JPH0619285U - Coaxial connector - Google Patents

Abstract

(57) [Abstract] [Purpose] To enable stable high-speed signal transmission without increasing the size of the connector and increasing the contact density. A pin connector side substrate 2 having a through hole 21 for inserting a signal pin, an insulating cylindrical portion 23 surrounding the through hole 21, and a ground pattern 25 arranged outside the insulating cylindrical portion 23,
The pin connector side substrate 2 and the socket side substrate 4 arranged in parallel are connected. The ground pattern 25 is inserted through the through hole 21 of the pin connector side substrate 2.
A pin connector 1 having a signal pin contact 13 protruding from the side, and a conductive piece 36a electrically connected to the ground of the pin connector side substrate 2 on the outside of the insulator 31 that receives the socket contact 33 corresponding to the signal pin contact 13. A conductive piece 36b that is electrically connected to the ground of the socket connector side substrate 4 is provided. The present invention is also applied to the LSI 37 and the socket used for the LSI 37.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a coaxial connector for high-speed signals such as exchanges and computers.

[0002]

[Prior art]

 Conventionally, as this type of coaxial connector, a connector including a pin connector 5 as shown in FIGS. 16 and 17 and a socket connector 6 as shown in FIGS. 18 and 19 is known. That is, in the pin connector 5, the signal pin contacts 13a and the ground pin contacts 13b are alternately arranged in a staggered manner, and the socket connector 6 correspondingly corresponds to the signal socket contacts 15a and the ground socket contacts 15b. Are arranged in a staggered pattern. Further, similar configurations have been adopted in the LSI and the LSI socket used for the LSI.

[0003]

[Problems to be solved by the device]

 In the conventional coaxial connector as described above, the signal contacts 13a and 15a are arranged so that the ground contacts 13b and 15b surround the signal contacts 13a and 15a in a grid pattern, and the adjacent signal contacts 13a and 15a are connected by the ground contacts 13b and 15b. Not completely shielded. Therefore, since there is a capacitance component between each signal contact, when the frequency increases, electrostatic induction causes crosstalk. As a result, when the signal contact and the ground contact are arranged in the conventional manner, there is a problem that it is not possible to cope with high frequency signals. Moreover, the same problem occurs in the LSI and the LSI socket used for the LSI.

To solve this problem, it is possible to increase the number of ground contacts. However, in this case, the connector must be made larger or the contact density must be increased. When making the connector large, it is against the demand for miniaturization. Further, when the contact density is increased, the difficulty of manufacturing the connector increases in proportion to the increase in the density, which in turn increases the manufacturing cost of the connector.

An object of the present invention is to provide a coaxial connector that enables stable high-speed signal transmission without increasing the size of the connector and increasing the contact density.

[0006]

[Means for Solving the Problems]

 According to the present invention, the through hole for inserting the signal pin, the insulating cylindrical portion surrounding the through hole, and the pin connector side base plate having the ground contact arranged outside the insulating cylindrical portion and the pin connector side substrate are parallel to each other. Surround the signal pin contact or the pin connector that has a signal pin contact protruding from the ground contact side through the through hole of the pin connector side substrate in the connector that connects to the socket side substrate arranged in On the outside of the insulator for receiving the socket contact corresponding to the LSI having the insulating cylinder portion and the ground contact arranged on the outside of the insulating cylinder portion, a conductive piece conductively connected to the pin connector side substrate or the ground of the LSI, A conductive piece that is electrically connected to the ground of the socket-side board is provided. Connector can be obtained.

[0007]

[Action]

 According to the present invention, a socket connector is electrically connected to a ground of a socket-side board and a conductive piece that is conductively connected to a ground pattern of the pin-connector-side board on the outside of an insulator that receives a socket contact corresponding to a signal pin contact. Since the conductive piece is provided, the signal pin and the ground (conductive member) are arranged outside the signal pin.

