JPH06152090A - Ceramic plate board with conductor - Google Patents

Ceramic plate board with conductor

Info

Publication number
JPH06152090A
JPH06152090A JP32596892A JP32596892A JPH06152090A JP H06152090 A JPH06152090 A JP H06152090A JP 32596892 A JP32596892 A JP 32596892A JP 32596892 A JP32596892 A JP 32596892A JP H06152090 A JPH06152090 A JP H06152090A
Authority
JP
Japan
Prior art keywords
conductor
silver
powder
ceramic plate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32596892A
Other languages
Japanese (ja)
Inventor
Kazuko Tanaka
和子 田中
Keiichi Kawakami
圭一 川上
Eiji Ichikura
栄治 市倉
Masatoshi Suehiro
雅利 末広
Katsuo Sugano
克夫 菅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
AGC Inc
DKS Co Ltd
Original Assignee
Asahi Glass Co Ltd
Dai Ichi Kogyo Seiyaku Co Ltd
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Dai Ichi Kogyo Seiyaku Co Ltd, Dowa Mining Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP32596892A priority Critical patent/JPH06152090A/en
Publication of JPH06152090A publication Critical patent/JPH06152090A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a ceramic plate board with conductor having less reduction in insulation resistance due to diffusion of silver, etc., around silver conductor. CONSTITUTION:Silver conductive powder, glass frit, and organic vehicle are included and further a conductive paste containing antimony oxide for the conductive powder by 0.2-12wt.% in terms of antimony conversion is spread on a ceramic plate board or a non-burn green sheet and then is burn.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は導電性ペーストを用いた
導体付きセラミックス基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate with a conductor using a conductive paste.

【0002】[0002]

【従来の技術】銀は、パラジウム、白金、金、銅、ニッ
ケル、タングステン及びその合金と並び導電性を有する
材料として、この粉末を有機バインダーと必要に応じて
各種添加物を加え、ペースト化したものが低温焼成基板
用導電性材料として一般に用いられている。
2. Description of the Related Art Silver is a conductive material along with palladium, platinum, gold, copper, nickel, tungsten and their alloys, and this powder is made into a paste by adding an organic binder and various additives as required. Those are generally used as a conductive material for low temperature fired substrates.

【0003】銀を用いた導電体は抵抗値が低く、かつ空
気中の焼成が可能であるという点で優れた特性をもって
いる。しかし、焼成中や電場中では、特に高湿度下にお
いて銀が基板中に拡散し、絶縁不良をおこすことがあ
る。従来はこの拡散を防ぐため銀をパラジウム、白金等
と合金化するという方法を採っていたが、このため導電
体の抵抗値が上がり性能の低下を招いていた。
A conductor using silver has excellent properties in that it has a low resistance value and can be fired in air. However, during firing or in an electric field, silver may diffuse into the substrate particularly under high humidity, which may cause insulation failure. Conventionally, in order to prevent this diffusion, a method of alloying silver with palladium, platinum, or the like has been adopted, but this increases the resistance value of the conductor, resulting in deterioration of performance.

【0004】特に低温焼成多層基板にこれらの導体を使
用する場合は、ガラス中への銀の拡散が激しいため、問
題が大きかった。
In particular, when these conductors are used in a low temperature fired multilayer substrate, there is a big problem because the diffusion of silver into the glass is severe.

【0005】[0005]

【発明が解決しようとする課題】本発明は、従来技術の
有する前述の欠点を解消することを目的とするものであ
り、従来知られていなかったセラミックス基板用銀系導
電性ペーストを用いたセラミックス基板を新規に提供す
るものである。
SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned drawbacks of the prior art, and ceramics using a silver-based conductive paste for a ceramic substrate, which has not been heretofore known. The substrate is newly provided.

