JPH0623531A - Reflow device - Google Patents

Abstract

PURPOSE:To make a temp. distribution on the printed board in reflow furnace uniform by recording a position different in a temp. rise on the printed board and executing an auxiliary blowing of the prescribed temp. to the position. CONSTITUTION:The printed board 2 with parts installed is charged in the reflow device 1. When the printed board proceeds to preheating part, the blowing hole 7 for auxiliary blowing is positioned to the position, which is inputted beforehand and has a slow temp. rise on the printed board, by the SX axis control means 11 and SY axis control means 12. The SX axis control means 11 makes the blowing hole 7 move in conformity with the transfer speed of the transfer conveyer 3. The auxiliary heating is always executed to the position of a slow temp. rise of the printed board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow device for soldering electronic components mounted on a printed circuit board.

[0002]

2. Description of the Related Art Generally, soldering on a printed circuit board on which electronic parts are mounted has been performed by a reflow device. A conventional reflow apparatus will be described below with reference to FIG.

As shown in FIG. 4 (a), the printed circuit board 2 on which the electronic components have been mounted is carried into the reflow furnace 1 by the conveyor 3. The inside of the reflow furnace 1 is divided into zones having different set temperatures, and the printed circuit board 2 loaded therein is heated to the set temperature of each zone, soldered, and then cooled and unloaded. The description of the soldering device is omitted.

FIG. 4B shows a sectional view of one of the zones in the reflow furnace 1. A heater unit 5, a blower fan 6, and a temperature detection sensor 4 are attached to the zone as shown in the figure. And inside the zone,
The heater unit 5 is controlled by the temperature detected by the temperature detection sensor 4 so as to reach the set ambient temperature.

[0005]

However, in the above-mentioned conventional reflow apparatus, each zone is controlled by the ambient temperature, and it is not possible to deal with the temperature variation generated on the printed circuit board 2, and the uniform temperature is maintained over the entire surface of the printed circuit board 2. There is a problem that reliability cannot be reduced because the soldering due to the rise cannot be performed.

In order to solve the above-mentioned problems of the prior art, it is an object of the present invention to provide a reflow apparatus which can make the temperature distribution of the printed circuit board in the reflow furnace uniform and improve the reliability of soldering. To do.

[0007]

In order to solve the above-mentioned problems, a reflow apparatus of the present invention comprises means for storing in advance the positions of different temperature rises on the printed circuit board in the reflow furnace, and the stored printed circuit board. For the position above
Means for storing the setting of the blowing temperature at the time of performing the auxiliary blowing, and the auxiliary blowing on the printed circuit board moving in the reflow furnace are also blown at the set temperature to the set position. It has a structure with means.

Further, the reflow apparatus of the present invention is provided with a plurality of air outlets having different shapes for performing auxiliary air blowing, and means for selecting the air outlet based on the data of the shape of the air outlet previously stored. It has a structure with.

Further, the reflow apparatus of the present invention is constructed such that auxiliary air is separately blown to the preheating section and the reflow section in the reflow furnace.

[0010]

According to the reflow apparatus of the present invention, the positions of different temperature rises on the printed circuit board in the reflow furnace are stored in advance, and the blowing temperature at the time of performing auxiliary blowing to the stored position on the printed circuit board. The setting of is stored, and the stored position of the printed circuit board that is moving in the reflow furnace,
Auxiliary air is blown at the set temperature. Then, the temperature of the printed board rises uniformly over the entire surface.

Further, a plurality of blower openings having different shapes are selected based on the data of the blower openings stored in advance, and it is possible to correspond to the type change of the printed circuit board. Further, in the reflow furnace, auxiliary air is separately blown to the preheating section and the reflow section, so that not only the maximum temperature on the printed circuit board but also the temperature rise from the preheating section is made uniform.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a flow chart showing a procedure for inputting data relating to auxiliary blowing to a reflow device according to an embodiment of the present invention. As shown in the figure, the position where the temperature rise of the printed circuit board is slow in advance is referred to the end surface of the printed circuit board as X,
Input as Y coordinate. Next, the blowing temperature of the auxiliary blowing is set for the reflow section and the preheating section. Further, it is selected which of the two blower port shapes having different opening areas is used.

FIG. 2 is a control block diagram of an embodiment of the present invention. As shown in the figure, the control system of the reflow apparatus comprises a main controller 14 operated by a storage means,
The auxiliary blower fan 15, the warm air circulation fan 16, the P-plate loading control stop valve 17, the auxiliary blower port tool selection valve 18, the pulse driver 19, and the heater controller 20 are controlled. And S for the pulse driver 19
The X axis and the SY axis are associated with each other, and the heater controller 20 is associated with the auxiliary air blower temperature detection sensor 21, each zone atmosphere temperature sensor 22, the auxiliary air blower heater 23, and the zone heater 24.

