JPH06219466A - Holding tape for electronic parts - Google Patents

Abstract

PURPOSE:To provide a holding tape for electronic parts which is easy to roll up and out without zigzaging, can be pierced without feathering, and causes no change to the electronic parts held in the tape. CONSTITUTION:The tile holding tape for electronic parts is formed of a carrier tape (a) whose thickness is 250 to 2000mum and which is provided with a number of holding holes 2 for electronic parts 5 and feeding holes parallel to the holding holes 2, which are both arranged regularly, a top cover film (b) sticked to upper and lower surfaces of the carrier tape (a) for sealing the holding holes 2 but not sealing the feeding holes, and a bottom cover film (c). The carrier tape (a) is made of a laminate resin film T which is obtained by pasting unextensible thermoplastic resin film T1 which contains 10 to 80wt.% of inorganic fine powder and extensible resin film T2 which includes many small holes and has a density of 0.60 to 1.1g/m<3> and a gap ratio of 10 to 60%. Thickness ratio of these films T1 and T2 is within a range of 0.5<T1/T2<50.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a fixed chip resistor, I
C chip, electrolytic capacitor, transistor, LS
The present invention relates to an electronic component storage tape for storing electronic components such as I and variable resistors. This electronic component storage tape is used for storing several thousand to 10,000 electronic components, wound on a reel, further packed in a cushioning material, and sent to a user.

[0002]

2. Description of the Related Art Conventionally, as a tape for storing electronic parts, JIS-C0806-1990 and JP-A-2-5757 have been used.
As disclosed in Japanese Patent No. 6 and the like, the following and are known. A carrier tape (a) made of paper in which a hole 2 for storing electronic parts, a plurality of feed holes 3 provided in parallel to the hole for holes are provided in a regular arrangement, and the carrier tape is attached to the front surface and the back surface of the carrier tape. Hole punch carrier type electronic component constituted by a resin-made top cover film (b) and a resin-made bottom cover film (c) which seal the attached storage hole 2 but do not seal the feed hole 3. Storage tape 1 (see FIG. 2). The storage recess 2'is sealed on the upper surface of the resin embossed carrier tape a'provided with the recess 2'for storing electronic parts formed by vacuum molding or the like and the feed hole 3 formed by perforation. The holes 3 are embossed carrier type electronic component storage tapes 1 '(see FIG. 3) to which a top cover film b which is not sealed is attached.

Such a storage tape is required to have the following performance when used. (1) Be flexible so that it can be wound on a reel. (2) It has such strength that it does not extend or break due to the tensile stress applied to the storage tapes 1 and 1'when wound on the reel 4 or unwound from the reel 4, and the storage tape 1 , 1'does not meander. (3) There is no paper dust problem affecting the stored electronic components 5. (4) The dimensional accuracy of the storage hole 2 and the feed hole 3 is good.

However, in the embossed carrier type electronic component storage tape 1 ', if the carrier tape is made thin, there is a problem that it may meander when it is wound on the reel 4 and the tape may be stretched. On the contrary, if the thickness is increased, it becomes difficult to wind the reel 4 or the number of electronic components to be stored in the reel 4 is reduced. Also, the storage hole punch carrier type storage tape 1 for electronic components is excellent in winding and rewinding, but the thickness obtained by making pulp fiber as the carrier tape a is 400 to 1, Since 000 μm pulp paper is used as a material, as shown in FIG.
When the component storage hole 2 is punched with a cutter blade, pulp fiber fibers fluff on its peripheral wall, and this fiber waste adheres to electronic components such as chip fixing resistors, IC chips, LSIs, transistors, etc. There is a drawback that 1-2 pieces operate in error. Also, the wall thickness is 1,000 μm
If the thickness exceeds, the rigidity increases and winding is difficult. Therefore, in order to obtain a carrier tape having a wall thickness of more than 1,000 μm,
Since it is necessary to bond the perforated pulp papers with an adhesive, it is difficult to align the positions of the holes, and it has not been put to practical use.

[0005]

According to the present invention, the storage tape 1 for electronic parts can be easily wound and unwound without winding when the storage tape 1 is wound and unwound. Further, the present invention provides a storage tape for an electronic component, which is free from fuzz during punching and does not deteriorate the stored electronic component 5. Further, even if the carrier tape a has a large thickness of 1,000 to 2,000 μm, the present invention provides a storage tape which is excellent in workability such that it can be perforated at once and can be wound.