【0006】[0006]

【課題を解決するための手段】本発明は前述の課題を解
決するべくなされたものであり、銀系の導電性粉末、ガ
ラスフリット、有機ビヒクルを含み、さらに、アンチモ
ンの酸化物を、前記導電性粉末に対して、アンチモン換
算で0.2〜12重量%含む導電性ペーストを、セラミ
ックス基板、または未焼成のグリーンシート上に塗布し
た後焼成したことを特徴とする導体付きセラミックス基
板を提供するものである。
The present invention has been made to solve the above-mentioned problems, and it contains a silver-based conductive powder, a glass frit, an organic vehicle, and further contains an antimony oxide as the conductive material. Provided is a ceramic substrate with a conductor, characterized in that a conductive paste containing 0.2 to 12% by weight of antimony in terms of antimony is applied onto a ceramic substrate or an unfired green sheet and then fired. It is a thing.

【0007】本発明の導電性粉末の主体は銀系粉末であ
り、具体的には、銀、銀−パラジウム合金、及び銀−白
金合金からなる導電性粉末が望ましく使用される。これ
らは、導体抵抗が低く抑えられ、かつ空気中で焼成でき
る点で有利だからである。なお、合金については、銀を
主体とするものが望ましく、また、銀−パラジウム、銀
−白金だけでなく第三成分を少量含むものであってもよ
い。
The main component of the conductive powder of the present invention is a silver-based powder, and specifically, a conductive powder composed of silver, a silver-palladium alloy, and a silver-platinum alloy is preferably used. This is because these are advantageous in that the conductor resistance can be suppressed low and the firing can be performed in the air. The alloy mainly composed of silver is preferable, and not only silver-palladium and silver-platinum but also a small amount of the third component may be used.

【0008】導電性粉末の大きさは、概ね平均粒径0.
5〜10μmの範囲にあるものを用いることができ、特
に1〜5μmの範囲にあるものが好ましい。この範囲で
特に良好な焼結性及びスクリーン印刷などにおける印刷
性が得られるからである。
The size of the electrically conductive powder is approximately 0.
Those in the range of 5 to 10 μm can be used, and those in the range of 1 to 5 μm are particularly preferable. This is because particularly good sinterability and printability in screen printing can be obtained in this range.

【0009】導電性粉末の導電性ペーストにおける配合
割合は、主体となる銀粉末の比表面積により異なるが概
ね75〜99重量%であり、85〜95重量%であるの
が好ましい。これ以下であると、焼結不足となり、導体
の抵抗値が増大するからである。
The blending ratio of the conductive powder in the conductive paste varies depending on the specific surface area of the main silver powder, but is generally 75 to 99% by weight, preferably 85 to 95% by weight. This is because if it is less than this, sintering becomes insufficient and the resistance value of the conductor increases.

【0010】また、導電性粉末の形状については、本発
明においては、特に限定されない。例えば、球状、フレ
ーク状など種々の形状の粉末を用いることができる。
The shape of the conductive powder is not particularly limited in the present invention. For example, powder having various shapes such as spherical shape and flake shape can be used.

【0011】ガラスフリットは無機のバインダーとして
の機能を有し、その軟化点や焼成温度での粘度がペース
トの焼結性を大きく左右する。ガラスフリットとして
は、例えば、ホウケイ酸系フリット、鉛ホウケイ酸系フ
リットなどを好適に用いることができるが、これらに限
定されない。
The glass frit has a function as an inorganic binder, and its softening point and viscosity at the firing temperature greatly affect the sinterability of the paste. As the glass frit, for example, borosilicate frit and lead borosilicate frit can be preferably used, but the glass frit is not limited thereto.

【0012】ガラスフリットの配合割合は、導電性粉末
に対して1〜15重量%であるのが好ましく、特に2〜
8重量%であるのが好ましい。ガラスフリットが少ない
と焼結を促進させることができず、多すぎると導電体の
抵抗値が増大するおそれがあるからである。
The compounding ratio of the glass frit is preferably 1 to 15% by weight with respect to the conductive powder, and particularly 2 to
It is preferably 8% by weight. This is because if the glass frit is small, sintering cannot be promoted, and if it is too large, the resistance value of the conductor may increase.

