JPH06239440A - Substrate conveyer device - Google Patents
Substrate conveyer deviceInfo
- Publication number
- JPH06239440A JPH06239440A JP5521493A JP5521493A JPH06239440A JP H06239440 A JPH06239440 A JP H06239440A JP 5521493 A JP5521493 A JP 5521493A JP 5521493 A JP5521493 A JP 5521493A JP H06239440 A JPH06239440 A JP H06239440A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- speed
- substrate transfer
- transfer mechanism
- substrate conveyor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Conveyors (AREA)
- Intermediate Stations On Conveyors (AREA)
- Controlling Sheets Or Webs (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体ウエハや液晶用
のガラス基板やフォトマスク用のガラス基板やサーマル
ヘッド製造用のセラミック基板、プリント基板、カラー
フィルタ用の基板といった各種の基板を、洗浄、フォト
レジスト液などの塗布液の塗布、露光、現像、エッチン
グといった各種の表面処理工程に搬送するために、基板
を搬送する第１の基板搬送機構と、その第１の基板搬送
機構から基板を受け取って後工程に搬送する第２の基板
搬送機構とを設けた基板搬送装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention cleans various substrates such as glass substrates for semiconductor wafers and liquid crystals, glass substrates for photomasks, ceramic substrates for manufacturing thermal heads, printed circuit boards, and substrates for color filters. A first substrate transfer mechanism for transferring a substrate for transferring to various surface treatment processes such as coating of a coating liquid such as photoresist liquid, exposure, development, and etching, and a substrate from the first substrate transfer mechanism. The present invention relates to a substrate transfer device provided with a second substrate transfer mechanism which receives and transfers to a subsequent process.
【０００２】[0002]
【従来の技術】上述のような基板搬送装置では、従来、
各基板搬送機構ごとに電動モータなどの駆動機構と、そ
の駆動速度を調整する変速手段とを備え、適用対象に応
じ、各基板搬送機構の搬送速度を調整して同期させるよ
うに構成している。2. Description of the Related Art In the substrate transfer apparatus as described above,
Each substrate transfer mechanism is provided with a drive mechanism such as an electric motor and a speed changer for adjusting the drive speed, and the transfer speed of each substrate transfer mechanism is adjusted and synchronized according to the application target. .
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、基板搬
送機構間で電動モータの仕様が異なったり、伝動効率に
違いがあるような場合、実際の搬送速度を確認しながら
調整するといったように試行錯誤的な調整を行わなけれ
ばならず、速度調整に多大な手間と労力とを必要とする
欠点があった。However, when the specifications of the electric motors differ between the substrate transfer mechanisms or the transmission efficiencies differ, trial and error such as adjusting while confirming the actual transfer speed is carried out. However, there is a drawback in that the speed adjustment requires a great deal of time and labor.
【０００４】本発明は、このような事情に鑑みてなされ
たものであって、複数の基板搬送機構間で同期させるた
めの調整を容易に行うことができる基板搬送装置を提供
することを目的とする。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a substrate transfer apparatus capable of easily performing adjustment for synchronizing a plurality of substrate transfer mechanisms. To do.
【０００５】[0005]
【課題を解決するための手段】本発明は、上述のような
目的を達成するために、基板を搬送する第１の基板搬送
機構と、その第１の基板搬送機構から基板を受け取って
後工程に搬送する第２の基板搬送機構とを設けた基板搬
送装置において、第１の基板搬送機構の基板の搬送速度
を検知する第１の速度センサと、第２の基板搬送機構の
基板の搬送速度を検知する第２の速度センサと、第２の
基板搬送機構の基板の搬送速度を変更する変速手段と、
第１および第２の速度センサそれぞれで検知した搬送速
度に基づいて、第２の基板搬送機構の搬送速度を第１の
基板搬送機構の搬送速度に一致させるように変速手段を
制御する変速制御手段とを備えて構成する。In order to achieve the above-mentioned object, the present invention provides a first substrate transfer mechanism for transferring a substrate and a post-process for receiving the substrate from the first substrate transfer mechanism. In a substrate transfer device provided with a second substrate transfer mechanism for transferring to a substrate, a first speed sensor for detecting a transfer speed of the substrate of the first substrate transfer mechanism and a transfer speed of the substrate of the second substrate transfer mechanism. A second speed sensor for detecting the speed, and a speed change means for changing the speed at which the substrate is transferred by the second substrate transfer mechanism,
A shift control means for controlling the shift means so that the transport speed of the second substrate transport mechanism matches the transport speed of the first substrate transport mechanism based on the transport speeds detected by the first and second speed sensors, respectively. And is configured.
