JPH06177030A - Film formation substrate processing device - Google Patents

Abstract

PURPOSE:To accurately remove a coating film in a specified pattern by providing with a developer tank that holds developer of enough amount for the entire substrate to be submerged in and an overflow tank that receives the overflowed developer from the develop tank. CONSTITUTION:A pair of guides 38, 38 that vertically support a substrate 16, a holder 18 in which desired numbers of 38, 38 are provided in parallel, and a developer tank 14 that holds enough amount of developer for the entire substrate 16, supported by the holder 18, to be submerged in, are provided. In addition, an overflow tank 32 that allows flowing-in of the developer overflowed out of the developer tank 14 is provided. Further a liquid supply part 20, comprising a discharge part 58 that discharges the developer upward along the surface of respective substrates 16, is provided, so that the developer in the overflow tank 32 is circulation-supplied to the liquid supply part 20. With this, a coating film formation surface of the substrate 16 can always be supplied with the developer with no degradation, so the coating film is surely removed with a specified pattern left as it is.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming substrate processing apparatus, and more particularly, a substrate used for forming a film of a required pattern in a process of obtaining wafers for various semiconductors and magnetic thin film heads. The present invention relates to a processing device.

[0002]

2. Description of the Related Art In order to form a magnetic or conductive thin film on a substrate in a required pattern, a coating film (resist) is applied on the film formed on the substrate, and then a coating film is formed by photoetching. It has been conventionally practiced to peel off in a required pattern to form a film. That is, only the required portions of the coating film are exposed through a mask having a required pattern, and then the substrate is immersed in a developing solution to remove (dissolve) the exposed portions of the coating film. Then, based on the required pattern formed by peeling off the coating film, patterning of film formation is performed in the next step.

As a developing method for peeling off the above-mentioned coating film leaving a required pattern, a method of immersing a substrate in a developer stored in a container, or a method of positioning a rotating table and rotating the substrate from above is used. A method of showering the developing solution through a nozzle, a method of supplying the entire amount of the developing solution to the upper surface of the substrate, and leaving the developing solution stationary on the substrate due to surface tension. It has been known.

[0004]

In the above-mentioned method, since the substrate is simply dipped in the developing solution, the peeling depth becomes insufficient. Also, oxygen in the air
Along with the deterioration due to (O) ₂ and carbon dioxide (CO ₂ ), the coating film dissolved by the developing operation is mixed and the developing solution gradually deteriorates. When the developer thus degraded reaches the surface of the substrate (the surface on which the coating film is formed), the peeling efficiency of the coating film is reduced. Therefore, the developing solution is agitated in order to expose the developing solution which has not deteriorated to the surface of the substrate. However, there are drawbacks that the peeling time of the coating film varies depending on the degree of agitation, the coating film tends to be non-uniform, and the work of taking out the substrate from the developer and checking it becomes complicated.
Further, it is pointed out that the developing solution deteriorates due to oxidation and the like when exposed to air, and thus the coating film is insufficiently peeled off, and the running cost increases due to short-term replacement of the developing solution.

In the above method, it is difficult to uniformly shower the developing solution over the entire surface of the substrate, and excessive peeling occurs at a portion where the developing solution is showered intensively. That is, it is pointed out that the time required for peeling the coating film is not uniform in each part of the substrate, the peeling is excessive and insufficient, and the amount of liquid used is large and the cost is high. Further, in the above method, the amount of the developer is insufficient, and the thick coating film causes insufficient peeling, or the decomposed gas generated when the coating film is dissolved adheres to the surface as bubbles,
The bubbles hinder the peeling, resulting in problems such as insufficient peeling and the inability to peel the coating film in an accurate pattern.

[0006]

SUMMARY OF THE INVENTION The present invention has been proposed in view of the above-mentioned drawbacks inherent in the prior art, and is a base treatment capable of accurately peeling a coating film in a required pattern. The purpose is to provide a device.

