JPH06181390A - Multilayer printed-wiring board - Google Patents
Multilayer printed-wiring boardInfo
- Publication number
- JPH06181390A JPH06181390A JP4351611A JP35161192A JPH06181390A JP H06181390 A JPH06181390 A JP H06181390A JP 4351611 A JP4351611 A JP 4351611A JP 35161192 A JP35161192 A JP 35161192A JP H06181390 A JPH06181390 A JP H06181390A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- heat dissipation
- dissipation layer
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層プリント配線板に
関し、特に実装された発熱素子の放熱特性を良好とした
多層プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and more particularly to a multilayer printed wiring board in which mounted heat generating elements have good heat dissipation characteristics.
【０００２】[0002]
【従来の技術】図３は、特開平１−２９６６８９号に開
示された従来の金属コアプリント配線板における発熱素
子の放熱構造を示す側断面図で、金属コアプリント配線
板３０に電子部品３５を実装した状態を示す。これを概
略説明すると、金属コア３１の上下両面には、絶縁層３
２および導体層３３が順次設けられて、全体として金属
コアプリント基板３０を構成している。金属コア３１と
絶縁層３２との間に、接着層３４が設けられ、配線板３
０の上面の適所には、その深さが金属コア３１に達する
発熱素子配置用凹部３５が設けられており、この凹部３
５には、発熱素子３６がその上下を逆にして金属コア３
１と密着するよう挿入配置されている。2. Description of the Related Art FIG. 3 is a side sectional view showing a heat dissipation structure of a heating element in a conventional metal core printed wiring board disclosed in Japanese Patent Laid-Open No. 1-296689, in which an electronic component 35 is mounted on a metal core printed wiring board 30. Indicates the mounted state. This will be roughly described. On the upper and lower surfaces of the metal core 31, the insulating layer 3 is formed.
2 and the conductor layer 33 are sequentially provided to form the metal core printed board 30 as a whole. The adhesive layer 34 is provided between the metal core 31 and the insulating layer 32, and the wiring board 3
A heating element arranging recess 35 having a depth reaching the metal core 31 is provided at an appropriate position on the upper surface of the recess 0.
5, the heating element 36 is turned upside down and the metal core 3
It is inserted and arranged so as to be in close contact with 1.
【０００３】そして、配線板３０の上面の導体層３３に
は、発熱素子３６からのリード線３７が半田３８により
接続されて、所望の機能を果たす回路装置を構成してい
る。なお、配線板３０の所用の箇所に設けたスルーホー
ル孔３９の内壁には連絡導体層４０が設けられ、上下の
導体層３３を電気的に接続している。このような構成に
おいて、発熱素子３６から発生する発熱は、発熱素子３
６の裏面から、熱伝導率の良い金属コア３１へ放熱され
る。A lead wire 37 from a heating element 36 is connected to the conductor layer 33 on the upper surface of the wiring board 30 by a solder 38 to form a circuit device which performs a desired function. A connection conductor layer 40 is provided on the inner wall of the through-hole 39 provided at a desired portion of the wiring board 30 to electrically connect the upper and lower conductor layers 33. In such a configuration, the heat generated from the heating element 36 is generated by the heating element 3
Heat is radiated from the back surface of 6 to the metal core 31 having good thermal conductivity.
【０００４】[0004]
【発明が解決しようとする課題】ところで、近年、発熱
素子３６として、図４に示すＬＣＣパッケージ４２、Ｐ
ＬＣＣパッケージ４３あるいはＰＡＧパッケージ４４等
のような集積度の高い超ＬＳＩや高速動作するＬＳＩ等
が多く用いられるようになっている。これらのパッケー
ジ４２、４３および４４は、図示の如くリード線がな
い、または、リード線に自由度がないといった構造とな
っており、これらの構造のパッケージの場合には、上述
したような従来の発熱素子の実装構造では、実装できな
いといった不都合があった。By the way, in recent years, as the heating element 36, the LCC package 42, P shown in FIG.
A highly integrated super LSI such as the LCC package 43 or the PAG package 44, a high-speed operating LSI, and the like have been widely used. These packages 42, 43 and 44 have a structure in which no lead wire is provided or the lead wire has no degree of freedom as shown in the figure. In the case of a package having these structures, the conventional packages as described above are used. The mounting structure of the heating element has a disadvantage that it cannot be mounted.
