JPH0621121A - Method and apparatus for resin sealing molding of electronic component - Google Patents

Abstract

PURPOSE:To prevent the mixing or entrainment of gas and moisture into a fused resin material by discharging air and moisture remaining in a space constituted between double-type die surfaces and gas and moisture, which flow out of a resin tablet R to the outside of the above described space. CONSTITUTION:An irregular part 61, which is made to communicate with a thermal-expansion space part S of a resin tablet R is formed at the tip surface of a plunger 60. Gas and moisture, which tend to remain in the thermal- expansion space part, are made to flow out to the outside. One end part of the resin tablet R is thermally attached to an engaging projection part, which is provided at the cull of a metal mold. Under the state wherein the plunger 60 is retreated, the resin tablet is thermally expanded, and the formation of the thermal-expansion space part S at both end parts of the resin tablet is prevented. The air and the moisture, which remain in the space part constituted between both die surfaces, are forcibly sucked and discharged to the outside. Thus, the gas and the moisture, which flow out of the inside of the resin tablet R, are also sucked and discharged to the outside at the same time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, ICs and LSs.
The present invention relates to an improvement in a method and apparatus for sealing and molding electronic components such as I, diodes, and capacitors with resin.

[0002]

2. Description of the Related Art A transfer molding method has been conventionally used for sealing and molding an electronic component with a thermosetting resin material such as an epoxy resin. This method is, for example, as shown in FIG. It is usually carried out as follows using a resin molding die.

That is, the upper mold 1 and the lower mold 2 are preheated to the resin molding temperature by heating means (1a, 2a) such as a heater. Next, the lead frame 3 on which the electronic component 3a is mounted is fitted and set at a predetermined position of the recess 4 provided on the mold surface of the lower mold, and the resin tablet R is supplied into the pot 5. Next, the lower mold 2 is moved upward to clamp the upper and lower molds (1 and 2), and the lead frame 3 around the electronic component and its periphery is placed on the parting line (PL) surface of the upper and lower molds. Fit and set in both upper and lower cavities (1b ・ 2b). Next, the resin tablet R in the pot 5 is pressurized by the plunger 6, and the molten resin material heated and melted by the heating means is provided between the pot 5 and both upper and lower cavities (1b and 2b). A resin passage 7 is used to fill and fill both cavities. Therefore, the electronic component 3a and the lead frame 3 around the electronic component 3a are molded in correspondence with the shapes of the upper and lower cavities (1b, 2b) and the resin-sealed molded body 8 (mold package).
After the resin is cured, the lower mold 2 is moved downward to open the upper and lower molds (1 and 2) again, and substantially simultaneously with the mold opening of the upper and lower molds. The resin sealing molding 8 in the cavity (1b, 2b) and the cured resin 9 in the lead frame 3 and the resin passage 7 are separated by the mold release mechanism (1c, 2c) into upper and lower molds (1.
2) It should be projected in the middle and released.

Air remains in the cavities (1b, 2b) formed when the upper and lower molds (1, 2) are clamped. For this reason, when this is mixed in the molten resin material injected and filled in both cavities, a void is formed inside the resin-sealed molded body 8, and this also creates a void in both cavities (1b.
There is a serious problem that a defect is left on the interface between b) and the resin-sealed molded body 8 to form a defect on the surface of the resin-sealed molded body, impairing the moisture resistance and durability of the product. Therefore, by utilizing the action of injecting and filling the molten resin material into both cavities (1b and 2b), the air remaining in both cavities is naturally discharged from the air vent 1d to the outside or it is vacuumed. It is forcibly discharged outside by pulling.

[0005]

By the way, in this way, even if the residual air in both cavities (1b, 2b) is naturally or forcibly discharged to the outside, resin sealing molding is performed. The fact is that it is not possible to reliably prevent the formation of voids or defective portions inside and outside the body 8, but this is considered to be based on the following factors.

