JPH06216517A - Correcting method for folder bridge - Google Patents

Correcting method for folder bridge

Info

Publication number
JPH06216517A
JPH06216517A JP642593A JP642593A JPH06216517A JP H06216517 A JPH06216517 A JP H06216517A JP 642593 A JP642593 A JP 642593A JP 642593 A JP642593 A JP 642593A JP H06216517 A JPH06216517 A JP H06216517A
Authority
JP
Japan
Prior art keywords
solder
bridge
solder bridge
leads
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP642593A
Other languages
Japanese (ja)
Inventor
Hiroyuki Nakano
博之 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP642593A priority Critical patent/JPH06216517A/en
Publication of JPH06216517A publication Critical patent/JPH06216517A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To move solder forming a solder bridge on to leads by heating the leads bridged by the solder at high speed locally. CONSTITUTION:When voltage is applied to the feeding part 11 of a correction head 6, a heat chip 7 generates heat by its resistance. It is desirable that this heating should be performed at high speed. For example, it is so performed that the temperature may reach 280 deg.C within a second. Besides, it is desirable that leads or pads should be point-heated in a range of 0.01-0.20mm<2>, on this occasion. The heat chip 7 is positioned on leads 2 bridged by solder by observation with a with a microscope, etc. After that, voltage is applied to the feeding part 11, and the heat chip 7 is heated. By doing this way, the solder is separated and moves to the leads where it should originally be, and the solder bridge is corrected by the nature of solder that solder melted by heat generated by the heat chip 7 spreads and moves in a direction of higher solder temperature. Consequently, it becomes possible to move the solder forming the solder bridge on to the leads.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は基板上に実装されている
電子部品の半田ブリッジ修正方法に関し、特に半田を不
必要に除去しないようにした半田ブリッジ修正方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bridge repair method for electronic components mounted on a board, and more particularly to a solder bridge repair method for preventing unnecessary removal of solder.

【０００２】[0002]

【従来の技術】従来、この種の半田不良の修正技術とし
ては、例えば、特開平2-200376号公報に開示された技術
が知られている。この技術は、バキュームを利用した半
田吸い取り機を用いて、基板上の半田不良個所から過剰
あるいは不要な半田を吸い取るものである。また、特開
平1-237073号公報に開示された技術は、プリント基板の
不良半田に吸い取りワイヤを押し当て、不良半田を溶融
させて、不良半田をワイヤによる毛管現象を利用して、
吸い取り除去するものである。2. Description of the Related Art Conventionally, as a technique for correcting this type of solder defect, for example, the technique disclosed in Japanese Patent Application Laid-Open No. 2-200376 is known. In this technique, a solder sucker using vacuum is used to suck excess or unnecessary solder from a defective solder portion on a substrate. Further, the technology disclosed in JP-A 1-237073, the suction wire is pressed against the defective solder of the printed circuit board, the defective solder is melted, the defective solder utilizing the capillary phenomenon by the wire,
It is absorbed and removed.

【０００３】[0003]

【発明が解決しようとする課題】上記従来技術は、いず
れも、半田ブリッジを形成している半田を溶融し、その
後、何等かの手段で半田を吸い取り、除去するものであ
った。しかしながら、この種の方法による場合には、半
田ブリッジ修正時に、半田ブリッジを形成している半田
以外の半田、すなわち、本来必要な半田をも吸い取り・
除去し、半田の接合強度が低下するという問題がある。
これについて詳述すると、以下の通りである。近年、基
板への各電子部品の高密度実装化が要求され、例えば、
ＩＣパッケージのリードピッチは 当初２.５４ｍｍであ
ったものが、現在では、０.５mmと狭ピッチ化され、更
に、最近では０.３mmピッチ化が検討されていること
で、より重要になってきている。このように狭ピッチ化
が進んだＩＣパッケージの半田接合部の半田量は、従来
のリードピッチのものに比較して著しく少なくなってお
り、半田ブリッジ修正時に吸い取りによる修正を行う
と、半田接合部の接合強度が低下して、信頼性がなくな
るので、該当リード部への半田の供給が必要となる。本
発明は上記事情に鑑みてなされたもので、その目的とす
るところは、従来の技術における上述の如き問題を解消
し、半田を不必要に除去しないようにして、半田の接合
強度の低下を防止可能とした半田ブリッジ修正方法を提
供することにある。In all of the above-mentioned prior arts, the solder forming the solder bridge is melted, and then the solder is sucked and removed by some means. However, in the case of this type of method, at the time of repairing the solder bridge, the solder other than the solder forming the solder bridge, that is, the solder that is originally necessary is also absorbed.
There is a problem that the joint strength of the solder is reduced due to the removal.
This will be described in detail below. In recent years, high-density mounting of each electronic component on a substrate has been required, for example,
The lead pitch of the IC package was initially 2.54 mm, but now it is narrowed to 0.5 mm, and recently, 0.3 mm pitch is being considered, which is becoming more important. ing. In this way, the solder amount of the solder joint portion of the IC package whose pitch has been narrowed is remarkably smaller than that of the conventional lead pitch. Since the joint strength of No. 1 is reduced and the reliability is lost, it is necessary to supply solder to the corresponding lead portion. The present invention has been made in view of the above circumstances, and an object of the present invention is to solve the above-mentioned problems in the conventional technique and prevent the solder from being unnecessarily removed to reduce the joint strength of the solder. It is to provide a solder bridge repairing method that can be prevented.