【０００５】したがって、本発明は上記の従来の不都合
に鑑みてなされたものであり、その目的とするところ
は、リード線がない、または、リード線に自由度がない
といった構造の発熱素子でも実装可能な放熱構造を有す
る多層プリント配線板を提供することにある。Therefore, the present invention has been made in view of the above-mentioned conventional inconveniences, and an object thereof is to mount a heating element having a structure in which no lead wire is provided or the lead wire has no degree of freedom. It is to provide a multilayer printed wiring board having a possible heat dissipation structure.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る多層プリント配線板は、熱伝導率の高
い金属からなる放熱層と、この放熱層を挟持するように
して配設された一対の配線基板と、この配線基板と前記
放熱層との間に配設されて配線基板を絶縁するプリプレ
グとからなり、前記配線基板にプリプレグを貫通し底部
が前記放熱層に達する凹部を設けるとともに、この凹部
に埋設され下面が前記放熱層に密着され発熱素子の発熱
部が密着される上端面が前記配線基板の上端面から突出
した高効率熱伝導体を有する。In order to achieve this object, a multilayer printed wiring board according to the present invention is provided with a heat dissipation layer made of a metal having a high thermal conductivity, and the heat dissipation layer sandwiched therebetween. A pair of wiring boards, and a prepreg disposed between the wiring board and the heat dissipation layer to insulate the wiring board, and a recess that penetrates the wiring board and has a bottom reaching the heat dissipation layer. A high-efficiency heat conductor is provided, which is embedded in the recess and has a lower surface that is in close contact with the heat dissipation layer and an upper end surface that is in close contact with the heat generating portion of the heat generating element, protrudes from the upper end surface of the wiring board.
【０００７】[0007]
【作用】本発明によれば、凹部に埋設された高効率熱伝
導体の発熱素子が載置される上端面が配線基板から突出
しているので、載置された発熱素子の電気的接続部が配
線基板に対設される。According to the present invention, since the upper end surface on which the heating element of the high-efficiency heat conductor buried in the recess is mounted is projected from the wiring board, the electrical connection portion of the mounted heating element is Opposed to the wiring board.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図に基づいて説明
する。図１は本発明に係る多層プリント配線板に発熱素
子を実装した状態を示す側断面図である。同図におい
て、１は多層プリント配線板、６は厚さが０．５ｍｍの
銅板からなる放熱層で、この放熱層６の上面には、プリ
プレグ５をはさんで第１の層２と第２の層３の信号層か
らなる両面基板４が設けられている。一方、放熱層６の
下面には、プリプレグ７をはさみ第３の層８である電源
層が設けられている。第３の層８の下面にはプリプレグ
７をはさみ第４の層９であるグランド層が設けられてお
り、第４の層９の下面にはプリプレグ７をはさみ第５の
層１０と第６の層１１からなる両面基板１２が設けられ
ている。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a state where a heating element is mounted on a multilayer printed wiring board according to the present invention. In the figure, 1 is a multilayer printed wiring board, 6 is a heat dissipation layer made of a copper plate having a thickness of 0.5 mm, and a prepreg 5 is sandwiched between the first layer 2 and the second layer 2 on the upper surface of this heat dissipation layer 6. A double-sided board 4 including a signal layer of the layer 3 is provided. On the other hand, on the lower surface of the heat dissipation layer 6, a power supply layer which is the third layer 8 is provided with the prepreg 7 interposed therebetween. The lower surface of the third layer 8 is provided with a ground layer which is the fourth layer 9 with the prepreg 7 sandwiched therebetween, and the lower surface of the fourth layer 9 has the prepreg 7 sandwiched between the fifth layer 10 and the sixth layer 9. A double-sided substrate 12 consisting of layer 11 is provided.
【０００９】１３は、両面基板４と両面基板１２との間
を相互に導通するスルーホールで、クリアランス１５に
よって放熱層６と絶縁されている。放熱層６の上面の両
面基板４には、発熱素子である超ＬＳＩＰＧＡパッケー
ジ１９の発熱部１７と同一形状で、かつ電気的接続のな
く、プリプレグ５を貫通して放熱層６にまで達する凹部
１６が設けられている。この凹部１６には、高効率熱伝
導体であるアルミニウム板１８が埋設されており、アル
ミニウム板１８の下面は放熱層６と密着するように接着
剤２０で接合され、上面は両面基板４の上端面より突出
し、超ＬＳＩＰＡＧパッケージ１９の発熱部１７と密着
されている。Reference numeral 13 is a through hole for electrically connecting the double-sided substrate 4 and the double-sided substrate 12 to each other, and is insulated from the heat dissipation layer 6 by the clearance 15. The double-sided substrate 4 on the upper surface of the heat dissipation layer 6 has the same shape as the heat generation portion 17 of the VLSI PGA package 19 which is a heat generation element, and has no electrical connection, and penetrates through the prepreg 5 to reach the heat dissipation layer 6. Is provided. An aluminum plate 18, which is a high-efficiency heat conductor, is embedded in the recess 16, the lower surface of the aluminum plate 18 is bonded with an adhesive 20 so as to be in close contact with the heat dissipation layer 6, and the upper surface thereof is on the double-sided substrate 4. It projects from the end face and is in close contact with the heat generating portion 17 of the VLSI PAG package 19.