【0013】有機ビヒクルとしては、前述の無機の粉末
に適当な流動特性を持たせるために用いられる。具体的
には、例えば、ブチルカルビトールアセテートやターピ
ネオールなどの沸点の高い溶剤にエチルセルロース、
(メタ)アクリル酸系ポリマーなどを溶解して、適宜粘
度を調整すればよい。その配合割合は、通常、導電性ペ
ースト全量に対して、3〜30重量%、好ましくは7〜
20重量%である。
As an organic vehicle, it is used to give the above-mentioned inorganic powder suitable flow characteristics. Specifically, for example, ethyl cellulose in a high boiling point solvent such as butyl carbitol acetate and terpineol,
The viscosity may be adjusted appropriately by dissolving a (meth) acrylic acid-based polymer or the like. The compounding ratio is usually 3 to 30% by weight, preferably 7 to 30% by weight based on the total amount of the conductive paste.
It is 20% by weight.

【0014】本発明の導電ペーストは、アンチモンの酸
化物をSb重量に換算して前記導電性粉末に対して0.
2〜12重量%含むことが好ましい。
In the conductive paste of the present invention, the oxide of antimony is converted into the weight of Sb, and the content of the conductive powder is 0.
It is preferable to contain 2 to 12% by weight.

【0015】銀導体の基板への拡散過程は、銀が基板中
の陽イオンとイオン交換反応を起こして一価の陽イオン
となり、これが基板中に浸透するためであることが知ら
れている。この際、イオンがコロイド化し、発色、黄変
することもある。本発明の導電ペーストによれば、上記
のような拡散現象を抑えた導電体付きセラミックス基板
を得ることができる。
It is known that the diffusion process of the silver conductor into the substrate is because silver undergoes an ion exchange reaction with cations in the substrate to become monovalent cations, which penetrate into the substrate. At this time, the ions may turn into colloids, which may cause coloration or yellowing. According to the conductive paste of the present invention, it is possible to obtain a ceramics substrate with a conductor in which the above diffusion phenomenon is suppressed.

【0016】アンチモン酸化物の添加については、市販
されている粉末をペースト組成物中に添加するだけで十
分な効果が得られる。緻密にペースト中に分散させるた
めにその粉末の粒径は小さい方がよく、好ましくは5μ
m以下、特に好ましくは2.5μm以下である。
Regarding the addition of antimony oxide, a sufficient effect can be obtained only by adding a commercially available powder to the paste composition. In order to disperse it in the paste densely, the particle size of the powder should be small, preferably 5μ.
m or less, and particularly preferably 2.5 μm or less.

【0017】アンチモン酸化物の添加量としてはSb重
量に換算して12%以下が望ましい。多すぎると導電
性、半田濡れの低下を引き起こすおそれがある。また、
0.2%未満だと拡散抑止効果が顕著になりにくい。
The amount of antimony oxide added is preferably 12% or less in terms of Sb weight. If it is too large, the conductivity and the solder wettability may decrease. Also,
If it is less than 0.2%, the effect of suppressing diffusion will not be significant.

【0018】[0018]

【実施例】平均粒径が2.5μmであるような銀粉末
に、ホウケイ酸系のガラスフリットを銀粉末に対して
2.0重量%、粒径2μmの三酸化アンチモンを銀粉末
に対して表1に示すような各種の割合で加え、さらに有
機バインダーとして、エチルセルロースをα−タルピオ
ールに溶解させたビヒクルをペースト全量に対して15
重量%加えて自動乳鉢で一括混合し、さらに3本ロール
で混合して、ペーストとした。
EXAMPLE A silver powder having an average particle diameter of 2.5 μm, a borosilicate glass frit at 2.0% by weight based on the silver powder, and an antimony trioxide having a particle diameter of 2 μm relative to the silver powder. In addition to various proportions as shown in Table 1, as an organic binder, a vehicle in which ethyl cellulose was dissolved in α-tarpiol was added to the paste in an amount of 15%.
% By weight, mixed all together in an automatic mortar, and further mixed with three rolls to form a paste.