[0006]

[Means for Solving the Problems]

[Summary of the Invention] The present inventors have conducted extensive studies in view of the above problems, and as a result, as the carrier tape a, an inorganic fine powder-containing thermoplastic resin unstretched film (T ₁ ) and a microporous stretched resin have been used. The present invention has been completed based on the finding that the above problems can be solved by using a laminated resin film (T) obtained by laminating a film (T ₂ ). That is, the storage tape for electronic components of the present invention has a wall thickness of 250 to 2, in which a plurality of storage holes for electronic components and feed holes provided in parallel with the storage holes are provided in a regular arrangement. 000 μm carrier tape (a), and a top cover film (b) and a bottom cover film (c) that seal the storage holes attached to the front and back surfaces of the carrier tape but do not seal the feed holes. In a storage tape for electronic parts, the carrier tape (a) is an unstretched thermoplastic resin film (T ₁ ) containing 10 to 80% by weight of inorganic fine powder.
And a density of 0.60 to 1.1 g / cm ³ and a porosity of 10
A laminated resin film (T) obtained by bonding a microporous stretched resin film (T ₂ ) of ˜60% and the thickness ratio thereof is 0.5 <T ₁ / T ₂ <50. It is what

[Detailed Description of the Invention] [I] Structure of Storage Tape for Electronic Parts As shown in FIGS. 1 and 2, the storage tape 1 for electronic parts of the present invention basically stores electronic parts. A resin carrier tape (a) in which a plurality of holes 2 and a plurality of feed holes 3 provided in parallel with the storage holes 2 are provided in a regular arrangement.
And a resin-made top cover film (b) and resin-made bottom cover film (which seals the storage holes 2 attached to the front and back surfaces of the carrier tape (a) but does not seal the feed holes 3 ( It is a rectangular hole punch carrier type storage tape composed of c).

[II] Carrier Tape (a) (1) Structure The carrier tape (a) of the storage tape 1 is a thermoplastic resin (B ₁ ) containing 10 to 80% by weight of inorganic fine powder (A ₁ ) 6. 7 unstretched film (T ₁ ) with a density of 0.6
~1.1g / cm ^3, a stretched resin film of the microporous porosity is 10~60% (T ₂₎ laminated resin film and the bonding thickness which is combined is 250~2,000μm (T), Moreover, the thickness ratio is formed in the range of 0.5 <T ₁ / T ₂ <50.

(2) Production of Laminated Resin Film (T) Such a laminated resin film (T) can be produced by the following methods (1) and (2). Thermoplastic resin (B ₁ ) containing 10 to 80% by weight, preferably 18 to 55% by weight of inorganic fine powder (A ₁ ) 6.
The unstretched film (T ₁ ) of _No. 7 or the thermoplastic resin composition (B ₁ ) containing the inorganic fine powder (A ₁ ) 6 and a chemical foaming agent or a physical foaming agent is melted by an extruder. A kneaded, extruded and foamed into a film form from a T-die, and a microporous stretched resin film (T ₂ ) is applied to one or both sides of an unstretched foamed resin film (T ₁ ) cooled by using an adhesive. How to attach. 150-280 thermoplastic resin film (T ₁ ) containing inorganic fine powder (optionally may contain a foaming agent) on the surface of the microporous stretched resin film (T ₂ ).
Melt extrusion laminate at a temperature of ℃, 0.1-60kg /
A method of pressing with a roll pressure of cm ² .

[0010] (A) non-oriented film of thermoplastic resin (T ₁₎ (a) producing the unstretched resin film of non-oriented resin film (T ₁₎ (T ₁₎ is an inorganic fine powder (A
₁ ) Manufactured by melting and kneading a thermoplastic resin (B ₁ ) 7 containing 10 to 80% by weight, preferably 18 to 55% by weight of 6 with an extruder and extruding it in a film form from a T die without stretching. Alternatively, the thermoplastic resin composition (B ₁ ) 7 containing the inorganic fine powder (A ₁ ) 6 and containing a chemical foaming agent or a physical foaming agent is melted and kneaded by an extruder, and is not stretched. It can be manufactured by extruding and foaming into a film form from a T-die and cooling it.

(B) Constituent Material Thermoplastic Resin (B ₁ ) As the thermoplastic resin (B ₁ ) 7, low density, medium density, high density polyethylene, linear low density polyethylene, polypropylene, ethylene-propylene copolymer Coal, ethylene / propylene / butene-1 copolymer, propylene / butene-1 copolymer, propylene / 4-methylpentene-
1 copolymer, olefin resin such as ethylene / vinyl acetate copolymer, polystyrene, styrene resin such as acrylonitrile / styrene copolymer, acrylonitrile / butadiene / styrene copolymer, polyethylene terephthalate, polyamide, polyphenylene sulfide, polyphenylene Ether, etc. can be mentioned. These may be mixed and used.