【００１０】次に、上述した構成の多層プリント配線板
の製造方法を図２に基づいて説明する。同図（ａ）にお
いて、第１の層２と第２の層３とからなる両面基板４に
は、ＮＣルータ加工によって超ＬＳＩＰＡＧパッケージ
１９の搭載位置に発熱部１７と同一形状の穴１６ａを設
け、第２の層３の導体パターン３ａを公知の露光・エッ
チングにより形成する。Next, a method for manufacturing the multilayer printed wiring board having the above-mentioned structure will be described with reference to FIG. In FIG. 3A, a double-sided board 4 composed of a first layer 2 and a second layer 3 is provided with a hole 16a having the same shape as that of the heat generating portion 17 at the mounting position of the ULSI PAG package 19 by NC router processing. , The conductor pattern 3a of the second layer 3 is formed by known exposure and etching.
【００１１】同図（ｂ）において、銅板で形成された放
熱層６には、スルーホール１３と同一位置にスルーホー
ル１３よりも直径において０．７ｍｍ大きい穴を開け
て、片側０．３５ｍｍのクリアランス１５を設ける。第
３の層８と第４の層９の電源層とグランド層は、厚さが
０．１５ｍｍの銅板であり、接続されるスルーホール１
４を除き、放熱層６と同様にスルーホール１３に対して
０．３５ｍｍのクリアランス１５が設けられている。両
面基板１２には、第５の層１０のみ導体パターンを形成
する。In FIG. 1B, the heat dissipation layer 6 made of a copper plate has a hole 0.7 mm larger in diameter than the through hole 13 at the same position as the through hole 13 and a clearance of 0.35 mm on one side. 15 is provided. The power supply layer and the ground layer of the third layer 8 and the fourth layer 9 are copper plates with a thickness of 0.15 mm, and the through hole 1 to be connected is used.
A clearance 15 of 0.35 mm is provided for the through hole 13 as in the heat dissipation layer 6 except for 4. On the double-sided board 12, only the fifth layer 10 is formed with a conductor pattern.
【００１２】両面基板４と放熱層６との間にはさみ込ま
れたノーフロータイプのプリプレグ５は、両面基板４の
穴１６ａと同一位置に穴１６ａよりも外形寸法が０．５
ｍｍから１ｍｍ程度大きい穴２１を設け、放熱層６に達
する凹部１６を形成する。同図（ｂ）に示すように、各
層を重ね合わせ、公知のピンラミネート方式により積層
加工を施し、次に、スルーホール１３、１４をＮＣ穴明
け機による穴明け加工とメッキ処理によって形成し、し
かるのちに、第１の層２と第８の層１２に導体パターン
を形成する。The no-flow type prepreg 5, which is sandwiched between the double-sided board 4 and the heat dissipation layer 6, has the outer dimension of 0.5 at the same position as the hole 16a of the double-sided board 4.
A hole 21 that is larger than mm to 1 mm is provided, and a recess 16 that reaches the heat dissipation layer 6 is formed. As shown in (b) of the figure, the layers are superposed and laminated by a known pin lamination method, and then the through holes 13 and 14 are formed by an NC drilling machine and a plating process. After that, a conductor pattern is formed on the first layer 2 and the eighth layer 12.
【００１３】同図（ｃ）において、凹部１６にアルミニ
ウム板１８を熱伝導性の良い接着剤２０で接合する。こ
のとき、図１に示すように、アルミニウム板１８は、パ
ッケージ１９の下端面２２とストッパー２３とによって
形成される間隙０．５ｍｍから１ｍｍをうめるために、
両面基板４の上端面から１ｍｍ突出するような厚さを有
している。このような構成とすることにより、パッケー
ジ１９の図示を省略した電気的接続部が配線基板４に対
設され、図４に示すようなリード線がない、または、リ
ード線に自由度がないといった構造の発熱素子の実装も
可能となる。In FIG. 1C, an aluminum plate 18 is joined to the recess 16 with an adhesive 20 having good thermal conductivity. At this time, as shown in FIG. 1, the aluminum plate 18 fills a gap of 0.5 mm to 1 mm formed by the lower end surface 22 of the package 19 and the stopper 23.
