JPH0623577A - Detector for converged position of converging optical system in laser beam machine - Google Patents

Detector for converged position of converging optical system in laser beam machine

Info

Publication number
JPH0623577A
JPH0623577A JP4183690A JP18369092A JPH0623577A JP H0623577 A JPH0623577 A JP H0623577A JP 4183690 A JP4183690 A JP 4183690A JP 18369092 A JP18369092 A JP 18369092A JP H0623577 A JPH0623577 A JP H0623577A
Authority
JP
Japan
Prior art keywords
laser beam
optical system
position sensor
laser
condensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4183690A
Other languages
Japanese (ja)
Inventor
Shigeru Kosugi
茂 小杉
Kunio Arai
邦夫 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP4183690A priority Critical patent/JPH0623577A/en
Publication of JPH0623577A publication Critical patent/JPH0623577A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To automatically measure a converged position by detecting the output of a photodetector composing a positional sensor and discriminating the converged position to calculate the deviation of a converged position on an X-Y table. CONSTITUTION:Positional sensors are set to tables 2, 5, the tables 2, 5 are moved to a prescribed position and the positional sensors are irradiated with laser beam so that the coordinate axes in the X, Y direction of X-Y tables 2, 5 on a base 1 coincides with the coordinate axes in the X, Y directions of the positional sensor. The output of each photodetector composing the positional sensor is detected to discriminate which photodetector is irradiated with laser beam. The converged position of the laser beam is calculated by asking for the coordinate position of the positional sensor of the photodetector receiving the laser beam from the origin. In this way, the converged position can be detected in a short time and at a high accuracy.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、X−Yテーブル上に被
加工物を載置して加工するレーザ加工機における集光光
学系の集光位置検出装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a condensing position detecting device for a condensing optical system in a laser processing machine for processing a workpiece by placing it on an XY table.

【0002】[0002]

【従来の技術】プリント基板は、配線の細線化、多層化
が進められ、プリント基板に使用される銅箔の厚さも薄
くなってきている。このため、内層と外層を結ぶための
ブラインドホールの加工に、予めドリルで外層の銅箔を
除去して窓穴を形成した後、この窓穴を通してレーザ光
を照射し、プリント基板の絶縁基材を選択的に除去する
目的で、炭酸ガスレーザの使用が提案されている。炭酸
ガスレーザは、そのレーザ光を銅材に照射した場合、銅
箔上に照射痕を残す程度で、銅材を殆ど加工することが
できないため、プリント基板の絶縁基材を選択的に加工
してブラインドホールを形成するのに適している。
2. Description of the Related Art In a printed circuit board, wiring is becoming finer and multilayered, and the thickness of copper foil used in the printed circuit board is becoming thinner. Therefore, to process the blind hole for connecting the inner layer and the outer layer, after removing the copper foil of the outer layer with a drill in advance to form a window hole, irradiate laser light through this window hole, the insulating substrate of the printed circuit board The use of a carbon dioxide laser has been proposed for the purpose of selectively removing carbon dioxide. When a carbon dioxide gas laser irradiates a laser beam on the copper material, the copper material can hardly be processed, leaving only an irradiation mark on the copper foil. Therefore, the insulating base material of the printed circuit board is selectively processed. Suitable for forming blind holes.

【0003】プリント基板の配線の細線化にともなって
加工される穴の径も小径化し、前記ブラインドホールの
場合には、直径が0.2mm以下になっている。このよ
うな小径の穴を精度良く加工するためには、ドリルで加
工された窓穴にレーザ光の照射位置を正確に位置決めし
なければならない。
The diameter of the hole to be machined is also made smaller as the wiring of the printed circuit board is made finer, and in the case of the blind hole, the diameter is 0.2 mm or less. In order to accurately machine such a small-diameter hole, the irradiation position of the laser light must be accurately positioned in the window hole machined with the drill.

