JPH06151652A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve a mold separability, cracking-resistant properties, a heat- resistant reliability, etc., by a method wherein special resin composition which contains polymaleimide compound, phenol allylide resin, one or both of aliphatic carboxylic acid and metallic salt of aliphatic carboxylic acid and inorganic fillers is employed for sealing. CONSTITUTION:Phenol allylide resin which is used with polymaleimide compound functions as the curing agent of the polymaleimide compound. Curing catalyst enhances the adhesion between sealing resin and a semeconductor chip and between sealing resin and a lead frame and reduces curing time. Further, the improvement effect of the separability between the sealing resin and a mold, cracking-resistant properties and a moisture-resistant reliability can be obtained by at least one of aliphatic carboxylic acid and metalate of aliphatic carboxylic acid. Moreover, inorganic fillers improve the bonding strength between the sealing resin and the semiconductor chip and between the sealing resin and the lead frame. With this constitution, a semiconductor device which has excellent mold separability, cracking-resistant properties, heat-resistant properties and moisture-resistant reliability can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having excellent reliability.

[0002]

2. Description of the Related Art In recent years, resin encapsulation using a plastic package has become the mainstream for semiconductor elements such as transistors, ICs and LSIs from the viewpoint of cost and mass productivity.
However, due to technological innovation in the semiconductor field, device sizes are becoming larger, wiring is becoming finer, and packages are becoming smaller and thinner due to improvements in integration. Further improvement in reliability is demanded.

In particular, surface mounting has become the mainstream as a method for mounting a semiconductor package, and steps such as solder dipping, infrared reflow, vapor phase reflow, etc. are adopted. During these steps, the package is exposed to high temperatures (215
Therefore, in a semiconductor device having a resin encapsulation, a small amount of water that has penetrated into the inside of the resin by the resin encapsulation abruptly vaporizes, and this water causes cracks in the encapsulation resin. As a result, there arises a problem that it is impossible to guarantee the moisture resistance reliability. In addition, there is a problem that swelling of the sealing resin occurs and mounting becomes impossible.

In order to cope with the problems that occur in the surface mounting process, the sealing resin has a low stress and a glass transition temperature (Tg) higher than the solder bath temperature.
Further, it is required to have characteristics that the high temperature strength corresponding to the mounting temperature and the high humidity absorption high temperature strength are large.

Then, a maleimide resin (Tg: 200 to 300) which is superior in heat resistance to an epoxy resin (Tg: 100 to 200 ° C.) which has been conventionally used as a sealing resin.
℃) is drawing attention. In particular, recently, a resin composition composed of the above maleimide resin and an epoxy resin and a resin composition using an amine-modified maleimide resin obtained by a reaction of a maleimide resin and an aromatic diamine have been proposed.

[0006]

However, even if the above resin composition is used, it is difficult to obtain a semiconductor device having sufficient heat resistance, moisture resistance reliability and high temperature strength.
In addition to the above, a resin composition in which polymaleimide and an allylated phenol resin are sealed in the presence of a basic catalyst or an organic peroxide has been proposed as a product using the above maleimide resin. However, since the mold release property between the mold resin and the sealing resin formed by the above resin composition is poor, the mold resin is peeled off from the semiconductor element and the lead frame at the time of mold release. This causes problems such that moisture enters the interface, cracks occur during surface mounting, and moisture resistance reliability decreases.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor device having excellent crack resistance and moisture resistance reliability during immersion of solder.

[0008]

In order to achieve the above object, the semiconductor device of the present invention encloses a semiconductor element with a resin composition containing the following components (A) to (E). Take composition. (A) A polymaleimide compound having two or more maleimide groups in one molecule. (B) Allylated phenolic resin. (C) Curing catalyst. (D) At least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid. (E) Inorganic filler.

[0009]

That is, the present inventors have conducted a series of studies in order to obtain a sealing resin which is excellent in mold releasability from a mold and is also excellent in crack resistance, heat resistance reliability and moisture resistance reliability. As a result, the above-mentioned specific polymaleimide compound (component A) having excellent heat resistance and allylated phenolic resin (component B)
When at least one of the aliphatic carboxylic acid and the metal salt of the aliphatic carboxylic acid (component D) and the inorganic filler (component E) are used in combination, the resin composition containing them is released from the mold. The inventors have found that an encapsulating resin having excellent heat resistance, crack resistance when immersed in solder, heat resistance reliability and moisture resistance reliability can be obtained, and arrived at the present invention.

