JPH0621693Y2 - Mold runner structure - Google Patents
Mold runner structureInfo
- Publication number
- JPH0621693Y2 JPH0621693Y2 JP1988155791U JP15579188U JPH0621693Y2 JP H0621693 Y2 JPH0621693 Y2 JP H0621693Y2 JP 1988155791 U JP1988155791 U JP 1988155791U JP 15579188 U JP15579188 U JP 15579188U JP H0621693 Y2 JPH0621693 Y2 JP H0621693Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- runner
- lower mold
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は金型のランナ構造に係り、特にＯ／Ｅ（光／
電）変換モジュールのトランスファ成形用の金型のラン
ナ構造に関する。[Detailed Description of the Invention] Industrial Field of the Invention The present invention relates to a mold runner structure, and in particular to an O / E (optical / optical)
The present invention relates to a runner structure of a die for transfer molding of an electric conversion module.
従来の技術 第７図、第８図は従来のＯ／Ｅ変換モジュールの金型の
上下型型板の平面図、第９図は従来のＯ／Ｅ変換モジュ
ールの金型の組立時の要部の断面図を示す。Ｏ／Ｅ変換
モジュールは発光素子と受光素子とを有し、光ファイバ
ケーブルの端部に設けられ電気信号を光信号に変換した
り逆に光信号を電気信号に変換したりするモジュールで
ある。この種のモジュールは通常透明な樹脂で封止され
ている。モジュールを透明樹脂で封止するための金型と
して従来、第７図乃至第９図に示すようなものが用いら
れていた。2. Description of the Related Art FIGS. 7 and 8 are plan views of upper and lower mold plates of a mold of a conventional O / E conversion module, and FIG. 9 is a main part of a mold of a conventional O / E conversion module when assembling the mold. FIG. The O / E conversion module is a module that has a light emitting element and a light receiving element and is provided at the end of the optical fiber cable to convert an electric signal into an optical signal and vice versa. This type of module is usually sealed with a transparent resin. As a mold for sealing a module with a transparent resin, a mold as shown in FIGS. 7 to 9 has been conventionally used.
下型型板１７ｂには第８図及び第９図に示すように樹脂
を型内に注入するための樹脂注入ランナ１８が形成され
ている。上型型板１７ａには第７図に示すように樹脂注
入口１９が設けられている。The lower mold plate 17b is provided with a resin injection runner 18 for injecting resin into the mold as shown in FIGS. The upper die plate 17a is provided with a resin injection port 19 as shown in FIG.
下型型板１７ｂに第６図に示すような５つの同一の配線
パターンを有し、夫々に発光素子６及び受光素子７が配
設された金属板８を型の上に配置し、上型型板１７ａを
下型型板１７ｂ上に積層し、上型型板１７ａに設けられ
た注入口１９より透明樹脂を圧入する。透明樹脂は樹脂
注入ランナ１８を通って型２１内に流れ込み、発光素子
６及び受光素子７を樹脂内に封入していた。このとき、
型内の空気は第９図に示すような上下型板１７ａ，１７
ｂの間に設けた約0.02mmのエア抜き部２０より排出され
る構成であった。A metal plate 8 having five identical wiring patterns as shown in FIG. 6 on the lower mold plate 17b, on which the light emitting element 6 and the light receiving element 7 are arranged, is arranged on the mold, The mold plate 17a is laminated on the lower mold plate 17b, and transparent resin is press-fitted through the injection port 19 provided in the upper mold plate 17a. The transparent resin flows into the mold 21 through the resin injection runner 18, and the light emitting element 6 and the light receiving element 7 are enclosed in the resin. At this time,
The air in the mold is the upper and lower mold plates 17a, 17 as shown in FIG.
It was configured to be discharged from the air bleeding portion 20 of about 0.02 mm provided between b.
考案が解決しようとする課題 しかるに、従来の金型のランナ構造は注入口と型とを結
ぶ樹脂注入ランナだけであり、樹脂は型部分で封じ込め
られる構成とされていたため、型内にすでに注入された
樹脂が注入の勢いで樹脂注入ランナ方向に逆流し、後か
ら注入される樹脂と干渉し合って、型内でボイドが発生
してしまい、製品にボイドが残り、したがって、商品価
値が低下したり、製品が正常な動作をしなくなってしま
い、製品の歩留りが悪い等の問題点があった。However, the conventional mold runner structure is only the resin injection runner that connects the injection port and the mold.Since the resin is configured to be contained in the mold, it has already been injected into the mold. The resin flows backwards in the direction of the resin injection runner due to the force of injection, and interferes with the resin injected later, causing voids in the mold, leaving voids in the product, thus reducing the commercial value. However, the product does not operate normally, and the product yield is low.
