JPH06232526A - Printed wiring board with key contact - Google Patents

Printed wiring board with key contact

Info

Publication number
JPH06232526A
JPH06232526A JP3418693A JP3418693A JPH06232526A JP H06232526 A JPH06232526 A JP H06232526A JP 3418693 A JP3418693 A JP 3418693A JP 3418693 A JP3418693 A JP 3418693A JP H06232526 A JPH06232526 A JP H06232526A
Authority
JP
Japan
Prior art keywords
key contact
wiring board
printed wiring
printed
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3418693A
Other languages
Japanese (ja)
Inventor
Katsutomo Nikaido
勝友 二階堂
Shin Kawakami
伸 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP3418693A priority Critical patent/JPH06232526A/en
Publication of JPH06232526A publication Critical patent/JPH06232526A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent generation of oozing between the electrodes, of key contact point pattern caused by conductive paste when the key contact point patterns are screen printed using conductive paste. CONSTITUTION:In this printed wiring board with a key contact point pattern consisting of conductive paste located at least on a part of the printed wiring board which constitutes a conductor pattern on an insulating substrate, a separation line 2 is printed simultaneously with a screen between the electrodes 1a and 1b of the key contact point pattern 1 before screen printing the key contact point pattern 1. The oozing of the conductor paste is prevented by the thickness of the printed separation line 2, and defective insulation can be eliminated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はキー接点を有するプリン
ト配線板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having key contacts.

【0002】[0002]

【従来の技術】導電ペーストから成るキー接点パターン
は、絶縁基板上に形成した導体回路間を導通または遮断
する目的で回路間の所要の位置に設けるものである。
2. Description of the Related Art A key contact pattern made of a conductive paste is provided at a desired position between conductor circuits formed on an insulating substrate for the purpose of connecting or disconnecting the conductor circuits.

【0003】そして、従来のキー接点パターンは、例え
ば、図3および図4に示すように、電極10a,10b
が互いに入り組んだ串型状(角型および串型状に限らな
い)をなすとともに、総体的に角型を形成している。
A conventional key contact pattern is, for example, as shown in FIGS. 3 and 4, electrodes 10a and 10b.
Form an intricate skewered shape (not limited to a square shape and a skewered shape) and form a square shape as a whole.

【0004】このキー接点パターンは、導体回路14間
を接続する際の導通効率をよくするために、その電極1
0a,10b相互間の距離を非常に近接させてスクリー
ン印刷している。
This key contact pattern is provided for the electrode 1 in order to improve the conduction efficiency when connecting the conductor circuits 14.
Screen printing is performed by making the distances 0a and 10b very close to each other.

【0005】このキー接点パターン10を基板13の面
に設ける工程は、まず、基板13の面に導体回路14を
形成させ、キー接点パターンと接続する導体回路14の
部分を除いて、その他の所要部分にソルダレジスト15
を設ける。つぎに、シンボルマークを印刷する(図示せ
ず)。
In the step of providing the key contact pattern 10 on the surface of the substrate 13, first, the conductor circuit 14 is formed on the surface of the substrate 13, and the other parts except for the portion of the conductor circuit 14 connected to the key contact pattern are required. Solder resist 15 on the part
To provide. Next, the symbol mark is printed (not shown).

【0006】その後に、導体回路14のキー接点パター
ン接続部(ソルダレジスト15を施していない部分)
に、電極10a,10bの接続部16a,16bが重な
るように印刷することにより完成させている。
After that, the key contact pattern connecting portion of the conductor circuit 14 (the portion where the solder resist 15 is not applied)
Is completed by printing so that the connecting portions 16a and 16b of the electrodes 10a and 10b overlap.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、前記従
来のキー接点パターン10は、その電極10a,10b
の間隔が非常に接近しているために、スクリーン印刷の
際に滲み11,12が生じると、その部分の電極10
a,10b間に疑似ショートによる絶縁不良がおこる。
このために絶縁を確保することが困難となり、プリント
配線板の品質が低下するという問題があった。
However, the conventional key contact pattern 10 has electrodes 10a and 10b.
Are so close to each other that bleeding 11 and 12 occurs during screen printing, the electrode 10 in that portion
Insulation failure occurs due to a pseudo short circuit between a and 10b.
For this reason, it is difficult to ensure insulation, and there is a problem that the quality of the printed wiring board deteriorates.

