JPH0617316Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0617316Y2
JPH0617316Y2 JP1988105056U JP10505688U JPH0617316Y2 JP H0617316 Y2 JPH0617316 Y2 JP H0617316Y2 JP 1988105056 U JP1988105056 U JP 1988105056U JP 10505688 U JP10505688 U JP 10505688U JP H0617316 Y2 JPH0617316 Y2 JP H0617316Y2
Authority
JP
Japan
Prior art keywords
main electrode
semiconductor element
lid
element pellet
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988105056U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226259U (enrdf_load_stackoverflow
Inventor
廣登 巣山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1988105056U priority Critical patent/JPH0617316Y2/ja
Publication of JPH0226259U publication Critical patent/JPH0226259U/ja
Application granted granted Critical
Publication of JPH0617316Y2 publication Critical patent/JPH0617316Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988105056U 1988-08-09 1988-08-09 半導体装置 Expired - Lifetime JPH0617316Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Publications (2)

Publication Number Publication Date
JPH0226259U JPH0226259U (enrdf_load_stackoverflow) 1990-02-21
JPH0617316Y2 true JPH0617316Y2 (ja) 1994-05-02

Family

ID=31337331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105056U Expired - Lifetime JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Country Status (1)

Country Link
JP (1) JPH0617316Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393126A (ja) * 1986-10-08 1988-04-23 Fuji Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0226259U (enrdf_load_stackoverflow) 1990-02-21

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