JPH0621614A - Method of inserting wire by wire bonding device - Google Patents

Abstract

PURPOSE:To improve the productivity by automatically inserting a wire into a groove, concerning the wire insertion method by a wire bonding device for inserting a wire into the groove or the wire guide arranged on a printed board. CONSTITUTION:A wire 4 is shifted to above a groove 6 and is pressed, being hooked with wire hookers 2 and 2a, whereby it is bent to be in the same direction as the wire insertion part of a wire guide 3. The wire 4 is inserted in a groove 6, being pressed with wire hooks 2 and 2a and lowered in Z1 direction. The wire hooks 2 and 2a are separated from the wire 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire insertion method for a wire bonding apparatus, and more particularly to a wire insertion method for a wire bonding apparatus for inserting a wire into a groove or a wire guide provided on a printed circuit board.

In recent years, the density of printed circuit boards for medium and large computers has been increasing in order to improve the performance of computers, and the wires connecting the bonding pads of the printed circuit boards have been considerably miniaturized. Therefore, it is difficult to insert the coated fine wire into a thin groove or wire guide provided on the printed circuit board during routing (wiring the wire to a desired position between bonding pads). It has become.

Further, by wire-bonding a twin wire which is a set of two wires of a signal wire and a ground wire, it is difficult for noise to get on the wire which becomes a signal wire and the reliability of the computer is improved. Is being done. In this way, by miniaturizing the wire and using twin wires,
Handling wires during routing is becoming more difficult.

[0004]

2. Description of the Related Art Conventionally, one uncoated wire (single wire) has been bonded by a wire bonding device dedicated to a single wire. In this case, it suffices to simply route and bond the two pads linearly so as not to come into contact with other wires.
This wire bonding device cannot handle twin wires, and is configured to perform only linear wiring.

For this reason, the routing work of the covered twin wires has been performed manually by an operator while holding the twin wires with tweezers and looking into a microscope or the like.

[0006]

However, as described above, it has become more difficult to handle wires during routing due to the high density of the printed circuit board, and the conventional method has a problem of low productivity. .

In view of the above points, it is an object of the present invention to provide a wire insertion method for a wire bonding apparatus which can easily route a high-density printed circuit board and has high productivity.

[0008]

In order to solve the above problems, the present invention has the following configuration.

That is, according to the first aspect of the invention, the wire is gripped by the first gripping means and the second gripping means, and the groove of the guiding means is provided in the groove provided on the substrate and has the hooking portion. In a wire insertion method of a wire bonding device for inserting a wire into a groove via wire insertion portions arranged in different directions, a wire for controlling movement of each of the first and second gripping means holding the wire above the groove. A moving step, a wire bending step of controlling the movement of the first and second pressing means to press the wire so that the wire is bent in the same direction as the wire insertion portion above the guide means; A wire insertion step of pressing the wire by controlling the movement of the first and second pressing means so that the wire is inserted into the groove through the insertion portion and is hooked by the hooking portion. Two
The first and second pressing means so as to separate the pressing means from the wire.
And a separating step of controlling the movement of the pressing means.

[0010]

According to the present invention having the above-described structure, the wire is inserted into the groove through the wire insertion portion, and is operated by the hook portion so that the wire does not come out of the groove.

[0011]

1 is a block diagram for carrying out the present invention, FIG.
3 and FIG. 3 are views showing details of FIG.

The wire insertion device 10 shown in FIG.
An XY table 11, a wire gripping hand 1 (first gripping means) and a wire gripping hand 1a (second gripping means),
Wire hooking device 2 (first pressing means), wire hooking device 2a (second pressing means), wire guide 3
(Guide means) and guide pin 7 (bar-shaped member). The printed board 8 is placed on the XY table 11, and the controller 16 controls the movement of the printed board 8 in both the XY directions.

An LS (not shown) is provided on the printed circuit board 8.
I (Large Scale Integrated Circuit) is mounted on the interposer (Int), which has a substantially square shape to establish electrical connection with the printed circuit board 8.
A plurality of erposers 5 are arranged at predetermined intervals. As a result, grooves 6 are formed orthogonally between the interposers 5,
The wire 4 is routed in the groove 6.

The wire gripping hands 1 and 1a are controlled by the controller 17
Is controlled to be opened and closed to grip the wire 4, and XY
The wire 4 is controlled to move in the Z3 direction and around the Z axis to apply a predetermined tension to the wire 4, and the wire 4 is arranged at a desired position on the printed board 8 in a desired orientation.

As shown in FIG. 2, the wire hooking devices 2 and 2a are formed substantially perpendicular to the Z-direction pressing surface 2b and the Z-direction pressing surface 2b arranged so as to face the printed circuit board (see FIG. 1). A wire hooking portion 2d in the form of a notch, which is composed of the XY direction pressing surface 2c, and the wire 4 has both surfaces 2b,
It is shaped so as to abut on 2c at the same time. The wire hooking devices 2, 2a are controlled to move in the XYZ3 directions by the control device 18, the wire 4 is pressed in the direction of the printed circuit board 8 by the Z direction pressing surface 2b, and the surface direction of the printed circuit board 8 is pressed by the XY direction pressing surface 2c. To do.

