JPH0623297U - Case cooling device - Google Patents
Case cooling deviceInfo
- Publication number
- JPH0623297U JPH0623297U JP066353U JP6635392U JPH0623297U JP H0623297 U JPH0623297 U JP H0623297U JP 066353 U JP066353 U JP 066353U JP 6635392 U JP6635392 U JP 6635392U JP H0623297 U JPH0623297 U JP H0623297U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- block
- cooling device
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 20
- 239000002918 waste heat Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000005485 electric heating Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 ヒートパイプ廃熱側をペルチェ素子低温側と
接合せしめ、冷却ファンを不要としたことにより、スペ
ース効率の良い、低騒音でメンテナンスの不要な筐体冷
却装置を得る。
【構成】 筐体１、は内部は、ダクト３、ファン４、に
より内気を循環すべく構成される。発熱体２、より発生
した熱は、内気循環によりヒートパイプ５、に伝導され
る。ヒートパイプ５、は、その一端がブロック９、に嵌
合され、筺体の熱をブロック９、へ輸送する。ブロック
９、外側には、ペルチェ素子１０、の低温側が接合せし
められ、同素子に電流を流すことにより、ブロック９、
を冷却し、ヒートパイプ５、の熱を奪う。
(57) [Summary] (Modified) [Purpose] The heat-pipe waste heat side is joined to the Peltier element low-temperature side, eliminating the need for a cooling fan, resulting in space-efficient, low-noise and maintenance-free housing. Get a cooling device. [Structure] The inside of the housing 1 is configured to circulate the inside air by a duct 3 and a fan 4. The heat generated by the heating element 2 is conducted to the heat pipe 5 by the internal air circulation. The heat pipe 5, one end of which is fitted into the block 9, transfers the heat of the housing to the block 9. A low temperature side of the Peltier element 10 is joined to the outside of the block 9, and a current is passed through the element, so that the block 9,
And heat of the heat pipe 5 is removed.
Description
【０００１】[0001]
本考案は、電子回路機器等の発熱体を収容する筐体内の冷却を行う筐体冷却装 置に関する。 The present invention relates to a housing cooling device that cools the inside of a housing that houses a heating element such as an electronic circuit device.
【０００２】[0002]
従来の電子回路機器を収容する筐体の冷却装置を図２に示す。 １，は、筐体であり外気とは遮断されている。 ２，は、電子回路基板等の発熱体である。 筐体１，内部は、ダクト３，ファン４，により内気を循環すべく構成される。 発熱体２，より発生した熱は、内気循環によりヒートパイプ５，に伝導される 。 ヒートパイプ５，は、その一端が筐体１の外部に出ており、筐体１，内の熱を 外部へ輸送する。 FIG. 2 shows a conventional cooling device for housing a housing of electronic circuit equipment. Reference numeral 1 denotes a housing, which is shielded from the outside air. 2 is a heating element such as an electronic circuit board. The inside of the housing 1 is configured to circulate the inside air by the duct 3 and the fan 4. The heat generated from the heating element 2 is conducted to the heat pipes 5 by the internal air circulation. One end of the heat pipe 5 is exposed to the outside of the housing 1, and the heat inside the housing 1 is transported to the outside.
【０００３】 ダクト８，廃熱ファン７，にて導入された外気でヒートパイプ５，を冷却する ことによって、筐体１，の内部冷却を行うものである。 効率的な熱伝導が得られるように、ヒートパイプ５，の外周には、多数のフィ ン６，が設けられる。The inside of the housing 1 is cooled by cooling the heat pipe 5 with the outside air introduced by the duct 8 and the waste heat fan 7. A large number of fins 6 are provided on the outer periphery of the heat pipe 5, so that efficient heat conduction can be obtained.
【０００４】[0004]
解決しようとする問題点は、従来の技術による筐体の冷却装置は廃熱側が筐体 外部に突出する為、スペース効率が悪い上に廃熱ファンによる騒音が発生し、さ らにはフィンに埃等の異物が目詰まりし、冷却効率が落ち易いという点である。 The problem to be solved is that in the conventional cooling device for the casing, the waste heat side protrudes to the outside of the casing, so the space efficiency is poor and noise is generated by the waste heat fan. This is because foreign matter such as dust is clogged and cooling efficiency is likely to drop.
