JPH06216226A - Buffer member for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent decrease in quality of semiconductor devices due to an external shock during transfer of the semiconductor devices. CONSTITUTION:In a buffer member 101 for semiconductor devices installed between a tray group 107 in which a plurality of trays are stacked on which a plurality of semiconductor devices are respectively mounted and a container 109 for holding the tray group 107, unevenness parts are formed on the inner and outer surfaces of the buffer member 101, and protrusion parts 105-1 of the inner surface come into contact with the tray group 107 to fix the tray group 107, and protrusion parts 103 of the outer surface come into contact with the container 109 for holding the tray group 107 to fix the entire buffer member 101. Thus, even if an external shock is applied to the container 109 for holding the tray group 107, the protrusion parts 103 in contact with the container 109 correspond to recess parts 103-1 and as a result, a large force can be prevented from being directly applied to the semiconductor devices.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a buffer for a semiconductor device arranged between a tray group in which a plurality of trays each having a plurality of semiconductor devices mounted thereon are stacked, and a container for accommodating the tray group. It relates to members.

[0002]

2. Description of the Related Art Generally, when a semiconductor device is transported from a manufacturer to a user (user), a plurality of semiconductor devices are placed on a tray (semiconductor device storage container), and a plurality of the trays are put together in a box. It is stored in and transported. Such a conventional technique will be described with reference to the drawings.

When a semiconductor device is transported, first, as shown in FIG.
As shown in (a), the semiconductor device 401 is mounted on the tray 4
It is mounted on a predetermined part of 03. Although only one semiconductor device is shown in FIG. 4A, a plurality of semiconductor devices are placed on this tray 403. This tray 40
3 is the same as that usually used. Further, the semiconductor device 401 has external leads, which are not shown but are known, as is known.

Next, as shown in FIG. 4B, a plurality of trays 403 on which the semiconductor devices are mounted are stacked and bundled with a string-shaped one 405 to form one tray group 40.
7

Next, as shown in FIG. 5, the tray group 4
07 is surrounded by a cushioning member 409 and is housed in a box 411, and then transported. The cushioning member 409 protects the semiconductor device from shock and vibration during transportation, and is generally made of urethane. The process in which the tray group 407 is surrounded by the cushioning member 409 is shown in FIG.
It is shown in (a) to FIG. 6 (f). In this case, the enclosed tray group 407 is not shown. Buffer member 409
Is a first member 409-1, a second member 409-2, a third member 409-3, a fourth member 409-4, a fifth member 409-5, and a sixth member 409-6. Consists of. When enclosing the tray group 407, first, FIGS.
As shown in (d), the first member 409-1 to the fifth member 409-5 are sequentially stacked, and the tray group 40 is placed thereon.
7 is placed. Next, as shown in FIG. 6 (e), each member is bent along the tray group 407 (not shown), and thereafter, as shown in FIG. 6 (f), each member is bent. A sixth member 409-6 is placed on top to complete the enclosure. Then, the enclosed tray group 40
7 is accommodated in the box 411 and transported as described above.

[0006]

However, since the buffer member as described above has a plate-like structure, an external impact such as a drop or vibration that occurs during transportation (although it may be somewhat mitigated). ) Since it is directly transmitted to the tray group, any tray in the tray group is displaced, a large force is applied to the semiconductor device, the external lead of the semiconductor device is bent, etc. It was happening. In addition to external problems such as bending of the external lead, external shock such as vibration may adversely affect the circuit portion of the semiconductor device in terms of quality. In the semiconductor industry, quality requirements from manufacturers for users are extremely high, and these problems are serious.

Further, as described above with reference to FIG. 6, enclosing the tray group requires a large amount of cushioning members and a large number of work steps. Further, when the user takes out the tray group, a wide space for temporarily storing the unnecessary cushioning member such as urethane is required.

Further, since the buffer member has a plate-like structure,
For the material itself, an organic polymer material such as urethane must be used to absorb external shock. Current,
Recycling of such organic polymer materials has not been socially established, and the cushioning member is in a disposable state, which is a waste of resources from the viewpoint of environmental protection.

The present invention provides a cushioning member for a semiconductor device which solves various problems as described above.

[0010]

In order to solve the above-mentioned problems, the present invention provides a tray group in which a plurality of trays each having a plurality of semiconductor devices mounted thereon are stacked, and a container for accommodating the tray groups. A cushioning member for a semiconductor device arranged between a first member having a first inner surface and a first outer surface, wherein the first inner surface has a plurality of first recesses and A plurality of first protrusions are formed between the first recesses, and the first outer surface has the first protrusions.
A first member having a second convex portion formed by a concave portion of the second member, and a second member having a second inner surface and a second outer surface, and the second inner surface has a plurality of members. Second concave portion and a plurality of third convex portions formed between the second concave portions, respectively, and a fourth convex portion formed by the second concave portion on the second outer surface. A second member having a portion, and the tray group is surrounded by abutting the first member and the second member, and the first member
The convex portion and the third convex portion are in contact with the tray group, and the second and fourth convex portions are in contact with the container.