【0004】[0004]

【発明が解決しようとする課題】このため、ドリルで窓
穴が形成されたプリント基板に、レーザ光を照射した
後、顕微鏡でその照射痕の中心と、窓あなの中心のずれ
量を測定し、その結果に基づいて、レーザ加工機の制御
装置に補正量を登録し、レーザ加工機により、照射位置
を補正しながら加工を行っている。この補正量の設定に
当たっては、レーザ光の照射と測定を何度も繰返し適正
値を求めているが、時間がかかり作業性が悪いだけでな
く、精度も不十分な状態であった。
Therefore, after irradiating a laser beam to a printed circuit board having a window hole formed by a drill, the deviation amount between the center of the irradiation mark and the center of the window hole is measured with a microscope. Based on the result, the correction amount is registered in the control device of the laser processing machine, and the laser processing machine performs the processing while correcting the irradiation position. In setting the correction amount, laser light irradiation and measurement are repeated many times to obtain an appropriate value. However, not only is it time-consuming and poor in workability, but also the accuracy is insufficient.

【0005】本発明の目的は、上記の事情に鑑み、短時
間で高精度の測定を可能にするレーザ加工機における集
光光学系の集光位置検出装置を提供することにある。
In view of the above situation, an object of the present invention is to provide a condensing position detecting device of a condensing optical system in a laser processing machine which enables highly accurate measurement in a short time.

【0006】[0006]

【課題を解決するための手段】上記の目的を達成するた
め、本発明においては、複数の受光素子がマトリックス
状に配置され、X−Yテーブルの所定の位置に着脱可能
に配置される位置センサと、この位置センサに向けてレ
ーザ光を照射したとき、位置センサを構成する各受光素
子の出力を検出し、レーザ光の集光位置を判別する判別
装置と、この判別結果に基づいて、前記X−Yテーブル
の座標軸に対する集光位置のずれ量を算出する演算装置
とを設けた。
In order to achieve the above object, according to the present invention, a plurality of light receiving elements are arranged in a matrix, and a position sensor is detachably arranged at a predetermined position on an XY table. When the laser light is irradiated toward the position sensor, the output of each light-receiving element that constitutes the position sensor is detected, and a discriminating device that discriminates the condensing position of the laser light, and based on the discrimination result, An arithmetic unit for calculating the shift amount of the light-condensing position with respect to the coordinate axes of the XY table is provided.

【0007】[0007]

【作用】X−YテーブルのX−Y方向の座標軸と位置セ
ンサのX−Y方向の座標軸が一致するように位置センサ
をX−Yテーブルに取り付け、X−Yテーブルを所定の
位置(例えば、X−Yテーブルの原点位置が、集光光学
系と対向するべき位置)へ移動させ、位置センサにレー
ザ光を集光照射する。そして、位置センサを構成する各
受光素子の出力を検出し、どの受光素子がレーザ光を受
光しているかを判別する。レーザ光を受光している受光
素子の位置センサの原点からの座標位置を求めることに
より、レーザ光の集光位置を求める。
The position sensor is attached to the XY table so that the XY coordinate axis of the XY table and the XY coordinate axis of the position sensor coincide with each other, and the XY table is placed at a predetermined position (eg, The origin position of the XY table is moved to a position where it should be opposed to the condensing optical system), and the position sensor is condensed and irradiated with laser light. Then, the output of each light receiving element forming the position sensor is detected to determine which light receiving element receives the laser beam. The focus position of the laser light is obtained by finding the coordinate position from the origin of the position sensor of the light receiving element receiving the laser light.

【0008】[0008]

【実施例】以下、本発明の一実施例を、図1ないし図3
に基づいて説明する。同図において、1はレーザ加工装
置のベース。2はXテーブルで、ベース1にX方向に移
動可能に支持されている。3はモータで、ベース1に支
持され、ねじ送り機構4を介してXテーブル2を移動さ
せる。5はYテーブルで、Xテーブル2にY方向に移動
可能に支持されている。6はモータで、Xテーブル2に
支持され、ねじ送り機構7を介してYテーブル5を移動
させる。8はレンガなどで形成された収光プレートで、
ブラケット9を介してベース1に取付けられている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
It will be described based on. In the figure, 1 is the base of the laser processing apparatus. An X table 2 is supported on the base 1 so as to be movable in the X direction. A motor 3 is supported by the base 1 and moves the X table 2 via the screw feed mechanism 4. A Y table 5 is supported by the X table 2 so as to be movable in the Y direction. A motor 6 is supported by the X table 2 and moves the Y table 5 via the screw feed mechanism 7. 8 is a light collecting plate made of bricks,
It is attached to the base 1 via a bracket 9.