The double-sided substrate 4 has a thickness such that it projects from the upper end surface by 1 mm. With such a configuration, the electrical connection portion (not shown) of the package 19 is provided opposite to the wiring board 4, and there is no lead wire as shown in FIG. 4 or there is no degree of freedom in the lead wire. It is also possible to mount a heating element having a structure.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、配
線基板にプリプレグを貫通し底部が放熱層に達する凹部
を設けるとともに、この凹部に埋設され下面が放熱層に
密着され発熱素子の発熱部が密着される上端面が配線基
板の上端面から突出した高効率熱伝導体を有するので、
超ＬＳＩのＬＣＣパッケージ、ＰＬＣＣパッケージある
いはＰＡＧパッケージ等のようなリード線がない、また
は、リード線に自由度がないといった構造の発熱素子も
実装することが可能となるとともに、高効率熱伝導体を
介して発熱素子の放熱を効率よく行うことができる。As described above, according to the present invention, the wiring board is provided with the recess which penetrates the prepreg and reaches the heat dissipation layer at the bottom, and the lower surface which is buried in the recess is brought into close contact with the heat dissipation layer to generate heat of the heat generating element. Since the upper end surface to which the parts are closely attached has a high efficiency heat conductor protruding from the upper end surface of the wiring board,
It becomes possible to mount a heating element having a structure without lead wires, such as LCC packages, PLCC packages, PAG packages, etc. of ultra-LSI, or with no degree of freedom in the lead wires, and a high-efficiency heat conductor can be mounted. Through this, the heat dissipation of the heating element can be efficiently performed.
【図１】本発明に係る多層プリント配線板に発熱素子を
実装した状態を示す側断面図である。FIG. 1 is a side sectional view showing a state in which a heating element is mounted on a multilayer printed wiring board according to the present invention.
【図２】本発明に係る多層プリント配線板の製造方法を
示す側断面図である。FIG. 2 is a side sectional view showing a method for manufacturing a multilayer printed wiring board according to the present invention.
【図３】従来の多層プリント配線板の側断面図である。FIG. 3 is a side sectional view of a conventional multilayer printed wiring board.
【図４】集積度の高い超ＬＳＩの外観図で、（ａ）はＬ
ＣＣパッケージ、（ｂ）はＰＬＣＣパッケージ、（ｃ）
はＰＡＧパッケージ４４である。FIG. 4 is an external view of a highly integrated VLSI, where (a) is L
CC package, (b) PLCC package, (c)
Is a PAG package 44.
１ 多層プリント配線板 ４ 両面基板 ５ プリプレグ ６ 放熱層 ７ プリプレグ １２ 両面基板 １３ スルーホール １４ スルーホール １５ クリアランス １６ 凹部 １７ 発熱部 １８ アルミニウム板 １９ 発熱素子 ２０ 接着剤 DESCRIPTION OF SYMBOLS 1 Multilayer printed wiring board 4 Double-sided board 5 Prepreg 6 Heat dissipation layer 7 Prepreg 12 Double-sided board 13 Through hole 14 Through hole 15 Clearance 16 Recess 17 Heat generating part 18 Aluminum plate 19 Heat generating element 20 Adhesive
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年２月１７日[Submission date] February 17, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】全文[Correction target item name] Full text
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【書類名】 明細書[Document name] Statement
【発明の名称】 多層プリント配線板[Title of Invention] Multilayer printed wiring board
【特許請求の範囲】[Claims]
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は、多層プリント配線板に
関し、特に実装された電子部品のうち発熱する部品（以
下、発熱素子という）の放熱特性を良好とした多層プリ
ント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and particularly to a heat generating component among mounted electronic components.
(Hereinafter, referred to as a heating element) and a multilayer printed wiring board having good heat dissipation characteristics.
【０００２】[0002]
【従来の技術】図３は、特開平１−２９６６８９号に開
示された従来の金属コアプリント配線板における発熱素
子の放熱構造を示す断面図で、金属コアプリント配線板
３０に電子部品３６を実装した状態を示す。これを概略
説明すると、金属コア３１の上下両面には、絶縁層３２
および導体層３３が順次設けられて、全体として金属コ
アプリント配線板３０を構成している。金属コア３１と
絶縁層３２との間に、接着層３４が設けられ、配線板３
０の上面の適所には、その深さが金属コア３１に達する
発熱素子配置用凹部３５が設けられており、この凹部３
５には、発熱素子３６がその上下を逆にして金属コア３
１と密着するよう挿入配置されている。BACKGROUND ART FIG. 3 is a shown to cross-sectional view of the heat radiation structure of the heat generating element in a conventional metal core printed wiring board disclosed in JP-A-1-296689, the electronic component 3 to the metal core printed wiring board 30 6 shows a state where 6 is mounted. This will be roughly described. On the upper and lower surfaces of the metal core 31, the insulating layer 32 is formed.
