JPH06172636A - Resin composition - Google Patents

Abstract

PURPOSE:To obtain the subject composition having excellent impact resistance and chemical resistance free from peeling, comprising a specific polyphenylene ether resin and specific two kinds of block copolymers. CONSTITUTION:The objective composition comprises (A) 5-98wt.% polyphenylene ether resin containing >=0.01 ring formation end of the formula (R1 to R5 are H, alkyl, etc.; R6 to R9 are H, aryl, etc.) based on 100 phenylene ether units on the average and having 1,000-100,000 molecular weight, (B) 94-1wt.% block copolymer which is a block copolymer composed of (i) a vinyl aromatic compound polymer block and (ii) an olefin compound polymer block and has 50-90wt.% block (i) content and <=20% degree of unsaturation of the olefin compound polymer in the block (ii) and (C) 1-50wt.% block copolymer which is a block copolymer of the block (i) and the block (ii) and has 20-50 wt. block (i) content and <=20 degree of unsaturation of the olefin compound polymer in the block (ii).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyphenylene ether resin composition having excellent impact resistance and chemical resistance and free from problems such as peeling.

[0002]

2. Description of the Related Art As disclosed in JP-A-3-86756 and JP-A-3-77258, polyphenylene ether resins are known, but impact resistance,
Insufficient improvement in chemical resistance.

[0003]

Means for Solving the Problems Under the circumstances, the inventors of the present invention have made extensive studies and as a result, have found that excellent impact resistance,
The present invention relates to a polyphenylene ether-based resin composition having chemical resistance and free from problems such as peeling.

That is, the present invention provides: (I) a cyclized terminal group represented by the following general formula (a):
5 to 98% by weight of a polyphenylene ether resin containing 0.01 or more on average to 100 of phenylene ether units constituting the resin and having a number average molecular weight of 1,000 to 100,000.

[0005]

[Chemical 2]

(In the formula, R _{1 to} R ₅ are each independently hydrogen, an alkyl group, a substituted alkyl group, a halogen group, an aryl group or a substituted aryl group, and R _{6 to} R ₉ are independently hydrogen. , Alkyl group, substituted alkyl group, alkenyl group, substituted alkenyl group, halogen group, aryl group, substituted aryl group, alkoxy group, N-lactam group, carboxylic acid group, carboxylic acid anhydride group, carboxylic acid ester group, carboxylic acid It is an amide group, a nitrile group, an acyloxy group or an acyl group. Note that R ₆ and R ₇ , and R ₈ and R ₉ may be independently bonded to each other to form a ring having a spiro cyclic structure.)

(II) A block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B, wherein the vinyl aromatic compound polymer in the block copolymer is 94 to 1% by weight of the block copolymer in which the content of the combined block A is 50% by weight or more and 90% by weight or less, and the degree of unsaturation of the olefin compound polymer in the olefin compound polymer block B is 20% or less. %,

(III) A block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B, wherein the vinyl aromatic compound polymer in the block copolymer is 1 to 50% by weight of a block copolymer in which the content of the polymer block A is 20% by weight or more and less than 50% by weight, and the degree of unsaturation of the olefin compound polymer in the olefin compound polymer block B is 20% or less. % Of the resin composition and a molded article made of the resin composition.

That is, the present inventors have found that the polyphenylene ether resin has a composition in which the vinyl aromatic compound polymer in the block copolymer is 50% by weight or more and 90% by weight or less, and the vinyl in the block copolymer is A resin composition and molding having excellent impact resistance and chemical resistance, and having no trouble such as peeling, by blending a combination of aromatic compound polymers having a composition of 20% by weight or more and less than 50% by weight It was found that the body can be obtained, and the present invention has been completed.

The polyphenylene ether resin (I) used in the present invention has an average of 0.01 or more cyclized terminal groups represented by the general formula (a) per 100 polyphenylene ether units constituting the resin. Must be included.