【０００４】[0004]

【課題を解決するための手段】本発明の上記目的は、基
板上に実装されている電子部品の半田ブリッジを修正す
る方法であって、半田ブリッジが生じているリードを局
部的に高速加熱することにより、半田ブリッジを形成し
ている半田を溶融させ、この際、前記リードと半田ブリ
ッジが生じているリード間(半田ブリッジ部)に温度差を
生じさせて、前記半田ブリッジを形成していた半田を前
記リード上に移動させることを特徴とする半田ブリッジ
修正方法によって達成される。SUMMARY OF THE INVENTION The above object of the present invention is a method for correcting a solder bridge of an electronic component mounted on a substrate, in which a lead having a solder bridge is locally heated at high speed. By this, the solder forming the solder bridge is melted, and at this time, a temperature difference is generated between the lead and the lead (solder bridge portion) where the solder bridge is formed, and the solder bridge is formed. This is accomplished by a solder bridge repair method, which comprises moving solder onto the leads.

【０００５】[0005]

【作用】本発明に係る半田ブリッジ修正方法において
は、基板上に実装されている各電子部品の半田不良とし
て存在している半田ブリッジ部のリード(またはパッド)
を局部的に加熱することにより、半田ブリッジ部を形成
している半田を熱伝導により溶融すると同時に、リード
(またはパッド)と半田ブリッジ部に急激な温度差を与え
る。これにより、溶融した半田は、その性質により温度
の高い方へ濡れ広がり、加熱素子によって加熱されてい
るリード(またはパッド)の方へ移動し、しかも良好なフ
ィレット形状を形成するものである。In the solder bridge repair method according to the present invention, the lead (or pad) of the solder bridge portion existing as a defective solder of each electronic component mounted on the substrate
By locally heating the solder, the solder that forms the solder bridge is melted by heat conduction, and at the same time the lead
(Or a pad) and a solder bridge part are given a sharp temperature difference. As a result, the melted solder wets and spreads to a higher temperature due to its property, moves to the lead (or pad) heated by the heating element, and forms a good fillet shape.

【０００６】[0006]

【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。まず、半田ブリッジについて説明する。半
田ブリッジは、電子部品のリード間に発生し易いもので
ある。なお、以下の説明は、狭ピッチ多入出力ピンのＬ
ＳＩ(以下、単に「ＬＳＩ」という)を対象として、半田ブ
リッジの修正を行う場合を説明するものである。図２
に、上述の、本発明の対象とするＬＳＩ１の一例を示す
斜視図であり、半田印刷条件やＬＳＩ搭載ずれ，リフロ
ー条件等により、ピン２相互間に半田ブリッジ３が生じ
た例を示すものである。以下、第１の実施例を、図１お
よび図３〜図６に基づいて説明する。図１は、本発明の
一実施例に係る半田ブリッジ修正装置の概要を示す側面
図であり、図３は、修正ヘッドの拡大図で、(ａ)は正面
図、(ｂ)は側面図である。また、図４は、ヒートチップ
拡大図であり、(ａ)は正面図、(ｂ)は側面図、(ｃ)は先
端部の拡大図である。Embodiments of the present invention will now be described in detail with reference to the drawings. First, the solder bridge will be described. The solder bridge is likely to occur between the leads of the electronic component. In addition, the following explanation is for the narrow pitch multi-input / output pin L
A case where the solder bridge is corrected for SI (hereinafter, simply referred to as “LSI”) will be described. Figure 2
FIG. 3 is a perspective view showing an example of the LSI 1 to which the present invention is applied, showing an example in which a solder bridge 3 is generated between the pins 2 due to solder printing conditions, LSI mounting deviation, reflow conditions, and the like. is there. The first embodiment will be described below with reference to FIGS. 1 and 3 to 6. FIG. 1 is a side view showing an outline of a solder bridge repairing apparatus according to an embodiment of the present invention, FIG. 3 is an enlarged view of a repairing head, (a) is a front view, and (b) is a side view. is there. Further, FIG. 4 is an enlarged view of the heat chip, (a) is a front view, (b) is a side view, and (c) is an enlarged view of the tip portion.

