JPH0619494Y2 - Lightweight electronic component packaging - Google Patents
Lightweight electronic component packagingInfo
- Publication number
- JPH0619494Y2 JPH0619494Y2 JP1987071579U JP7157987U JPH0619494Y2 JP H0619494 Y2 JPH0619494 Y2 JP H0619494Y2 JP 1987071579 U JP1987071579 U JP 1987071579U JP 7157987 U JP7157987 U JP 7157987U JP H0619494 Y2 JPH0619494 Y2 JP H0619494Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- molded product
- lightweight electronic
- lightweight
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は軽量電子部品の保管・輸送・装着に際し、軽量
電子部品を静電気による破壊及びほこりなどによる汚染
から保護し軽量電子部品を電子機器に組付ける時に生じ
る作業上のトラブルを防止した軽量電子部品の包装体に
関するものである。[Detailed Description of the Invention] [Industrial field of application] The present invention protects lightweight electronic components from damage due to static electricity and contamination due to dust when storing, transporting, and mounting lightweight electronic components, and the lightweight electronic components are used in electronic devices. The present invention relates to a lightweight electronic component package that prevents work-related troubles that occur during assembly.
従来、ＩＣを始めとするトランジスター・ダイオード・
コンデンサー（キャパシター）・圧電素子・レジスター
などの電子部品はトレイ状又はブリスター成形された部
分のあるテープ状の合成樹脂成形品とカバーフイルムと
からなる包装体として供給され、電子機器への組付けは
カバーフイルムをめくり中の電子部品を取り出し所定位
置に運ばれる使われ方をしているが、包装体に使われて
いる包装材に静電気対策のなされていない場合は保管、
輸送時に空気中のほこりを引きつけ著しく汚染し商品価
値を失うことや、包装材に帯電した静電気が内容物に放
電し、ＩＣなどのような電子部品はその回路を破壊され
てしまうことがあり、また包装材に上述の電子部品類が
静電気の作用により、吸着された状態で包装体から取り
出され電子機器へ正しく組付けできないことが生じる欠
点があった。これらの欠点を解消するためＰＶＣ、Ｐ
Ｓ、ＰＥ、ＰＰ、ＡＢＳなどの合成樹脂に導電性のある
カーボンブラック粉末などを練り込んだり、界面活性剤
を主成分とするような帯電防止剤を塗布又は練り込まれ
た材料からなる成形品やフイルムを使用する方法で種々
な静電気対策が包装体に実施されてきたが、帯電防止効
果が自然に短時間に失われたり、高温高湿の環境におか
れると消失したり、他の物に触れると脱落したりして包
装体としては満足なものがなかった。Conventionally, ICs and other transistors, diodes, etc.
Electronic parts such as capacitors, piezoelectric elements, and resistors are supplied as a package consisting of a tray-shaped or tape-shaped synthetic resin molded product with a blister-molded part and a cover film, and are not assembled to electronic devices. The cover film is turned over and the electronic components are taken out and transported to a specified position.However, if the packaging material used for the packaging does not have anti-static measures, store it.
During transportation, dust in the air may be attracted and it may be contaminated, resulting in loss of commercial value, or static electricity charged in the packaging material may discharge the contents, destroying the circuit of electronic parts such as ICs. In addition, there is a drawback in that the above-mentioned electronic components may be taken out from the packaging body in an adsorbed state due to the action of static electricity on the packaging material and cannot be correctly assembled to the electronic device. PVC, P to eliminate these drawbacks
A molded product made of a material obtained by kneading conductive carbon black powder or the like into a synthetic resin such as S, PE, PP or ABS, or coating or kneading an antistatic agent containing a surfactant as a main component. Various countermeasures against static electricity have been implemented on the package by using a film or film, but the antistatic effect is naturally lost in a short time, or disappears when exposed to a high temperature and high humidity environment. When I touched it, it fell off and was not satisfactory as a package.
本考案は前述のこのような実状を考え、特に帯電した包
装体に吸着されるような比較的軽量な電子部品の使用実
態に合った包装体を得んとして研究した結果、ある積層
フイルムと静電気対策のなされた成形品で軽量電子部品
を封入することにより効果的な軽量電子部品の包装体が
得られるとの知見を得て本考案を完成するに至ったもの
である。The present invention has been made in consideration of the above-mentioned situation, and as a result of researching to obtain a packaging body that fits the actual usage of a relatively lightweight electronic component that is adsorbed by a charged packaging body, as a result, a certain laminated film and electrostatic The present invention has been completed based on the finding that an effective packaging body for lightweight electronic components can be obtained by encapsulating the lightweight electronic components in a molded product for which measures have been taken.