【０００６】[0006]
【作用】本発明の基板搬送装置の構成によれば、基板の
搬送方向で上流側となる第１の基板搬送機構において、
その基板の搬送速度を適用対象に応じた最適の速度に設
定することにより、下流側の第２の基板搬送機構の基板
の搬送速度を変速制御手段によって自動的に制御し、第
１の基板搬送機構に同期させることができる。According to the structure of the substrate transfer apparatus of the present invention, in the first substrate transfer mechanism located upstream in the substrate transfer direction,
By setting the transfer speed of the substrate to the optimum speed according to the application target, the transfer speed of the substrate of the second substrate transfer mechanism on the downstream side is automatically controlled by the shift control means to transfer the first substrate. It can be synchronized with the mechanism.
【０００７】[0007]
【実施例】次に、本発明の実施例を図面を用いて詳細に
説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【０００８】図１は、本発明に係る第１実施例の基板搬
送装置の概略斜視図であり、基板Ｗを搬送する第１の基
板搬送機構１と、その第１の基板搬送機構１から基板Ｗ
を受け取って後工程に搬送する第２の基板搬送機構２と
が設けられて基板搬送装置が構成されている。FIG. 1 is a schematic perspective view of a substrate transfer apparatus according to a first embodiment of the present invention, which includes a first substrate transfer mechanism 1 for transferring a substrate W and the first substrate transfer mechanism 1 to the substrate. W
The second substrate transfer mechanism 2 for receiving and transferring the second process to the subsequent process is provided to configure a substrate transfer device.
【０００９】第１の基板搬送機構１は、第１の主動プー
リー３と第１の従動プーリー４とにわたって二本の細幅
ベルト５を巻回するとともに、第１の主動プーリー３に
第１のベルト式伝動機構６を介して第１の電動モータ７
を連動連結して構成されている。The first substrate transfer mechanism 1 winds the two narrow belts 5 around the first driving pulley 3 and the first driven pulley 4, and at the same time, the first driving pulley 3 has the first narrow belt 5. The first electric motor 7 via the belt type transmission mechanism 6
It is configured by interlocking and connecting.
【００１０】第１の従動プーリー４のプーリー軸４ａに
第１の歯車８が一体回転可能に取り付けられ、その第１
の歯車８の歯部を挟んで、第１の投光器９と第１の受光
器１０とが設けられ、歯部を通じて光が第１の受光器１
０に入射されるに伴ってパルス信号を出力させ、そのパ
ルス数を計測して単位時間当りのパルス数からその回転
速度、すなわち、第１の基板搬送機構１の基板Ｗの搬送
速度を検知するように第１の速度センサ１１が構成され
ている。A first gear 8 is attached to a pulley shaft 4a of a first driven pulley 4 so as to be integrally rotatable.
A first light projector 9 and a first light receiver 10 are provided with a tooth portion of the gear 8 of the first light receiver 1 interposed therebetween, and light is transmitted through the tooth portion to the first light receiver 1
A pulse signal is output as it is incident on 0, the number of pulses is measured, and the rotation speed thereof, that is, the transfer speed of the substrate W of the first substrate transfer mechanism 1 is detected from the number of pulses per unit time. Thus, the first speed sensor 11 is configured.