Returning to FIG. 1, the guide pin 7 is formed in a rod shape and is arranged perpendicular to the printed circuit board 8, and is controlled to move in the Z direction by the controller 19. The respective control devices are generally controlled by the control device 20.

The wire guide 3 arranged at the intersection of the grooves 6
As shown in FIG. 3, a guide member 3a having a substantially triangular shape on the upper portion of a quadrangular prism and an arcuate cutout formed at the corner is formed as shown in FIG.
The wire insertion portions 3b are formed between the respective guide members 3a by combining them separately. Therefore, the directions of the wire insertion portions 3b are different from each other in the XY plane with respect to the directions of the grooves, which are not shown in the figure, respectively arranged in the X direction and the Y direction. Further, the substantially triangular portion forms a hooking portion 3c, and an arc-shaped opening 3d is formed at the center of each guide member 3a.

Subsequently, the wire 4 held by the wire gripping hand 1 is cut into the groove 6 by the wire inserting device 10 described above.
A method of inserting the wire guide 3 into the wire insertion portion 3b of the wire guide 3 will be described.

FIG. 4 is a process explanatory view of the first embodiment of the present invention. This figure shows an example in which the wire 4 is routed in a straight line. In the figure, the same components as those in FIGS. 1 to 3 are designated by the same reference numerals.

First, the wire 4 having one end bonded
Is grasped by the wire grasping hands 1 and 1a arranged at a predetermined interval (the wire grasping hand 1 side is assumed to be bonded), and the XY table (see FIG. 1) and the wire grasping hands 1 and 1a are printed circuit board ( The wire 4 in the gripped state is positioned above the groove 6 and on the same straight line as the groove 6 (see FIG. 1A). At this time, the wire gripping hands 1 and 1a apply a tensile force to the wire 4 in the directions of the arrows X ₁ and X ₂ , and a desired tension is applied to the wire 4 so that the wire 4 has a linear shape.

Next, the wire hooking devices 2, 2a are moved above the wire 4 in a state of being separated from the wire 4 so that the wire hooking devices 2, 2a can come into contact with the wire 4 (see FIG. 4 ( B)).

Next, the wire hooking devices 2 and 2a are shown in FIG.
After being lowered in the direction of the middle arrow Z ₁ to bring the respective XY-direction pressing surfaces into contact with the wire 4, the wire hooking devices 2, 2a are further moved in the directions of the arrows Y ₁ , Y ₂ to bend the wire 4, The wire 4 is made to have substantially the same inclination as the straight line of the wire insertion portion 3b between the wire hooking devices 2 and 2a (FIG. 4C, wire bending step).

Subsequently, the wire hooking devices 2, 2a are further lowered in the direction of the arrow Z _{1 in} FIG. 1 to bring the respective Z-direction pressing surfaces of the wire hooking devices 2, 2a into contact with the wires 4, and the wires 4 are printed. Insert in the groove by pressing in the direction (wire insertion step). At this time, the wire 4 is inserted from the wire insertion portion 3b.

Then, when the wire hooking devices 2, 2a are moved in the directions of the arrows Y ₂ , Y _{1 respectively} to separate the wire hooking devices 2, 2a from the wire 4, the pressing force on the wire 4 does not act. (FIG. 4 (D) separation step).

In this way, one wire insertion work is completed, and the wire 4 is linearly inserted into the groove and disposed below the hooking portion 3c of the wire guide 3, so that the wire guide 3 can be easily inserted. It never comes out.

Next, FIG. 5 is a process explanatory view of the second embodiment of the present invention. This figure shows an example in which the wire 4 is routed at a right angle. In the figure, the same components as those in FIGS. 1 to 3 are designated by the same reference numerals.

First, the wire 4 having one end bonded
Is grasped by the wire grasping hands 1 and 1a arranged at a predetermined interval (the wire grasping hand 1 side is assumed to be bonded), and the XY table 11 and the wire grasping hands 1 and 1a are moved in the plane direction of the printed circuit board 8. The wire 4 in the gripped state is moved and positioned above the groove 6 on the same straight line as the groove 6 (FIG. 5 (A) wire moving step). At this time,
The wire gripping hands 1, 1a are attached to the wire 4 by the arrows X ₁ , X.
A pulling force in _two directions is applied, and a desired tension is applied to the wire 4 to make it linear.

Next, the XY table 11 and the guide pin 7
Is controlled to move parallel to the printed circuit board to position the guide pin 7 above the wire guide 3, and then the guide pin 7 is lowered in the Z ₁ direction in FIG. 1 to be inserted into the central opening of the wire guide 3 (rod-shaped member moving step). ).

Subsequently, the wire 4 is hooked on the guide pin 7, and the wire gripping hand 1a is rotated 90 ° counterclockwise around the guide pin 7 as a rotation center.
Is bent (FIG. 5 (B) wire tension step). At this time, the wire gripping hand 1 applies a pulling force in the arrow X ₁ direction and the wire gripping hand 1a applies a pulling force in the arrow Y ₁ direction to the wire 4, respectively.
Is a right angle.