That is, the resin tablet R supplied into the pot 5 contains a large amount of air and is in a state of absorbing moisture in the atmosphere. Therefore, when such a resin tablet R is heated and melted in the pot 5 part, it is ensured that the air and water contained therein, and further the gas generated at the time of heating is mixed into the molten resin material. This is because it cannot be prevented. For example, resin tablet R
Is supplied into the pot 5 in a heated state, the resin tablet thermally expands in the pot 5, but since the lower end surface of the resin tablet R and the upper end surface of the resin pressurizing plunger 6 are joined. , The downward thermal expansion effect is suppressed, and thermal expansion is performed toward the upper space. At this time, a thermal expansion space S as shown in FIG. 8 is formed at the lower end of the resin tablet joined to the upper end surface of the resin pressing plunger. Therefore, the thermal expansion space S
Air and moisture will remain inside, and this will be mixed into the molten resin material and injected into the cavity.

In view of this, the present invention provides a space portion formed between the mold surfaces of both molds, that is, a resin tablet housing portion including a pot and a cull for transferring the molten resin material when the molds are clamped. Air and moisture remaining in the passages and air vents,
Efficiently and reliably discharge the gas (air contained in the resin tablet and the gas generated during heating) and moisture flowing out of the resin tablet out of the space, and the gas, moisture, etc. are discharged into the molten resin material. A product with high quality and high reliability in which voids and defects are not formed inside and outside the resin-sealed molded body by preventing mixing or entrapment in the molten resin material. An object of the present invention is to provide a resin encapsulation molding method and an apparatus for the same, which are capable of molding electronic parts.

[0008]

In the resin encapsulation molding method for an electronic component according to the present invention for solving the above-mentioned technical problems, a resin tablet is supplied to a housing portion composed of a pot and a cull of a mold. At the same time, by heating and melting the resin tablet in the containing portion and pressurizing and transferring the molten resin material to inject and fill the cavity into the cavity, an electronic component that is resin-sealed and molded into the cavity is set. A resin encapsulation molding method, wherein by forming a required uneven portion on the tip end surface of the resin pressure plunger that is joined to the resin tablet in the accommodation portion, in the step of thermally expanding the resin tablet in the accommodation portion, The gas and / or water in the thermal expansion space of the resin tablet generated on the joint surface with the tip end surface of the resin pressurizing plunger is used for the unevenness of the plunger tip end surface. It is characterized in that to flow out of the thermal expansion space through.

Further, in the method of resin-sealing and molding an electronic component according to the present invention, a resin tablet is supplied to a housing portion composed of a pot and a cull of a mold, the resin tablet in the housing portion is heated and melted, and A resin encapsulation molding method for an electronic component, wherein an electronic component fitted and set in the cavity is resin-encapsulated by injecting and filling a molten resin material into the cavity to fill the cavity. In the step of heating and expanding the resin tablet in the housing portion by forming a required engaging protrusion to attach a part of the one end side of the tablet, a part of the one end side of the resin tablet is pressed by the resin pressurizing plunger. Press on the engaging projection of the cull to temporarily attach it by heat,
After that, the resin pressurizing plunger is retracted, and thermal expansion of the resin tablet is performed in this state.

The present invention also provides, in the above method,
When the two molds are clamped, the residual air and / or water in the space formed between the mold surfaces is forcibly sucked and discharged to the outside, so that the gas and / or water flowing out from the inside of the resin tablet Is also characterized in that it is simultaneously sucked and discharged to the outside.

The resin encapsulation molding apparatus for electronic parts according to the present invention includes a fixed die, a movable die opposed to the fixed die, and a pot provided on one of the two dies. A cull opposite to the mold position on the other side corresponding to the position of the pot,
The heating means for the resin tablet supplied to the containing portion consisting of the pot and the cull, the plunger for pressurizing the resin tablet, and the molten resin material in the containing portion heated and melted by the heating means and the pressing plunger for the resin tablet A resin encapsulation molding apparatus for an electronic component, comprising: a resin passage for pressurizing and transferring into a cavity of both molds, wherein a gas in a thermal expansion space portion of the resin tablet is provided at a tip end portion of a pressing plunger of the resin tablet. It is characterized in that it is configured by forming a required uneven portion for allowing moisture and / or water to flow out of the thermal expansion space.