【００１１】第２の基板搬送機構２も、第１の基板搬送
機構１と同様に、第２の主動プーリー１２と第２の従動
プーリー１３とにわたって二本の細幅ベルト１４を巻回
するとともに、第２の主動プーリー１２に第２のベルト
式伝動機構１５を介して第２の電動モータ１６を連動連
結して構成されている。この第２の電動モータ１６は、
サーボモータで構成され、印加する電圧を変えることに
より、その回転速度、すなわち、第２の基板搬送機構２
の搬送速度を調整する変速手段が備えられている。Similarly to the first substrate transport mechanism 1, the second substrate transport mechanism 2 also winds two narrow belts 14 around the second main drive pulley 12 and the second driven pulley 13. A second electric motor 16 is interlockingly connected to the second driving pulley 12 via a second belt type transmission mechanism 15. The second electric motor 16 is
It is composed of a servomotor, and its rotational speed, that is, the second substrate transfer mechanism 2 is changed by changing the applied voltage.
Is provided with a speed changing means for adjusting the transport speed.
【００１２】第２の従動プーリー１３のプーリー軸１３
ａに第２の歯車１７が一体回転可能に取り付けられ、そ
の第２の歯車１７の歯部を挟んで、第２の投光器１８と
第２の受光器１９とが設けられ、歯部を通じて光が第２
の受光器１９に入射されるに伴ってパルス信号を出力さ
せ、そのパルス数を計測して単位時間当りのパルス数か
らその回転速度、すなわち、第２の基板搬送機構２の基
板Ｗの搬送速度を検知するように第２の速度センサ２０
が構成されている。The pulley shaft 13 of the second driven pulley 13
The second gear 17 is attached to a so as to be integrally rotatable, and the second light emitter 18 and the second light receiver 19 are provided with the tooth portion of the second gear 17 interposed therebetween, and light is emitted through the tooth portion. Second
A pulse signal is output as it is incident on the photodetector 19, and the number of pulses is measured, and the rotation speed is determined from the number of pulses per unit time, that is, the transfer speed of the substrate W of the second substrate transfer mechanism 2. Second speed sensor 20 to detect
Is configured.
【００１３】第１および第２の速度センサ１１，２０そ
れぞれを構成する第１および第２のカウンタ２１，２２
が、図２のブロック図に示すように、変速制御手段とし
てのＣＰＵ２３に接続されるとともに、そのＣＰＵ２３
が第２の電動モータ１６に接続され、第２の基板搬送機
構２の基板Ｗの搬送速度を第１の基板搬送機構１の基板
Ｗの搬送速度に同期するように構成されている。First and second counters 21 and 22 constituting the first and second speed sensors 11 and 20, respectively.
2 is connected to the CPU 23 as the shift control means as shown in the block diagram of FIG.
Is connected to the second electric motor 16 and is configured to synchronize the transfer speed of the substrate W of the second substrate transfer mechanism 2 with the transfer speed of the substrate W of the first substrate transfer mechanism 1.
【００１４】次に、ＣＰＵ２３の動作につき、図３のフ
ローチャートを用いて説明する。先ず、第１および第２
のカウンタ２１，２２の単位時間当りでカウントしたパ
ルス数ＣA ，ＣB を読み取る（Ｓ１）。Next, the operation of the CPU 23 will be described with reference to the flowchart of FIG. First, the first and second
The pulse numbers C A and C B counted per unit time by the counters 21 and 22 are read (S1).
【００１５】次いで、第１および第２のカウンタ２１，
２２をリセットして（Ｓ２）から、両パルス数ＣA ，Ｃ
B を式ＣX ＝ＣA −α・ＣB に代入して第１および第２
の基板搬送機構１，２の速度差を演算する（Ｓ３）。こ
こで、αは補正係数であり、第１および第２の基板搬送
機構１，２の第１および第２の主動プーリー３，１２、
ならびに、第１および第２の従動プーリー４，１３の径
比に応じて１パルスに対応する速度の差を補正するため
の係数である。第１および第２の基板搬送機構１，２が
同じであれば、α＝１である。Then, the first and second counters 21,
After resetting 22 (S2), both pulse numbers C A , C
Substituting B into the formula C X = C A −α · C B , the first and second
The speed difference between the substrate transfer mechanisms 1 and 2 is calculated (S3). Here, α is a correction coefficient, and the first and second drive pulleys 3, 12 of the first and second substrate transfer mechanisms 1 and 2,
Also, it is a coefficient for correcting the difference in speed corresponding to one pulse according to the diameter ratio of the first and second driven pulleys 4 and 13. If the first and second substrate transfer mechanisms 1 and 2 are the same, α = 1.