The polyphenylene ether resin (I) of the present invention has an average number of cyclized end groups per 100 phenylene ether units when the polyphenylene ether resin (I) has an average molecular weight of about 10,000 to 30,000 as an engineering resin. It is preferably 0.15 or more. More preferably, it is 0.2 or more on average. There is no particular upper limit,
The larger the amount, the more preferable in terms of thermal oxidation resistance deterioration. Further, a resin in which all the terminal groups have the structure of the general formula (a) is also a very stable resin.

This polyphenylene ether resin (I)
Is generally used as a repeating unit except for its terminal group.

[Chemical 3] It is defined as containing a phenylene ether unit represented by and is not particularly limited.

A typical example thereof is the following formula (b);

[Chemical 4] (In the formula, each of R _{1 to} R ₅ is independently selected from hydrogen, an alkyl group, a substituted alkyl group, a halogen group, an aryl group or a substituted aryl group.) And at least one kind of phenylene unit. It

In order to produce the basic skeleton of the polyphenylene ether resin (I) by oxidative coupling polymerization of phenols, which is industrially advantageous, R ₁ is methyl, ethyl, propyl, isopropyl, n-butyl or the like. Lower alkyl group or phenyl, naphthyl and the like are preferable, and R is
_{2 to} R ₅ are preferably hydrogen or lower alkyl.

The most preferable combination is when R ₁ is a methyl group or a phenyl group and R _{2 to} R ₅ are hydrogen, when R ₁ and R ₂ are methyl groups and R _{3 to} R ₅ are hydrogen. Is. In particular, R ₁ is a methyl group and R ₂
Preferably, R ₅ is hydrogen and the phenylene ether units account for 90 to 100% of all units.

Most preferred R ₁ to satisfy these conditions
Examples of the monomer corresponding to the phenylene ether unit having R ₅ include 2,6-dimethylphenol, 2-methyl-6-phenylphenol, 2,3,6-trimethylphenol and the like.

These monopolymers and copolymers are preferably used as the polyphenylene ether polymer as the resin basic skeleton of the present invention.

Further, in the polyphenylene ether resin of the present invention, various other phenylene ether units, which have been proposed to be present in the polyphenylene ether resin, have been proposed so far as long as they do not violate the gist of the present application. May be included as.

Examples of those proposed to coexist in a small amount are described in JP-A-1-297428 and JP-A-63-301222.
Examples thereof include (dialkylaminomethyl) 6-methylphenylene ether unit and 2- (N-alkyl-N-phenylaminomethyl) 6-methylphenylene ether unit. Further, a polyphenylene ether resin in which a small amount of diphenoquinone or the like is bound in the main chain is also included.

Further, for example, JP-A-2-276823, JP-A-63-108059 and JP-A-59-
It also includes polyphenylene ether modified with a compound having a carbon-carbon double bond, as described in Japanese Patent Publication No. 59724.

The polyphenylene ether resin (I) used in the present invention has a number average molecular weight of 1,000.
100 to 100,000. Its preferred range is about 6,
000 to 60,000. The number average molecular weight as referred to in the present invention is a polystyrene equivalent number average molecular weight obtained by gel permeation chromatography using a calibration curve of standard polystyrene.

In the cyclized terminal group (a) of the polyphenylene ether resin (I) used in the present invention, R _{1 to} R ₅ are
Each independently represents hydrogen, an alkyl group, a substituted alkyl group, a halogen group, an aryl group or a substituted aryl group, and R ₆
To R ₉ are each independently hydrogen, an alkyl group, a substituted alkyl group, an alkenyl group, a substituted alkenyl group, a halogen group, an aryl group, a substituted aryl group, an alkoxy group, an N-lactam group, a carboxylic acid group, a carboxylic acid anhydride. A group, a carboxylic acid ester group, a carboxylic acid amide group, a nitrile group, an acyloxy group or an acyl group.

R ₆ and R ₇ , R ₈ and R ₉ may be independently bonded to each other to form a ring having a spiro ring structure. In the above definition of R _{1 to} R ₅ , the alkyl group is alkyl having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms. The substituent of the substituted alkyl includes fluorine, chlorine,
Examples thereof include halogen such as bromine; hydroxyl group; amino group; lower alkoxy group. Aryl is aryl having 6 to 20 carbon atoms.