【0008】よって本発明は上記事情を考慮してなされ
たものであり、キー接点パターン10をスクリーン印刷
しても、その電極10a,10b間に滲みによる絶縁不
良が生じないキー接点を有するプリント配線板の提供を
目的とする。
Therefore, the present invention has been made in consideration of the above circumstances, and even if the key contact pattern 10 is screen-printed, a printed wiring having a key contact in which insulation failure due to bleeding does not occur between the electrodes 10a and 10b. For the purpose of providing boards.

【0009】[0009]

【課題を解決するための手段】上記目的を達成するた
め、本発明は、絶縁基板上に導電パターンを形成するプ
リント配線板の少なくともその一部に、スクリーン印刷
にて導電ペーストからなるキー接点パターンを形成する
プリント配線板において、前記キー接点パターンをスク
リーン印刷する前に、前記キー接点パターンの電極間
に、絶縁体からなる分離線を設けたことを特徴とする。
In order to achieve the above object, the present invention provides a key contact pattern made of a conductive paste by screen printing on at least a part of a printed wiring board for forming a conductive pattern on an insulating substrate. In the printed wiring board forming the above, a separation line made of an insulator is provided between the electrodes of the key contact pattern before screen printing the key contact pattern.

【0010】[0010]

【作用】本発明によれば、キー接点パターンをスクリー
ン印刷をする前に、キー接点パターンの電極間に絶縁層
を設けたことによりスクリーン印刷の際の滲みの発生を
防止することができる。
According to the present invention, the occurrence of bleeding during screen printing can be prevented by providing an insulating layer between the electrodes of the key contact pattern before screen printing the key contact pattern.

【0011】[0011]

【実施例】図1および図2は本発明のプリント配線板の
キー接点パターンを示す。キー接点パターン1は導電ペ
ーストから成り、電極1aおよび1bにより構成する。
電極1aおよび1bは互いに入り組んだ形状をなすとと
もに若干の隙間を隔てて相対向し、総体的に角型を形成
している。
1 and 2 show key contact patterns of a printed wiring board according to the present invention. The key contact pattern 1 is made of a conductive paste and is composed of electrodes 1a and 1b.
The electrodes 1a and 1b have an intricate shape, face each other with a slight gap, and form a square shape as a whole.

【0012】前記キー接点パターン1は、電極1aの接
続部3a,および電極1bの接続部3bのそれぞれが、
導電パターン5に接続されることにより、キー接点とし
ての構成をなすものである。
In the key contact pattern 1, each of the connecting portion 3a of the electrode 1a and the connecting portion 3b of the electrode 1b is
By being connected to the conductive pattern 5, the structure serves as a key contact.

【0013】前記構成のキー接点パターン1において本
発明では、電極1a,1b間の若干の隙間に分離線2を
設けたものである。
In the present invention, in the key contact pattern 1 having the above-mentioned structure, the separation line 2 is provided in a slight gap between the electrodes 1a and 1b.

【0014】以下、本発明のキー接点パターン1の形成
工程について説明する。まず、絶縁基板4の面に対し従
来の手法により導電パターン5を形成する。つぎに導電
パターン5のキー接点パターン1との接続部5a,5b
を除いたその他の所要の部分にソルダーレジスト6を施
す。
The steps of forming the key contact pattern 1 of the present invention will be described below. First, the conductive pattern 5 is formed on the surface of the insulating substrate 4 by a conventional method. Next, the connection portions 5a and 5b of the conductive pattern 5 with the key contact pattern 1 are formed.
Solder resist 6 is applied to other required portions except for.

【0015】その後の、絶縁体から成るシンボルマーク
(図示せず)を印刷する工程において、シンボルマーク
の印刷と同時に、電極1a,1b間の位置に、その隙間
に対応する幅を有する分離線2を印刷する。印刷された
分離線2の厚さは15μm程度となる。
In the subsequent step of printing a symbol mark (not shown) made of an insulating material, at the same time as the printing of the symbol mark, a separation line 2 having a width corresponding to the gap is formed between the electrodes 1a and 1b. To print. The thickness of the printed separation line 2 is about 15 μm.