[0007]

In order to overcome the above-mentioned problems and achieve the intended object, the present invention is to expose a substrate having a film formed and a coating film on the surface thereof, and then develop the substrate with a developing solution. A device for peeling off a coating film other than a desired pattern by immersing it in a holder, in which a desired number of a pair of guides for vertically supporting the substrate are provided in parallel, and the holder is inserted in a fixed position. A developer tank that stores a developer solution in an amount capable of immersing the entire substrate supported by the holder, and a developer solution provided adjacent to the developer tank and overflowing from the developer tank. The developer is discharged upward along the surface of each substrate supported by the holder provided in the bottom of the developer tank and the overflow tank allowing the inflow of the developer solution tank. And a liquid supply unit having a discharging unit for discharging the developer in the overflow tank. Characterized by being composed of a circularly supplying fluid circulation device to the sheet portion.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a film forming substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings with reference to preferred embodiments. FIG. 1 is a perspective view showing a schematic configuration of a film-forming substrate processing apparatus according to an embodiment. The apparatus 10 includes a container 12 as a main body and a developer tank 1 defined inside the container 12.
4, a base holder 18 that is detachably inserted into the container 4, and a container 12
It is basically composed of a distributor 20 which is detachably disposed on the bottom surface of the container, and a developer circulating device 22 and a lid 24 which is detachably disposed on the upper portion of the container 12.

[0012] The container 12 is formed in a rectangular shape that opens up and down, and the bottom portion is closed by disposing the distributor 20 at the bottom portion. Inside the container 12, as shown in FIG. 4, a first partition plate 26 for partitioning the inner space into right and left is arranged, and the partition plate 26 defines a cleaning tank 28 on the right side of the container 12. This cleaning tank 28
A cleaning liquid such as water is stored in a required amount, and is used when the developing liquid is removed from the substrate 16 on which the development is completed. Further, in the space on the left side defined by the first partition plate 26, the second partition plate 30 set lower than the partition plate 26 is provided.
Are orthogonal to each other, and the space is defined by the developer tank 14 and the overflow tank 32. And developer tank 1
4 and the overflow tank 32 store a required amount of the developer, and as described later, the developer is circulated and supplied from the overflow tank 32 to the developer tank 14 through the circulation device 22, so that the developer tank 14 is supplied. The developer overflowing from the second
It is designed to flow evenly and gradually beyond the partition plate 30 into the overflow tank 32. The second partition plate 3
The height dimension of 0 is set so that when the substrate 16 is loaded into the developer tank 14 via the holder 18, the entire substrate 16 is immersed in the developer stored in the developer tank 14. .

As shown in FIG. 1, four supporting portions 34 each having a groove portion 34a extending in the vertical direction are formed on the inner surface of the second partition plate 30 defining the developer tank 14 and the container inner surface facing the second partition plate 30. Each of them is arranged in parallel in the lateral direction with a predetermined distance therebetween. The support portion 34 functions to accurately position the holder 18 of the base 16 at a predetermined position in the developer tank 14.

As shown in FIG. 1, the holder 18 is placed at a position corresponding to the supporting portion 34 provided in the developer tank 14 on the facing surfaces of the pair of side plates 36, 36 which are separated by a predetermined distance.
The two guides 38 are arranged in parallel. Both side plates 3
Blocking plates 39 are arranged between both ends of 6, 36, respectively. Further, as shown in FIG. 3, a rectifying mounting plate 40 is disposed at a position facing each guide 38 on both side plates 36, 36, whereby the four guide sets are integrated and the developer tank is formed. It is configured so that it can be loaded into and taken out of the unit 14. On the facing surfaces of the guides 38, 38, taper grooves 38a that expand toward the other facing guide 38 are formed respectively in the vertical direction, and between the taper grooves 38a, 38a,
The substrate 16 having the film formation 41 and the coating film 43 on one surface is vertically supported. Further, as shown in FIG. 2, a stopper 42 is formed at an appropriate position in the tapered groove 38 a, and the base 16 is positioned at a position where it abuts on the stopper 42. The stopper 42 is provided at a position where the lower end of the base 16 faces a predetermined height above the lower end of the holder 18. It should be noted that the mounting plate 40 is provided with both guides 38, 38.
It is set so as to face a position retracted from directly below the base 16 vertically supported between them.

On the outer surface of the side plate 36, the developer tank 1 is provided.
4. The protrusions 36a extending in the vertical direction are respectively formed at positions corresponding to the grooves 34a of the support portions 34 arranged in FIG. 4, and the protrusions 36a are fitted into the groove portions 34a of the corresponding support portions 34, respectively. Thus, the holder 18 is positioned at a fixed position in the developer tank 14 (see FIG. 4).