The substituent of the substituted aryl is fluorine,
Examples thereof include halogen such as chlorine and bromine; hydroxyl group; amino group; lower alkoxy group. R ₆ ~ R
_In the definition of ₉ , the alkyl group is alkyl having 1 to 20 carbons, preferably 1 to 10 carbons, and more preferably lower alkyl.

As the substituent of the substituted alkyl, fluorine,
Examples thereof include halogen such as chlorine and bromine; hydroxyl group; amino group; lower alkoxy group. The alkenyl is preferably lower alkenyl such as ethylenyl and 3-propenyl. A representative example of a substituted alkenyl is 1-hydroxy-3-propenyl. Aryl has 6 to 6 carbon atoms
20 aryls.

Examples of the substituent of the substituted aryl include a lower alkyl group; a lower alkoxy group; a halogen such as fluorine, chlorine and bromine; a hydroxyl group; an amino group; and an aminoalkyl group such as an aminomethyl group.

The aryl group means an aromatic ring group in a broad sense, and in addition to aryl in a narrow sense, a heteroaromatic ring group such as a pyridyl group and a triazyl group is also included. Representative examples of N-lactams are N-2-pyrrolidonyl, N-ε-caprolactamoyl and the like.

Typical examples of the carboxylic acid amide include carbamoyl, phenylcarbamoyl and ceryl. Preferred examples of the carboxylic acid anhydride are acetoxycarbonyl and benzoyloxycarbonyl.

Representative examples of the carboxylic acid ester include methoxycarbonyl, ethoxycarbonyl, allyloxycarbonyl and the like. Representative examples of the acyl group include acetyl and benzoyl, and preferable examples of the acyloxy include acetoxy and benzoyloxy.

Of R _{6 to} R ₉ , 2 to 3 of them are 2 to 3 of them.
From the viewpoint of stability, it is preferable that the number of hydrogen atoms, in particular, 3 is hydrogen. At this time, the other group is an aryl group, a substituted aryl group,
It is preferable to select from a carboxylic acid group, a carboxylic acid anhydride group, a carboxylic acid ester group, a carboxylic acid amide group, a nitrile group, and an N-lactam group. In particular, it is preferable that at least one of R ₈ and R ₉ is an aryl group or a substituted aryl group from the viewpoint of stability against thermal oxidative deterioration and the production method described later.

Representative examples of the aryl or substituted aryl group in the definition of R _{6 to} R ₉ are phenyl, tolyl, chlorophenyl, naphthyl, 4-pyridyl, 3,5-diamino- (s) -triazyl group and the like.

The structure and the amount of such a cyclized terminal group can be measured by using a nuclear magnetic resonance spectrum.
Since the polyphenylene ether resin having the cyclized end group (a) has the cyclized end group, it produces a transition structure represented by the following general formula (c) when melted (molded), as compared with a conventional polyphenylene ether resin. Very few,
It has an excellent property that the molecular weight hardly changes.

[0033]

[Chemical 5] (In the formula, R _{1 to} R ₅ are each independently hydrogen, an alkyl group,
It is a substituted alkyl group, a halogen group, an aryl group or a substituted aryl group. )

The stabilized polyphenylene ether resin can be manufactured as follows. That is, the general formula (d);

[0035]

[Chemical 6] (In the formula, R _{1 to} R ₅ are the same as those defined in the formula (a), and R ₁₀ and R ₁₁ are independently hydrogen, an alkyl group,
It represents a substituted alkyl group, but is not hydrogen at the same time. ) A polyphenylene ether polymer having a terminal group represented by the general formula (e);

[0036]

[Chemical 7] (In the formula, R _{6 to} R ₉ are the same as those defined in the formula (a).)

Heating with a compound having a carbon-carbon double bond represented by (hereinafter referred to as an unsaturated compound) to a temperature not lower than the glass transition temperature of the polyphenylene ether polymer in the absence of a radical polymerization initiator. Can be manufactured by.