【００１６】その後、上記速度差ＣX を式ＶB ＝ＶB ＋
β・ＣX に代入し、第２の電動モータ１６に出力する指
令電圧値ＶB を演算し、求めた電圧を第２の電圧１６に
出力して、第２の基板搬送機構２の基板Ｗの搬送速度を
第１の基板搬送機構１の基板Ｗの搬送速度に同期させ
る。ここで、βは補正係数であり、パルス数を電圧に換
算するためのものである。Thereafter, the speed difference C X is calculated by the formula V B = V B +
Substituting into β · C X , the command voltage value V B to be output to the second electric motor 16 is calculated, the obtained voltage is output to the second voltage 16, and the substrate W of the second substrate transfer mechanism 2 is output. Is synchronized with the transport speed of the substrate W of the first substrate transport mechanism 1. Here, β is a correction coefficient for converting the number of pulses into a voltage.
【００１７】以上の構成により、第１の基板搬送機構１
の基板Ｗの搬送速度を適切に調整しさえすれば、第２の
基板搬送機構２の基板Ｗの搬送速度を自ずと一致させる
ことができる。第３および第４の基板搬送機構といった
ように多数の基板搬送機構が設けられる場合も同様であ
る。With the above configuration, the first substrate transfer mechanism 1
If the transfer speed of the substrate W is appropriately adjusted, the transfer speed of the substrate W of the second substrate transfer mechanism 2 can be naturally matched. The same applies when a large number of substrate transfer mechanisms such as the third and fourth substrate transfer mechanisms are provided.
【００１８】図４は、本発明に係る第２実施例の基板搬
送装置の概略側面図であり、第１実施例と異なるところ
は、次の通りである。すなわち、第１および第２の基板
搬送機構１，２に対し、割プーリー式の摩擦伝動による
第１および第２の無段変速機構２４，２５を介して１個
の電動モータ２６を連動連結し、第１および第２の基板
搬送機構１，２の速度差を変速制御手段としての差動増
幅器２７で求め、速度差に応じて第２の無段変速機構２
５に制御信号を出力して変速制御し、第２の基板搬送機
構２の基板Ｗの搬送速度を第１の基板搬送機構１の基板
Ｗの搬送速度に自ずと一致させるようになっている。他
の構成は第１実施例と同じであり、同一番号を付すこと
により、その説明は省略する。第２の無段変速機構２５
が、特許請求の範囲でいうところの変速手段に相当す
る。FIG. 4 is a schematic side view of a substrate transfer apparatus according to the second embodiment of the present invention. The differences from the first embodiment are as follows. That is, one electric motor 26 is interlockingly connected to the first and second substrate transfer mechanisms 1 and 2 via the first and second continuously variable transmission mechanisms 24 and 25 by split pulley type friction transmission. , The speed difference between the first and second substrate transfer mechanisms 1 and 2 is obtained by the differential amplifier 27 as the speed change control means, and the second continuously variable speed change mechanism 2 is obtained according to the speed difference.
A control signal is output to 5 for gear shift control so that the transfer speed of the substrate W of the second substrate transfer mechanism 2 naturally matches the transfer speed of the substrate W of the first substrate transfer mechanism 1. The other structure is the same as that of the first embodiment, and the description thereof is omitted by giving the same reference numerals. Second continuously variable transmission 25
Corresponds to the transmission means in the claims.
【００１９】本発明としては、第１および第２の基板搬
送機構１，２としてローラーコンベアを使用する場合に
も適用できる。The present invention can also be applied to the case where roller conveyors are used as the first and second substrate transfer mechanisms 1 and 2.