The electronic component resin encapsulation molding apparatus according to the present invention includes a fixed die, a movable die opposed to the fixed die, and a pot provided on one of the two dies. A cull opposite to the mold position on the other side corresponding to the position of the pot,
The heating means for the resin tablet supplied to the containing portion consisting of the pot and the cull, the plunger for pressurizing the resin tablet, and the molten resin material in the containing portion heated and melted by the heating means and the pressing plunger for the resin tablet A resin encapsulation molding apparatus for an electronic component, comprising: a resin passage for pressurizing and transferring into the cavities of both molds, wherein a required engaging protrusion for thermally adhering a part of one end side of the resin tablet to the cull. It is characterized by forming and forming.

[0013]

When the resin tablet is supplied into the housing portion of the heated mold, the resin tablet thermally expands because it contains a large amount of air and moisture. At this time, if the tip end surface of the resin pressurizing plunger and one end surface of the resin tablet are joined, the resin tablet thermally expands from this joint surface toward the space on the opposite side, and at the end on the joint surface side. A thermal expansion space portion is generated in the portion. However, since the required convexo-concave portion communicating with the thermal expansion space portion of the resin tablet is formed on the tip end surface of the resin pressurizing plunger, air and moisture that are about to remain in the thermal expansion space portion,
Further, it is possible to easily flow out gas and the like generated during heating to the outside, and to prevent these from being mixed into the molten resin material and injected into the cavity.

Further, after one end of the resin tablet is thermally adhered to the engaging projection provided on the cull of the mold by the resin pressing plunger, the resin pressing plunger is retracted to move the resin tablet It is possible to prevent the above-described thermal expansion space portions from being generated at both ends.

Further, in the heat expansion step of the resin tablet described above, the air and water remaining in the space formed between the two mold surfaces are forcibly sucked and discharged to the outside to flow out from the inside of the resin tablet. The generated gas and water can be simultaneously sucked and discharged to the outside.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described based on the embodiments. FIG. 1 shows a main part of a mold in a resin encapsulation molding apparatus for electronic parts. The mold includes an upper mold 10 on the fixed side,
The movable lower mold 20 that opposes the upper mold 10, the pots 50 provided on the lower both 20, the cull 71 that opposes the position of the upper mold 10 corresponding to the position of the pot 50, and the pot. Heating means (10a
20a) and a plunger 60 for pressurizing the resin tablet,
A resin passage 70 for pressure-transferring the molten resin material in the housing heated and melted by the heating means and the pressure plunger into the cavities (10b, 20b) opposite to the upper and lower molds, and the upper and lower cavities ( 10b ・ 20b), the cull 71 and an appropriate mold release mechanism (10c) for ejecting the resin-sealed molded product molded in the resin passage 70 and the cured resin between the upper and lower molds (10 ・ 20) Is equipped with.

Further, the tip end of the resin pressurizing plunger 60 has a required unevenness for allowing gas and / or water in a thermal expansion space S of a resin tablet, which will be described later, to flow out of the thermal expansion space. A section 61 is provided. Irregularities 61 at the tip of the resin pressure plunger shown in FIGS. 1 and 2.
Is formed by cutting a groove 61a, which is substantially concentric with the axis of the plunger, and vertical and horizontal groove portions 61b communicating with the shaft 61 on the tip end surface of the plunger. An appropriate draft angle 61c is provided.

The mold can be used in the same manner as the conventional one. That is, the upper mold 10 and the lower mold 20 are heated by a heating means.
By (10a ・ 20a), it is heated up to the resin molding temperature in advance. Next, the lead frame 30 on which the electronic component 30a is mounted is fitted and set at a predetermined position of the recess 40 provided on the mold surface of the lower mold, and the resin tablet R is supplied into the pot 50. Next, the lower mold 20 is moved upward to clamp the upper and lower molds (10, 20), and the electronic component 30a and the lead frame 30 around it are placed on the parting line (PL) surface of the upper and lower molds. Fit and set in both upper and lower cavities (10b, 20b) (see Fig. 1). At this time, the resin tablet R is supplied and housed in the housing portion composed of the heated pot 50 and the cull 71, so that the resin tablet R contains a large amount of air and water. , Thermally expands in the accommodation portion.