The alkyl group and substituted alkyl group for R ₁₀ and R ₁₁ in the above formula (d) are preferably (C ₁ -C ₂₀ ) alkyl groups, (C ₁ -C ₂₀ ) hydroxyalkyl groups, and (C
_{2 to} C ₂₂ ) alkoxyalkyl group, (C _{3 to} C ₂₂ ) acyloxyalkyl group or (C _{4 to} C ₂₀ ) polyalkylene ether group.

The polyphenylene ether having such a terminal group (d) is oxidatively coupled with a phenol compound having at least one benzylic hydrogen at the ortho position of the hydroxyl group in the presence of a catalyst containing a primary or secondary amine. Obtained by polymerization or copolymerization (see, for example, US Pat.
88,277).

In this case, the polymer obtained is a mixture of a polyphenylene ether having a terminal group represented by the general formula (d) and a polyphenylene ether having a terminal structure in which no primary or secondary amine is bonded at the benzyl position. Although obtained, it can be used without separation in the present invention. The ratio of the former and the latter used is not particularly limited, but it is preferably 0.9 or more as shown by the ratio of the number of terminal groups of the former / the number of terminal groups of the latter.

The reaction amount of the polyphenylene ether having a terminal group represented by the general formula (d) and the unsaturated compound represented by the general formula (e) in the present invention is preferably,
To the polyphenylene ether having a terminal group represented by the general formula (d), the unsaturated compound of the general formula (e) is added in an amount of 2 to
About 50 equivalents may be used.

In the production of the stabilized polyphenylene ether resin of the present invention, as the unsaturated compound (e), in order to stabilize the intermediate radical (f) produced, for example, in the form of a biradical (g), R ₈ and / or R ₉
Is preferably an aryl or substituted aryl group.

[0043]

[Chemical 8]

[0044]

[Chemical 9]

Preferred specific examples of the unsaturated compound (e) include styrene, α-methylstyrene, chlorostyrene, methylstyrene, stilbene, cinnamic alcohol,
Examples thereof include benzalacetone, ethyl cinnamate, cinnamic nitrile, 4-vinylpyridine, 2-vinyl-3,5-diamino- (s) -triazine and the like.

As the unsaturated compound (e), a compound containing no aromatic ring can be used. Specific examples of such unsaturated compounds (e) include acrylic acid; methyl acrylate, ethyl, propyl, butyl, isopropyl, t
-Acrylic acid esters such as butyl, 2-ethylhexyl, octyl, isodecyl, lauryl, lauryl-tridecyl, tridecyl, cetyl-stearyl, stearyl, cyclohexyl, benzyl ester;

Acrylamide, acrylonitrile, methacrylic acid; methyl methacrylic acid, ethyl, propyl,
Methacrylic acid esters such as butyl, isopropyl, t-butyl, 2-ethylhexyl, octyl, isodecyl, lauryl, lauryl-tridecyl, tridecyl, cetyl-stearyl, stearyl, cyclohexyl, benzyl ester;

Methacrylamide, methacrylonitrile,
Itaconic acid; Itaconic acid monoesters of itaconic acid such as dimethyl, diethyl, dibutyl, di-2-ethylhexyl, dinolyl, dioctyl ester; Itaconic anhydride; N-vinyl compounds such as N-vinylpyrrolidone; Butyl vinyl ether, etc. Vinyl ethers, etc.

In the production of the stabilized polyphenylene ether resin of the present invention, the polyphenylene ether polymer is mechanically mixed with the unsaturated compound (e) before being heated to a glass transition temperature of 180 ° C. or higher. It is preferable to save it.

The method of mixing is not particularly limited, but it is a method of dry blending with a Henschel mixer or the like, a method of drying after melt blending, a polyphenylene ether in which the unsaturated compound (e) is not dissolved, but the unsaturated compound (e) is dissolved. Alternatively, for example, a method of dissolving in a solvent such as methanol or pentane and impregnating the polyphenylene ether-based polymer having a powdery end group (d) and then removing the solvent by drying may be mentioned.