Inorganic fine powder (A ₁ ) The inorganic fine powder (A ₁ ) 6 has a particle size of generally 0.05 to 30 μm, preferably 0.5 to 10 μm, calcium carbonate, magnesium carbonate, calcium hydroxide,
Magnesium hydroxide, aluminum hydroxide, aluminum phosphate, talc, mica, clay, carbon black,
Examples thereof include graphite, zeolite, barium sulfate, hydrous calcium silicate, diatomaceous earth, titanium oxide, aluminum sulfate and silica.

Foaming agent As the foaming agent compounded in the thermoplastic resin film (T ₁ ), there are a chemical foaming agent and a physical foaming agent, and the former chemical foaming agent is azodicarbonamide or azobisisobutyro. Nitrile, diazoaminobenzene, N, N'-
Examples thereof include dinitrosopentamethylenetetramine, N, N'-dimethyl-N, N'-dinitroterephthalamide, benzenesulfonyl hydrazide, sodium hydrogencarbonate salt, monosodium citrate salt and the like, and mixtures thereof. These are used in a proportion of 0.1 to 3 parts by weight of the resin component. Further, as the latter physical foaming agent, hydrocarbons such as butane, propane and pentane are used. These are used in a proportion of 15 to 40% by weight of the resin component.

Other compounding agents In addition to the above compounding agents , the thermoplastic resin (B ₁ ) 7 contains an antioxidant, a colorant, an ultraviolet absorber, an antistatic agent, a dispersant, a nucleating agent, a plasticizer. Agents and additives such as fatty acid metal salts and fatty acid amide slip agents may be added as necessary.

(B) Microporous stretched resin film (T ₂ ) (a) Structure The microporous stretched resin film (T ₂ ) to be bonded to the unstretched thermoplastic resin film (T ₁ ) is shown below. Specific examples include those having the structure of. Inorganic fine powder (A ₂₎ 8 which contained 5 to 30 wt% biaxially stretched resin microporous film (T _2), said biaxially stretched resin film (T ₂₎ as a core layer, an inorganic fine on one side or both sides A stretched resin film having a multi-layer structure in which a uniaxially stretched resin microporous film containing 8 to 65% by weight of the powder (A ₂ ) is laminated (Japanese Patent Publication Nos. 46-40794 and 63-11).
No. 83). Of course, a stretched resin film containing no inorganic fine powder (A ₂ ) may be laminated as long as it does not impair the ease of winding and perforation of the carrier tape. For example, in order to facilitate heat sealability, a stretched resin film layer having a wall thickness of 0.2 to 8 μm and substantially not containing inorganic fine powder 6 (0 to 3% by weight) is added to the microporous film. It can also be laminated on both sides. Inorganic fine powder (A ₂ ) 5 to 35% by weight, high melting point thermoplastic resin 10 to 65% by weight, and low melting point thermoplastic resin 8 to
A pearl-like microporous film obtained by biaxially stretching a film composed of 45% by weight of the mixture (B ₂ ). A microporous stretched resin film obtained by uniaxially stretching a film made of a mixture of 5 to 60% by weight of an inorganic fine powder (A ₂ ) and 40 to 95% by weight of a thermoplastic resin (B ₂ ).

(B) Element inorganic fine powder (A ₂ ) The inorganic fine powder (A ₂ ) 8 has a particle size of generally 0.03 to 15 μm, preferably 0.1 to 5 μm and an aspect ratio of 8. To 35, preferably 10 to 20 talc, scaly inorganic fine powder such as mica, calcined clay having a particle size of 0.03 to 15 μm, calcium carbonate, diatomaceous earth, titanium oxide, vermiculite, etc. You can Thermoplastic resin (B ₂ ) Examples of the thermoplastic resin (B ₂ ) 9 include polypropylene, polyethylene, ethylene-propylene copolymer, ethylene-butene-1 copolymer, ethylene-4-methylpentene-1 copolymer. , Propylene / ethylene / butene-
1 copolymer, polystyrene, polyethylene terephthalate, nylon-6, nylon-6,6, nylon-6
10, nylon-6,12 etc. can be mentioned.
Among these thermoplastic resins, polypropylene is preferably used.