【０００７】図１に示した半田ブリッジ修正装置５は、
半自動または全自動装置として機能するもので、修正ヘ
ッド６，Ｘ−Ｙテーブル９，加熱用電源(図示されてい
ない)および架台１０等から構成されている。修正ヘッ
ド６の給電部１１に電圧を印加することにより、ヒート
チップ７は、その抵抗により発熱する。この加熱は高速
に行うことが望ましく、例えば、１秒以内に ２８０0Ｃ
になるように行う。また、上述の加熱は、リードまたは
パッドを０.０１〜０.２０mm2の範囲でポイント加熱す
ることが望ましい。図５(ａ)に示されるように、半田ブ
リッジを形成しているリード２へ、チップ７を顕微鏡
(図示されていない)等による観察により、位置決めを行
う。位置決め後、給電部１１に電圧を印加し、ヒートチ
ップ７を加熱すると、ヒートチップ７の発熱により溶融
した半田が、図に示すように、半田の、温度が高い方へ
濡れ広がり移動する性質により、半田が本来あるべきリ
ードへ分離・移動して、半田ブリッジが修正される。The solder bridge repair apparatus 5 shown in FIG.
It functions as a semi-automatic or fully-automatic device, and is composed of a correction head 6, an XY table 9, a heating power source (not shown), a gantry 10 and the like. By applying a voltage to the power supply unit 11 of the correction head 6, the heat chip 7 generates heat due to its resistance. It is desirable to perform this heating at a high speed, and for example, within 2 seconds, 280 0 C
Do so. Further, in the above heating, it is desirable that the lead or pad be point-heated in the range of 0.01 to 0.20 mm 2 . As shown in FIG. 5A, the chip 7 is attached to the lead 2 forming the solder bridge by a microscope.
Positioning is performed by observation (not shown) or the like. After positioning, when a voltage is applied to the power supply unit 11 to heat the heat chip 7, the solder melted by the heat generated by the heat chip 7 has the property of spreading and moving toward the higher temperature of the solder as shown in the figure. , The solder is separated and moved to the proper lead, and the solder bridge is corrected.

【０００８】なお、図５(ｂ)は、ヒートチップ７をパッ
ド４に位置決めして加熱した場合を示している。この場
合にも、上と同様の作用により、半田の、温度が高い方
へ濡れ広がり移動する性質により、半田が本来あるべき
リードへ分離・移動して、半田ブリッジが修正される。
次に、図６に基づいて、第２の実施例を説明する。本実
施例は、加熱手段として、キセノンランプ等からの光ビ
ーム１２を用いるものである。半田ブリッジを形成して
いるリード２またはパッド４へ、光ビーム１２を照射す
ることで、半田を溶融し、上述の如き、半田の、温度が
高い方へ濡れ広がり移動する性質により、半田が本来あ
るべきリードへ分離・移動することにより、半田ブリッ
ジの修正が可能にするものである。次に、図７に基づい
て、第３の実施例を説明する。第１，第２の実施例で
は、半田ブリッジが２つのリード２間に形成されている
例を示したが、ここでは、半田ブリッジが連続する３つ
のリード２間に形成されている例を示す。FIG. 5B shows the case where the heat chip 7 is positioned on the pad 4 and heated. Also in this case, due to the same action as above, due to the property of the solder that spreads and spreads in the direction of higher temperature, the solder is separated and moved to the lead that should be, and the solder bridge is corrected.
Next, a second embodiment will be described with reference to FIG. In this embodiment, the light beam 12 from a xenon lamp or the like is used as the heating means. By irradiating the lead 2 or the pad 4 forming the solder bridge with the light beam 12, the solder is melted, and as described above, due to the nature of the solder that spreads and spreads to the higher temperature side, the solder is originally The solder bridge can be repaired by separating and moving to the desired lead. Next, a third embodiment will be described based on FIG. In the first and second embodiments, the example in which the solder bridge is formed between the two leads 2 is shown, but here, the example in which the solder bridge is formed between the three continuous leads 2 is shown. .