【０００５】[0005]
上記問題を解決するために本考案では、ヒートパイプ廃熱側にペルチェ素子の 低温側を接合せしめ、電子的に冷却を行い、廃熱側には、冷却ファンを持たない ことを特徴とするヒートパイプ式筐体冷却装置を用いる。 In order to solve the above problems, the present invention is characterized in that the heat pipe waste heat side is joined to the low temperature side of the Peltier element for electronic cooling, and the waste heat side has no cooling fan. A pipe type cooling device is used.
【０００６】[0006]
【実施例１】 図１，は、本考案の実施例による冷却装置である。 １，は筐体であり、外気とは遮断されている。 ２，は電子回路基板等の発熱体である。 筐体１，は内部は、ダクト３，ファン４，により内気を循環すべく構成される 。 発熱体２，より発生した熱は、内気循環によりヒートパイプ５，に伝導される 。 ヒートパイプ５，は、その一端がブロック９，に嵌合され、筐体の熱をブロッ ク９，へ輸送する。Embodiment 1 FIG. 1 shows a cooling device according to an embodiment of the present invention. Reference numeral 1 denotes a housing, which is shielded from the outside air. Reference numeral 2 is a heating element such as an electronic circuit board. The inside of the housing 1 is configured to circulate the inside air by the duct 3, the fan 4, and the like. The heat generated from the heating element 2 is conducted to the heat pipes 5 by the internal air circulation. The heat pipe 5, one end of which is fitted into the block 9, transports the heat of the housing to the block 9.
【０００７】 ブロック９，外側には、ペルチェ素子１０，の低温側が接合せしめられ、同素 子に電流を流すことにより、ブロック９，を冷却し、ヒートパイプ５，の熱を奪 う。 １１，は、ペルチェ素子１０，の高温側の熱を効率的に放射する為のヒートシ ンクである。 以上の構成により、筐体１，の内部冷却を行う。A low temperature side of the Peltier element 10 is joined to the outside of the block 9, and a current is passed through the element to cool the block 9 and remove heat from the heat pipes 5. Reference numeral 11 denotes a heat sink for efficiently radiating heat on the high temperature side of the Peltier element 10. With the above configuration, the inside of the housing 1 is cooled.
【０００８】[0008]
本考案により、廃熱側に冷却ファンを持たない、スペース効率の良い、低騒音 で、メンテナンスの不要な筐体冷却装置が得られる。 According to the present invention, it is possible to obtain a space-efficient, low-noise, maintenance-free enclosure cooling device that does not have a cooling fan on the waste heat side.
【０００９】[0009]
【図１】本考案による筐体冷却装置FIG. 1 is a chassis cooling device according to the present invention.
【図２】従来の技術による筐体冷却装置FIG. 2 is a conventional case cooling device.
【符合の説明】 １，筐体 ２，発熱体 ３，内気ダクト ４，内気循環用ファン ５，ヒートパイプ ６，フィン ７，廃熱ファン ８，外気ダクト ９，ブロック １０，ペルチェ素子 １１，ヒートシンク[Description of References] 1, case 2, heating element 3, inside air duct 4, inside air circulation fan 5, heat pipe 6, fins 7, waste heat fan 8, outside air duct 9, block 10, Peltier element 11, heat sink
Claims (1)
の冷却を行う筐体冷却装置であって、その電熱部材とし
てヒートパイプを用いるとともに、ヒートパイプ廃熱側
はペルチェ素子の低温側と接合せしめ、廃熱側に冷却フ
ァンを持たないことを特徴とするヒートパイプ式筐体冷
却装置。1. A casing cooling device for cooling the inside of a casing containing a heating element such as an electronic circuit device, wherein a heat pipe is used as an electric heating member, and the heat pipe waste heat side is the low temperature side of the Peltier element. A heat pipe type housing cooling device, which is joined and does not have a cooling fan on the waste heat side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP066353U JPH0623297U (en) | 1992-08-27 | 1992-08-27 | Case cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP066353U JPH0623297U (en) | 1992-08-27 | 1992-08-27 | Case cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0623297U true JPH0623297U (en) | 1994-03-25 |
Family
ID=13313413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP066353U Pending JPH0623297U (en) | 1992-08-27 | 1992-08-27 | Case cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623297U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013524329A (en) * | 2010-03-30 | 2013-06-17 | アスト モデュラール，エス．エル． | Environmental control system for internal space of data center |
-
1992
- 1992-08-27 JP JP066353U patent/JPH0623297U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013524329A (en) * | 2010-03-30 | 2013-06-17 | アスト モデュラール，エス．エル． | Environmental control system for internal space of data center |
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