[0017] (c) preparation of a microporous stretched resin film (T ₂₎ (stretching) microporous stretched resin film (T _2), the inorganic fine powder (A
₂ ) A film obtained by stretching a thermoplastic resin film comprising a thermoplastic resin (B ₂ ) 9 containing 8 at a temperature lower than the melting point of the resin, and the stretching ratio at this time is unidirectional or bidirectional. Each is 1.3 to 15 times, preferably 3.5 to 10 times. The number of stretching axes is uniaxial or biaxial. Therefore, such a microporous stretched resin film (T
₂ ) has a density of 0.60 to 1.1 g / cm ³ , preferably 0.60 to 0.90 g / cm ³ , and
Porosity calculated by the following formula is 10 to 60%, preferably 1
It is in the range of 5 to 50%, particularly preferably 15 to 45%. Porosity = [(ρ ₀ −ρ) / ρ ₀ ] × 100 ρ ₀ : Density of film before stretching ρ: Density of film after stretching If the porosity is less than 10%, punching holes for storage are carried out. At the time of punching with a mold, the bottom part is stretched and whiskers (resin linear material left after punching) are generated. Also, if it exceeds 60%, the tensile stress decreases when winding on a reel and meanders. It is not practical because it is cut or cut.

(C) Adhesion (a) Adhesive An adhesive used when the inorganic stretched resin film (T ₁ ) and the microporous stretched resin film (T ₂ ) are attached to each other include a hot melt adhesive and a solvent. Mold adhesives can be used. Hot-melt adhesive The hot-melt adhesive used in the method of laminating with the above-mentioned hot-melt adhesive includes low-density polyethylene, linear low-density polyethylene, ethylene-vinyl acetate copolymer (preferably a vinyl acetate content of 12% by weight. % Or less ethylene / vinyl acetate copolymer), ethylene / acrylic acid copolymer (preferably ethylene / acrylic acid copolymer having an ethylene content of 65 to 94% by weight), ethylene / methacrylic acid alkyl ester copolymer, Ionomer (Metal salt of ethylene-acrylic acid copolymer, ethylene
Examples thereof include metal salts of methacrylic acid copolymers), ethylene / propylene copolymers, ethylene / propylene / butene-1 copolymers, and vinyl chloride / vinyl acetate copolymers. Solvent-type adhesive As the solvent-type adhesive used by the method of bonding with the solvent-type adhesive, polyether polyol,
Examples thereof include polyisocyanate adhesives and polyester / polyol / polyisocyanate adhesives.

(B) Thickness of adhesive layer The thickness of the above-mentioned adhesive layer is generally 1 to 30 μm, preferably 1 to 20 μm. Specifically, the coating type adhesive is generally 1 to 20 g / m ² , preferably 2 to
It is applied in an amount of 6 g / m ² . The hot-melt type adhesive is melt-extrusion laminated and generally heat-sealed to a thickness of 8 to 30 μm, preferably 8 to 20 μm.

(3) Thickness The thickness of the laminated resin film (T) is generally 250 to
The thickness is 2,000 μm, preferably 400 to 1,500 μm. The thickness ratio of the unstretched resin film (T ₁ ) and the microporous stretched resin film (T ₂ ) in the laminated resin film (T) is 0.5 <T ₁ / T ₂ <50, preferably 1 < T
₁ / T ₂ <40, particularly preferably 1 <T ₁ / T ₂ <30
Is. When the T ₁ / T ₂ ratio is less than 0.5, heat shrinkage occurs in the carrier tape (a) when the top cover film (b) or the bottom cover film (c) is heat-sealed on the front and back surfaces of the carrier tape (a). I have something to do. Further, when the T ₁ / T ₂ ratio exceeds 50, when the non-stretched resin film (T ₁ ) is an unfoamed resin film, the carrier tape (a) has a high specific gravity, and there is no weight reduction effect. It is necessary to have a large tension when the storage tape is wound up on the reel or when pulled back from the reel. When the inorganic stretched film (T ₁ ) is a foamed resin film, perforation becomes difficult. The thickness of the microporous stretched resin film (T ₂ ) is generally 30 to 500 μm, preferably 30 to 300 μm, and particularly preferably 50 to 200 μm.

(4) Storage hole and feed hole The hole 2 of the storage recess differs depending on the size of the parts, but generally has a length of 0.6 to 6 mm and a width of 1.2 to 8 mm. a round hole of square hole or diameter 1 to 10 mm, also the diameter of the feed holes has a diameter of 1 to 3 mm ^phi, the tape width is 8～56Mm. The pitch numbers of the storage holes 2 and the feed holes 3 are determined by the above-mentioned JIS C0806-1990, but are generally 2 to 8 mm. Laminated resin film (T) is the inorganic oriented film (T ₁₎ as when a two-layer structure of a microporous stretched resin film (T ₂₎ is microporous stretched resin film in order to facilitate the punching (T ₂₎ On the inorganic stretched film (T ₁ ) side so that the cutter blade abuts on the side of the inorganic stretched film (T ₁ ).