【００２０】[0020]
【発明の効果】以上の説明から明らかなように、本発明
の基板搬送装置によれば、基板の搬送方向で上流側とな
る第１の基板搬送機構の搬送速度を設定するだけで、下
流側の第２の基板搬送機構の基板の搬送速度を第１の基
板搬送機構に同期させることができるから、各基板搬送
機構における仕様や伝動効率の違いとか、基板搬送機構
の個数のいかんにかかわらず、第１の基板搬送機構に対
して速度調整をするだけで済み、複数の基板搬送機構間
で同期させるための調整を容易に行うことができる。ま
た、各基板搬送機構における仕様や伝動効率に何ら影響
されずに同期のための調整を容易に行えるから、各基板
搬送機構において、電動モータや伝動機構などに最適な
ものを採用でき、基板搬送装置全体として好適なものを
容易に構成できる。As is apparent from the above description, according to the substrate transfer apparatus of the present invention, it is possible to set the transfer speed of the first substrate transfer mechanism, which is the upstream side in the transfer direction of the substrate, to the downstream side. Since the substrate transfer speed of the second substrate transfer mechanism can be synchronized with that of the first substrate transfer mechanism, regardless of the difference in specifications and transmission efficiency of each substrate transfer mechanism or the number of substrate transfer mechanisms. Therefore, it is only necessary to adjust the speed of the first substrate transfer mechanism, and the adjustment for synchronizing the plurality of substrate transfer mechanisms can be easily performed. Also, because adjustments for synchronization can be easily made without being affected by the specifications and transmission efficiency of each substrate transfer mechanism, it is possible to adopt the most suitable one for each electric motor or transmission mechanism in each substrate transfer mechanism. A suitable device as a whole can be easily constructed.
【図１】本発明に係る第１実施例の基板搬送装置の概略
斜視図である。FIG. 1 is a schematic perspective view of a substrate transfer device according to a first embodiment of the present invention.
【図２】ブロック図である。FIG. 2 is a block diagram.
【図３】フローチャートである。FIG. 3 is a flowchart.
【図４】第２実施例の基板搬送装置の概略側面図であ
る。FIG. 4 is a schematic side view of a substrate transfer device according to a second embodiment.
１…第１の基板搬送機構 ２…第２の基板搬送機構 １１…第１の速度センサ ２０…第２の速度センサ ２３…変速制御手段としてのＣＰＵ ２５…第２の無段変速機構 ２７…変速制御手段としての差動増幅器 Ｗ…基板 DESCRIPTION OF SYMBOLS 1 ... 1st board | substrate conveyance mechanism 2 ... 2nd board | substrate conveyance mechanism 11 ... 1st speed sensor 20 ... 2nd speed sensor 23 ... CPU as a shift control means 25 ... 2nd continuously variable transmission mechanism 27 ... Gear shift Differential amplifier as control means W ... Substrate
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/68 Ａ 8418−4Ｍ Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 21/68 A 8418-4M
Claims (1)
その第１の基板搬送機構から基板を受け取って後工程に
搬送する第２の基板搬送機構とを設けた基板搬送装置に
おいて、 前記第１の基板搬送機構の基板の搬送速度を検知する第
１の速度センサと、 前記第２の基板搬送機構の基板の搬送速度を検知する第
２の速度センサと、 前記第２の基板搬送機構の基板の搬送速度を変更する変
速手段と、 前記第１および第２の速度センサそれぞれで検知した搬
送速度に基づいて、前記第２の基板搬送機構の搬送速度
を前記第１の基板搬送機構の搬送速度に一致させるよう
に前記変速手段を制御する変速制御手段と、 を備えたことを特徴とする基板搬送装置。1. A first substrate transfer mechanism for transferring a substrate,
In a substrate transfer device provided with a second substrate transfer mechanism that receives a substrate from the first substrate transfer mechanism and transfers it to a subsequent process, a first substrate transfer mechanism for detecting the substrate transfer speed of the first substrate transfer mechanism is provided. A speed sensor; a second speed sensor for detecting a transfer speed of the substrate of the second substrate transfer mechanism; a speed change means for changing the transfer speed of the substrate of the second substrate transfer mechanism; Shift control means for controlling the shift means so that the transport speed of the second substrate transport mechanism matches the transport speed of the first substrate transport mechanism based on the transport speed detected by each of the two speed sensors. A substrate transfer device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5521493A JPH06239440A (en) | 1993-02-18 | 1993-02-18 | Substrate conveyer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5521493A JPH06239440A (en) | 1993-02-18 | 1993-02-18 | Substrate conveyer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06239440A true JPH06239440A (en) | 1994-08-30 |
