it is necessary to consider the corrosion of the conductor pattern due to the gold metallization forming the terminals of each component, which makes it difficult to set the conditions such as temperature. However, there is a problem in that the wiring time is long in combination with the poor workability, and that many parts depend on the skill of the worker to maintain reliability. The present invention has been made to solve such a problem, and an object of the present invention is to provide an optical fiber module which facilitates setting of wiring conditions and workability and has long-term reliability.

[0010]

In order to achieve this object, the present invention provides a housing for accommodating and protecting a light emitting element, a light receiving element, and other parts, and a penetrating from the outside of the housing to the inside. An optical fiber module provided with a rod-shaped pin that is electrically connected to a light emitting element, a light receiving element, and other electronic parts on the inner side of the housing through a lead wire. The cross-sectional area on the side projecting to the outside is made wider than the cross-sectional area on the side projecting to the outside.

[0011]

In the present invention having the above-mentioned structure, the electrical connection between the pins such as the light emitting element and the light receiving element and the pin is performed by wire bonding by ultrasonic bonding.
By widening the cross-sectional area of the side of the pin projecting inside the housing, it is possible to prevent the pin from vibrating due to ultrasonic bonding.

[0012]

Embodiments will be described below with reference to the drawings. FIG. 1 is a partial cross-sectional perspective view showing the structure of an optical fiber module according to an embodiment of the present invention. Reference numeral 1 is a light emitting element such as a laser diode (LD), 2 is a heat sink that radiates heat generated by the light emitting element 1, 3 is an LD header to which the light emitting element 1 and the heat sink 2 are bonded, and 4 is a light receiving element for monitoring.

Reference numeral 6 designates a LD header 3 and a light receiving element 4, which is not shown here, but is a metal substrate to which the thermistor described in the prior art FIG. 2 is attached. The metal substrate 6 and the LD header 3 improve heat dissipation. It is fixed by solder. 7
Is an electronic cooling element that cools the heat generated from the light emitting element 1, and is fixed to the metal substrate 6 by soldering.

Reference numeral 10 denotes a housing in which the electronic cooling element 7 is mounted by soldering and which houses and protects the light emitting element 1, the light receiving element 4 and a lens (not shown). Reference numeral 17 denotes a rod-shaped pin that penetrates from the outside of the housing 10 to the inside thereof, and a plurality of pins 17 are arranged in two rows with the metal substrate 6 interposed therebetween. The diameter of the pin 17 on the side protruding inside the housing 10 is larger than that on the side protruding outside,
As shown in FIG. 1B, the pin 17 has a step in the middle, and the cross-sectional area on the side projecting inside the housing 10 is wide. The diameter of the pin 17 on the side projecting inside the housing 10 is, for example, about .phi.0.8 mm, and the diameter on the side projecting to the outside is about .phi.0.45 mm as before. In addition,
In FIG. 1, with respect to the pin 17 arranged on the front side of the metal board 6, although the illustration of the part on the side projecting inside the housing 10 is omitted, it is arranged on the other side of the metal board 6. A pin having the same structure as the existing pin 17 is arranged.

The electrical connection between the pin 17 and the LD header 3, the light receiving element 4, the thermistor (not shown) and the electronic cooling element 7 forms the terminals of the LD header 3, the light receiving element 4, the thermistor and the electronic cooling element 7. The conductive pattern such as each gold metallized pattern or gold plated pattern and the head of the pin 17 on the side projecting inside the housing 10 are connected by wire bonding by ultrasonic bonding using a gold wire 18, for example. There is.

Here, as described above, by widening the cross-sectional area of the side of the pin 17 projecting inside the housing 10, the pin 17 absorbs vibration and vibrates even if ultrasonic bonding is used. Pin 17
On the other hand, wire bonding by ultrasonic bonding can be used. Although not shown in the present embodiment, the optical fiber module of the present embodiment described above is also provided with a lens or a lens holder for focusing the light from the light emitting element 1 as described in the related art FIG. Further, the optical fiber is connected by using a ferrule or a sleeve.

[0017]

As described above, according to the present invention, the casing of the optical fiber module is penetrated in order to electrically connect the components such as the light emitting element and the light receiving element in the casing to the external equipment. The cross-sectional area of the side of the pin provided on the side projecting inside the housing is widened.

As described above, by widening the cross-sectional area of the side of the pin projecting inside the housing, the pin does not absorb ultrasonic waves and vibrate. Wire bonding can be performed by using. In addition, since soldering is not performed, the work difficulty caused by connecting the wire to the pin with a small diameter by soldering is eliminated, and damage to the parts due to the work difficulty is prevented and reliability is improved. In addition to the effect that the temperature can be increased, the temperature condition is stabilized, and thus, damage to the parts can be prevented, and the reliability can be improved.

Furthermore, it is no longer necessary to set difficult conditions associated with soldering, such as setting a temperature for preventing damage to each part and setting a temperature for not corroding the conductor pattern of each part. Is also eliminated, so that there is an effect that the wiring time can be shortened, and that the work is easy and the reliability can be maintained regardless of the skill of the operator.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional perspective view showing the structure of an optical fiber module according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional perspective view showing the structure of a conventional optical fiber module.

FIG. 3 is a partial cross-sectional perspective view of an optical fiber module showing a connection state between a conventional pin and each component.

[Explanation of symbols]

 1 Light emitting element 10 Housing 17 pins

Claims (1)

[Claims] 1. A housing for accommodating and protecting a light emitting element, a light receiving element and other electronic components inside, and a light emitting element provided inside the housing so as to penetrate therethrough from the outside of the housing, In an optical fiber module including a rod-shaped pin that is electrically connected to a light receiving element or other electronic component via a conductive wire, a cross-sectional area of the side of the pin projecting inside the housing is projected outside. The optical fiber module is characterized in that it is wider than the cross-sectional area on the side where it is located.