[III] Top Cover Film (b) and Bottom Cover Film (c) (1) Material The top cover film (b) and the bottom cover film (c) laminated on the front and back surfaces of the carrier tape are as follows: A heat-sealable resin film may be used alone, or a heat-sealable resin film may be laminated on a transparent film such as polypropylene, polyethylene terephthalate, nylon-6 having a thickness of 2 to 60 μm. Specific examples of the heat sealable resin include low density polyethylene,
Linear low density polyethylene, ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate copolymer having a vinyl acetate content of 12% by weight or less), ethylene / acrylic acid copolymer (preferably ethylene content of 65-94) Wt% ethylene / acrylic acid copolymer), ethylene / methacrylic acid alkyl ester copolymer, ionomer (metal salt of ethylene / acrylic acid copolymer, metal salt of ethylene / methacrylic acid polymer), ethylene / propylene copolymer Examples thereof include polymers, ethylene / propylene / butene-1 copolymers, vinyl chloride / vinyl acetate copolymers and the like.

(2) Shape Therefore, the thickness of the top cover film (b) and the bottom cover film (c) is generally 8 to 60 μm, preferably 18 to 25 μm. The widths of the top cover film (b) and the bottom cover film (c) are such that the cover film is attached to the front surface and the back surface of the carrier tape, and the electronic components housed by sealing the housing holes are missing. It is stored securely so as not to do so. However, it is important that the cover film has a width that does not seal the feed hole 3 of the storage tape 1. Therefore, the width of the top cover film and the bottom cover film is generally 4 to 50 mm, preferably 4 to 45 mm.

[IV] Storage (Lamination) The storage tape 1 for electronic components thus obtained is, for example, a chip taping machine SCT-30 manufactured by Seiwa Sangyo Co., Ltd.
00 (commercial name), after storing the electronic component 5 that has been inspected in the square hole 2 of the carrier tape (a),
The top cover film (b) is heat-sealed, wound on the reel 4, further packed in a cushioning material, and shipped to the user.

[0025]

EXAMPLES The present invention will be described in more detail with reference to the following examples and comparative examples. Example 1 (1) Production of Carrier Tape (a) Production of Microporous Resin Stretched Film (T ₂ ) Melt Flow Rate (MFR) 81 g by weight of polypropylene 0.8 g / 10 min, 3% by weight of high density polyethylene and The composition (A) containing 16% by weight of calcium carbonate having an average particle size of 1.5 μm was kneaded by an extruder set at 270 ° C., extruded into a sheet, and cooled by a cooling device to obtain an unstretched sheet. Obtained. Then, this sheet was heated again to a temperature of 140 ° C. and then stretched 5 times in the machine direction. A composition (B) in which 54% by weight of polypropylene having an MFR of 4.0 g / 10 min and 46% by weight of calcium carbonate having an average particle size of 1.5 μm were mixed and kneaded with another extruder, It was extruded into a sheet and laminated on both sides of the above-mentioned 5 times stretched film to obtain a laminated film having a three-layer structure. Then, after cooling the laminated film having the three-layer structure to 60 ° C., it is heated again to a temperature of about 160 ° C. and stretched 7.5 times in the transverse direction using a tenter,
Annealing at a temperature of 65 ° C., cooling to a temperature of 60 ° C., slitting the ears and a three-layer structure (uniaxial stretching /
Biaxially stretched / uniaxially stretched, 105 μm thick (B / A / B
= 31 μm / 43 μm / 31 μm) was obtained. The porosity of each layer is (B / A / B = 39% /
31% / 39%), and the total porosity is 37%.
A microporous resin stretched film (T ₂ ) having a IS-P8118 density of 0.76 g / cm ³ was obtained.

(B) Production of laminated resin film (T) 45% by weight of polypropylene having MFR of 4.0 g / 10 min
And a composition (T ₁ ) in which 55 wt% of calcium carbonate having an average particle diameter of 1.5 μm are mixed and melted and kneaded at a temperature of 250 ° C. with an extruder having a diameter of 90 mm ^φ , and a T die having a width of 750 mm is thermoplastic. The resin film (T ₁ ) was extruded. The thermoplastic resin film (T ₁ ) extruded from the T die was heated to a temperature of 200 ° C. at which the thermoplastic resin film (T ₁ ) was still in a softened state, and this was treated with a pair of microporous resin stretched films (T ₂ ).
Between the _two layers and sandwich-laminating using a pressure bonding roll to obtain a microporous resin stretched film (T ₂ ) layer (wall thickness 105 μm) / thermoplastic resin film (T ₁ ) layer (wall thickness 740 μm) / microporous resin Stretched film (T ₂ )
A laminated resin film (T) having a wall thickness of 950 μm and having a layer (wall thickness of 105 μm) was obtained. Further, this laminated resin film (T) was slit into a width of 8 mm to obtain a carrier tape.