即ち、本考案は最外層のポリエステルフイルムの表面が
酸化錫コーティングされており、該ポリエステルフイル
ムの反対側にエチレン−酢ビ共重合体とポリブテンの混
合体からなる易開封性のシーラント層を持つ透明複合フ
イルムと導電性又は帯電防止された合成樹脂製の凹部の
周辺にフランジ部を有する成形品とにより、該成形品の
凹部に軽量電子部品が内在し、該積層フイルムのシーラ
ント層と該成形品のフランジ部は易開封性の熱シールが
なされ、軽量電子部品が封入されていることを特徴とす
る軽量電子部品の包装体である。That is, according to the present invention, the outermost polyester film has a surface coated with tin oxide, and a transparent and easily openable sealant layer made of a mixture of ethylene-vinyl acetate copolymer and polybutene is provided on the opposite side of the polyester film. A composite film and a molded product having a flange portion around a conductive or antistatic synthetic resin recess have a lightweight electronic component in the recess of the molded product, and a sealant layer of the laminated film and the molded product. The flange portion is heat-sealed so that it can be easily opened, and a lightweight electronic component is enclosed therein.
本考案において用いられる構成要素を一実施例を示す図
面によって説明すると積層フイルム１は透明なポリエス
テル層５の表面に酸化錫層４がコーティングにより形成
されており、接着層６を介してシーラント層７が積層さ
れている。シーラント層７はエチレン−酢ビ共重合体と
ポリブテンとの混合体からなり、シールされる相手材料
とシール後に易開封性をもつものである。The components used in the present invention will be described with reference to the drawings showing an embodiment. In the laminated film 1, a tin oxide layer 4 is coated on the surface of a transparent polyester layer 5, and a sealant layer 7 is formed via an adhesive layer 6. Are stacked. The sealant layer 7 is made of a mixture of an ethylene-vinyl acetate copolymer and polybutene, and has an easy-open property after sealing with a mating material.
成形品２は軽量電子部品３を内部に封入できる凹部９と
積層フイルム１とシールされる平面部が凹部９の周辺に
形成されたフランジ部８とからなり、カーボンブラック
や金属酸化物が練り込まれ導電性が付与されているか又
は種々な帯電防止剤が練り込まれたり塗布されたり、或
いは中間層に形成されたりした硬質塩ビ（ＰＶＣ）、Ａ
ＢＳ、ＰＳなどの比較的硬質の合成樹脂が射出成形され
たり、圧縮成形されたり、シートから真空成形や圧空成
形されたりしたものである。The molded product 2 is composed of a concave portion 9 in which the lightweight electronic component 3 can be enclosed, and a flange portion 8 formed around the concave portion 9 with a flat surface portion for sealing the laminated film 1, and carbon black or metal oxide is kneaded therein. Hard vinyl chloride (PVC), A, which is rarely provided with conductivity, is kneaded or coated with various antistatic agents, or is formed in the intermediate layer.
A relatively hard synthetic resin such as BS or PS is injection molded, compression molded, or vacuum molded or pressure molded from a sheet.
軽量電子部品３は積層フイルム１と成形品２により包装
された状態で保管・輸送され、使用される電子機器に組
み付けられる直前に包装体から熱シールされた積層フイ
ルム１が成形品２から引剥がれて開封し取り出される。The lightweight electronic component 3 is stored and transported in a state of being packaged with the laminated film 1 and the molded product 2, and the laminated film 1 heat-sealed from the package is peeled off from the molded product 2 immediately before being assembled in the electronic device used. It is opened and taken out.
本考案による軽量電子部品の包装体によれば軽量電子部
品を確実に静電気の放電による破壊及びほこりや外力か
ら保護し得ると共に使いやすい状態になっている。その
理由を述べると積層フイルム１に用いた酸化錫コーティ
ング層、ポリエステルフイルム及びエチレン−酢ビ共重
合体とポリブテンを混合したシーラント層は、共に透明
性のある素材であり、接着層に透明性のある材料を選ぶ
ことにより積層フイルム全体として透明性を確保でき内
封されている軽量電子部品３の存在を外部より開封前に
容易に確認することができる。According to the lightweight electronic component package of the present invention, the lightweight electronic component can be reliably protected from damage due to electrostatic discharge, dust, and external force, and is in an easy-to-use state. To explain the reason, the tin oxide coating layer, the polyester film, and the sealant layer obtained by mixing the ethylene-vinyl acetate copolymer and polybutene used in the laminated film 1 are both transparent materials, and the adhesive layer is transparent. By selecting a certain material, the transparency of the laminated film as a whole can be ensured, and the presence of the lightweight electronic component 3 enclosed can be easily confirmed from the outside before opening.
次に酸化錫のコーティング膜はけんろうであり、容易に
脱落することがないので包装体としての保存期間及び使
用時においても導電性を保持し、内封されている軽量電
子部品を電気的障害から守ることができる。Next, the tin oxide coating film is a brazing filler metal that does not fall off easily, so it retains its electrical conductivity even during storage and during use as a package, and prevents electrical damage to the enclosed lightweight electronic components. Can be protected from
次に本考案に用いたエチレン−酢ビ共重合体とポリブテ
ン混合物からなるシーラント層は通常成形品２として使
用されるＰＶＣ及びＰＳの両方の素材に熱シールするこ
とができ、且つ、一定の剥離力で容易に開封することが
できるので実用的に極めて便利である。又、一定の剥離
力で容易に開封することができるため、２つの合成樹脂
などの誘導体が引剥される時に発生する静電気も少なく
なっている。Next, the sealant layer composed of the ethylene-vinyl acetate copolymer and the polybutene mixture used in the present invention can be heat-sealed to both the PVC and PS materials which are usually used as the molded article 2, and a certain degree of peeling can be achieved. It is practically very convenient because it can be opened easily by force. Further, since it can be easily opened with a constant peeling force, static electricity generated when the two derivatives such as synthetic resins are peeled off is reduced.