Next, the present invention will be described in detail.

The resin composition used in the present invention comprises a specific polymaleimide compound (component A), an allylated phenol resin (component B), a curing catalyst (component C), an aliphatic carboxylic acid and an aliphatic carboxylic acid. It is obtained by using at least one of metal salts of acids (component D) and an inorganic filler (component E), and is usually in the form of powder or tablets formed by tableting.

The above-mentioned specific polymaleimide compound (component A) has two or more maleimide groups in one molecule. Such a polymaleimide compound is represented by, for example, the following general formula (1).

[0013]

[Chemical 1]

Specific examples of the specific polymaleimide compound (component A) include N, N'-ethylenedimaleimide, N, N'-hexamethylene bismaleimide, N, N'-dodecamethylene bismaleimide. , N,
N'-m-xylylene bismaleimide, N, N'-p-
Xylylene bismaleimide, N, N'-1,3-bismethylenecyclohexane bismaleimide, N, N'-1,
4-bismethylenecyclohexane bismaleimide, N,
N'-2,4-tolylene bismaleimide, N, N'-
2,6-tolylene bismaleimide, N, N'-3,3 '
-Diphenylmethane bismaleimide, N, N'-4,
4'-diphenylmethane bismaleimide, 3,3'-diphenylsulfone bismaleimide, 4,4'-diphenylsulfone bismaleimide, N, N'-4,4'-diphenylsulfide bismaleimide, N, N'-p-benzophenone Bismaleimide, N, N'-diphenylethane bismaleimide, N, N'-diphenyl ether bismaleimide, N, N '-(methylene-ditetrahydrophenyl) bismaleimide, N, N'-(3-ethyl)-
4,4'-diphenylmethane bismaleimide, N, N '
-(3,3'-Dimethyl) -4,4'-diphenylmethane bismaleimide, N, N '-(3,3'-diethyl)
Diphenylmethane bismaleimide, N, N '-(3,
3'-dichloro) -4,4'-diphenylmethane bismaleimide, N, N'-tolidine bismaleimide, N,
N'-isophorone bismaleimide, N, N'-p, p '
-Diphenyldimethylsilyl bismaleimide, N, N '
-Benzophenone bismaleimide, N, N'-diphenylpropane bismaleimide, N, N'-naphthalene bismaleimide, N, N'-p-phenylene bismaleimide, N, N'-m-phenylene bismaleimide, N,
N'-4,4 '-(1,1'-diphenyl-cyclohexane) -bismaleimide, N, N'-3,5- (1,
2,4-triazole) -bismaleimide, N, N'-
Pyridine-2,6-diyl bismaleimide, N, N'-
5-methoxy-1,3-phenylene bismaleimide,
1,2-bis- (2-maleimidoethoxy) -ethane,
1,3-Bis- (3-maleimidopropoxy) -propane, N, N'-4,4'-diphenylmethane-bis-dimethylmaleimide, N, N'-hexamethylene-bis-
Dimethyl maleimide, N, N'-4,4 '-(biphenyl ether) -bis-dimethyl maleimide, N, N'-
4,4'-diphenylsulfone-bis-dimethylmaleimide, N, N'-bismaleimide of 4,4'-diamino-triphenylphosphate, N, N'-bis of 4,4'-diamino-triphenylthiophosphate Maleimide, 2,2-bis [4- (4-maleimidophenoxy)
Examples include phenyl] propane.