The polyphenylene ether polymer and the unsaturated compound (e) mechanically mixed as described above are
Next, the polyphenylene ether-based polymer is heated and melted to the glass transition temperature (about 208 ° C.) or higher.

The preferred temperature range is 2 of the glass transition temperature.
0 to 150 ° C. above, more preferably 50 to 120 ° C.
℃ above. The heating time cannot be generally stated in relation to the temperature, but heating may be performed for a time sufficient to complete the desired reaction. Generally, it is about 1 minute to 1 hour, preferably about several minutes. There is no point in being too long.

Since the reaction for forming the cyclized terminal group (a) is usually sufficiently fast at a glass transition temperature or higher, it is better not to unnecessarily apply excessive heat. Also, the heating is as described above.
It needs to be carried out in the absence of a radical polymerization initiator. Oxygen should be excluded as much as possible, and for that reason, it is preferable to use a nitrogen gas atmosphere as the reaction atmosphere.

The polyphenylene ether resin (I) of the present invention is used in an amount of 5 to 98% by weight. Preferably 20-
95% by weight, more preferably 35 to 95% by weight.

Next, the block copolymer (II) used in the present invention is a block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B. The content of the vinyl aromatic compound polymer block A in this block copolymer is 50% by weight or more and 90% by weight or less, and the degree of unsaturation of the olefin compound in the olefin compound polymer block B is 20% or less. It is a thing of.

The olefin compound polymer block of the block copolymer is a monoolefin such as ethylene, propylene, 1-butene or isobutylene, or a conjugated diolefin such as butadiene, isoprene or 1,3-pentadiene, or 1,4. A polymer block in which one or more olefin compounds selected from non-conjugated diolefins such as hexadiene, norbornene and norbornene derivatives are polymerized or copolymerized, and the degree of unsaturation of the block is 20 % Or less.

Therefore, when the above-mentioned diolefins are used as the constituent monomers of the olefin compound polymer block, the degree of unsaturation of the block portion is determined by hydrogenation to such an extent that the degree of unsaturation does not exceed 20%. Must be taken to reduce

The olefin compound polymer block may be randomly copolymerized with a vinyl aromatic compound as long as its characteristics are not impaired. A preferred block copolymer is a block copolymer composed of a vinyl aromatic compound polymer block and a polymer block containing a conjugated diene compound as a main component (hereinafter referred to as "block copolymer as a precursor"). (Hereinafter referred to as)) is selectively hydrogenated to such an extent that the degree of unsaturation of the conjugated diene portion does not exceed 20%.

The vinyl aromatic compound constituting the "block copolymer as a precursor" is selected from one or more kinds selected from styrene, α-methylstyrene, vinyltoluene and the like, of which styrene is particularly preferable. preferable.

The conjugated diene compound is selected from one or more kinds selected from butadiene, isoprene, 1,3-pentadiene, etc. Among them, butadiene and / or isoprene are particularly preferable.

In the “block copolymer as a precursor”, the weight ratio of the vinyl aromatic compound content to the conjugated diene compound content is preferably 50/50 to 90/10, and 55/45 to The range of 85/15 is more preferable.

Content of vinyl aromatic compound is 50% by weight
When the amount is smaller, a phase separation phenomenon due to poor compatibility occurs when the resin composition is molded, and the fluidity is also adversely affected.

The above block copolymer has a number average molecular weight of 2,000 to 500,000, preferably 20,000.
The range is 0 to 300,000, and the molecular weight distribution (ratio of weight average molecular weight to number average molecular weight) is preferably 1.05 to 10.

The molecular structure of the block copolymer may be linear, branched, radial or a combination thereof. Among these, a linear structure is more preferable.

The method for producing the "block copolymer as a precursor" is, for example, Japanese Patent Publication No. 36-19286, Japanese Patent Publication No. 43-14979, and Japanese Patent Publication No. 49-36.
957, Japanese Patent Publication No. 48-2423, Japanese Patent Publication No. 4
The method described in, for example, JP-A-8-4106 can be used.