The distributor 20, which is detachably disposed on the bottom surface of the container 12 and closes the bottom surface thereof, is a rectangular closed container. As shown in FIG. A discharge passage 44 is formed at a position corresponding to the overflow tank 32 in the installed state. A suction pipe 48 led out from a liquid flow pump 46 constituting the circulation device 22 is connected to the discharge passage 44 so that the developer flowing into the overflow tank 32 can be sucked through the liquid flow pump 46. ing. A main passage 50 is formed in the distributor 20 in parallel with the second partition plate 30, and a discharge pipe 52 led out from the liquid flow pump 46 is connected to the main passage 50 through a flow meter 54. Has been done. That is, by driving the liquid flow pump 46, the overflow tank 3
The developer sucked from No. 2 is supplied to the main passage 50. A filter 61 is provided in the suction pipe 48 so that the developer sucked from the overflow tank 32 can be filtered and the developer without deterioration can be supplied to the main passage 50.

As shown in FIG. 3, the distributor 20 communicates with the main passage 50 and faces the supporting portions 3 facing each other.
Four distribution passages 56 facing each other are formed in parallel. Further, as shown in FIG. 2, a plurality of discharge holes 58 communicating with the distribution passage 56 and opening on the upper surface are formed at predetermined intervals in the longitudinal direction of the distribution passage 56 at positions corresponding to the respective distribution passages 56 in the distributor 20. It is set up. Therefore, the developer supplied to the main passage 50 through the liquid flow pump 46 is branched into the distribution passages 56 and then vertically discharged into the developer tank 14 through the discharge holes 58. In addition, the discharge hole array including the plurality of discharge holes 58 faces in parallel to the front surface side of the surface (the surface on which the coating film 43 is formed) of the substrate 16 supported by the holder 18 loaded in the developer tank 14. The developer discharged from each discharge hole 58 rises between the mounting plates 40 and 40 and upward on the surface of the base 16 (FIGS. 5 and 6). reference).

The liquid flow pump 46 has a controller 60.
Are connected to each other and are configured so that the flow rate of the pump 46 can be adjusted. Then, the developer discharged from the discharge holes 58 communicating with the distribution passages 56 gradually rises (for example, at a speed of 3 cm / s to 10 cm / s), and the development from the developer tank 14 to the overflow tank 32 is performed. The flow rate is set so that the overflow of the liquid is gentle. The flow rate of the developing solution from the liquid flow pump 46 to the main passage 50 can be roughly adjusted by adjusting the throttle of the flow meter 54.

The distributor 20 has a valve at a position corresponding to the developer tank 14, the overflow tank 32 and the cleaning tank 28.
A drain pipe 62 (not shown) is provided so that the developing solution and the cleaning solution can be discharged while the distributor 20 is provided in the container 12.

As shown in FIG. 1, a circular flange 64 is integrally formed outside the upper end of the container 12, and packing 66 is concentrically arranged on the flange 64. Then, by covering the upper portion of the flange 64 with a circular lid 24 that is set to have substantially the same size as the outer diameter of the flange 64, and fixing both with appropriate fasteners (not shown), the inside of the container is It is configured to be hermetically sealed. At an appropriate position of the lid body 24, a supply pipe 68 that communicates with a vacuum suction source and a supply source of an inert gas (for example, argon gas) via a switching valve (neither is shown) is provided. And container 12
After the inside is evacuated, the container 12 is filled with an inert gas.
By making the inside an inert atmosphere, the deterioration of the developing solution can be prevented.

[0018]

Operation of the Embodiment Next, the operation of the film forming substrate processing apparatus according to the embodiment will be described.

A predetermined amount of developer is stored in the developer tank 14 and the overflow tank 32 with the distributor 20 provided at the bottom of the container 12. Also, in the holder 18,
The four substrates 16 exposed after forming the film formation 41 and the coating film 43 are vertically interposed between the guides 38, 38.

Then, the holder 18 is attached to the side plates 36, 3
By inserting the protrusions 36a, 36a formed in 6 into the grooves 34a of the supporting portions 34 arranged in the developer tank 14, the holder 18 is loaded into the developer tank 14 at a predetermined position.
That is, as shown in FIG. 3, the discharge holes 58 formed in the distributor 20 are positioned so as to face the surface of each base 16 substantially directly below the surface thereof. Also, with the lid 24 fixed to the upper part of the container 12 to seal the inside of the container 12,
The inside of the container 12 is made an inert atmosphere by filling the inside of the container 12 with a vacuum and then filling it with an inert gas at a normal pressure.