Further, the wire hooking devices 2, 2a are moved above the wire 4 in a state of being separated from the wire 4 so that the wire hooking devices 2, 2a can come into contact with the wire 4.

Next, the wire hooking devices 2 and 2a are shown in FIG.
After being lowered in the direction of the middle arrow Z ₁ to bring the respective XY-direction pressing surfaces into contact with the wire 4, the wire hooking device 2, 2a is further moved in the direction of the arrow Y ₁ , X ₂ so that the wire 4 is hooked by the wire hooking device. Bend between 2 and 2a so as to substantially coincide with the orthogonal portion of the wire insertion portion 3b (FIG. 5C, wire bending step).

Subsequently, the wire hooking devices 2, 2a are further lowered in the direction of the arrow Z _{1 in} FIG. 1 to bring the respective Z-direction pressing surfaces of the wire hooking devices 2, 2a into contact with the wire 4, and the wire 4 is printed. Insert in the groove by pressing in the direction (wire insertion step). At this time, the wire 4 is inserted from the wire insertion portion 3b.

Then, when the wire hooking devices 2, 2a are moved in the directions of the arrows Y ₂ , X _{1 respectively} to separate the wire hooking devices 2, 2a from the wire 4, the pressing force on the wire 4 does not act. (FIG. 5 (D) separation step).

In this way, one wire insertion operation is completed, the wire 4 is inserted into the groove at a right angle, is disposed below the hook portion 3c of the wire guide 3, and easily comes out of the wire guide 3. There is no such thing. And the wire gripping hand 1
The wire 4 can be routed to a desired position by moving the wire 4 to grasp another portion of the wire 4 and subsequently repeating the next wire insertion operation of a straight line or a right angle.

The wiring material may be either a single wire or a twin wire, and a flexible wiring material other than the wiring material for bonding to the printed board may be inserted into the groove by the above method. Can be done.

The wire hooking portion 2d of the wire hooking device 2 or 2a is not limited to the one formed by two planes that are substantially orthogonal to each other, and the surface facing the printed circuit board 8 and the surface substantially perpendicular to this surface are continuous. For example, a “U” -shaped groove may be formed as the curved surface.

[0037]

As described above, according to the present invention, since the wires are automatically arranged linearly in the groove without manual labor, a high-density printed circuit board can be easily bonded and wired. It has the feature that it is possible to improve productivity.

[Brief description of drawings]

FIG. 1 is a configuration diagram for implementing the present invention.

FIG. 2 is a view showing the wire hooking device of FIG.

3 is a diagram showing the wire guide of FIG. 1. FIG.

FIG. 4 is a process explanatory view of the first embodiment of the present invention.

FIG. 5 is a process explanatory view of the second embodiment of the present invention.

[Explanation of symbols]

 1 wire gripping hand (first gripping means) 1a wire gripping hand (second gripping means) 2 wire hooking tool (first pressing means) 2a wire hooking tool (second pressing means) 2b Z-direction pressing surface 2c XY direction pressing surface 2d Wire hooking portion 3 Wire guide (guide means) 3a Guide member 3b Wire inserting portion 3c Hooking portion 4 Wire 6 Groove 7 Guide pin (bar-shaped member)

Claims (3)

[Claims] 1. A wire (4) is gripped by a first gripping means (1) and a second gripping means (1a), and the wire (4) is provided in a groove (6) provided in a substrate (8) and hooked therein. Wire bonding for inserting the wire (4) into the groove (6) through the wire insertion part (3b) arranged in a direction different from the groove (6) of the guide means (3) having the part (3c). In the wire insertion method of the device, the wire (4) is fixed to the first and second gripping means (1, 1).
a) a wire moving step of grasping by a) and moving above the groove (6), and bending the wire (4) in substantially the same direction as the wire insertion portion (3b) above the guide means (3). As described above, a wire bending step of controlling the movement of the first and second pressing means (2, 2a) to press the wire (4), and the wire (4) is inserted through the insertion portion. The wire (4) is moved by controlling the movement of the first and second pressing means (2, 2a) so that the wire is inserted into the groove (6) and is brought into a position to be locked by the locking portion (3c). And a wire insertion step of pressing the first and second pressing means (2, 2a) so as to separate the first and second pressing means (2, 2a) from the wire (4). A wire insertion method for a wire bonding apparatus, comprising: 2. A rod-shaped member moving step of arranging a rod-shaped member (7) disposed substantially perpendicular to the substrate (8) above the intersection of the groove (6) after the wire moving step, A wire (4) is stretched around the rod-like member (7), and the second gripping means (1a) is moved so that the wire (4) is located above each groove (6) intersecting at the intersection. The wire inserting method of the wire bonding apparatus according to claim 1, further comprising a wire tensioning step of controlling. 3. The first and second pressing means (2, 2)
When pressing the wire (4) with a), the first
The wire insertion method for a wire bonding apparatus according to claim 1 or 2, wherein the second gripping means (1, 1a) is controlled to apply a predetermined tension to the wire (4).