Further, the conductor layer 33 is sequentially provided to form the metal core printed wiring board 30 as a whole. The adhesive layer 34 is provided between the metal core 31 and the insulating layer 32, and the wiring board 3
A heating element arranging recess 35 having a depth reaching the metal core 31 is provided at an appropriate position on the upper surface of the recess 0.
5, the heating element 36 is turned upside down and the metal core 3
It is inserted and arranged so as to be in close contact with 1.
【０００３】そして、配線板３０の上面の導体層３３に
は、発熱素子３６からのリード線３７が半田３８により
接続されて、所望の機能を果たす回路装置を構成してい
る。なお、配線板３０の所用の箇所に設けたスルーホー
ル孔３９の壁には連絡導体層４０が設けられ、上下の導
体層３３を電気的に接続している。このような構成にお
いて、発熱素子３６から発生する熱は、発熱素子３６の
裏面から、熱伝導率の良い金属コア３１へ放熱される。A lead wire 37 from a heating element 36 is connected to the conductor layer 33 on the upper surface of the wiring board 30 by a solder 38 to form a circuit device which performs a desired function. A connecting conductor layer 40 is provided on the wall of the through-hole hole 39 provided at a desired portion of the wiring board 30 to electrically connect the upper and lower conductor layers 33. In such a configuration, the heat that occur from the heat generating element 36, from the back of the heating element 36, is radiated thermal conductivity the better metal core 31.
【０００４】[0004]
【発明が解決しようとする課題】ところで、近年、発熱
素子３６として、図４に示すＬＣＣパッケージ４２、Ｐ
ＬＣＣパッケージ４３あるいはＰＡＧパッケージ４４等
のような集積度の高い超ＬＳＩや高速動作するＬＳＩ等
が多く用いられるようになっている。これらのパッケー
ジ４２、４３および４４は、図に示すようにリード線が
ないか、またはリード線に自由度がないといった構造と
なっており、これらの構造のパッケージの場合には、上
述したような従来の発熱素子の実装構造では、実装でき
ないといった不都合があった。By the way, in recent years, as the heating element 36, the LCC package 42, P shown in FIG.
A highly integrated super LSI such as the LCC package 43 or the PAG package 44, a high-speed operating LSI, and the like have been widely used. These packages 43 and 44, there are no leads, as shown in FIG, or has a structure such that no flexibility in re lead wires, in the case of these structures packages, above The conventional mounting structure of the heating element as described above has a disadvantage that it cannot be mounted.
【０００５】したがって、本発明は上記の従来の不都合
に鑑みてなされたものであり、その目的とするところ
は、リード線がないか、またはリード線に自由度がない
といった構造の発熱素子でも実装可能な放熱構造を有す
る多層プリント配線板を提供することにある。Accordingly, the present invention has been made in consideration of the conventional disadvantages of the above, it is an object or not there leads, or heating of the structure such that no flexibility in re lead wire Another object of the present invention is to provide a multilayer printed wiring board having a heat dissipation structure that can be mounted even with elements.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る多層プリント配線板は、熱伝導率の高
い金属からなる放熱層と、この放熱層を挟持するように
して配設された一対の配線基板と、この配線基板と前記
放熱層との間に配設されて配線基板を絶縁するプリプレ
グとからなる多層プリント配線板であって、前記配線基
板にプリプレグを貫通し底部が前記放熱層に達する穴を
設けるとともに、下面が前記放熱層に密着するように穴
に埋設され、かつ上端面が前記配線基板の上端面から突
出して発熱素子の発熱部が密着される高効率熱伝導体を
設ける。In order to achieve this object, a multilayer printed wiring board according to the present invention is provided with a heat dissipation layer made of a metal having a high thermal conductivity, and the heat dissipation layer sandwiched therebetween. A multilayer printed wiring board comprising a pair of wiring boards, and a prepreg arranged between the wiring board and the heat dissipation layer to insulate the wiring board, wherein the wiring board has a bottom portion that penetrates the prepreg. Provide a hole that reaches the heat dissipation layer and make a hole so that the lower surface is in close contact with the heat dissipation layer.
Embedded in the wiring board, and the upper end surface protrudes from the upper end surface of the wiring board.
A high-efficiency heat conductor is provided to which the heat generating portion of the heat generating element is closely attached .