本考案は上記の点に鑑みてなされたものでボイドが発生
しにくい金型のランナ構造を提供することを目的とす
る。The present invention has been made in view of the above points, and an object thereof is to provide a mold runner structure in which voids are unlikely to occur.
課題を解決するための手段 本考案は溶解した樹脂の流通路であるランナを介して該
溶解した樹脂を型内に導入する金型のランナ構造におい
て、 前記型の底面より下方に底面を有し、前記溶解した樹脂
を型内より排出する樹脂排出ランナと、 前記樹脂排出ランナ先端部に設けられ、前記樹脂排出ラ
ンナの底面より下方に底面を有し、前記溶解した樹脂を
蓄積する樹脂だまりとを具備してなる。Means for Solving the Problems The present invention is a mold runner structure for introducing a melted resin into a mold through a runner which is a flow passage for the melted resin, and has a bottom surface below the bottom surface of the mold. A resin discharge runner for discharging the melted resin from the mold; and a resin pool provided at the tip of the resin discharge runner, having a bottom surface below the bottom surface of the resin discharge runner, and accumulating the melted resin. It is equipped with.
作 用 本考案によれば、溶解した樹脂は導入用ランナより型内
に流れ込み、さらに、型より樹脂排出ランナを通って樹
脂だまりに到る。つまり、型は樹脂の通過点となる。こ
のため、樹脂だまり内において、すでに流れ込んだ樹脂
と、新たに流れ込む樹脂との間での干渉が生じることに
なり、型内では生じることはなくなる。According to the present invention, the melted resin flows into the mold from the introduction runner, and further reaches the resin pool from the mold through the resin discharge runner. That is, the mold serves as a passage point for the resin. Therefore, in the resin pool, interference between the resin that has already flown in and the resin that has flowed in newly occurs, and it will not occur in the mold.
また、樹脂排出ランナの底面は型底面より下方に位置す
るため、型から樹脂排出ランナへの樹脂の流れをスムー
ズにでき、樹脂だまりの底面は樹脂排出ランナの底面よ
り下方に位置するため、樹脂排出ランナから樹脂だまり
への樹脂の流れもスムーズにできる。Also, since the bottom surface of the resin discharge runner is located below the bottom surface of the mold, the flow of resin from the mold to the resin discharge runner can be made smooth, and the bottom surface of the resin pool is located below the bottom surface of the resin discharge runner. The resin can also flow smoothly from the discharge runner to the resin pool.
実施例 第１図，第３図は夫々本考案の一実施例の要部の平面図
を示す。図中、１ａは下型型板、１ｂは上型型板、２ａ
は下型部、２ｂは上型部、３は樹脂注入ランナ、４は樹
脂排出ランナ、５は樹脂だまりを示す。Embodiment FIG. 1 and FIG. 3 are plan views of the essential portions of an embodiment of the present invention. In the figure, 1a is a lower mold plate, 1b is an upper mold plate, 2a
Is a lower mold part, 2b is an upper mold part, 3 is a resin injection runner, 4 is a resin discharge runner, and 5 is a resin pool.
本実施例はＯ／Ｅ変換モジュールを透明な樹脂で封止す
る金型で、個々のＯ／Ｅ変換モジュールは小型であるた
め、第６図に示すように夫々に発光素子６及び受光素子
７を配設した５つの同一の配線パターンを有する金属板
８を用いて、同時に１つのモジュールを樹脂で封止し、
後に金属板８より切離す構成としてある。This embodiment is a mold for sealing the O / E conversion module with a transparent resin. Since each O / E conversion module is small, as shown in FIG. 6, the light emitting element 6 and the light receiving element 7 are respectively provided. Using the metal plate 8 having five identical wiring patterns in which
It is configured to be separated from the metal plate 8 later.
金属板８には位置決め用の穴部９が設けられ、これらの
うちの３個の穴部が下型型板１ａに設けられた３本の位
置決めピン１０に嵌合して、金属板７上の発光素子６及
び受光素子７が下型部２ａ上に配置されるよう位置決め
が行なわれる。位置決めピン１０はさらに型組立て時に
上型型板１ｂの位置決め孔と嵌合して上下型板の位置決
めも行なう。下型部２ａ内には第２図に示すように、金
属板８の配線パターンの端子部１２に対応する部分にコ
アピン１３ａ，１３ｂが設けられており、端子部１２が
樹脂で封止されない構成とされている。また、下型型板
１ａに設けられた下型部２ａの中心部には取り出し穴１
４が設けられており、下方よりピンにより上方に押圧す
ることにより、樹脂封止後樹脂が硬化した後に取り出し
が容易な構成とされている。The metal plate 8 is provided with positioning holes 9, and three of these holes are fitted to the three positioning pins 10 provided on the lower mold plate 1a, so that the metal plate 7 has The light emitting element 6 and the light receiving element 7 are positioned on the lower mold part 2a. The positioning pin 10 is further fitted to the positioning hole of the upper mold plate 1b at the time of assembling the mold to position the upper and lower mold plates. As shown in FIG. 2, core pins 13a and 13b are provided in the lower die portion 2a at the portions corresponding to the terminal portions 12 of the wiring pattern of the metal plate 8, and the terminal portions 12 are not sealed with resin. It is said that. Further, the take-out hole 1 is provided at the center of the lower mold part 2a provided on the lower mold plate 1a.