(2) Production of top cover film and bottom cover film Polypropylene (A) having an MFR of 4 g / 10 min and ethylene / vinyl acetate copolymer (B) having an ethylene content of 8% by weight are separately prepared. At the extruder of 230 ℃,
Melt-kneading at a temperature of 220 ° C., and supply them to a single co-extrusion die, co-extrude at a temperature of 220 ° C., cool and laminate with a thickness of 40 μm (A / B = 32 μm / 8 μm) A film was obtained and this was slit into a width of 5 mm.

(3) Storage The carrier tape, the top cover film and the bottom cover film obtained in the production of the carrier tape and the production of the top cover film and the bottom cover film are used as a chip taping machine SC manufactured by Seiwa Sangyo Co., Ltd.
It was attached to the reel of T-3000. Then, first, with a punching device of the device, a square hole of 0.7 × 1.2 mm and a diameter of 1.
After perforating the laminated resin film (T) with feed holes of 5 ^{mmφ at} a pitch of 4 mm (1,500 per minute), the bottom cover film was heat-sealed to the carrier tape. Then, the chip-fixed resistors that had been inspected were stored in square holes, and the top cover film was heat-sealed to form a chip-fixed resistor storage tape, which was then wound on a reel (for 10,000 chip-fixed resistors). ). 100 of this were produced.

(4) Evaluation The one using the above-mentioned laminated film (T) is easy to perforate, and there is no meandering of the storage tape at the time of winding,
Moreover, there was no elongation, and the feeding and returning of the storage tape were good. Further, this was rewound, the top cover film was peeled off, and the chip fixing resistors were all taken out and re-examined. As a result, none of them deteriorated (the chip fixing resistors had an operation error).

Example 2 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used. (1) Manufacture of carrier tape 45% by weight of polypropylene with MFR of 4.0 g / 10 min
And 55% by weight of calcium carbonate having an average particle diameter of 1.5 μm were melted and kneaded by another extruder to obtain extruded pellets. To 100 parts by weight of this pellet, MFR
20 parts by weight of low-density polyethylene of 0.7 g / 10 minutes,
By blending Azojikaruamido 2 parts by weight chemical blowing agent, it was melt-kneaded in an extruder having a diameter of 65 mm ^phi, width 7
It was extruded and foamed into a film at 210 ° C. from a 50 mm T-die. Temperature 1 at which the thermoplastic resin foam film (T ₁ ) extruded and foamed from the T-die is still in a softened state 1
The same microporous resin stretched film (T ₂ ) as in Example 1 was sandwich-laminated on the front and back surfaces at a temperature of 80 ° C. to obtain a microporous resin stretched film (T ₂ ).
Layer (wall thickness 105 μm) / thermoplastic resin foam film (T
₁ ) layer (wall thickness 740 μm) / microporous resin stretched film (T ₂ ) layer (wall thickness 105 μm), wall thickness 950 μm
To obtain a laminated resin film (T). Further, this laminated resin film (T) was slit into a width of 8 mm. In addition, (T
₁ ) The expansion ratio of the layer is 1.58 times and the density is 0.81 g /
It was cm ³ . (2) Evaluation Those using the above-mentioned laminated resin film (T) were good in perforation, feeding and rewinding, and there was no deterioration of the chip fixed resistor.

Example 3 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used as the carrier tape. (1) Production of carrier tape The same as in Example 2 except that only one microporous resin stretched film (T ₂ ) is used and the opening degree of the die when extruding the thermoplastic resin foam film (T ₁ ) is changed. 750 μm thick laminated resin film having a two-layer structure comprising a thermoplastic resin foamed film (T ₁ ) layer (thickness 645 μm) / microporous resin stretched film (T ₂ ) layer (thickness 105 μm) (T) was obtained. Furthermore,
This laminated resin film (T) was slit into a width of 8 mm. (2) Evaluation Those using the above-mentioned laminated resin film (T) were good in perforation, feeding and rewinding, and there was no deterioration of the chip fixed resistor.