Further, the lower end surface of the resin tablet R supplied and stored in the storage portion is joined to the front end surface (upper end surface) of the resin pressing plunger 60, and this portion is heated strongly. That is, the air and water in the lower end portion of the resin tablet R are heated more strongly than other portions and swell and expand the entire resin tablet R. However, at this time, since the resin tablet R is shielded by the tip end surface of the plunger, the downward thermal expansion is suppressed, and the air and water in the strongly heated lower end portion of the resin tablet are directed upward. Since the resin tablet R in the accommodating portion is thermally expanded toward the upper space, that is, toward the cull 71 side, the resin tablet R in the accommodating portion thermally expands. At the lower end of the resin tablet joined to the surface, a thermal expansion space S as shown by a chain line in FIG. 1 is formed. At this time, the peripheral surface portion of the resin tablet R also thermally expands toward the inner peripheral surface of the pot 50, but as described above, the resin tablet R expands vigorously in the upward direction. The degree of thermal expansion is small in comparison.

In the thermal expansion space S at the lower end of the resin tablet, the air and water in the resin tablet or the gas generated during heating tends to remain. However, on the tip end surface of the resin pressurizing plunger, a desired uneven portion communicating with the thermal expansion space S of the resin tablet is formed.
Since 61 is formed, it is possible to easily flow out the gas or moisture that is going to remain in the thermal expansion space S through the uneven portion 61 to the outside. Therefore, it is possible to effectively prevent these from being mixed in the molten resin material or being caught in the molten resin material, and ensure that they are pressure-transferred and injected into the cavity (10b, 20b) side. Therefore, it is possible to mold a product having high quality and high reliability in which voids and defects are not formed inside and outside the resin-sealed molded body.

The gas and water flowing out of the thermal expansion space S can be naturally discharged to the outside of the mold through the gap between the pot 50 and the resin pressurizing plunger 60. In order to enhance the discharging effect, a forced discharging mechanism such as a vacuum mechanism may be used together.
That is, in the heat expansion step of the resin tablet R described above, the container for the resin tablet R formed of the pot 50 and the cull 71 formed between the mold surfaces of the upper and lower molds (10, 20) and for transferring the molten resin material are used. Resin passage 70 / air vent (reference numeral 1d in FIG. 7)
For example, by forcibly sucking and discharging the air and water remaining in the space of the mold to the outside of the mold, the gas and water flowing out from the inside of the resin tablet R are also simultaneously discharged to the outside of the mold. It may be sucked and discharged.

After the heat expansion step of the resin tablet R described above, or at substantially the same time as the heat expansion step, the resin tablet R is pressed by the resin pressurizing plunger 60 to accelerate its heat melting action. , Heated and melted molten resin material through the resin passage 70
20b) the electronic component 30a, which is injected and filled into both cavities and set in the cavities, and the lead frame 30 around it
Is sealed and molded into a resin-sealed molded body that is molded corresponding to the shapes of both cavities. Next, after curing the resin,
The lower mold 20 is moved downward to open the upper and lower molds (10 and 20) again, and at the same time when the upper and lower molds are opened, both cavities are moved.
Molded resin molding in (10b ・ 20b), lead frame 30, resin passage 70 and cured resin in cull 71 are ejected between upper and lower molds (10 ・ 20) by the mold release mechanism (10c). You can do it.

FIGS. 3 and 4 show another example of the shape of the uneven portion 61 provided at the tip of the resin pressing plunger. That is, the concavo-convex portion 61 shown in each of the figures is provided with a conical convex portion 61d in which the plunger tip portion is formed into a conical convex portion, and the inclined surface thereof has a draft angle,
Further, the space formed between the inclined surface and the pot 50 also serves as a recess (substantially lower space) in which the resin tablet can thermally expand downward. in this case,
Even if the resin tablet R is supplied and housed in the housing part of the mold, the lower end surface of the resin tablet R is supported by the conical convex part of the resin pressurizing plunger, so that it is shown by a chain line in FIG. Thus, the lower portion of the resin tablet can thermally expand toward the lower space, and the upper portion of the resin tablet can thermally expand toward the upper space inside the accommodating portion. Therefore, a thermal expansion space (S) as shown by a chain line in FIG. 1 does not occur between the plunger tip and the resin tablet lower end. In addition, the effect and other points of resin molding in the case of using a resin pressing plunger having such a conical convex portion formed at the tip end thereof are shown in FIG. 1 except for the above-mentioned differences. It is substantially the same as that of the above-mentioned embodiment. Even if the thermal expansion space (S) as described above occurs between the plunger tip and the resin tablet lower end due to the shape of the resin tablet, its heating temperature, and other reasons, the conical convex portion Since the thermal expansion space can be surely communicated with the outside by the portion 61d, the gas or water that is going to remain in the thermal expansion space can be easily transferred to the outside along the inclined surface of the conical convex portion. Can be drained to.