All of them use an organolithium compound or the like as an anionic polymerization initiator in a hydrocarbon solvent, and optionally a vinylating agent, a coupling agent or the like to block the vinyl aromatic compound and the conjugated diene compound. It is a method of polymerizing.

The above-mentioned "block copolymer as a precursor" is hydrogenated by a known method, for example, the method described in JP-B-42-8704, whereby the block copolymer used in the present invention is obtained. can get. The block copolymer (II) is used in an amount of 1 to 96% by weight. Preferably 1 to
It is 50% by weight, and more preferably 5 to 40% by weight.

Next, the block copolymer (III) used in the present invention is a block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B. The content of the vinyl aromatic compound polymer block A in this block copolymer is 20% by weight or more and less than 50% by weight,
Moreover, the degree of unsaturation of the olefin compound in the olefin compound polymer block B is 20% or less.

This block copolymer is the same as the block copolymer (II) except that the content of the vinyl aromatic compound polymer block A in the copolymer is 20% by weight or more and less than 50% by weight. belongs to.

This block copolymer (III) has 1 to 5
0% by weight is used. It is preferably 1 to 30% by weight, more preferably 1 to 20% by weight. The composition of the present invention may be prepared by blending at the same time as manufacturing or after manufacturing.
Furthermore, extrusion granulation can be performed. A vinyl aromatic resin may be added to this composition as long as its characteristics are not impaired.

Examples of the vinyl aromatic resin include homopolymers of styrene and copolymers with other ethylenically unsaturated monomers as long as the compatibility as a composition is not impaired. Further, a vinyl aromatic polymer in which these resins are reinforced with an elastomer may be used.

Specific examples of comonomers include α-methylstyrene, acrylonitrile, methacrylonitrile, acrylic acid esters, methacrylic acid esters,
Examples include maleic anhydride, N-alkylmaleimides, N-arylmaleimides, vinyloxazoline and the like.

In the resin composition of the present invention, an antistatic agent, glass fiber and other inorganic fillers, various stabilizers, plasticizers, flame retardants, pigments, etc. may be added to the resin composition according to known methods, as long as the characteristics are not impaired. It can be added and used.

The method for obtaining a molded product from the resin composition of the present invention is not particularly limited, and a commonly used method such as injection molding or melt pressing may be used. The resin composition of the present invention is not particularly limited, but is used for automobiles, office machines, electric / electronic parts, refueling machines, furniture and the like.

[0075]

The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. Each measurement was performed under the following conditions. Polymer viscosity; 0.5% chloroform solution 30
Ηsp / measured using an Ubbelohde viscous tube at ℃
Represented by c.

¹ H-nuclear magnetic resonance spectrum: measured with GX-270 manufactured by JEOL Ltd. using CDCl ₃ as a solvent, and tetramethylsilane is used as a reference. Gel permeation chromatography (hereinafter G
PC); measured by HL-802RTS manufactured by Toyo Soda Kogyo Co., Ltd. As the calibration curve for GPC, one prepared using standard polystyrene is used.

Free Phenolic OH in Polymer
Group; methods such as EHUD SHCHORI [Journal
Of Applied Polymers Science; Applied Polymer Symposium, 34, 103-117
Page, (1978)].

Izod impact strength; ASTM D-
It measures according to 256. Phase releasability: Injection molded 1/8 inch thick dumbbell test pieces are bent and broken, and the fracture surface is evaluated by visual observation.

Chemical resistance (stress crack resistance);
A test piece is cut out from a compression-molded product having a thickness of 3 mm, and after annealing, it is isopropanol / cyclohexane 60 at 23 ° C.
The minimum strain (%) required to generate stress cracks is measured by immersing in a mixed solution of / 40 (% by weight) for 30 minutes.

[0080]

Reference Example 1 Preparation of Polyphenylene Ether Resin (I) Polyphenylene ether as a raw material is described in US Pat.
It is produced by oxidative coupling polymerization of 2,6-xylenol in the presence of dibutylamine according to the method described in 8,277.

