JPH06163613A - Encapsulation agent coating device - Google Patents

Abstract

PURPOSE:To prevent uneven coating and sticking of encapsulation agent to an element surface by saving labor through automation. CONSTITUTION:A feeder mechanism that carries a lead frame 20 mounted with a to-be-processed semiconductor element is provided with a carry claw connected to the first jig cylinder and a carry block 23 assigned on the lead frame, and the carry claw is lowered to hook the lead frame. The carry black 23 connected to the first rodless cylinder is carried by one lead frame. The lead frame at a specified position is, while held by a frame holder connected to the second jig cylinder, moved backward. Then a motor tilts the lead frame by a specified angle. These a series of operations are performed by an oscillating mechanism 22. In accordance with the lead frame at this position, an XY robot 31 waves a dispenser 32, and the inclined lead frame is automatically coated with the encapsulation agent by a needle filled with the encapsulation agent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an encapsulating agent coating device, and is particularly suitable for encapsulation of a diode bridge.

[0002]

2. Description of the Related Art As a semiconductor element, a so-called planar type in which a junction end is exposed on a substrate surface and a so-called mesa type in which a junction end is exposed in a thickness direction of a substrate have been put into practical use. It is common to protect the joint ends by encapsulation. Diode bridges and the like are known as semiconductor elements of this type,
Usually, a potting process is performed. This step is performed manually, and a method is adopted in which the operator holds the needle for filling the encapsulating agent and applies it to the gap of the tilted lead frame. On the other hand, since the diode bridge constitutes a two-phase bridge or a three-phase bridge with a plurality of diodes, at least two terminals are required.

In the manual capping process, a lead frame with a gap is used as described above, and other types of DIP type lead frames are
Since there are holes on the top surface, a mechanical treatment method was adopted. This will be described with reference to FIGS. FIG. 1 is a plan view of a so-called DIP type lead frame 1, and an enlarged view of a bed portion 3 installed on the plate body 2 at the same pitch.
It was shown to. As is clear from FIGS. 1 and 2, holes 4 for transportation are provided at both ends of the plate body 2. To fix the diode bridge 5 as shown in FIGS. It has a sandwiching structure and is electrically connected to the outside through a part 6 of the plate body 2. A hole 7 is installed in the central portion of the plate body 2, and a needle for accommodating the encapsulating agent is applied to the hole for encapsulation to expose the junction of the mesa diode bridge 5 with the encapping agent 8. Protect.

In addition, a diode bridge 5 is attached to the bed 3.
In order to mount, the solder layer 9 is utilized as apparent from FIGS. 3 and 4, and the sectional structure thereof is shown in FIG.

To perform the above steps, an apparatus (not shown) is used. That is, a stocker for the lead frame 2, a product storage unit for which encapsulation has been completed, and a magazine elevator are installed on the left and right of the gantry, and a frame feed unit is arranged between them. On top of that, Z
A device capable of moving the needle only in the direction is provided, and the cap 1 is applied to the hole portion 7 of the lead frame 1 in which the needle 1 is manually transferred to the frame feed unit to perform encapsulation.

[0006]

As described above, in the SMD type lead frame encapsulation process that is performed manually, uneven coating may occur, the diode bridge surface mounted on the lead frame may be adhered, and the transfer process in the subsequent process may be performed. This has been a cause of defective products because of the drawbacks such as the thin wall thickness of the envelope formed by the molding process.

The present invention has been made under such circumstances, and particularly aims to automate the encap process.

[0008]

[MEANS FOR SOLVING THE PROBLEMS] A feeder mechanism that conveys a lead frame on which a semiconductor element to be processed is mounted and is attached to a loader mechanism, an unloader mechanism that is installed separately from this loader mechanism, and a center block that is installed in the loader mechanism. ， A swing mechanism that is installed in this center block and can be moved to a different position from the feeder mechanism to tilt, and a dispenser that can move with respect to the tilted lead frame, discharges the encapsulation agent, and is installed in the unloader mechanism. The mechanism and the features of the encapsulation agent application device according to the present invention are characteristic.