By driving the liquid flow pump 46 in this state, the developer stored in the overflow tank 32 is supplied to the main passage 50 of the distributor 20, and the developer is branched into the respective distribution passages 56. . Then, the developing solution is discharged to the developing solution tank 14 through the corresponding plurality of discharging holes 58,
This developer rises gently along the surface of the base 16. A mounting plate 40 arranged between the side plates 36, 36
Thereby, the developing solution is rectified and rises vertically.

On the surface of the substrate 16, the exposed coating film 43b is dissolved and the developing solution is deteriorated. If the deteriorated developing solution is exposed on the surface, the coating film 43b is formed. Peeling is not performed efficiently. However, in the apparatus 10 of the embodiment, since the flow of the developing solution rises along the surface of the base 16, the deteriorated developing solution rises and the non-deteriorated developer is always present on the surface side of the base 16. Supplied. That is, on the surface side of the base 16,
A developer that does not deteriorate is constantly circulated and the required pattern 4
The exposed coating film 43b other than 3a can be efficiently peeled off. In addition, since the base 16 is supported by the tapered grooves 38a, 38a of the guides 38, 38, the groove 3
The developing solution smoothly circulates and moves on the surface of the base 16 facing the inside of 8a, so that the developing solution is always supplied to the entire base 16 without deterioration.

The deteriorated developer, which has risen along the surface of the base 16, has the second partition plate 3 which defines the developer tank 14.
0 overflows and flows into the overflow tank 32. Then, the developing solution that has flowed into the overflow tank 32 is recirculated by the liquid flow pump 46. Further, since the developing solution sucked by the liquid flow pump 46 is filtered by the filtering device 61, it is circulated and supplied to the developing solution tank 14 as a developing solution without deterioration. It should be noted that the deteriorated developer is less than the total amount of the developer stored in the developer tank 14 and the overflow tank 32. Therefore, the deteriorated developer is stirred and dispersed in the circulation and passed through the filter 61. Even if the coating film 43b is supplied to the developing solution tank 14 without any trouble, it does not hinder the dissolution of the coating film 43b, and the filter 61 can be omitted.

When the development of the substrate 16 is completed, the lid 24 is removed and the holder 18 is attached to the developer tank 14.
Then, the developing process is completed by immersing it in the cleaning liquid in the cleaning liquid tank 28 to wash off the developing liquid, and drying.

[0025]

[Modification] In the embodiment shown in FIG. 1, the developer sucked from the overflow tank 32 is directly supplied to the developer tank 14 as it is.
The temperature of the developing solution is kept constant (for example, 20 ° C. to 25 ° C.) by circulating the developing solution through a temperature adjusting device 70 as shown in FIG. 7, for example.
You may make it hold | maintain at (degreeC). This temperature control device 7
In the case of 0, the closed container 72 is filled with water that functions as a heat medium and a heat storage material, and an insulated electric heater 74 is provided. By energizing the heater 74, the water is heated to a predetermined temperature and heated. It is like this. Also a closed container 7
2, a heat exchange coil 76 wound with a required diameter is inserted, and the suction pipe 48 or the discharge pipe 52 is connected to the coil 76 so as to pass the developer through the coil 76. It Therefore, when the developer is passed through the heat exchange coil 76 when the water is heated to a predetermined temperature, the developer is heated by heat exchange with the hot water. Then, a temperature sensitive element 78 such as a thermostat is inserted in the closed container 72 at a position apart from the heat exchange coil 76, and the temperature of hot water heated by the heater 74 is monitored to control the energization of the heater 74. The temperature of the developer can be kept constant by carrying out the operation and keeping the water temperature in the closed container 72 constant.

The embodiment has been described with respect to the case where the substrate 16 having the film 41 and the coating film 43 on one surface is used for development, but the film 41 and the coating film 43 on both surfaces of the substrate 16 are described.
It can also be applied to the product with. For example, as shown in FIG. 6, the distributor 20 is provided with a discharge hole 58 communicating with each of the distribution passages 56 at a position facing directly below both surfaces of the base 16 so as to deteriorate along both surfaces of the base 16. Free developer can always be supplied. Since the distributor 20 is detachably mounted on the container 12 as described above, the distributor 20 can be installed according to the specifications of the base 16.
Can be dealt with by simply replacing Further, instead of the discharge holes 58, slits communicating with each of the distribution passages 56 may be formed, and the developer may be discharged from the slits in parallel to the surface of the substrate 16.