【０００７】[0007]
【作用】本発明によれば、穴に埋設された高効率熱伝導
体の発熱素子が載置される上端面が配線基板から突出し
ているので、載置された発熱素子の電気的接続部が配線
基板に対設される。According to the present invention, since the upper end surface on which the heating element of the high-efficiency heat conductor embedded in the hole is mounted is projected from the wiring board, the electrical connection portion of the mounted heating element is Opposed to the wiring board.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図に基づいて説明
する。図１は本発明に係る多層プリント配線板に発熱素
子を実装した状態を示す断面図である。同図において、
１は多層プリント配線板、６は厚さが０．５ｍｍの銅板
からなる放熱層で、この放熱層６の上面には、プリプレ
グ５をはさんで第１の層２と第２の層３の信号層からな
る両面基板４が設けられている。一方、放熱層６の下面
には、プリプレグ７をはさみ第３の層８である電源層が
設けられている。第３の層８の下面にはプリプレグ７を
はさみ第４の層９であるグランド層が設けられており、
第４の層９の下面にはプリプレグ７をはさみ第５の層１
０と第６の層１１からなる両面基板１２が設けられてい
る。An embodiment of the present invention will be described below with reference to the drawings. Figure 1 is a view to cross-sectional view of a state mounted a heating element on the multilayer printed wiring board according to the present invention. In the figure,
Reference numeral 1 is a multilayer printed wiring board, 6 is a heat dissipation layer made of a copper plate having a thickness of 0.5 mm, and a prepreg 5 is sandwiched between the first layer 2 and the second layer 3 on the upper surface of the heat dissipation layer 6. A double-sided board 4 including a signal layer is provided. On the other hand, on the lower surface of the heat dissipation layer 6, a power supply layer which is the third layer 8 is provided with the prepreg 7 interposed therebetween. On the lower surface of the third layer 8, a prepreg 7 is sandwiched and a fourth layer 9, which is a ground layer, is provided.
A prepreg 7 is sandwiched between the lower surface of the fourth layer 9 and the fifth layer 1
A double-sided substrate 12 consisting of 0 and a sixth layer 11 is provided.
【０００９】１３は、両面基板４と両面基板１２との間
を相互に導通するスルーホールで、クリアランス１５に
よって放熱層６と絶縁されている。放熱層６の上面の両
面基板４には、発熱素子である超ＬＳＩＰＧＡパッケー
ジ１９の発熱部１７と同一形状で、かつ電気的接続のな
く、プリプレグ５を貫通して放熱層６にまで達する凹部
１６が設けられている。この凹部１６には、高効率熱伝
導体であるアルミニウム板１８が埋設されており、アル
ミニウム板１８の下面は放熱層６と密着するように接着
剤２０で接合され、上面は両面基板４の上端面より突出
し、超ＬＳＩＰＡＧパッケージ１９の発熱部１７と密着
されている。Reference numeral 13 is a through hole for electrically connecting the double-sided substrate 4 and the double-sided substrate 12 to each other, and is insulated from the heat dissipation layer 6 by the clearance 15. The double-sided substrate 4 on the upper surface of the heat dissipation layer 6 has the same shape as the heat generation portion 17 of the VLSI PGA package 19 which is a heat generation element, and has no electrical connection, and penetrates through the prepreg 5 to reach the heat dissipation layer 6. Is provided. An aluminum plate 18, which is a high-efficiency heat conductor, is embedded in the recess 16, the lower surface of the aluminum plate 18 is bonded with an adhesive 20 so as to be in close contact with the heat dissipation layer 6, and the upper surface thereof is on the double-sided substrate 4. It projects from the end face and is in close contact with the heat generating portion 17 of the VLSI PAG package 19.
【００１０】次に、上述した構成の多層プリント配線板
１の製造方法を図２に基づいて説明する。同図（ａ）に
おいて、第１の層２と第２の層３とからなる両面基板４
には、ＮＣルータ加工によって超ＬＳＩＰＡＧパッケー
ジ１９の搭載位置に発熱部１７と同一形状の穴１６ａを
設け、第２の層３の導体パターン３ａを公知の露光・エ
ッチングにより形成する。Next, the multilayer printed wiring board having the above structure
The manufacturing method of No. 1 will be described with reference to FIG. In FIG. 1A, a double-sided board 4 composed of a first layer 2 and a second layer 3
A hole 16a having the same shape as that of the heat generating portion 17 is provided at the mounting position of the VLSI PAG package 19 by NC router processing, and the conductor pattern 3a of the second layer 3 is formed by known exposure / etching.