[0008]

【Example】

 Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 show a pin connector 1 used in the present invention, in which an insulator 11 is provided with signal pin contacts 13 at predetermined intervals (indicated by 2 in the figure). Column). Although the signal pin contact 13 is shown in FIG. 1 as a soldering type, it may be a compliant type.

FIG. 3 shows a ground pattern formed on the pin connector side substrate 2. Through holes 21 are formed corresponding to the arrangement of the signal pin contacts 13 of the pin connector 1. An insulating cylinder portion 23 is formed on the outer periphery of these through holes 21. A ground pattern 25, which is a conductive ground-side contact, is formed outside the insulating cylindrical portion 23. The signal pin contact 13 of the pin connector 1 is inserted into the through hole 21 from the surface of the substrate 2 on which the ground pattern 25 is not formed, and is inserted through the through hole 21 to project from the ground pattern 25. .

An example of using the LSI 37 instead of the pin connector will be described with reference to FIGS. 4 and 5. Signal pin contacts 13 are planted in the package 38 at a predetermined interval (two rows in FIG. 5). An insulating cylindrical portion 23 is formed on the outer periphery of the signal pin contact 13. A ground pattern 25, which is a conductive contact on the ground side, is formed outside the insulating cylindrical portion 23.

Next, the socket contact 3 will be described.

As shown in FIGS. 6 to 8, the socket contact 3 is composed of an insulator 31, a socket contact 33, a conductive member 35, and elastic conductive pieces 36 a and 36 b.

The insulator 31 has a cylindrical portion 31 a formed at a position corresponding to the signal pin contact 13 of the pin connector 1. The socket contact 33 is fitted in the cylindrical portion 31a. The socket contact 33 has a pin contact portion 33a that comes into contact with the signal pin contact 13 of the pin connector 1 inside the cylindrical portion 31a, and a board-side contact portion 33b that is connected to a board on the socket connector side.

A conductive member 35 is provided on the upper surface side (the connection surface side with the pin connector 1) of the insulator 31 so as to entirely surround the cylindrical portion 31 a. An opening 35a is formed on the upper end surface of the conductive member 35 at a position corresponding to the cylindrical portion 31a, and when the pin connector 1 and the socket connector 3 are connected to each other, the signal pin contact 13 has a cylindrical portion. It is adapted to be fitted into the socket contact 33 in 31a.

Elastic conductive pieces 36 a and 36 b are provided at predetermined positions on the upper surface of the conductive member 35. The elastic conductive piece 36 a is in pressure contact with the ground pattern 25 of the pin connector side substrate 2, and the elastic conductive piece 36 b is in contact with the conductive member 35. The elastic conductive pieces 36a and 36b may be made of elastic metal plates or may be made of conductive rubber.

Next, the fitting connection between the pin connector 1 and the socket connector 3 will be described.

As shown in FIG. 9, the board-side contact portion 33 b of the socket contact 33 of the socket connector 3 is soldered to the contact portion of the socket-connector-side board 4.

The signal pin contact 13 of the pin connector 1 is inserted into the through hole 21 from the surface side of the pin connector side substrate 2 where the ground pattern 25 is not formed. At this time, the signal pin contact 13 is connected to the signal contact of the pin connector side substrate 2.

In this state, the signal pin contact 13 is pushed through the opening 35a of the conductive member 35 and inserted so as to be sandwiched by the internal socket contact 33, and the signal pin contact 13 and the socket contact 33 are electrically connected. Let

Then, in this state, the elastic conductive piece 36a comes into pressure contact with the ground pattern 25 of the pin connector side substrate 2, and the conductive piece 36b comes into contact with the conductive member 35 so as to contact the ground pattern 25. The conductive member 35 is in a conductive state.

In the present embodiment, the socket connector 3 and the socket-side substrate 4 are fixedly connected by the screw 9. The screw 9 is brought into conductive connection with the conductive member 35, and the other is connected to the socket. It should be connected to the ground contact of the side substrate 4.