Family
ID=12992377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5521493A Pending JPH06239440A (en) | 1993-02-18 | 1993-02-18 | Substrate conveyer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06239440A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190821A (en) * | 1997-09-17 | 1999-04-06 | Nissanki:Kk | Machining burr removing device for steel product |
| JPH11301842A (en) * | 1998-04-22 | 1999-11-02 | Toyo Kanetsu Kk | In-loading conveyer |
| JP2001219909A (en) * | 2000-02-09 | 2001-08-14 | Yamada Kikai Kogyo Co Ltd | Carry-put conveyer of bundler |
| JP2005119791A (en) * | 2003-10-16 | 2005-05-12 | Toshiba Corp | Paper sheet conveying device |
| JP2005125241A (en) * | 2003-10-24 | 2005-05-19 | Hitachi Industries Co Ltd | Coating apparatus |
| WO2010135077A3 (en) * | 2009-05-20 | 2011-01-13 | Kla-Tencor Corporation | Solar cell transport |
| CN105712058A (en) * | 2014-12-02 | 2016-06-29 | 大族激光科技产业集团股份有限公司 | PCB conveying belt control system and control method thereof |
| CN110963258A (en) * | 2018-09-30 | 2020-04-07 | 北新集团建材股份有限公司 | Gypsum board conveying system |
| JP2022025602A (en) * | 2020-07-29 | 2022-02-10 | 株式会社アルバック | Conveyance driving mechanism |
| CN117316830A (en) * | 2023-11-28 | 2023-12-29 | 成都高投芯未半导体有限公司 | Semiconductor packaging system and control method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711123B2 (en) * | 1974-06-12 | 1982-03-02 | ||
| JPH0275514A (en) * | 1988-09-08 | 1990-03-15 | Sanyo Electric Co Ltd | Transfer system |
-
1993
- 1993-02-18 JP JP5521493A patent/JPH06239440A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711123B2 (en) * | 1974-06-12 | 1982-03-02 | ||
| JPH0275514A (en) * | 1988-09-08 | 1990-03-15 | Sanyo Electric Co Ltd | Transfer system |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190821A (en) * | 1997-09-17 | 1999-04-06 | Nissanki:Kk | Machining burr removing device for steel product |
| JPH11301842A (en) * | 1998-04-22 | 1999-11-02 | Toyo Kanetsu Kk | In-loading conveyer |
| JP2001219909A (en) * | 2000-02-09 | 2001-08-14 | Yamada Kikai Kogyo Co Ltd | Carry-put conveyer of bundler |
| JP2005119791A (en) * | 2003-10-16 | 2005-05-12 | Toshiba Corp | Paper sheet conveying device |
| JP2005125241A (en) * | 2003-10-24 | 2005-05-19 | Hitachi Industries Co Ltd | Coating apparatus |
| WO2010135077A3 (en) * | 2009-05-20 | 2011-01-13 | Kla-Tencor Corporation | Solar cell transport |
| US8286785B2 (en) | 2009-05-20 | 2012-10-16 | Kla-Tencor Corporation | Solar cell transport |
| US8430234B2 (en) | 2009-05-20 | 2013-04-30 | Kla-Tencor Corporation | Solar cell transport |
| CN105712058A (en) * | 2014-12-02 | 2016-06-29 | 大族激光科技产业集团股份有限公司 | PCB conveying belt control system and control method thereof |
| CN110963258A (en) * | 2018-09-30 | 2020-04-07 | 北新集团建材股份有限公司 | Gypsum board conveying system |
| CN110963258B (en) * | 2018-09-30 | 2021-12-03 | 北新集团建材股份有限公司 | Gypsum board conveying system |
| JP2022025602A (en) * | 2020-07-29 | 2022-02-10 | 株式会社アルバック | Conveyance driving mechanism |
| CN117316830A (en) * | 2023-11-28 | 2023-12-29 | 成都高投芯未半导体有限公司 | Semiconductor packaging system and control method |
| CN117316830B (en) * | 2023-11-28 | 2024-02-02 | 成都高投芯未半导体有限公司 | Semiconductor packaging system and control method |
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