5 and 6 show another example of the shape of the uneven portion 61 provided at the tip of the resin pressure plunger. That is, the concavo-convex portion 61 shown in each of the figures is formed by cutting a conical recess 61e formed at the center of the plunger tip and vertical and horizontal grooves 61f communicating with the concavity 61e. An appropriate draft 61 on the tip peripheral surface
g is provided. In this case, even if the resin tablet R is supplied and housed in the housing part of the mold, a substantially lower space is secured in the lower end surface of the resin tablet R by the conical recess 61e. As shown by the chain line in FIG. 5, the lower portion of the resin tablet can thermally expand toward the inside of the conical recess 61e, and the upper portion thereof can thermally expand toward the upper space inside the accommodating portion. For this reason,
A thermal expansion space (S) as shown by a chain line in FIG. 1 does not occur between the plunger tip and the resin tablet lower end. In addition, except for the above-mentioned differences, the operation effect and other points of the resin molding in the case of using such a resin pressing plunger having such a conical recess 61e or vertical and horizontal groove portions 61f at the tip thereof are used. And is substantially the same as that of the embodiment shown in FIG. Depending on the shape of the resin tablet, its heating temperature, and other reasons,
Between the tip of the plunger and the bottom of the resin tablet,
Even if the thermal expansion space (S) is generated as described above, the conical recess 61e and the vertical and horizontal grooves 61f can reliably communicate the thermal expansion space with the outside.
It is possible to easily flow out the gas or water that is going to remain in the thermal expansion space to the outside through the conical recess 61e and the vertical and horizontal grooves.

When the resin tablet R is supplied and housed in the housing of the heated mold, not only the upper and lower end portions of the resin tablet R but also the side peripheral surface portions thereof are heated and the whole is thermally expanded. become. That is, the side peripheral surface portion of the resin tablet R thermally expands toward the inner peripheral surface side of the pot 50 in the housing portion. However, as described above, since the resin tablet R swells in the vertical direction vigorously, the degree of thermal expansion of the side peripheral surface portion is smaller than that in the vertical direction, which is confirmed by experiments. ing. By the way, the diameter of the resin tablet is formed so as to be smaller than the inner diameter of the pot 50. However, since the resin tablet R has to be put into the pot 50, the resin tablet inevitably has a diameter smaller than that of the pot. It is said that the diameter is formed thinner than the inner diameter of the pot 50, and the relationship between the inner diameter dimension of the pot 50 and the diameter dimension of the resin tablet is taken into consideration in consideration of the thermal expansion of the thermosetting resin tablet such as epoxy resin. However, there is no clear standard for setting proper dimensions.

If the diameter of the resin tablet is too large with respect to the inner diameter of the pot, it may be difficult to charge and supply the resin tablet into the pot. However, from the viewpoint of thermal expansion of the resin tablet, There is an evil. That is, the thermal expansion action of the side peripheral surface portion of the resin tablet R is performed at substantially the same time as or faster than the thermal expansion action in the vertical direction, and at the same time, the side peripheral surface portion is thermally expanded and the pot Since the inner peripheral surface is pressed, the pressed portion is thermally cured to form a cured coating layer. When such a cured coating layer is formed on the surface of the thermally expanded resin tablet, the gas and water remaining inside will not be able to flow to the outside at all. When it is mixed in, it causes the above-mentioned harmful effects.