[0027]

As described above, according to the film formation substrate processing apparatus of the present invention, the developing solution can be always supplied to the surface of the substrate on which the coating film is formed, so that the coating film can be formed in a desired pattern. The remaining film can be reliably peeled off, and the patterning of the film formation can be performed accurately. In addition, since a plurality of thin film substrates can be processed at the same time, the processing capacity can be improved.

Further, the developing solution is filtered by a filtering means and supplied to the solution supply section, so that the developing solution can be efficiently recirculated and used in a small amount, and no stirring of the solution is required. Becomes Further, by keeping the temperature of the developing solution constant by the temperature adjusting means, it is possible to prevent the excess or deficiency of the peeling of the coating film due to the temperature change. Furthermore, by holding the developing solution in an atmosphere of inert gas, there is an advantage that the deterioration of the developing solution can be prevented and the running cost can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a partially broken view of a film forming substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a vertical sectional side view of a film forming substrate processing apparatus.

FIG. 3 is a vertical cross-sectional front view of a film forming substrate processing apparatus.

FIG. 4 is a plan view of a container in the film forming substrate processing apparatus.

FIG. 5 is an explanatory diagram showing a positional relationship between a substrate loaded in a developer tank and discharge holes of a distributor.

FIG. 6 is an explanatory diagram showing a relationship between a base according to another specification loaded in a developer tank and a discharge hole of a distributor according to a modification corresponding to the base.

FIG. 7 is a schematic configuration diagram of a temperature adjusting device adopted in the film forming substrate processing apparatus.

[Explanation of symbols]

 14 developer tank 16 substrate 18 holder 20 distributor 22 circulation device 24 lid 32 overflow tank 38 guide 38a taper groove 41 film formation 43 coating film 43a required pattern 43b peeling coating film 58 discharge hole 61 filter 70 Temperature control device

Claims (7)

[Claims] 1. A substrate other than a desired pattern (43a) is obtained by exposing a substrate (16) having a film (41) and a coating film (43) formed on the surface thereof and exposing the substrate (16) to a developing solution. A device for peeling off the coating film (43b) of (1), a holder (18) in which a desired number of pair of guides (38, 38) for vertically supporting the base (16) are provided in parallel, and the holder. (18) can be loaded in place, a developer tank (14) for storing a sufficient amount of developer to allow the entire substrate (16) supported by the holder (18) to be immersed, and the developer The developer tank (14) is provided adjacent to the tank (14).
Overflow tank (3 that allows the inflow of developer overflowing from
2), and along the surface of each substrate (16) provided on the bottom surface of the developer tank (14) and supported by the holder (18) loaded in the developer tank (14), A liquid supply part (20) having a discharge part (58) for discharging the liquid upward, and a developer in the overflow tank (32) are supplied to the liquid supply part (2).
A film forming substrate processing apparatus comprising a liquid circulating device (22) for circulating supply to (0). 2. The film forming substrate processing apparatus according to claim 1, wherein the liquid supply unit (20) has a desired number of discharge hole rows in which discharge holes (58) are formed at predetermined intervals. 3. The liquid supply section (20) includes the developer tank (14).
The film-forming substrate processing apparatus according to claim 1 or 2, wherein the film-forming substrate processing apparatus is arranged so that it can be attached to and detached from the apparatus. 4. The developer in the overflow tank (32),
The film forming substrate processing apparatus according to any one of claims 1 to 3, wherein the liquid is supplied to the liquid supply unit (20) after being filtered by a filtering unit (61). 5. The film formation substrate processing apparatus according to claim 1, wherein the developing solution is kept at a constant temperature by a temperature adjusting means (70). 6. Guides (38, 38) in the retainer (18)
The taper groove (38a, 38a) is formed on the facing surface of the substrate, and the substrate (16) is vertically supported between the taper groove (38a, 38a) facing each other. Base processing equipment. 7. The developer according to claim 1, wherein the developer tank (14) and the overflow tank (32) are closed by a lid (24) and an internal space is filled with an inert gas. Membrane substrate processing equipment.