Further, as specific representative examples of the above-mentioned fluorine-containing polymaleimide compound, 1,3-bis (maleimide) hexafluoropropane, 1,4-bis (maleimide) octafluorobutane, 1,5-bis (maleimide) ) Decafluoropentane, 1,7-bis (maleimide) tetradecafluorohebutane, 2,2-bis (4-
Maleimidophenyl) hexafluoropropane, 2,2
-Bis (3-maleimidophenyl) hexafluoropropane, 2,2-bis (4-maleimidophenyl-3'-
Maleimidophenyl) hexafluoropropane, 2,2
-Bis (3-maleimido-4-methylphenyl) hexafluoropropane, 2,2-bis (4-maleimido-3)
-Methylphenyl) hexafluoropropane, 2,2-
A binuclear fluorine-containing aromatic bismaleimide such as bis (3-maleimido-4-methylphenyl-4′-maleimido-3′-methylphenyl) hexafluoropropane;
2,2-bis [4- (4-maleimidophenoxy) phenyl] hexafluoropropane, 2,2-bis [4-
(3-Maleimidophenoxy) phenyl] hexafluoropropane, 2,2-bis [4- (2-maleimidophenoxy) phenyl] hexafluoropropane, 2,2-
Bis [4- (4-maleimidophenoxy) phenyl-
4 '-(3'-maleimidophenoxy) phenyl] hexafluoropropane, 2,2-bis [4- (2-maleimidophenoxy) -3,5-dimethylphenyl] hexafluoropropane, 2,2-bis [4- Maleimide-2
-Trifluoromethylphenoxy) phenyl] hexafluoropropane, 2,2-bis [3- (3-maleimidophenoxy) phenyl] hexafluoropropane, 1,
3-bis [4- (4-maleimidophenoxy) phenyl] hexafluoropropane, 1,3-bis [4- (3
-Maleimidophenoxy)] hexafluoropropane,
1,4-bis [4- (4-maleimidophenoxy) phenyl] octafluorobutane, 1,5-bis [4- (4
Examples include tetranuclear fluorine-containing aromatic bismaleimides such as -maleimidophenoxy) phenyl] decafluoropentane and 1,5-bis [4- (4-maleimido-2-trifluoromethylphenoxy) phenyl] hexafluoropentane. .

In addition to the above bifunctional maleimide, a reaction product of aniline and formalin (polyamine compound), 3,4,4-triaminodiphenylmethane,
3,3 ', 4,4'-tetraaminodiphenylmethane,
Polyfunctional maleimide obtained by reaction of triaminophenol and maleic anhydride, trifunctional maleimide obtained by reaction of tris- (4-aminophenyl) phosphate or tris (4-aminophenyl) thiophosphate with maleic anhydride And other polyvalent maleimides.

In addition to the above-mentioned polyvalent maleimide, amine adducts, phenol adducts and thiochol adducts of the above polyvalent maleimides can be mentioned. Further, the above N, N'-
In addition to the substituted bismaleimide, a polyvalent N-substituted maleimide compound, a mixture of a mono-substituted maleimide, a tri-substituted maleimide or a tetra-substituted maleimide and the above N, N'-substituted bismaleimide or an adduct thereof can be used. These specific polymaleimide compounds can be used alone or in combination, and it is particularly effective to use them in combination.

In the present invention, an epoxy resin may be used as a part of the specific polymaleimide compound (component A). The epoxy resin is not particularly limited, and examples thereof include conventionally known various compounds having two or more epoxy groups in one molecule. For example, usually, the epoxy equivalent is 50 to 5000 and the softening point is room temperature to 20.
Those having a temperature of 0 ° C. are preferable, and epoxy equivalent 1 is particularly preferable.
It has a softening point of room temperature to 150 ° C. Such epoxy resins include those that are liquid at room temperature and those that are solid at room temperature. Specifically, bisphenol A type, bisphenol F type, resor seal,
Examples thereof include glycidyl ethers of phenols such as phenol novolac and cresol novolac, and glycidyl ethers of alcohols such as butanediol, polyethylene glycol and polypropylene glycol.

The allylated phenolic resin (component B) used together with the specific polymaleimide compound (component A) acts as a curing agent for the polymaleimide compound which is component A and has the following general formula (2): ), And has one or more functional groups.

[0020]

[Chemical 2]

The above allylated phenolic resin (component B)
Are, for example, monovalent phenols such as phenol, cresol, ethylphenol, isopropylphenol, butylphenol, octylphenol, xylenol, nonylphenol, vinylphenol, isopropylphenol, phenylphenol, benzylphenol, chlorophenol, bromophenol, ethoxyphenol, and bisphenol. A, a phenol novolac resin obtained by subjecting a dihydric phenol such as A, bisphenol F, hydroxy, caracol and resorcinol as a raw material to a condensation reaction of this with an aldehyde compound such as formalin, paraformaldehyde and glyoxal, and the above The presence of allyl halides such as allyl chloride, allyl bromide and allyl iodide and alkali in the presence of monohydric phenols and dihydric phenols Alkenyl phenols obtained by reacting under obtained by Claisen rearrangement.

The compounding ratio of the specific polymaleimide compound (component A) and the allylated phenol resin (component B) is the equivalent ratio of the maleimide group in the polymaleimide compound to the allyl group in the allylated phenol resin. Is 0.
It is preferable to mix them in the range of 1 to 1.2. That is, if it is out of the above range, the heat resistance, processability and mechanical strength of the resin composition tend to deteriorate.