【0016】前記分離線2の印刷を施工した後に、キー
接点パターン1を印刷する。この場合、電極1a,1b
の接続部3a,3bが導電パターン5の接続部5a,5
bに重ねて印刷することにより、キー接点パターン1と
導電パターン5とが接続される。
After the separation line 2 is printed, the key contact pattern 1 is printed. In this case, the electrodes 1a, 1b
The connecting portions 3a, 3b of the connecting portions 5a, 5b of the conductive pattern 5 are
The key contact pattern 1 and the conductive pattern 5 are connected by superposing and printing on b.

【0017】キー接点パターン1を印刷した状態は、図
2に示すように、分離線2の厚さが約15μmであるの
に対してキー接点パターン1の厚さが約20μmである
ので、分離線2の厚さによる段差がキー接点パターン1
の印刷における塗料の滲みを防止する。従って、電極1
a,1b間に絶縁不良が生じることがなくなる。
When the key contact pattern 1 is printed, as shown in FIG. 2, the separation line 2 has a thickness of about 15 μm, while the key contact pattern 1 has a thickness of about 20 μm. The step due to the thickness of the contact wire 2 is the key contact pattern 1
Of paint bleeding during printing. Therefore, electrode 1
Insulation failure will not occur between a and 1b.

【0018】[0018]

【発明の効果】本発明のキー接点を有するプリント配線
板は、キー接点パターンを印刷する前にキー接点パター
ンの電極間に分離線を設けておくので、キー接点パター
ンを印刷する際に滲みが生じない。また、キー接点パタ
ーン電極間の分離線は、シンボルマークの印刷と同時に
印刷するので、工程数を増加させることなく施工するこ
とができる。これにより、電極間の絶縁不良を防止し、
プリント配線板の信頼性を向上させることができる。
In the printed wiring board having the key contact of the present invention, the separating line is provided between the electrodes of the key contact pattern before the key contact pattern is printed, so that bleeding occurs when the key contact pattern is printed. Does not happen. Further, since the separation line between the key contact pattern electrodes is printed at the same time as the printing of the symbol mark, it can be installed without increasing the number of steps. This prevents insulation failure between electrodes,
The reliability of the printed wiring board can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のキー接点の平面図。FIG. 1 is a plan view of a key contact of the present invention.

【図2】図1の断面図。FIG. 2 is a sectional view of FIG.

【図3】従来のキー接点の説明図。FIG. 3 is an explanatory view of a conventional key contact.

【図4】図3の断面図。FIG. 4 is a sectional view of FIG.

【符号の説明】[Explanation of symbols]

1 キー接点パターン 1a,1b 電極 2 分離線 3a,3b 接続部 4 絶縁基板 5a,5b 導体パターン 6 ソルダーレジスト 1 key contact pattern 1a, 1b electrode 2 separation line 3a, 3b connection part 4 insulating substrate 5a, 5b conductor pattern 6 solder resist

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板上に導電パターンを形成するプ
リント配線板の少なくともその一部に、スクリーン印刷
にて導電ペーストからなるキー接点パターンを形成する
プリント配線板において、前記キー接点パターンをスク
リーン印刷する前に、前記キー接点パターンの電極間
に、絶縁体からなる分離線を設けたことを特徴とするキ
ー接点を有するプリント配線板。
1. A printed wiring board in which a key contact pattern made of a conductive paste is formed by screen printing on at least a part of a printed wiring board on which an electrically conductive pattern is formed on an insulating substrate. Before the above, a printed wiring board having a key contact, characterized in that a separation line made of an insulator is provided between the electrodes of the key contact pattern.
JP3418693A 1993-01-29 1993-01-29 Printed wiring board with key contact Pending JPH06232526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3418693A JPH06232526A (en) 1993-01-29 1993-01-29 Printed wiring board with key contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3418693A JPH06232526A (en) 1993-01-29 1993-01-29 Printed wiring board with key contact

Publications (1)

Publication Number Publication Date
JPH06232526A true JPH06232526A (en) 1994-08-19

Family

ID=12407172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3418693A Pending JPH06232526A (en) 1993-01-29 1993-01-29 Printed wiring board with key contact

Country Status (1)

Country Link
JP (1) JPH06232526A (en)

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