On the contrary, if the diameter of the resin tablet is too small with respect to the inner diameter of the pot, there is an advantage that the resin tablet can be easily fed and supplied into the pot, but unnecessary air or Since a large amount of water is retained, these residual air and water are mixed in the molten resin material, or there is an adverse effect such as being caught in the molten resin material, and also from the viewpoint of thermal expansion of the resin tablet. From the viewpoint, there are the following harmful effects. That is, since unnecessary air and moisture in the pot are heated and evaporated, the resin tablet in the pot is thermally expanded more than a predetermined shape, and as a result, the entire surface of the thermally expanded resin tablet is expanded. Is pressed against the inner surfaces of the pot 50 and the cull 71 to form a thermosetting coating layer. Therefore, similarly to the above, the gas and moisture remaining inside thereof cannot flow out to the outside at all, and the residual gas and moisture are mixed in the molten resin material, which causes the above-mentioned harmful effects.

To solve such a problem, the pot 50
It is necessary to set the inner diameter dimension of the pot and the diameter dimension of the resin tablet in consideration of the size when the side peripheral surface portion of the resin tablet R is thermally expanded, while being able to be easily charged and supplied. . According to the experiment, the pot inner diameter and the resin tablet diameter are provided with a difference of about 0.50 mm to 1.50 mm, and for the thermal expansion of about 0.25 mm to 0.75 mm around the outer periphery of the resin tablet supplied and housed in the pot. In the case where the gap is set so as to be configured, favorable results that satisfy such a demand have been obtained.

In each of the above-mentioned embodiments, the case where the resin tablet R is joined to the concave-convex portion 61 at the tip of the resin pressurizing plunger, or the thermal expansion of the resin tablet is carried out while the resin tablet R is supported. However, for example, even if a part of the upper end side of the resin tablet is temporarily attached to the upper mold by heat, and the resin pressurizing plunger is retracted downward, the thermal expansion of the resin tablet may be performed. Good. That is, a part of the upper end side of the resin tablet, for example, a required engaging protrusion (not shown) for temporarily adhering several parts of the upper end surface of the resin tablet by heat is formed on the upper mold cull 71 described above. . Then, in the step of heating and expanding the resin tablet R in the accommodating section, the resin tablet R is pushed up by the resin pressurizing plunger 60 and a part of the upper end side thereof is pressed against the engaging projection of the cull 71. The heat is temporarily applied, and then the resin pressurizing plunger 60 is lowered, and in this state, the resin tablet R is thermally expanded. In this case, since a space for substantial thermal expansion is secured at the upper and lower ends of the resin tablet R in the housing portion,
Both upper and lower end portions of the resin tablet can be thermally expanded in both upper and lower directions. Therefore, the resin tablet itself has a thermal expansion space portion as shown by the chain line in FIG.
(S) does not occur, and the operation effect and other points of the resin molding in this case are substantially the same as those of the embodiment shown in FIG. 1 except for the differences as described above. Is.

The present invention is not limited to the above-described embodiments, and other methods and configurations can be arbitrarily and appropriately changed and selected as necessary within the scope of the gist of the present invention. Can be adopted as

[0031]

According to the present invention, the air and water inside the resin tablet supplied and housed in the housing part of the mold, or the gas generated during heating can be efficiently discharged to the outside. However, it is possible to reliably prevent these from being mixed in the molten resin material or being injected into the cavity in a state of being rolled up. Therefore, it is possible to provide a resin encapsulation molding method for electronic parts and an apparatus therefor capable of molding a product having high quality and high reliability in which voids and defects are not formed inside and outside the resin encapsulation molding. It has excellent practical effects that can be achieved.

[Brief description of drawings]

FIG. 1 is a schematic vertical cross-sectional view of a main part of a mold in a resin sealing molding apparatus for electronic parts according to the present invention, showing a mold clamping state of both upper and lower molds.

FIG. 2 is a perspective view showing an enlarged end portion of the resin pressing plunger shown in FIG.

FIG. 3 is a schematic vertical sectional view of a main part of a mold in a resin sealing molding apparatus for another electronic component according to the present invention, showing a mold clamping state of both upper and lower molds.

FIG. 4 is an enlarged perspective view showing a resin pressurizing plunger tip portion of FIG. 3;

FIG. 5 is a schematic vertical sectional view of a main part of a mold in a resin sealing molding apparatus for another electronic component according to the present invention, showing a mold clamping state of both upper and lower molds.