【００１１】同図（ｂ）において、銅板で形成された放
熱層６には、スルーホール１３と同一位置にスルーホー
ル１３よりも直径において０．７ｍｍ大きい穴を開け
て、片側０．３５ｍｍのクリアランス１５を設ける。第
３の層８と第４の層９の電源層とグランド層は、厚さが
０．１５ｍｍの銅板であり、接続されるスルーホール１
４を除き、放熱層６と同様にスルーホール１３に対して
０．３５ｍｍのクリアランス１５が設けられている。両
面基板１２には、第５の層１０のみ導体パターンを形成
する。In FIG. 1B, the heat dissipation layer 6 made of a copper plate has a hole 0.7 mm larger in diameter than the through hole 13 at the same position as the through hole 13 and a clearance of 0.35 mm on one side. 15 is provided. The power supply layer and the ground layer of the third layer 8 and the fourth layer 9 are copper plates with a thickness of 0.15 mm, and the through hole 1 to be connected is used.
A clearance 15 of 0.35 mm is provided for the through hole 13 as in the heat dissipation layer 6 except for 4. On the double-sided board 12, only the fifth layer 10 is formed with a conductor pattern.
【００１２】両面基板４と放熱層６との間にはさみ込ま
れたノーフロータイプのプリプレグ５は、両面基板４の
穴１６ａと同一位置に穴１６ａよりも外形寸法が０．５
ｍｍから１ｍｍ程度大きい穴２１を設け、放熱層６に達
する凹部１６を形成する。同図（ｂ）に示すように、各
層を重ね合わせ、公知のピンラミネート方式により積層
加工を施し、次に、スルーホール１３、１４をＮＣ穴明
け機による穴明け加工とメッキ処理によって形成し、し
かるのちに、第１の層２と第８の層１２に導体パターン
を形成する。The no-flow type prepreg 5, which is sandwiched between the double-sided board 4 and the heat dissipation layer 6, has the outer dimension of 0.5 at the same position as the hole 16a of the double-sided board 4.
A hole 21 that is larger than mm to 1 mm is provided, and a recess 16 that reaches the heat dissipation layer 6 is formed. As shown in (b) of the figure, the layers are superposed and laminated by a known pin lamination method, and then the through holes 13 and 14 are formed by an NC drilling machine and a plating process. After that, a conductor pattern is formed on the first layer 2 and the eighth layer 12.
【００１３】同図（ｃ）において、凹部１６にアルミニ
ウム板１８を熱伝導性の良い接着剤２０で接合する。こ
のとき、図１に示すように、アルミニウム板１８は、パ
ッケージ１９の下端面２２とストッパー２３とによって
形成される間隙０．５ｍｍから１ｍｍをうめるために、
両面基板４の上端面から１ｍｍ突出するような厚さを有
している。このような構成とすることにより、パッケー
ジ１９の図示を省略した電気的接続部が配線基板４に対
設され、図４に示すようなリード線がないか、またはリ
ード線に自由度がないといった構造の発熱素子の実装も
可能となる。In FIG. 1C, an aluminum plate 18 is joined to the recess 16 with an adhesive 20 having good thermal conductivity. At this time, as shown in FIG. 1, the aluminum plate 18 fills a gap of 0.5 mm to 1 mm formed by the lower end surface 22 of the package 19 and the stopper 23.
The double-sided substrate 4 has a thickness such that it projects from the upper end surface by 1 mm. With such a configuration, electrical connections (not shown) of the package 19 are oppositely arranged on the wiring board 4, there are no leads, as shown in FIG. 4, or Li <br/> over de It is also possible to mount a heating element having a structure in which the lines have no degree of freedom.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、配
線基板にプリプレグを貫通し底部が前記放熱層に達する
穴を設けるとともに、下面が前記放熱層に密着するよう
に穴に埋設され、かつ上端面が前記配線基板の上端面か
ら突出して発熱素子の発熱部が密着される高効率熱伝導
体を設けたので、超ＬＳＩのＬＣＣパッケージ、ＰＬＣ
ＣパッケージあるいはＰＡＧパッケージ等のようなリー
ド線がないか、またはリード線に自由度がないといった
構造の発熱素子も実装することが可能となるとともに、
高効率熱伝導体を介して発熱素子の放熱を効率よく行う
ことができる。According to the present invention as described above, according to the present invention, the bottom through the prepreg reached before Symbol radiating layer on the wiring substrate
Make holes so that the bottom surface is in close contact with the heat dissipation layer.
Is embedded in the hole and the upper end surface is the upper end surface of the wiring board.
High-efficiency heat conduction that sticks out and sticks to the heating part of the heating element
Since the body is provided, the VLSI LCC package and PLC
There are no leads, such as package C or PAG package, with or it is possible to also implement heating elements of the structure, such that there is no freedom to lead wire,
It is possible to efficiently dissipate heat from the heating element via the high-efficiency heat conductor.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明に係る多層プリント配線板に発熱素子を
実装した状態を示す断面図である。1 is a view to cross-sectional view of a state mounted a heating element on the multilayer printed wiring board according to the present invention.