[0009]

The feeder mechanism for carrying the lead frame on which the semiconductor element to be processed is carried is provided with a carrying claw connected to the first jig cylinder and a carrying block for arranging the lead frame, and the carrying claw is lowered to move the lead frame. Engage. Then, the transport block connected to the first rodless cylinder is transported by one lead frame.

Further, the lead frame at a predetermined position is pressed by a frame presser connected to the second jig cylinder and moved rearward by the operation of the second rodless cylinder.

After that, the lead frame is tilted at a predetermined angle by the pulse motor. The rocking mechanism performs this series of operations. The dispenser mechanism is moved stepwise by the XY robot corresponding to the lead frame at this position to apply the encapsulant to the inclined lead frame. In the tilted lead frame, the encapsulation is automatically performed by the needle filled with the encapsulation agent instead of being manually operated.

[0012]

Embodiments of the present invention will be described with reference to FIGS. A top view of the SMD type lead frame used in the present invention is shown in FIG. 5, a cross section after mounting the diode bridge is shown in FIG. 6, and a top view after encapsulation is shown in FIG. FIG. 8 shows the insertion direction of the needle containing the encapsulation agent with respect to the mounted diode bridge. FIG. 9 is a perspective view of a transfer claw that constitutes a feeder mechanism that transfers a lead frame, FIG. 10 is an external view of a swinging mechanism, FIG. 11 is an external view of a dispenser mechanism by an XY robot, and FIG. 12 is the present invention. It is a figure which shows the encapsulation agent application process by.

Prior to the description of the actual encapsulation agent coating step, the SMD type lead frame 10 on which a semiconductor element, for example, a mesa type diode bridge 4 is mounted,
This will be described with reference to FIGS.

Lead frame 1 described in the prior art section
The difference with is the presence or absence of holes. That is, in the lead frame 10 used in the present invention, the needle is inserted from the thickness direction of the semiconductor element to be processed to be mounted, for example, the diode bridge, that is, the arrow direction shown in FIG. Then, fill up the encapsulation agent. For this reason, one of the features of the encapsulating agent application apparatus according to the present invention is to install a swinging mechanism.

FIG. 5 shows a top view after mounting the diode bridge 5 on the lead frame 10 used in the encapsulating agent application apparatus of the present invention, and FIG. 6 shows a cross section after the encapsulating agent application on the diode bridge 5. That is, as is clear from FIG. 6, since the diode bridge 5 is fixed to the two lead frame 10 portions via the solder layer 9 as in the conventional case, the diode bridge 5 is sandwiched in the same manner as in the conventional case.

The top view of FIG. 7 reveals that after the encapsulation agent is applied, the diode bridge 5 is covered with an extremely thin encapsulation agent 8 to show its shape.

When the encapsulation agent 8 is applied, the diode bridge is also tilted by a swing mechanism described later, and a needle is applied in the thickness direction to apply the encapsulation agent to apply the thickness of the mesa diode bridge 5. Protects the joint end exposed in the vertical direction. Next, the encapsulating agent application device will be described with reference to FIGS. 9 to 12. The encapsulating agent application device is composed of a loader and an unloader. The former is provided with a feeder mechanism 21 and a swing mechanism 22 (see FIG. 12), and the former is provided with a transport block 23 and a transport claw 2.
Install 4.

A center block 25 (see FIG. 10) is movably arranged on the carrying block 23, and the lead frame 10 mounted with the diode bridge 5 arranged on the carrying block 23 is hooked on the carrying pawl 24 up to this position. For this purpose, the transfer claw 24 connected to the first jig cylinder 26 shown in FIG. 9 is lowered, and the center block 25 is moved by using the attached first rodless cylinder 27. Therefore, the lead frame 10 moves using the first rodless cylinder 27 in the horizontal direction and the first jig cylinder 26 in the vertical direction. Note that, as is clear from FIG. 9, the central portion of the transport block 23 can be freely moved in and out.

Next, as shown in FIG. 10, the lead frame 10 is held by the frame retainer 28, and the center block 25 is moved rearward by the second rodless cylinder 29. At this point, the pulse motor 30 connected to the center block 25 operates and rotates 45 ° and stands still (see FIG. 12).