【0019】また、平均粒径2.0μmのアルミナ粒子
52重量部、平均粒径2.5μmの鉛ホウケイ酸ガラス
50重量部、バインダーとしてポリビニルブチラール、
溶剤としてメチルエチルケトン、トルエン、ブタノール
を用いてスラリーとし、これをドクターブレード法によ
りセラミックグリーンシートに成形した。
52 parts by weight of alumina particles having an average particle size of 2.0 μm, 50 parts by weight of lead borosilicate glass having an average particle size of 2.5 μm, polyvinyl butyral as a binder,
Methyl ethyl ketone, toluene and butanol were used as a solvent to form a slurry, which was formed into a ceramic green sheet by the doctor blade method.

【0020】前述のペーストにより、このセラミックス
グリーンシート上に100μm幅の導体を100μm間
隔でスクリーン印刷し、焼成してセラミックス基板を作
製し、導体の抵抗値、導体パターン間の絶縁抵抗値、及
び導体周辺の黄変の様子を観察、測定したものを表1に
示す。No.3〜5では導体部分の導体抵抗値、導体パ
ターン間の絶縁抵抗値ともに良好な値を示し、かつ黄変
も発生しなかった。No.6では導体パターン間の絶縁
抵抗値の低下は見られなかったが、導体部分の抵抗値の
増大が見られた。また、No.1及び2では、絶縁抵抗
値の低下が見られると共に、導体周辺の黄変が観察され
た。
A conductor having a width of 100 μm is screen-printed on the ceramic green sheet at intervals of 100 μm with the above-mentioned paste and fired to produce a ceramic substrate. The resistance value of the conductor, the insulation resistance value between the conductor patterns, and the conductor Table 1 shows the observed and measured appearance of yellowing around the periphery. No. In Nos. 3 to 5, both the conductor resistance value of the conductor portion and the insulation resistance value between the conductor patterns showed good values, and no yellowing occurred. No. In No. 6, the insulation resistance between conductor patterns did not decrease, but the resistance of the conductor portion increased. In addition, No. In Nos. 1 and 2, a decrease in insulation resistance was observed and yellowing around the conductor was observed.

【0021】なお、表1の黄変に関する表示は次の通り
である。 ○:黄変せず ×:黄変
The indications relating to yellowing in Table 1 are as follows. ○: No yellowing ×: Yellowing

【0022】[0022]

【表1】 [Table 1]

【0023】[0023]

【発明の効果】本発明は所定の銀系導電性ペーストを用
いる事により銀系導体周辺の銀等の拡散による絶縁抵抗
の低下、黄変が防止され、導体の抵抗値が低く、外観も
良い商品価値の高いセラミックス基板が得られる。さら
に本発明は従来のペースト製造方法を全く変えること無
く効果が得られるため、量産性にも優れており、その工
業的価値は大である。しかもパラジウム等の貴金属を用
いる方法に比べ安価であり、また抵抗値も低く抑えるこ
とができる効果がある。
According to the present invention, by using a predetermined silver-based conductive paste, the insulation resistance is prevented from lowering and yellowing due to the diffusion of silver or the like around the silver-based conductor is prevented, the resistance value of the conductor is low, and the appearance is good. Ceramic substrates with high commercial value can be obtained. Furthermore, since the present invention can obtain the effect without changing the conventional paste manufacturing method at all, it is excellent in mass productivity, and its industrial value is great. Moreover, it is cheaper than the method using a noble metal such as palladium, and has an effect that the resistance value can be suppressed low.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 川上 圭一 神奈川県横浜市神奈川区羽沢町松原1160番 地 エイ・ジー・テクノロジー株式会社内 (72)発明者 市倉 栄治 神奈川県横浜市神奈川区羽沢町1150番地 旭硝子株式会社中央研究所内 (72)発明者 末広 雅利 京都府京都市西京区川島粟田町50−8 (72)発明者 菅野 克夫 京都府京都市西京区牛ケ瀬川原口町37 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Keiichi Kawakami Inventor Keiichi Kawakami 1160 Matsubara, Hazawa-machi, Kanagawa-ku, Yokohama, Kanagawa GG Technology Co., Ltd. (72) Eiji Ichikura Hazawa-machi, Kanagawa-ku, Yokohama, Kanagawa 1150, Central Research Laboratory, Asahi Glass Co., Ltd. (72) Inventor Masatoshi Suehiro 50-8 Kawashima Awata-cho, Nishikyo-ku, Kyoto-shi, Kyoto (72) Inventor Katsuo Sugano 37 Ushikasegawaraguchi-cho, Nishi-kyo-ku, Kyoto-shi, Kyoto