【0009】10はレーザ発振機で、レーザ加工装置の
コラム(図示せず)に支持されている。11はレーザ光
で、レーザ発振機11から発振される。12は光導管
で、一端がレーザ発振機10に接続され、他端はレーザ
加工装置の構造部材13に支持されている。14は反射
鏡で、光導管12内に配置されている。15は集光光学
系で、前記コラムにZ方向に移動可能に支持されてい
る。16は対物レンズで、集光光学系15内に配置され
ている。17はモータで、前記コラムに支持され、ねじ
送り機構18を介して集光光学系15を移動させる。
A laser oscillator 10 is supported by a column (not shown) of the laser processing apparatus. A laser beam 11 is emitted from the laser oscillator 11. An optical conduit 12 has one end connected to the laser oscillator 10 and the other end supported by a structural member 13 of the laser processing apparatus. Reference numeral 14 denotes a reflecting mirror, which is arranged in the light pipe 12. A condensing optical system 15 is supported by the column so as to be movable in the Z direction. Reference numeral 16 denotes an objective lens, which is arranged in the condensing optical system 15. A motor 17 is supported by the column and moves the condensing optical system 15 via a screw feed mechanism 18.

【0010】20はビームスプリッタで、集光光学系1
5に着脱可能に配置される。21は複数の受光素子をマ
トリックス状に配置した位置センサ。この位置センサ2
1は、その中央にある受光素子が前記Xテーブル2とY
テーブル5の原点位置と一致し、かつ位置センサの座標
軸がXテーブル2とYテーブル5の座標軸と一致するよ
うにYテーブル5に着脱可能に配置される。22は焦点
位置判別装置で、位置センサ21に接続されている。2
3は制御装置で、焦点位置判別装置22から印加される
判別結果に基づいて、焦点位置のずれ量を求める演算部
と、この演算結果に基づいて、Xテーブル2とYテーブ
ル5の移動量を補正する制御部を備えている。 上記の
構成で、集光光学系15にビームスプリッタ20を取り
付け、位置センサ21をYテーブル5に取り付けた後、
制御装置23の指令に基づいて、Xテーブル2とYテー
ブル5を移動させ、その原点位置を、レーザ加工装置の
設計上の集光光学系15の集光位置へ移動させる。この
状態で、レーザ発振機10を作動させ、レーザ光11を
発振させる。すると、レーザ光11は、光導管12内を
通り、反射鏡13で反射されて集光光学系15に入射さ
れ、対物レンズ16により絞られて、位置センサ21上
に照射される。このとき、レーザ光11の一部は、ビー
ムスプリッタ20によって反射され、収光プレート8に
照射吸収される。
Reference numeral 20 denotes a beam splitter, which is a focusing optical system 1.
5 is detachably arranged. 21 is a position sensor in which a plurality of light receiving elements are arranged in a matrix. This position sensor 2
1, the light receiving element in the center is the X table 2 and the Y
It is removably arranged on the Y table 5 so that it coincides with the origin position of the table 5 and the coordinate axis of the position sensor coincides with the coordinate axes of the X table 2 and the Y table 5. Reference numeral 22 denotes a focus position determination device, which is connected to the position sensor 21. Two
Reference numeral 3 denotes a control device, which calculates a shift amount of the focus position based on the determination result applied from the focus position determination device 22 and a movement amount of the X table 2 and the Y table 5 based on the calculation result. A control unit for correction is provided. With the above configuration, after attaching the beam splitter 20 to the condensing optical system 15 and attaching the position sensor 21 to the Y table 5,
Based on a command from the control device 23, the X table 2 and the Y table 5 are moved, and the origin position thereof is moved to the focusing position of the focusing optical system 15 designed in the laser processing apparatus. In this state, the laser oscillator 10 is operated to oscillate the laser light 11. Then, the laser beam 11 passes through the inside of the optical conduit 12, is reflected by the reflecting mirror 13, enters the condensing optical system 15, is focused by the objective lens 16, and is irradiated onto the position sensor 21. At this time, a part of the laser light 11 is reflected by the beam splitter 20 and is irradiated and absorbed by the light collecting plate 8.