On the other hand, the unloader mechanism includes an XY robot 31 and a dispenser mechanism 32 as shown in FIG.
Needle 3 which is connected to and is filled with the encapsulant
3, the X of the XY robot 31 is the vertical direction, and the Y is the horizontal direction. Since the XY robot 31 can move in a zigzag manner, the dispenser mechanism 32 is moved in a zigzag manner corresponding to the lead frame 10 mounted with the diode bridge 5, which is tilted and stopped in accordance with the rotation, and the encapsulation agent 35 is ejected from the needle 33. Apply (see FIGS. 7 and 8).

At this time, the needle 33 is applied in the thickness direction of the diode bridge 5 as described above, and after applying the encapsulating agent 35, the needle 33 rises straight up (in the X direction) and then reaches the position of the next diode bridge 5. Horizontal direction (Y direction)
Then, the operation is repeated and the previous operation is repeated to complete the processing of all the diode bridges 5 to be processed.

When the coating agent 35 is applied to all of the diode bridges 5 mounted on the lead frame 10, the pulse motor 30 is activated again to return the lead frame 10 to the horizontal state and the second rodless cylinder 29.
To move the center block 25 forward,
Return to the original position.

Here, the frame holder 28 is released, and the lead frame 20 is sent to the unloader side by the carrying claw 24.

In such an encapsulating agent coating device,
Needless to say, the lead frame stocker, product storage section, and magazine elevator are installed on the left and right sides.

[0025]

According to the encapsulating agent coating apparatus of the present invention, the lead frame on which the diode bridge, which is the semiconductor element to be processed, is mounted is inclined,
Encapsulation can be performed automatically on the processed diode bridges that place the needles in a narrow space without any manual operation.

Therefore, the encapsulation agent application process can be automated, labor can be saved, and the encapsulation agent can be applied accurately, so that defects such as application unevenness are reduced and the yield is improved.

[Brief description of drawings]

FIG. 1 is a top view of a DIP type lead frame.

2 is a detailed view of a DIP type lead frame A portion of FIG. 1. FIG.

FIG. 3 is a side sectional view of a lead frame mounted with a diode bridge.

FIG. 4 is an enlarged view of FIG.

FIG. 5 is a top view of an SMD type lead frame.

FIG. 6 is a side view of the SMD type lead frame, and is a top view showing a part of FIG. 5 in detail.

FIG. 7 is a diagram showing a top surface after applying an encapsulating agent to a diode bridge mounted on a lead frame using the encapsulating agent applicator of the present invention.

FIG. 8 is a diagram for clarifying the application direction of the encapsulating agent.

FIG. 9 is a perspective view of a feeding claw of a feeder mechanism including a feeding claw for feeding a lead frame, which constitutes a part of the encapsulating agent application device of the present invention.

FIG. 10 is an external view of a swinging mechanism that constitutes a part of the encapsulating agent application device of the present invention.

FIG. 11 is an external view of a dispenser mechanism by an XY robot that constitutes a part of the encapsulation agent coating device of the present invention.

FIG. 12 is a diagram showing an encapsulation according to the present invention.

[Explanation of symbols]

 1, 10, 20: Lead frame, 2: Plate body, 3: Head part, 4: Transport hole, 5: Diode bridge, 6: Part of plate body, 7: Discharge hole, 8, 35: Encap Agent: 9: Solder layer, 21: Feeder mechanism, 22: Swing mechanism, 23: Conveying block, 24: Conveying claw, 25: Center block, 26, 34: Jig cylinder, 27, 29: Rodless cylinder, 28: Frame holder, 30: pulse motor, 31: XY robot, 32: dispenser mechanism, 33: needle,

Claims (1)

[Claims] 1. A feeder mechanism that conveys a lead frame on which a semiconductor element to be processed is mounted and is attached to a loader mechanism, and an unloader mechanism that is installed separately from the loader mechanism.
A center block installed on the loader mechanism, a swinging mechanism installed on the center block and capable of moving to a different position from the feeder mechanism and tilting, and a movable lead frame that can move with respect to the tilted lead frame and discharges an encapsulation agent And a dispenser mechanism installed on the unloader mechanism.