FIG. 6 is an enlarged perspective view showing the tip end portion of the resin pressing plunger of FIG.

FIG. 7 is a schematic vertical cross-sectional view of a main part of a mold in a conventional resin encapsulation molding apparatus for electronic parts, showing a mold open state of both upper and lower molds.

8 is an enlarged vertical sectional view of a main part of a mold corresponding to FIG. 7, showing a mold clamping state of both upper and lower molds.

[Explanation of symbols]

 10… Upper mold 20… Lower mold 10a ・ 20a… Heating means 10b ・ 20b… Cavity 30a… Electronic parts 50… Pot 60… Plunger 61… Uneven part 61a… Groove 61b… Groove part 61c… Graduation 61d… Cone-shaped convex part 61e… Concave 61f… Groove 61g… Gradation 71… Cal R… Resin tablet S… Thermal expansion space

Claims (5)

[Claims] 1. A resin tablet is supplied to a housing portion composed of a pot and a cull of a mold, the resin tablet in the housing portion is heated and melted, and the molten resin material is pressure-transferred and injected into a cavity. A resin encapsulation molding method for an electronic component, in which an electronic component fitted and set in the cavity is resin-encapsulated by performing the resin encapsulation on the tip end surface of a resin pressure plunger that is joined to the resin tablet in the accommodation portion. In the step of heating and expanding the resin tablet in the accommodating portion by forming the uneven portion of, the gas and / or water in the thermal expansion space of the resin tablet generated at the joint surface with the tip end surface of the resin pressurizing plunger can be removed. A resin encapsulation molding method for an electronic component, characterized in that it flows out to the outside of the thermal expansion space through an uneven portion on the tip end surface of the plunger. 2. A resin tablet is supplied to an accommodation section consisting of a pot and a cull of a mold, the resin tablet in the accommodation section is heated and melted, and the molten resin material is pressure-transferred to be injected and filled into the cavity. A resin encapsulation molding method for an electronic component, comprising: encapsulating an electronic component fitted and set in the cavity by resin encapsulation. By forming the portion, in the step of heating and expanding the resin tablet in the accommodating portion, a part of one end side of the resin tablet is pressed against the engaging projection of the cull by the resin pressurizing plunger and temporarily heated by the heat. An electronic component characterized in that the resin pressurizing plunger is retracted after being attached, and the resin tablet is thermally expanded in this state. Resin encapsulation molding method. 3. When the two molds are clamped, the residual air and / or water in the space formed between the mold surfaces is forcibly sucked and discharged to the outside to flow out from the inside of the resin tablet. The resin-encapsulation molding method for an electronic component according to claim 1 or 2, wherein the gas and / or water that has been formed is also simultaneously sucked and discharged to the outside. 4. A fixed die, a movable die opposed to the fixed die, a pot provided on one of the two dies, and a position on the other die corresponding to the position of the pot. A heating means for the resin tablet supplied to the accommodating portion composed of the opposed cull and the pot and the cull, a plunger for pressurizing the resin tablet, and an accommodation heated and melted by the heating means and the pressing plunger for the resin tablet A resin encapsulation molding apparatus for an electronic component, comprising a resin passage for pressurizing and transporting a molten resin material in a mold into the cavities of both molds, wherein a resin tablet is formed at a tip portion of a pressing plunger of the resin tablet. A resin encapsulation molding apparatus for an electronic component, characterized in that it is formed by forming a required concavo-convex portion that allows gas and / or water in the thermal expansion space to flow out of the thermal expansion space. 5. A fixed die, a movable die opposed to the fixed die, a pot provided on one of the two dies, and a pot on the other die corresponding to the position of the pot. A heating means for the resin tablet supplied to the accommodating portion composed of the opposed cull and the pot and the cull, a plunger for pressurizing the resin tablet, and an accommodation heated and melted by the heating means and the pressing plunger for the resin tablet A resin encapsulation molding apparatus for an electronic component, comprising: a resin passage for pressurizing and transferring the molten resin material in the mold into the cavities of the molds, wherein a part of one end side of the resin tablet is thermally adhered to the cull. A resin encapsulation molding apparatus for an electronic component, characterized in that a required engaging protrusion is formed.