【図２】本発明に係る多層プリント配線板の製造方法を
示す断面図である。2 is a <br/> shown to cross-sectional view of a method for manufacturing a multilayer printed wiring board according to the present invention.
【図３】従来の多層プリント配線板の断面図である。3 is a cross sectional view of a conventional multilayer printed wiring board.
【図４】集積度の高い超ＬＳＩの外観図で、（ａ）はＬ
ＣＣパッケージ、（ｂ）はＰＬＣＣパッケージ、（ｃ）
はＰＡＧパッケージ４４である。FIG. 4 is an external view of a highly integrated VLSI, where (a) is L
CC package, (b) PLCC package, (c)
Is a PAG package 44.
【符号の説明】 １ 多層プリント配線板 ４ 両面基板 ５ プリプレグ ６ 放熱層 ７ プリプレグ １２ 両面基板 １３ スルーホール １４ スルーホール １５ クリアランス １６ 凹部 １７ 発熱部 １８ アルミニウム板 １９ 発熱素子 ２０ 接着剤[Explanation of reference numerals] 1 multilayer printed wiring board 4 double-sided board 5 prepreg 6 heat dissipation layer 7 prepreg 12 double-sided board 13 through hole 14 through hole 15 clearance 16 recessed portion 17 heat generating portion 18 aluminum plate 19 heat generating element 20 adhesive
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図１[Name of item to be corrected] Figure 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１】 [Figure 1]
【手続補正３】[Procedure 3]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図２[Name of item to be corrected] Figure 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図２】 [Fig. 2]
【手続補正４】[Procedure amendment 4]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図３[Name of item to be corrected] Figure 3
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図３】 [Figure 3]
Claims (1)
と、この放熱層を挟持するようにして配設された一対の
配線基板と、この配線基板と前記放熱層との間に配設さ
れて配線基板を絶縁するプリプレグとからなる多層プリ
ント配線板であって、前記配線基板にプリプレグを貫通
し底部が前記放熱層に達する凹部を設けるとともに、こ
の凹部に埋設され下面が前記放熱層に密着され発熱素子
の発熱部が密着される上端面が前記配線基板の上端面か
ら突出した高効率熱伝導体を有することを特徴とする多
層プリント配線板。1. A heat dissipation layer made of a metal having a high thermal conductivity, a pair of wiring boards arranged so as to sandwich the heat dissipation layer, and a heat dissipation layer provided between the wiring board and the heat dissipation layer. A multi-layer printed wiring board comprising a prepreg for insulating the wiring board by providing a recess in the wiring board that penetrates the prepreg and reaches the heat dissipation layer at the bottom, and the lower surface embedded in the recess adheres to the heat dissipation layer. A multilayer printed wiring board having a high-efficiency heat conductor whose upper end surface to which the heat generating portion of the heat generating element is closely attached protrudes from the upper end surface of the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4351611A JPH06181390A (en) | 1992-12-09 | 1992-12-09 | Multilayer printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4351611A JPH06181390A (en) | 1992-12-09 | 1992-12-09 | Multilayer printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06181390A true JPH06181390A (en) | 1994-06-28 |
Family
ID=18418442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4351611A Pending JPH06181390A (en) | 1992-12-09 | 1992-12-09 | Multilayer printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06181390A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039884A (en) * | 1983-08-13 | 1985-03-01 | 松下電工株式会社 | Method of mounting part of metal base circuit board |
| JPS6127270B2 (en) * | 1981-09-04 | 1986-06-24 | Asahi Chemical Ind | |
| JPS61292997A (en) * | 1985-06-17 | 1986-12-23 | マス・インダストリアル・ソシエタ・ペル・アチオ−ニ | Method of positively cooling electronic component fixed on multilayer body for printed circuit and multilayer body realized thereby |
-
1992
- 1992-12-09 JP JP4351611A patent/JPH06181390A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6127270B2 (en) * | 1981-09-04 | 1986-06-24 | Asahi Chemical Ind | |
| JPS6039884A (en) * | 1983-08-13 | 1985-03-01 | 松下電工株式会社 | Method of mounting part of metal base circuit board |
| JPS61292997A (en) * | 1985-06-17 | 1986-12-23 | マス・インダストリアル・ソシエタ・ペル・アチオ−ニ | Method of positively cooling electronic component fixed on multilayer body for printed circuit and multilayer body realized thereby |
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