Examples of the curing catalyst (C component) used together with the above-mentioned specific polymaleimide compound (A component) and allylated phenolic resin (B component) include peroxide catalysts and other catalysts. Are used alone or in combination. Examples of the peroxide catalyst include organic peroxides such as acetyl peroxide, isobutyryl peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, and 3,5,5-trimethylhexanoyl peroxide. Examples thereof include diacyl peroxides such as oxide, succinic acid peroxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, and m-toluyl peroxide. Moreover, di-t-butyl peroxide, t-butyl cumyl peroxide, dicumyl peroxide, [1,3-phenylene bis (1-
Methylethylidene)] bis [(1,1-dimethylethyl) peroxide], 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di ( Dialkyl peroxides such as t-butylperoxy) hexyne-3 can be mentioned. Further, there may be mentioned ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methyl cyclohexanone peroxide, methyl acetoacetate peroxide, acetylacetone peroxide and the like. And 1,1-bis (t-butylperoxy) 3,3,5-trimethylcyclohexane, 1,
1-bis (t-butylperoxy) cyclohexane,
2,2-bis (t-butylperoxy) octane, n-
Examples thereof include peroxyketals such as butyl-4,4-bis (t-butylperoxy) valerate and 2,2-bis (t-butylperoxy) butane. In addition, t-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide,
p-menthane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,
Examples of the hydroperoxide include 1,3,3-tetramethylbutyl hydroperoxide. further,
t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxypivalate,
t-butyl peroxy neodecanoate, cumyl peroxy neodecanoate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxy-3,5
5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxybenzoate, di-
t-butylperoxyisophthalate, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, t
-Butyl peroxy maleic acid, t-butyl peroxy isopropyl carbonate, cumyl peroxy octoate, t-hexyl peroxy neodecanoate, t-hexyl peroxypivalate, t-butyl peroxy neohexanoate, Examples thereof include peroxyesters such as t-hexylperoxy neohexanoate and cumylperoxy neohexanoate. And diisopropyl peroxy dicarbonate, di-2-ethylhexyl peroxy dicarbonate, di-n-propyl peroxy dicarbonate, bis (4-t-butylcyclohexyl) peroxy dicarbonate, dimyristyl peroxy dicarbonate, di Examples include peroxydicarbonate such as 2-ethoxyethyl peroxydicarbonate, dimethoxyisopropyl peroxydicarbonate and di (3-methyl-3-methoxybutyl) peroxydicarbonate, and t-butylperoxyallyl carbonate. To be These may be used alone or in combination.

Anionic polymerization catalysts may be mentioned as curing catalysts other than the above organic peroxides. As the anionic polymerization catalyst, a basic catalyst such as a tertiary amine, a tertiary amine salt, a quaternary ammonium salt and an imidazole, a Lewis acid amine complex catalyst and the like are used.

Examples of the tertiary amines include pyridine and 2
-Chloropyridine, 2,4,6-collidine, 2,6-dichloropyridine, α, β, γ-pyricon, 4-phenylpropylpyridine, 2-propylpyridine, 2,6-lutidine, 2,4-lutidine , 2,5-lutidine, 3, 4
-Pyridines such as lutidine, triethylamine, tri-
n-butylamine, tri-n-octylamine, benzyldimethylamine, dimethylaminomethylphenol,
Aliphatic tertiary amines such as trisdimethylaminomethylphenol, triethylenediamine, N, N, N ', N'-tetramethylethylenediamine, tetramethylguanidine, heptamethylisoguanide, N, N-dimethylaniline, N, N, N ', N'-tetramethyldiaminodiphenylmethane, N, N, N', N'-tetramethyl-
m-phenylenediamine, N, N, N ', N'-tetramethyl-p-phenylenediamine, N, N-dimethyl-
Aromatic tertiary amines such as p-toluidine, triphenylphosphine, 1,8-diazabicyclo (5,4,0)
Undecene-7 and its acid complex etc. are mentioned.

Examples of the tertiary amine salts include salts of the tertiary amines with triacetate or tribenzoate.

The above quaternary ammonium salts include tetramethylammonium chloride, tetramethylammonium bromide, tetraethylammonium chloride, tetraethylammonium bromide, trimethylcetylammonium chloride, trimethylcetylammonium bromide, triethylcetylammonium chloride, triethylcetylammonium bromide,
Examples include tetraethylammonium iodide.