4 is provided, and the pin is pressed upward from below, so that it is easy to take out after the resin is cured and the resin is cured.
樹脂注入ランナ３，樹脂排出ランナ４，樹脂だまり５は
下型型板１ａに設けられ、第１図に示すように樹脂は下
型型板１ａに設けられた上型型板１ｂの注入口１５に対
向する注入部１６より５方向に略均等に分配される構成
とされている。また、樹脂の流れをスムーズにするため
に樹脂排出ランナ４の底面は下型部２ａの底面より下方
に位置するように形成され、樹脂だまり５の底面は樹脂
排出ランナ４の底面より下方に位置するように形成され
ている。The resin injection runner 3, the resin discharge runner 4, and the resin pool 5 are provided in the lower mold plate 1a, and as shown in FIG. 1, the resin is the injection port 15 of the upper mold plate 1b provided in the lower mold plate 1a. Is substantially evenly distributed in five directions from the injecting portion 16 opposed to. Further, in order to make the resin flow smooth, the bottom surface of the resin discharge runner 4 is formed below the bottom surface of the lower mold part 2 a, and the bottom surface of the resin pool 5 is located below the bottom surface of the resin discharge runner 4. Is formed.
樹脂の流れは上型型板１ｂの注入口１５より圧入され、
下型型板１ａの注入部１６より樹脂注入ランナ３を介し
て上下型部２ａ，２ｂで形成される型内に注入され、さ
らに、樹脂排出ランナ４を通って樹脂だめ５に注入され
る構成とされている。The resin flow is press-fitted from the injection port 15 of the upper mold plate 1b,
It is injected from the injection part 16 of the lower mold plate 1a through the resin injection runner 3 into the mold formed by the upper and lower mold parts 2a and 2b, and further is injected into the resin sump 5 through the resin discharge runner 4. It is said that.
このため、金属板８の上下に樹脂が回り込み、夫々の型
内で発光素子６及び受光素子７が樹脂に封入される。Therefore, the resin wraps around the upper and lower sides of the metal plate 8, and the light emitting element 6 and the light receiving element 7 are encapsulated in the resin in the respective molds.
金属板８は金型の下型型板１ａに発光素子６及び受光素
子７が設けられた面が下型部２ａと対向するよう配置さ
れる。金属板８の上より上型型板１ｂが載置され、上型
型板１ｂに設けられた注入口１５より樹脂が圧入されつ
つ注入される。樹脂は樹脂注入ランナ２を通り、上下型
部１ａ，１ｂで形成される空間に注入される。上下型部
１ａ，１ｂで形成される空間に注入された樹脂は上下型
部１ａ，１ｂを通過して、さらに、樹脂排出ランナ４に
注入され、樹脂排出ランナ４を通って、樹脂だまり５に
到る。The metal plate 8 is arranged so that the surface on which the light emitting element 6 and the light receiving element 7 are provided on the lower mold plate 1a of the mold faces the lower mold part 2a. The upper mold plate 1b is placed on the metal plate 8, and the resin is injected while being press-fitted from the injection port 15 provided in the upper mold plate 1b. The resin passes through the resin injection runner 2 and is injected into the space formed by the upper and lower mold portions 1a and 1b. The resin injected into the space formed by the upper and lower mold parts 1a and 1b passes through the upper and lower mold parts 1a and 1b, and is further injected into the resin discharge runner 4, passes through the resin discharge runner 4, and enters the resin pool 5. Arrive
つまり、上下型部２ａ，２ｂにより形成される型空間は
樹脂の通過点となる。このため、樹脂は樹脂だめ５で樹
脂の逆流等による干渉が起こり、樹脂にボイドが生じる
が、上下型部２ａ，２ｂで形成される型空間は単なる通
過点にすぎず、また、樹脂排出ランナ４の底面は下型部
２ａ底面より下方、樹脂だまり５の底面は樹脂排出ラン
ナ４の底面より下方に形成され、樹脂の流動方向に向っ
て底面が順次低く設定されると共に、空間が拡大してい
るため、干渉は生じなくなり、ボイドは発生しなくな
る。That is, the mold space formed by the upper and lower mold portions 2a and 2b serves as a resin passage point. Therefore, the resin causes interference in the resin sump 5 due to backflow of the resin and the like, and voids are generated in the resin. However, the mold space formed by the upper and lower mold parts 2a and 2b is merely a passing point, and the resin discharge runner The bottom surface of 4 is formed below the bottom surface of the lower mold portion 2a, and the bottom surface of the resin pool 5 is formed below the bottom surface of the resin discharge runner 4, and the bottom surface is set to be gradually lower in the resin flow direction and the space is expanded. Therefore, the interference does not occur and the void does not occur.