【0011】焦点位置判別装置22は、位置センサ21
を構成する受光素子の出力を、受光素子の配列順にした
がって走査確認し、レーザ光11を受光している受光素
子の位置を判別する。そして、この位置を制御装置23
の演算部に印加する。制御装置23の演算部は、印加さ
れた受光素子の位置から、位置センサ21の原点位置と
の差を求め、その差を補正量として、制御部に登録す
る。
The focus position discriminating device 22 includes a position sensor 21.
The output of the light receiving element that constitutes the above is scanned and confirmed according to the arrangement order of the light receiving elements, and the position of the light receiving element receiving the laser beam 11 is determined. Then, this position is set to the control device 23.
Is applied to the calculation unit of. The arithmetic unit of the control device 23 obtains a difference from the origin position of the position sensor 21 from the position of the applied light receiving element, and registers the difference as a correction amount in the control unit.

【0012】前記判別装置22においては、たとえば、
図2に示すように、レーザ光11のスポット11aを受
光している受光素子21mnが一つの場合には、その位
置を制御装置23の演算部に印加し、図3に示すよう
に、レーザ光11のスポット11aを受光している受光
素子21mm、21mnが二つの場合には、それぞれの
位置を制御装置23の演算部に印加する。
In the discrimination device 22, for example,
As shown in FIG. 2, when the number of the light receiving elements 21mn receiving the spot 11a of the laser beam 11 is one, the position is applied to the arithmetic unit of the control device 23, and as shown in FIG. When there are two light receiving elements 21 mm and 21 mn receiving the 11 spots 11 a, the respective positions are applied to the arithmetic unit of the control device 23.

【0013】二つ以上の受光素子21mm、21mnの
位置が印加された場合、制御装置23の演算装置では、
それぞれX方向、Y方向の位置に分け、複数の位置の平
均値を算出し、補正量とする。
When two or more light receiving elements 21 mm and 21 mn are applied, the arithmetic unit of the control unit 23:
The values are divided into positions in the X direction and the Y direction, and the average value of a plurality of positions is calculated as the correction amount.

【0014】[0014]

【発明の効果】以上述べた如く、本発明によれば、複数
の受光素子がマトリックス状に配置され、X−Yテーブ
ルの所定の位置に着脱可能に配置される位置センサと、
この位置センサに向けてレーザ光を照射したとき、位置
センサを構成する各受光素子の出力を検出し、レーザ光
の集光位置を判別する判別装置と、この判別結果に基づ
いて、前記X−Yテーブルの座標軸に対する集光位置の
ずれ量を算出する演算装置とを設けたので、集光光学系
の集光位置を自動的に測定することができ、作業性を向
上させることができる。また、測定精度を向上させ、短
時間でより正確な位置合わせを行なうことができる。
As described above, according to the present invention, a plurality of light receiving elements are arranged in a matrix, and the position sensor is detachably arranged at a predetermined position on the XY table.
When a laser beam is emitted toward this position sensor, the output of each light receiving element that constitutes the position sensor is detected, and a discriminating device for discriminating the converging position of the laser beam, and the X- Since the calculation device for calculating the shift amount of the light collecting position with respect to the coordinate axis of the Y table is provided, the light collecting position of the light collecting optical system can be automatically measured, and the workability can be improved. Further, it is possible to improve the measurement accuracy and perform more accurate alignment in a short time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による集光光学系の集光位置検出装置の
一例を示すブロックせん図。
FIG. 1 is a block diagram showing an example of a condensing position detecting device of a condensing optical system according to the present invention.

【図2】単一の受光素子での検出状態を示す拡大図。FIG. 2 is an enlarged view showing a detection state with a single light receiving element.

【図3】複数の受光素子での検出状態を示す拡大図。FIG. 3 is an enlarged view showing a detection state of a plurality of light receiving elements.