The above-mentioned imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole,
Examples thereof include 2-phenylimidazole, 2-undecylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, 2-isopropylimidazole or their azine derivatives, trimellitic acid derivatives and nitrileethyl derivatives.

Examples of the Lewis acid amine complex include B
F ₃ , ZnCl ₂ , AlCl ₃ , SiCl ₄ , SnCl
₄ , Lewis acid such as FeCl ₃ and monoethylamine, n-
Hexylamine, benzylamine, triethylamine,
Examples thereof include complexes of amine compounds such as aniline and piperidine.

These anionic polymerization catalysts can be used alone or in combination.

The amount of the curing catalyst (component C) blended is 0.01 with respect to 100 parts by weight of the total weight of the polymaleimide compound (component A) and the allylated phenolic resin (component B).
It is preferable to set it in the range of 10 parts from the viewpoint of the adhesiveness between the sealing resin and the semiconductor element, the sealing resin and the lead frame, and the curing time. That is, when the amount of the curing catalyst (component C) is less than 0.01 part, the adhesive force with the semiconductor element or the lead frame becomes small, and the Tg also decreases. Further, the effect of improving crack resistance and moisture resistance reliability of the obtained semiconductor device during immersion in solder cannot be sufficiently obtained, and conversely, even if it exceeds 10 parts, further improvement effect is not observed. .

At least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid (D component) used together with the above specific polymaleimide compound (A component), allylated phenolic resin (B component) and curing catalyst (C component). ), The above-mentioned aliphatic carboxylic acids include capric acid, undecanoic acid, lauric acid, tridecanoic acid, myristic acid, pentadecanoic acid, partimic acid, margaric acid, stearic acid, nonadecanoic acid, arachidic acid, behenic acid, lignoceric acid, Examples thereof include cerotic acid, montanic acid, melissic acid, tetracontanoic acid, palmitoleic acid, oleic acid, linoleic acid, and linolenic acid. Also,
Examples of the metal salt of the aliphatic carboxylic acid include salts of the above aliphatic carboxylic acid such as calcium stearate, magnesium stearate and zinc stearate. These may be used alone or in combination.

Then, at least one of the aliphatic carboxylic acid and the metal salt of the aliphatic carboxylic acid (component D) is
It is preferable to use one having a carbon number of 10 to 40 from the viewpoints of releasability and viscosity between the sealing resin and the mold. That is, when the carbon number of at least one of the aliphatic carboxylic acid and the metal salt of the aliphatic carboxylic acid (component D) is less than 10, sufficient releasability is not exhibited, and the obtained semiconductor device is not easily exposed to solder. It is difficult to obtain the effects of improving crack resistance and moisture resistance reliability. On the other hand, when the carbon number exceeds 40, the releasability is reduced,
This is because there is a tendency that the crack resistance and moisture resistance reliability of the obtained semiconductor device when dipped in solder are significantly reduced.

Further, the compounding amount of at least one of the aliphatic carboxylic acid and the metal salt of the aliphatic carboxylic acid (component D) is such that the total amount of the specific polymaleimide compound (component A) and the allylated phenol resin (component B) is the same. It is preferable to set it in the range of 0.01 to 10 parts with respect to 100 parts by weight (hereinafter abbreviated as “part”) from the viewpoint of releasability between the sealing resin and the mold, and mechanical properties. That is, the blending amount of the D component is 0.
If it is less than 01 part, the releasability between the sealing resin and the mold is deteriorated, and it is difficult to sufficiently obtain the effect of improving crack resistance and moisture resistance reliability of the obtained semiconductor device during solder dipping. On the contrary, if the amount is more than 10 parts, no further improvement effect is observed.

The inorganic filler (E component) used together with the above A component, B component and C component is not particularly limited, and conventionally known ones are used, for example, quartz glass powder, talc, silica powder and Examples thereof include alumina powder. Particularly preferred is silica powder. The content of such an inorganic filler, in the case of silica powder,
It is preferably set to 50% by weight (hereinafter abbreviated as “%”) of the entire resin composition or more. It is particularly preferably 70% or more, further preferably 80% or more. That is,
If the content of the inorganic filler is less than 50%, the adhesive strength between the encapsulating resin and the semiconductor element and the encapsulating resin and the lead frame tends to decrease, and the effect of improving the crack resistance during solder immersion is significantly reduced. Because it does.