Next, with reference to FIG. 3, a specific configuration and operation of one embodiment of the present invention will be described in detail. Figure 3
It is a principal part expansion perspective view of the apparatus of one Example of this invention. As shown in the figure, the printed circuit board 2 on which the electronic components have been mounted is carried into the reflow apparatus 1 by the conveyor 3. At this time, the loading timing is set to the substrate loading control stopper 13
Controlled by. The main controller can know where in the reflow furnace the printed circuit board 2 is being conveyed from the conveying speed of the carry-in conveyor 3. 4 in the figure
Is a temperature detection sensor.

Next, when the printed circuit board 2 enters the preheating section, a blower opening 7 for performing auxiliary air blowing is input to the position S where the temperature rise on the printed circuit board 2 is slow in advance.
Positioning is performed by the X-axis control means 11 and the SY-axis control means 12. At this time, the SX axis control means 11 moves the blower port 7 according to the transport speed of the transport conveyor 3. For this reason, the auxiliary heating is always performed by the blower port 7 on the position on the printed circuit board 2 where the temperature rise is slow, and the conveyor 3
Can be operated continuously. From the blower port 7 for performing the supplementary blow, the auxiliary blower temperature detection sensor 8, the supplementary blower heater 9, and the supplementary blow pipe 10 can stably blow the preset blower temperature. .

Further, the same mechanism is provided in each of the preheating section and the reflow section so that the individual temperature can be set and the printed board transport tact can be accelerated.
Further, since two types of tools having different opening areas are prepared for the auxiliary blower port 7, it is possible to easily deal with the change of the printed circuit board to be processed. As a result, the temperature distribution on the printed circuit board has reduced the reliability of soldering in the past, but by supplementary partial heating, the temperature distribution is made uniform and the reliability of soldering is significantly improved. I was able to.

Further, the present invention is not limited to the above-mentioned embodiment, and it is possible to provide a plurality of auxiliary blower shapes and types and a plurality of auxiliary blower openings. Furthermore, the auxiliary blower set temperature can be lowered to be applied to partial cooling.

[0018]

As is apparent from the above description of the embodiments, according to the present invention, means for pre-storing positions of different temperature rises on the printed circuit board in the reflow furnace, and the stored printed circuit board are used. Means for storing the setting of the blowing temperature when performing the auxiliary blowing, and the auxiliary blowing of the set temperature for the printed circuit board moving in the reflow furnace. Since the air is blown to the position on the printed circuit board, the entire surface of the printed circuit board can be kept at a uniform temperature and the reliability of soldering can be improved.

Further, since a plurality of air outlets having different shapes for performing auxiliary air blowing are provided and the shape of the air outlet can be selected based on prestored data, it is also possible to change the type of printed circuit board. It can be handled easily. Furthermore, by individually and supplementarily blowing air to the preheating part and the reflow part, not only the maximum temperature on the printed circuit board but also the temperature rise from the preheating part can be made uniform, and the reliability of soldering is improved. It can be further improved.

[Brief description of drawings]

FIG. 1 is a flowchart showing a procedure for inputting data relating to auxiliary ventilation to a reflow device according to an embodiment of the present invention.

FIG. 2 is a block diagram showing control of one embodiment of the present invention.

FIG. 3 is an enlarged perspective view of an essential part of an apparatus according to an embodiment of the present invention.

FIG. 4A is a side view schematically showing a conventional reflow apparatus.
Is a cross-sectional view showing the outline of a conventional reflow apparatus

[Explanation of symbols]

 1 Reflow Furnace 2 Printed Circuit Board 3 Conveyor 4 Temperature Detection Sensor 7 Auxiliary Air Blower 8 Auxiliary Air Blower Temperature Detection Sensor 9 Auxiliary Air Blower Heater 10 Auxiliary Air Blower 11 SX Axis Control Means 12 SY Axis Control Means

Claims (3)

[Claims] 1. A means for pre-storing positions of different temperature rises on a printed circuit board in a reflow furnace, and a setting of a blast temperature at the time of performing auxiliary blast to the stored position on the printed circuit board. A reflow apparatus comprising: a means for storing and a means for auxiliaryly blowing air at the set temperature to the stored position on a printed circuit board moving in a reflow furnace. 2. The reflow apparatus according to claim 1, further comprising a plurality of air outlets having different shapes for performing auxiliary air blowing, and having means for selecting the shape of the air outlet based on data data stored in advance. 3. The reflow apparatus according to claim 1, wherein in the reflow furnace, auxiliary air is separately fed to the preheating section and the reflow section.