The polyphenylene ether obtained has a viscosity of 0.545 and a glass transition temperature of about 208.degree. As a result of analysis by ¹ H-nuclear magnetic resonance spectrum,
(H) formula;

[0082]

[Chemical 10] It is confirmed that 0.32 of the terminal groups of is present for every 100 of the following main repeating units (i).

[0083]

[Chemical 11] Further, it is confirmed that the amount of free phenolic hydroxyl group is 0.34 per 100 main repeating units (i).

After uniformly blending 10 parts by weight of styrene with 100 parts by weight of this polyphenylene ether with a Henschel mixer, the diameter of the screw was 30 mmφ.
In a twin-screw extruder (PCM-30 manufactured by Ikegai Tekko KK)
Melt-knead at 0 ° C. and pelletize through a water bath.

The pellet thus obtained was treated with ¹ H-
As a result of analysis by a nuclear magnetic resonance spectrum, formula (j):

[0086]

[Chemical 12] It is confirmed from the area value of the signal of 5.02 ppm that the 0.25 end group is present for every 100 main repeating units (i).

The amount of free phenolic hydroxyl group is
It is confirmed that there are 0.45 per 100 main repeating units (i). The number average molecular weight determined by GPC is 24,500 and the viscosity is 0.547.

[0088]

Examples 1 to 4 and Comparative Examples 1 to 3 Polyphenylene ether resin (I), block copolymer (II) and block copolymer (III) were mixed and melt-kneaded at 320 ° C. in a twin-screw extruder. And pelletize.

The pellets are molded by an injection molding machine under the conditions of 330 ° C., test pieces are prepared and evaluated. As the block copolymer (II), those having the following properties are used in the amounts shown in each table. Styrene content: 60% by weight Number average molecular weight: 8.0 × 10 ⁴ Unsaturation: 2%

[0090]

[Table 1] * 1 Styrene%; Weight% of styrene component in the block copolymer

[0091]

[Table 2]

As is clear from Tables 1 and 2, Examples 1 to 1
The composition No. 3 has excellent impact resistance, chemical resistance, and phase separation properties.

[0093]

EFFECT OF THE INVENTION The resin composition of the present invention has excellent impact resistance and chemical resistance and is free from problems such as peeling.

Claims (2)

[Claims] (I) An average of 0.01 or more of cyclized terminal groups represented by the following general formula (a) is contained per 100 phenylene ether units constituting a resin, and the number average molecular weight is 5 to 98% by weight of polyphenylene ether resin in the range of 1,000 to 100,000, (In the formula, R _{1 to} R ₅ are each independently hydrogen, an alkyl group, a substituted alkyl group, a halogen group, an aryl group or a substituted aryl group, and R _{6 to} R ₉ are each independently hydrogen,
Alkyl group, substituted alkyl group, alkenyl group, substituted alkenyl group, halogen group, aryl group, substituted aryl group,
It is an alkoxy group, N-lactam group, carboxylic acid group, carboxylic acid anhydride group, carboxylic acid ester group, carboxylic acid amide group, nitrile group, acyloxy group or acyl group. In addition, R ₆ and R ₇ , and R ₈ and R ₉ may be independently bonded to each other to form a ring having a spiro ring structure. (II) A block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B, wherein the vinyl aromatic compound polymer block in the block copolymer A
94 to 1% by weight of a block copolymer having a content of 50% by weight or more and 90% by weight or less and the degree of unsaturation of the olefin compound polymer in the olefin compound polymer block B is 20% or less, III) A block copolymer comprising at least one vinyl aromatic compound polymer block A and at least one olefin compound polymer block B, wherein the vinyl aromatic compound polymer block A in the block copolymer is 1 to 50% by weight of a block copolymer having a content of 20% by weight or more and less than 50% by weight and the degree of unsaturation of the olefin compound polymer in the olefin compound polymer block B is 20% or less. A resin composition comprising: 2. A resin molded product molded from the resin composition according to claim 1.