【符号の説明】[Explanation of symbols]

2 Xテーブル 5 Yテーブル 11 レーザ光 15 集光光学系 21 位置センサ 21ij 受光素子 22 判別装置 23 制御装置 2 X table 5 Y table 11 Laser light 15 Condensing optical system 21 Position sensor 21ij Light receiving element 22 Discriminating device 23 Control device

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】被加工物を載置するX−Yテーブルと、Z
方向に移動可能な集光光学系を備えたレーザ加工機にお
ける集光光学系の集光位置検出装置であって、複数の受
光素子がマトリックス状に配置され、前記X−Yテーブ
ルの所定の位置に着脱可能に配置される位置センサと、
この位置センサに向けてレーザ光を照射したとき、位置
センサを構成する各受光素子の出力を検出し、レーザ光
の集光位置を判別する判別装置と、この判別結果に基づ
いて、前記X−Yテーブルの座標軸に対する集光位置の
ずれ量を算出する演算装置とを設けたことを特徴とする
レーザ加工機における集光光学系の集光位置検出装置。
1. An XY table on which a workpiece is placed, and a Z table.
A condensing position detecting device of a condensing optical system in a laser processing machine having a condensing optical system movable in any direction, wherein a plurality of light receiving elements are arranged in a matrix form, and a predetermined position of the XY table. A position sensor that is detachably arranged in the
When a laser beam is emitted toward this position sensor, the output of each light receiving element that constitutes the position sensor is detected, and a discriminating device for discriminating the converging position of the laser beam, and the X- A condensing position detecting device of a condensing optical system in a laser processing machine, which is provided with an arithmetic device for calculating a deviation amount of a condensing position with respect to a coordinate axis of the Y table.
JP4183690A 1992-07-10 1992-07-10 Detector for converged position of converging optical system in laser beam machine Withdrawn JPH0623577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4183690A JPH0623577A (en) 1992-07-10 1992-07-10 Detector for converged position of converging optical system in laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4183690A JPH0623577A (en) 1992-07-10 1992-07-10 Detector for converged position of converging optical system in laser beam machine

Publications (1)

Publication Number Publication Date
JPH0623577A true JPH0623577A (en) 1994-02-01

Family

ID=16140235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4183690A Withdrawn JPH0623577A (en) 1992-07-10 1992-07-10 Detector for converged position of converging optical system in laser beam machine

Country Status (1)

Country Link
JP (1) JPH0623577A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009297726A (en) * 2008-06-10 2009-12-24 Kataoka Seisakusho:Kk Laser beam machine
JP2011051016A (en) * 2009-08-03 2011-03-17 Toray Eng Co Ltd Marking device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009297726A (en) * 2008-06-10 2009-12-24 Kataoka Seisakusho:Kk Laser beam machine
JP2011051016A (en) * 2009-08-03 2011-03-17 Toray Eng Co Ltd Marking device and method

Similar Documents

Publication Publication Date Title
TWI417509B (en) A measuring device and a laser processing machine which are held at the chuck table
JP3605359B2 (en) METHOD AND APPARATUS FOR CALIBRATION OF LASER PROCESSING MACHINE FOR PROCESSING WORKING MATERIAL
JP5393150B2 (en) Determination method of laser beam focus position
JP2008119718A (en) Laser beam machining apparatus
JP3460678B2 (en) Laser processing method and processing apparatus
TW201735138A (en) Wafer processing method
KR20080061372A (en) Real time target topography tracking during laser processing
JPH1076384A (en) Method for detecting focal position of laser beam machine
JP2004114203A (en) Apparatus for measuring profile of workpiece and profile measuring system using the same
JPH1076382A (en) Positioning method of laser beam machine
JP2000074644A (en) Measuring apparatus of rod type cutting tool and measuring method of drill which uses the measuring apparatus
JP7408332B2 (en) laser processing equipment
JPH0623577A (en) Detector for converged position of converging optical system in laser beam machine
JP2008119715A (en) Laser beam machining apparatus
JP2001334376A (en) Laser beam machining device and method of correction of laser beam spot position
JPH1058175A (en) Calibration method for optical axis of laser beam machine
JPH0825073A (en) Laser beam machine and method for adjusting optical axis in the same
JP2011115806A (en) Laser processing apparatus
JPH0724589A (en) Method and device for adjusting automatic alignment of laser beam robot
JP2766759B2 (en) Drilling equipment for fiber spinneret
JP2021048269A (en) Laser processing method and laser processing device
JP2822698B2 (en) Positioning device and laser processing device
JP2004209505A (en) Method for correcting deviation of machining position in laser beam machining device
JP4232638B2 (en) Optical processing equipment
JPS6180212A (en) Automatic focus detecting mechanism

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19991005