考案の効果 上述の如く、本考案によれば、型より樹脂を排出する排
出ランナを設けると共に排出ランナ端部に設けられ、樹
脂を蓄積する樹脂だまりを設けることにより、型部分は
樹脂の通過部分となり、また、樹脂排出ランナの底面は
型部の底面より下方に、樹脂だまりの底面は樹脂ランナ
の底面より下方に形成され、樹脂の流動方向に向かって
順次底面が低くなり、樹脂の干渉が生じなくなるため、
型内にボイドが生じにくくなり、製品の歩留りが向上す
る等の特長を有する。Effect of the Invention As described above, according to the present invention, the mold runner is provided with a discharge runner for discharging the resin, and a resin pool for accumulating the resin is provided at the end of the discharge runner. Also, the bottom surface of the resin discharge runner is formed below the bottom surface of the mold portion, and the bottom surface of the resin pool is formed below the bottom surface of the resin runner. Because it will not occur,
Voids are less likely to occur in the mold, and the product yield is improved.
第１図は本考案の一実施例の下型型板の平面図、第２図
は本考案の一実施例の要部の平面及びそのＡ−Ａ′断面
図、第３図は本考案の一実施例の上型型板の平面図、第
４図は本考案の一実施例の下型型板の側面図、第５図は
本考案の一実施例の組立時の要部の断面図、第６図はＯ
／Ｅ変換モジュールの配線パターンを示す図、第７図は
従来の一例の上型型板の平面図、第８図は従来の一例の
下型型板の平面図、第９図は従来の一例の組立時の要部
の断面図である。 １ａ…下型型板、１ｂ…上型型板、２ａ…下型部、２ｂ
…上型部、３…樹脂注入ランナ、４…樹脂排出ランナ、
５…樹脂だまり。FIG. 1 is a plan view of a lower mold plate according to an embodiment of the present invention, FIG. 2 is a plan view of a main part of the embodiment of the present invention and its AA ′ sectional view, and FIG. 3 is a view of the present invention. FIG. 4 is a plan view of an upper mold plate of one embodiment, FIG. 4 is a side view of a lower mold plate of one embodiment of the present invention, and FIG. 5 is a cross-sectional view of a main part of an embodiment of the present invention during assembly. , Fig. 6 is O
FIG. 7 is a plan view of an upper mold plate of an example of the related art, FIG. 8 is a plan view of a lower mold plate of the example of the related art, and FIG. 9 is an example of the related art. FIG. 6 is a cross-sectional view of a main part at the time of assembling. 1a ... Lower mold plate, 1b ... Upper mold plate, 2a ... Lower mold part, 2b
… Upper mold part, 3… Resin injection runner, 4… Resin discharge runner,
5 ... Resin pool.
Claims (1)
て該溶解した樹脂を型内に導入する金型のランナ構造に
おいて、 前記型の底面より下方に底面を有し、前記溶解した樹脂
を型内より排出する樹脂排出ランナと、 前記樹脂排出ランナ先端部に設けられ、前記樹脂排出ラ
ンナの底面より下方に底面を有し、前記溶解した樹脂を
蓄積する樹脂だまりとを具備してなる金型のランナ構
造。1. A runner structure of a mold for introducing the melted resin into a mold through a runner which is a flow passage for the melted resin, wherein the melted resin has a bottom surface below a bottom surface of the mold. A resin discharge runner for discharging the resin from the mold, and a resin pool provided at the tip of the resin discharge runner, having a bottom surface below the bottom surface of the resin discharge runner, and accumulating the melted resin. Mold runner structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988155791U JPH0621693Y2 (en) | 1988-11-30 | 1988-11-30 | Mold runner structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988155791U JPH0621693Y2 (en) | 1988-11-30 | 1988-11-30 | Mold runner structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0276015U JPH0276015U (en) | 1990-06-11 |
| JPH0621693Y2 true JPH0621693Y2 (en) | 1994-06-08 |
Family
ID=31433732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988155791U Expired - Lifetime JPH0621693Y2 (en) | 1988-11-30 | 1988-11-30 | Mold runner structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621693Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144804U (en) * | 1984-08-24 | 1986-03-25 | 日立工機株式会社 | gear switch |
-
1988
- 1988-11-30 JP JP1988155791U patent/JPH0621693Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0276015U (en) | 1990-06-11 |
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