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】銀系の導電性粉末、ガラスフリット、有機
ビヒクルを含み、さらに、アンチモンの酸化物を、前記
導電性粉末に対して、アンチモン換算で0.2〜12重
量%含む導電性ペーストを、セラミックス基板、または
未焼成のグリーンシート上に塗布した後焼成したことを
特徴とする導体付きセラミックス基板。
1. A conductive paste containing silver-based conductive powder, glass frit, an organic vehicle, and further containing antimony oxide in an amount of 0.2 to 12% by weight in terms of antimony based on the conductive powder. Is applied onto a ceramic substrate or a green sheet that has not been fired and then fired, and a ceramic substrate with a conductor.
JP32596892A 1992-11-11 1992-11-11 Ceramic plate board with conductor Pending JPH06152090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32596892A JPH06152090A (en) 1992-11-11 1992-11-11 Ceramic plate board with conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32596892A JPH06152090A (en) 1992-11-11 1992-11-11 Ceramic plate board with conductor

Publications (1)

Publication Number Publication Date
JPH06152090A true JPH06152090A (en) 1994-05-31

Family

ID=18182608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32596892A Pending JPH06152090A (en) 1992-11-11 1992-11-11 Ceramic plate board with conductor

Country Status (1)

Country Link
JP (1) JPH06152090A (en)

Similar Documents

Publication Publication Date Title
KR960001353B1 (en) Method for making multilayer electronic circuits
US4070517A (en) Low fired conductive compositions
JPH0334162B2 (en)
US4894184A (en) Low-temperature burnt conductive paste and method of manufacturing printed circuit board
JP2010532586A (en) Conductive paste for ceramic substrate and electric circuit
US4503090A (en) Thick film resistor circuits
US3943168A (en) Conductor compositions comprising nickel borides
JP2022509142A (en) Improved precious metal paste for screen-printed electrode structures
JPH06152090A (en) Ceramic plate board with conductor
EP0291064A2 (en) Conductive paste composition
JP2008218022A (en) Copper conductive paste, conductor circuit board, and electronic part
JPH06169140A (en) Ceramic board with conductor
JPH11130459A (en) Electrically conductive composition for glass substrate and anti-fog window glass for automobile
JP2518839B2 (en) Conductor paste composition
US4016447A (en) Dielectric substrate bearing nickel boride conductor
EP0045482B1 (en) Thick film conductor compositions
JPH0346705A (en) Copper paste
JP2931450B2 (en) Conductor paste
JPH06252524A (en) Method for manufacturing ceramic substrate with conductor
JP2841586B2 (en) Conductive paste
JPH05128910A (en) Conductor paste
JPH0541110A (en) Conductive paste
JP2004362862A (en) Conductive paste composition for thick-film conductor
JP2992958B2 (en) Conductive paste for low-temperature fired multilayer wiring boards
JP2022089460A (en) Thick film conductor, composition for formation thereof and thick film conductor paste containing the composition for formation thereof