In the above-described embodiment, the ground pattern 25 of the pin connector side substrate 2 and the ground of the socket connector side substrate 4 are conducted by the screw 9. However, the present invention is not limited to this. As shown in FIGS. 10 to 12, a ground contact 90 different from the signal contact (socket contact 33) may be provided to make the ground connection between the pin connector side substrate 2 and the socket side substrate 4.

Further, although it has been described that only the contact 33 for the signal pin is provided on the socket connector 3, the discrete contact 93 may be provided side by side as shown in FIGS. 13 to 15. Good.

The pin connector ground is formed in a pattern so as to surround each through hole, and the conductive connection between the ground and the conductive member 35 of the socket connector 3 is made by elastic conductive pieces 36a, 36b. However, the present invention is not limited to this, and a ground pin may be provided on the pin connector side substrate 2 so as to be directly connected to the conductive member 35.

[0026]

[Effect of device]

 According to the coaxial connector of the present invention, the insulator is provided around each socket contact, and the conductive member for the ground is further provided on the outside thereof, so that each contact has the same structure as the coaxial contact. As a result, stable high-speed signals can be transmitted without increasing the size of the connector and without increasing the contact density.

[Brief description of drawings]

FIG. 1 is a side view showing a pin connector used in the present invention.

FIG. 2 is a plan view showing a pin connector used in the present invention.

FIG. 3 is a bottom view showing an example of a ground pattern formed on one of parallel substrates (pin connector side substrate) which are mutually connected by the connector of the present invention.

FIG. 4 is a side view showing an LSI in the connector of the present invention.

FIG. 5 is a plan view showing an LSI in the connector of the present invention.

FIG. 6 is a plan view showing a socket connector in the connector of the present invention.

FIG. 7 is a side view showing a socket connector in the connector of the present invention.

FIG. 8 is an enlarged sectional view showing a socket connector in the connector of the present invention.

FIG. 9 is an enlarged sectional view showing a coaxial connector of the present invention.

FIG. 10 is a plan view showing another embodiment of the present invention.

11 is a side view showing the embodiment of FIG. 8. FIG.

FIG. 12 is an enlarged sectional view showing the embodiment of FIG.

FIG. 13 is a plan view showing still another embodiment of the present invention.

14 is a side view showing the embodiment of FIG. 11. FIG.

FIG. 15 is an enlarged sectional view showing the embodiment of FIG.

FIG. 16 is a side view showing a pin connector of a conventional coaxial connector.

FIG. 17 is a plan view showing a pin connector of a conventional coaxial connector.

FIG. 18 is a plan view showing a socket connector of a conventional coaxial connector.

FIG. 19 is a side view showing a socket connector of a conventional coaxial connector.

[Explanation of symbols]

 1-pin connector 2-pin connector side substrate 3 socket connector 4 socket connector side substrate 5 pin connector 6 socket connector 11 insulator 13 signal pin contact 21 through hole 23 insulating cylinder part 25 ground pattern 31 insulator 33 socket contact 36 conductive piece 37 LSI 38 package

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinichi Sasaki 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation

Claims (1)

[Scope of utility model registration request] 1. A pin connector side substrate having a through hole for inserting a signal pin, an insulating cylinder portion surrounding the through hole, and a ground contact arranged outside the insulating cylinder portion, and arranged in parallel with the pin connector side substrate. Pin connector having a signal pin contact that penetrates the through hole of the pin connector side substrate in the connector for connecting to the socket side substrate and that protrudes from the ground contact side, or an insulating tubular portion that surrounds the periphery of the signal pin contact And, on the outside of the insulator for receiving the socket contact corresponding to the LSI having the ground contact arranged on the outside of the insulating cylinder portion, the pin connector side board or the conductive piece for conductively connecting to the ground of the LSI, and the socket side board A coaxial connector provided with a conductive piece that is conductively connected to the ground .