【０００９】この場合には、図に示す如く、３点を同時
に加熱することにより、半田を溶融し、上述の如き、半
田の、温度が高い方へ濡れ広がり移動する性質により、
半田が本来あるべきリードへ分離・移動することによ
り、半田ブリッジの修正が可能になるものである。ま
た、図示は省略したが、半田ブリッジが連続して３つ以
上のリード２間に形成されている場合に、連続した半田
ブリッジが形成されているリード２の本数以下(例え
ば、２つ)の個所を加熱することによっても、修正は可
能である。なお、上記各実施例はいずれも本発明の一例
を示したものであり、本発明はこれらに限定されるべき
ものではないことは言うまでもないことである。In this case, as shown in the figure, by heating three points at the same time, the solder is melted, and as described above, due to the nature of the solder that spreads and moves to the higher temperature side,
The solder bridge can be repaired by separating and moving the solder to the originally intended lead. Although illustration is omitted, when the solder bridge is continuously formed between three or more leads 2, the number of the leads 2 having the continuous solder bridge is less than or equal to the number of the leads 2 (for example, two). Correction can also be done by heating the location. It is needless to say that each of the above-mentioned embodiments shows an example of the present invention, and the present invention should not be limited to these.

【００１０】[0010]

【発明の効果】以上、詳細に説明した如く、本発明によ
れば、本来必要な半田をも吸い取り・除去しないように
して、半田の接合強度の低下を防止可能とした半田ブリ
ッジ修正方法を実現できるという顕著な効果を奏するも
のである。As described above in detail, according to the present invention, it is possible to realize a solder bridge correction method capable of preventing a decrease in the solder joint strength by absorbing and removing the originally necessary solder. It has a remarkable effect that it can be done.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例に係る半田ブリッジ修正装置
の概要を示す側面図である。FIG. 1 is a side view showing an outline of a solder bridge repairing device according to an embodiment of the present invention.

【図２】本発明の対象とするＬＳＩと半田ブリッジが形
成されている状況の一例を示す斜視図である。FIG. 2 is a perspective view showing an example of a situation in which an LSI and a solder bridge which are the objects of the present invention are formed.

【図３】図１に示した半田ブリッジ修正装置の修正ヘッ
ドの拡大図である。FIG. 3 is an enlarged view of a repair head of the solder bridge repair apparatus shown in FIG.

【図４】図３に示した修正ヘッドのヒートチップ拡大図
である。FIG. 4 is an enlarged view of a heat chip of the correction head shown in FIG.

【図５】実施例に係る半田ブリッジ修正装置の作用を示
す斜視図である。FIG. 5 is a perspective view showing an operation of the solder bridge repairing device according to the embodiment.

【図６】本発明の他の実施例に係る半田ブリッジ修正装
置の修正ヘッドとその動作説明図である。FIG. 6 is a correction head of a solder bridge correction device according to another embodiment of the present invention and an operation explanatory diagram thereof.

【図７】本発明の更に他の実施例に係る半田ブリッジ修
正装置の修正ヘッドとその動作説明図である。FIG. 7 is a diagram illustrating a repair head of a solder bridge repair device according to still another embodiment of the present invention and an operation explanatory diagram thereof.

【符号の説明】[Explanation of symbols]

１：ＬＳＩ、２：リード、３：半田ブリッジ、４：パッ
ド、５：半田ブリッジ修正装置、６：修正ヘッド、７：
ヒートチップ、９：Ｘ−Ｙテーブル、１０：架台、１
２：光ビーム。1: LSI, 2: Lead, 3: Solder bridge, 4: Pad, 5: Solder bridge repair device, 6: Repair head, 7:
Heat chip, 9: XY table, 10: Stand, 1
2: Light beam.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 基板上に実装されている電子部品の半田
ブリッジを修正する方法であって、半田ブリッジが生じ
ているリードを局部的に高速加熱することにより、半田
ブリッジを形成している半田を溶融させ、この際、前記
リードと半田ブリッジが生じているリード間(半田ブリ
ッジ部)に温度差を生じさせて、前記半田ブリッジを形
成していた半田を前記リード上に移動させることを特徴
とする半田ブリッジ修正方法。1. A method of correcting a solder bridge of an electronic component mounted on a substrate, wherein a solder bridge is formed by locally heating a lead having the solder bridge at high speed. And melting at this time, a temperature difference is generated between the lead and the lead where the solder bridge is generated (solder bridge portion), and the solder forming the solder bridge is moved onto the lead. How to fix solder bridge.
JP642593A 1993-01-19 1993-01-19 Correcting method for folder bridge Pending JPH06216517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP642593A JPH06216517A (en) 1993-01-19 1993-01-19 Correcting method for folder bridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP642593A JPH06216517A (en) 1993-01-19 1993-01-19 Correcting method for folder bridge

Publications (1)

Publication Number Publication Date
JPH06216517A true JPH06216517A (en) 1994-08-05

Family

ID=11638032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP642593A Pending JPH06216517A (en) 1993-01-19 1993-01-19 Correcting method for folder bridge

Country Status (1)

Country Link
JP (1) JPH06216517A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

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