[0011]

According to the present invention, as described above, that is, the inner surface and the outer surface of the cushioning member are made uneven, and the projections on the inner surface (corresponding to the recesses on the outer surface) contact the tray group. Then, the tray group is fixed, and the convex portion on the outer surface (corresponding to the concave portion on the inner surface) comes into contact with the container for accommodating the tray group so as to fix the entire cushioning member. Even if an external impact is applied to the container, the convex portion in contact with the container corresponds to the concave portion on the inner surface, so that the force directly transmitted to the semiconductor device becomes small. Therefore, the above-mentioned problems can be solved.

[0012]

Embodiments of the present invention will be described with reference to FIGS. 1, 2 and 3.

FIG. 1 shows the structure of the cushioning member 101 of the present invention when viewed from the outer surface side. The outer surface has a convex portion 1
03 and concave portions 105 are alternately formed. FIG. 2 shows the structure when the cushioning member 101 is viewed from the inner surface side. On the inner surface, concave portions 103-1 formed by the convex portions 103 on the outer surface and convex portions 105-1 formed by the concave portions 105 on the outer surface are alternately formed.

FIG. 3 shows an example in which the tray group 107 is surrounded by the cushioning member 101 of the present invention and is housed in a box-shaped container 109. The tray group 107 is formed by stacking a plurality of trays on which a plurality of semiconductor devices are mounted, as in the conventional case, and bundling the trays with a string-shaped member 111. The tray group 107 includes the first buffer member 101-
1 and the second cushioning member 101-2, the container 10 is surrounded.
It is stored in 9. Since the cushioning member 101 has a shape having irregularities on the inner surface and the outer surface, the convex portion 105-1 on the inner surface contacts the tray group 107 to fix the tray group 107, and the cushioning member is provided on the inner surface of the container 109. The convex portion 103 on the outer surface of 101 comes into contact with the cushioning member 101 to fix the entire cushioning member 101. By carrying in this way, the tray group 1
Even if an external impact is applied to the container 109 in which 07 is accommodated, since the convex portion 103 in contact with the container 109 corresponds to the concave portion 103-1 on the inner surface, the semiconductor device is directly connected to the semiconductor device.
The transmitted power becomes smaller.

Further, since the shock absorbing member 101 of the present invention can absorb external impact by the uneven shape, the material is not limited to the organic polymer material, but is formed of paper (pulp molded product) mainly made of recycled paper. Has been done.

In the present embodiment, the cushioning member 101 of the present invention is shaped like a triangular prism, but the shape is not limited to this, but the triangular prism shape increases the degree of freedom in the surrounding work. That is, after enclosing the tray group 107 with the cushioning member wrap 101, the tray group 107 is housed in the container 109, and the first cushioning member 101-1 is housed in the container 109 first, and the tray group 107 is placed there. After that, the second cushioning member 101-2 can be placed on the tray group 107 and surrounded.

[0017]

As described above, according to the present invention,
Even if an external impact is applied to the container during transportation, the force directly transmitted to the semiconductor device is reduced, so that it is possible to prevent deterioration of quality due to the external impact.

Further, according to the present invention, the work process for accommodating the tray group in the container can be greatly shortened as compared with the conventional case.

Further, according to the present invention, since the cushioning member is small in amount for the user, the space for temporarily storing the cushioning member is small.

Further, according to the present invention, since papers can be used as the material of the cushioning member, recycling of papers has become popular in society, and it is also effective in terms of environmental protection. .

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing an example of the present invention.

FIG. 3 is a diagram showing an example of the present invention.

FIG. 4 is a diagram for explaining a conventional example.

FIG. 5 is a diagram for explaining a conventional example.

FIG. 6 is a diagram illustrating a conventional work process.

[Explanation of symbols]

 101 Cushioning member 103 Convex portion on outer surface 103-1 Recessed portion on inner surface 105 Recessed portion on outer surface 105-1 Convex portion on inner surface 107 Tray group 109 Container

Claims (4)

[Claims] 1. A cushioning member for a semiconductor device, which is arranged between a tray group in which a plurality of trays each having a plurality of semiconductor devices mounted thereon are stacked, and a container for accommodating the tray group. A first member having an inner surface and a first outer surface, wherein the first inner surface has a plurality of first recesses and a plurality of first recesses formed between the first recesses. The first member having a convex portion and the second convex portion formed by the first concave portion on the first outer surface, and the second inner surface and the second outer surface. The second member, wherein the second inner surface has a plurality of second recesses and a plurality of third protrusions formed between the second recesses, respectively. The outer surface is provided with the second member having a fourth protrusion formed by the second recess, The tray group is surrounded by abutting the first member and the second member, and the first convex portion and the third convex portion are in contact with the tray group, and the second and the second members are in contact with each other. Four
The cushioning member for a semiconductor device, wherein the convex portion of the contact member contacts the container. 2. The first member encloses approximately one half of the substantially total surface of the tray group, and the second member encloses the remaining approximately half surface. The cushioning member for a semiconductor device according to claim 1. 3. The tray group includes an upper surface, a lower surface facing the upper surface, a first side surface, and a second side facing the first side surface.
3. The second member according to claim 2, wherein the first member surrounds the upper surface and the first side surface, and the second member surrounds the lower surface and the second side surface. Buffer member for semiconductor device. 4. The cushioning member for a semiconductor device according to claim 1, wherein the material of the first and second members is paper.