Example 4 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used as the carrier tape. (1) Manufacture of carrier tape 82 wt% polypropylene with MFR of 4.0 g / 10 min
When a composition obtained by mixing calcium 18 wt% carbonate having an average particle diameter of 1.5 [mu] m, 250 ° C. in an extruder having a diameter of 90 mm ^phi
Was melted and kneaded at a temperature of, and extruded into a film form from a T die having a width of 750 mm. At a temperature of 200 ° C. at which the thermoplastic resin film (T ₁ ) extruded from the T die is still in a softened state, a pair of the microporous resin stretched film (T ₂ ) obtained in Example 1 was used. Between the two and sandwich-laminating to obtain a microporous resin stretched film (T ₂ ) layer (wall thickness 105 μm) / thermoplastic resin film (T ₁ ) layer (wall thickness 190 μm) / microporous resin stretched film (T ₂ A laminated resin film (T) having a three-layered structure (thickness: 105 μm) and a thickness of 300 μm was obtained.
Further, this laminated resin film (T) was slit into a width of 8 mm. The porosity of the thermoplastic resin film (T ₁ ) layer was 0%. (2) Evaluation Those using the above-mentioned laminated resin film (T) were good in perforation, feeding and rewinding, and there was no deterioration of the chip fixed resistor.

Comparative Example 1 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used. (1) Manufacture of carrier tape Polypropylene having an MFR of 4.0 g / 10 min and a caliber of 9
Melted at a temperature of 240 ° C. in an extruder of 0 mm ^phi, width 750
While extruding it into a film form from a T-die of mm, while still maintaining the softened state, it is introduced between a pair of the microporous resin stretched film (T ₂ ) obtained in Example 1, sandwich laminated, and microporous. Resin stretched film (T ₂ ) layer (wall thickness 105 μm) / polypropylene film (T ₁ )
Layer (thickness 400 μm) / microporous resin stretched film (T ₂ ) layer (thickness 105 μm) having a thickness of 610 μm
m three-layer laminated resin film (T) was obtained. Further, this laminated resin film (T) was slit into a width of 8 mm. (2) Evaluation When the carrier tape (T ₁ ) was punched with a knife in the storage hole, the bottom portion was stretched and punching was not performed completely, or the beard formed by punching was present on the bottom portion.
Therefore, what heat-sealed the bottom cover film (c) to this (a) has protrusions due to the beard in some places, and when the storage tape is wound on a reel, it does not reach the specified length. was there.

Comparative Example 2 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used. (1) Manufacture of carrier tape 82 wt% polypropylene with MFR of 4.0 g / 10 min
And 18% by weight of calcium carbonate having an average particle diameter of 1.5 μm are melted and kneaded with an extruder having a diameter of 90 mm ^φ , and extruded into a film form at a temperature of 240 ° C. from a T die, and then a metal roll is used. Cool down to 60 ℃ and have a wall thickness of 920μ
m film was obtained. Further, the unstretched resin film was slit into a width of 8 mm. (2) Evaluation When the carrier tape (T ₁ ) was punched in the storage hole with a punching die, the bottom was stretched and the punching was not completed completely, or the beard formed by the punching was present on the bottom.

Example 5 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used as the carrier tape. (1) Manufacture of carrier tape Polypropylene with a MFR of 2 g / 10 min (melting point 164
77% by weight, 10% by weight of high-density polyethylene, 10% by weight of calcium carbonate having an average particle diameter of 1.5 μm, and 3% by weight of titanium oxide are melted and kneaded in an extruder. Extruded into a sheet at a temperature of 200 ° C,
After cooling this with a cooling device, the sheet is again heated to 150 ° C.
After heating to the temperature of, the film was stretched 5 times in the machine direction to obtain a stretched film. Next, after heating again to a temperature of 158 ° C., it is stretched 9 times in the transverse direction, annealed at a temperature of 164 ° C., cooled to a temperature of 60 ° C., the ears are slit, and the wall thickness is increased. To obtain a monolayer biaxially oriented film (T ₂ ) having a thickness of 80 μm. The monolayer biaxially oriented film had a density of 0.65 g / cm ³ and a porosity of 44.7%.
This pair of biaxially stretched films (T ₂ ) was guided to face a guide roll of a sandwich laminating apparatus, and 45% by weight of polypropylene having an MFR of 4.0 g / 10 min was fed between them.
When the composition obtained by mixing a mean particle calcium carbonate diameter 1.5 [mu] m 55 wt% of (T _1), melted and kneaded at a temperature of 250 ° C. in an extruder having a diameter 90 mm ^phi, extruded from a T-die of width 750mm Rolled film, roll pressure 2kg / c
Crimp m ^{2, and} the microporous stretched resin film (T ₂₎ layer (thickness 80 [mu] m) / thermoplastic resin film (T ₁₎ layer (thickness 740μm) / microporous stretched resin film (T ₂₎
A 900 μm-thick laminated resin film (T) consisting of layers (thickness 80 μm) was obtained. Further, this laminated resin film (T) was slit into a width of 8 mm. The porosity of the thermoplastic resin film (T ₁ ) was 0%. (2) Evaluation The laminated film (T) had good perforation, had no meandering of the storage tape at the time of winding, did not extend, and was good in feeding and rewinding the storage tape. Furthermore, when this was rewound, the top cover film was peeled off, and all the chip fixing resistors were taken out and inspected, none of them deteriorated (the chip fixing resistors had an operation error).