次に成形品２の凹部３は内封する軽量電子部品３の大き
さに応じ、適宜充分なスペースをもって形成されてお
り、導電性又は帯電防止された比較的硬質の合成樹脂で
あるので軽量電子部品を放電、ほこり、外力から守る機
能をもつ。Next, the recess 3 of the molded product 2 is formed with a sufficient space according to the size of the light weight electronic component 3 to be sealed therein, and is a relatively hard synthetic resin that is electrically conductive or antistatic. It has the function of protecting parts from discharge, dust, and external force.
本考案による軽量電子部品の包装体は積層フイルム１と
成形品２が易開封性で熱シールされているので保管・輸
送時にトラブルを起こすことがなく、且つ、軽量電子部
品を電子機器に組付ける直前には容易に包装体から積層
フイルム１を剥離し軽量電子部品を取り出せるので機械
的に自動装填が可能であり、軽量電子部品が包材に吸着
されて装填ミスが生じることがない。Since the laminated film 1 and the molded product 2 of the lightweight electronic component package according to the present invention are easily opened and heat-sealed, no trouble occurs during storage and transportation, and the lightweight electronic component is assembled to an electronic device. Immediately before, the laminated film 1 can be easily peeled off from the package to take out the lightweight electronic component, so that automatic loading can be performed mechanically, and the loading error does not occur because the lightweight electronic component is adsorbed by the packaging material.
第１図は本考案の包装体の一実施例を示す部分断面図。 １は積層フイルム、２は成形品、３は内容物（軽量電子
部品）、４は酸化錫コーティング層、５はポリエステル
フイルム、６は接着剤層、７はシーラント層、８は成形
品フランジ部、９は成形品の凹部である。FIG. 1 is a partial sectional view showing an embodiment of the packaging body of the present invention. 1 is a laminated film, 2 is a molded product, 3 is a content (light weight electronic component), 4 is a tin oxide coating layer, 5 is a polyester film, 6 is an adhesive layer, 7 is a sealant layer, 8 is a flange part of the molded product, Reference numeral 9 is a recess of the molded product.
Claims (1)
化錫コーティングされており、該ポリエステルフイルム
の反対側にエチレン−酢ビ共重合体とポリブテンの混合
体からなる易開封性のシーラント層を持つ透明複合フイ
ルムと導電性又は帯電防止された合成樹脂製の凹部の周
辺にフランジ部を有する成形品とにより、該成形品の凹
部に軽量電子部品が内在し、該積層フイルムのシーラン
ト層と該成形品のフランジ部は易開封性の熱シールがな
され、軽量電子部品が封入されていることを特徴とする
軽量電子部品の包装体。1. A transparent outermost layer having a surface coated with tin oxide and having an easily openable sealant layer made of a mixture of ethylene-vinyl acetate copolymer and polybutene on the opposite side of the polyester film. A composite film and a molded product having a flange portion around a conductive or antistatic synthetic resin recess have a lightweight electronic component in the recess of the molded product, and a sealant layer of the laminated film and the molded product. The light-weight electronic component package is characterized in that the flange portion is heat-sealed so that the light-weight electronic component is enclosed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071579U JPH0619494Y2 (en) | 1987-05-15 | 1987-05-15 | Lightweight electronic component packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071579U JPH0619494Y2 (en) | 1987-05-15 | 1987-05-15 | Lightweight electronic component packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63183069U JPS63183069U (en) | 1988-11-25 |
| JPH0619494Y2 true JPH0619494Y2 (en) | 1994-05-25 |
Family
ID=33446766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071579U Expired - Lifetime JPH0619494Y2 (en) | 1987-05-15 | 1987-05-15 | Lightweight electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0619494Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS579943A (en) * | 1980-06-23 | 1982-01-19 | Nippon Light Metal Co | Isobaric construction of curtain wall |
| JPS6021480B2 (en) * | 1978-11-13 | 1985-05-28 | 松下電工株式会社 | discharge lamp lighting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021480U (en) * | 1983-07-19 | 1985-02-14 | 尾池工業株式会社 | Film for antistatic packaging bags |
| JPS6265959U (en) * | 1985-10-17 | 1987-04-24 |
-
1987
- 1987-05-15 JP JP1987071579U patent/JPH0619494Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021480B2 (en) * | 1978-11-13 | 1985-05-28 | 松下電工株式会社 | discharge lamp lighting device |
| JPS579943A (en) * | 1980-06-23 | 1982-01-19 | Nippon Light Metal Co | Isobaric construction of curtain wall |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63183069U (en) | 1988-11-25 |
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