Comparative Example 3 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the method described below was used. (1) Manufacture of carrier tape 45% by weight of polypropylene with MFR of 4.0 g / 10 min
And 55% by weight of calcium carbonate having an average particle diameter of 1.5 μm were melted and kneaded by another extruder to obtain extruded pellets. To 100 parts by weight of this pellet, MFR
After There was a low density polyethylene 20 parts by weight of 0.7 g / 10 min, by blending Azojikaruamido 2 parts by weight chemical blowing agent, it is melted and kneaded in an extruder having a diameter of 65 mm ^phi,
A T-die having a width of 750 mm was extruded and foamed into a film at a temperature of 210 ° C. to obtain a foaming ratio of 1.58 times and a density of 0.
A single-layer foamed resin sheet (T ₁ ) having a thickness of 81 g / cm ³ and a wall thickness of 900 μm was obtained. Furthermore, this foamed resin sheet (T ₁ )
Was slit to a width of 8 mm. (2) Evaluation If the carrier tape (T ₁ ) is punched through the storage hole, the bottom part is stretched and punching is not performed completely.
There were beards on the bottom caused by punching.

[0037]

EFFECT OF THE INVENTION An unstretched film (T ₁ ) of a thermoplastic resin containing 10 to 80% by weight of an inorganic fine powder and having a density of 0.6 to 1.1 g / cm ³ and a porosity of 10 to 60%. A laminated resin film (T) laminated with a microporous resin stretched film (T ₂ ) is used as a carrier tape having holes for storing electronic parts, and a top cover film and a bottom cover film are heat-sealed to the carrier tape. Storage tapes for electronic parts can be taken up and rewound
The storage tape can be easily wound and unwound without meandering, and even if a square hole is punched, pulp fibers do not fluff and the stored electronic components are not deteriorated. In addition, the reliability of electronic parts can be improved, and it is extremely useful industrially.

[Brief description of drawings]

FIG. 1 shows a sectional view of a storage tape for electronic parts of the present invention.

FIG. 2 is a perspective view of a square hole punch carrier type tape in which a part of a top cover film and a bottom cover film are peeled off.

FIG. 3 shows a perspective view of an embossed carrier type tape containing electronic components.

FIG. 4 is an enlarged photograph showing the shape of pulp fibers on the peripheral wall of a paper carrier tape obtained by making pulp fibers into square holes in a paper carrier tape.

FIG. 5 is an enlarged photograph of a peripheral wall of a carrier tape according to an embodiment of the present invention in which square holes are punched for comparison with FIG.

[Explanation of symbols]

1 Electronic Component Storage Tape (Square Hole Punch Carrier Type) 1'Embossed Carrier Type Electronic Component Storage Tape 2 Storage Square Hole 2'Groove 3 Feed Hole 4 Reel 5 Electronic Component 6 Inorganic Fine Powder (A ₁ ) 7 Thermoplastic resin (B ₁ ) 8 Inorganic fine powder (A ₂ ) 9 Thermoplastic resin (B ₂ ) 10 Void T Laminated resin film T ₁ Thermoplastic resin unstretched film T ₂ Microporous stretched resin film a Carrier tape b Top cover c Bottom cover

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tokumi Chiba 23, Towada, Kamisu-cho, Kashima-gun, Ibaraki Prefecture Okaka Synthetic Paper Co., Ltd. Kashima Plant

Claims (1)

[Claims] 1. A carrier tape (a) having a wall thickness of 250 to 2,000 .mu.m in which a large number of holes for storing electronic parts and feed holes provided in parallel with the holes are provided in a regular arrangement. And a storage tape for an electronic component comprising a top cover film (b) and a bottom cover film (c) that seal the storage holes attached to the front and back surfaces of the carrier tape but do not seal the feed holes. In the carrier tape (a), the unstretched thermoplastic resin film (T ₁ ) containing 10 to 80% by weight of inorganic fine powder.
And a density of 0.60 to 1.1 g / cm ³ and a porosity of 10
A laminated resin film (T) obtained by bonding a microporous stretched resin film (T ₂ ) of ˜60% and the thickness ratio thereof is 0.5 <T ₁ / T ₂ <50. Storage tape for electronic components.