Further, it is more effective to add a silicone compound (F component) in addition to the above A to E components in order to improve heat resistance and resin strength.

The above-mentioned silicone compound (component F) contains at least one epoxy group or SiH at the terminal or side chain.
It has a group, a vinyl group or an amino group. The silicone compound includes epoxy equivalent, S
iH equivalent and amine equivalent of 100-15000, S
The i content is preferably set to 1 to 35%. Furthermore, the blending amount of the silicone compound (F component) is A component +
50% of the total amount of B component + silicone compound (F component)
The following setting is preferable, and more preferably 5 to 3
It is to set in the range of 0%. That is, when the blending amount of the silicone compound (F component) exceeds 50%, the heat resistance and the resin strength of the resin composition tend to be remarkably lowered.

In addition to the components A to E and the component F, a chain transfer agent, a radical polymerization inhibitor, a filler, a colorant, a flame retardant, a coupling agent such as a silane coupling agent, etc. may be appropriately added, if necessary. You can

Examples of the chain transfer agent include mercaptans, sulfites, β-diketones, metal chelates, metal soaps and the like.

The above radical polymerization inhibitor is used for improving the storage stability of the thermosetting composition at room temperature, and examples thereof include quinones such as p-benzoquinone, naphthoquinone and phenanthraquinone. Phenols and nitro compounds such as hydroquinone, p-tertiary butyl catechol and 2,5-di-tertiary butyl hydroquinone, metal salts and the like can be appropriately used.

As the above-mentioned filler, aluminum oxide,
Magnesium oxide, aluminum hydroxide, aluminum carbonate, calcium carbonate, magnesium carbonate, diatomaceous earth, calcium silicate, calcined clay, powder silica, carbon black, kaolin, powder mica, graphite,
Examples include asbestos, antimony trioxide, glass fiber, rock wool and carbon fiber. The blending amount of the above-mentioned filler is appropriately blended depending on the use, but for example, (A
It is possible to use up to 900 parts per 100 parts of component + B component).

Examples of the colorant include titanium dioxide, carbon black, yellow lead carbon black, iron black, molybdenum red, ultramarine blue, navy blue, cadmium yellow, cadmium red and the like.

Examples of the flame retardant include phosphorus compounds and halides.

Examples of the coupling agent include titanate-based and aluminum-based coupling agents in addition to the silane-based coupling agent.

The resin composition used in the present invention can be manufactured, for example, as follows. That is,
The above essential components A to E and, if necessary, the above additives are appropriately blended, and the mixture is applied to a kneading machine such as a mixing roll machine and heat-melted and kneaded to obtain a semi-cured resin composition.
The desired resin composition can be obtained by cooling this to room temperature, pulverizing it by a known means, and tableting it as needed. Alternatively, they may be mixed using an appropriate solvent. When a silicone compound (F component) is used in addition to the above components, the polymaleimide compound (A component) or the allylated phenolic resin (B component) is first reacted with the silicone compound to prepare a modified silicone compound. In this case, when an epoxy group-containing silicone compound is used as the silicone compound (F component), a curing catalyst (C component) such as a tertiary amine, an imidazole, a quaternary ammonium salt or an organic phosphine compound is added in an amount of 0.1 to 0.1%. It is preferable to add 10%.
When using a SiH group-containing silicone compound,
It is preferable to add 0.1 to 10% of Pt catalyst. Next, the modified silicone compound prepared as described above and the remaining polymaleimide compound, allylated phenolic resin, curing catalyst, at least one of aliphatic carboxylic acid and metal salt of aliphatic carboxylic acid, and inorganic filler Properly mix the essential ingredients and the above additives as necessary,
After that, the desired resin composition can be obtained by going through the same steps as above.

The encapsulation of the semiconductor element using such a resin composition is not particularly limited and can be performed by a known molding method such as ordinary transfer molding.

The semiconductor device thus obtained has releasability between the encapsulating material and the mold, excellent crack resistance during immersion of solder, heat resistance and moisture resistance reliability.

[0048]

As described above, the semiconductor device of the present invention has a specific polymaleimide compound (A component), an allylated phenol resin (B component), and a curing catalyst (C component).
Resin-sealed with a special resin composition containing at least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid (component D) and an inorganic filler (component E), Since the encapsulating plastic package is different from the conventional maleimide resin composition encapsulating material, it has excellent releasability between the encapsulating resin and the mold, and package cracks do not occur even when solder is dipped after absorbing moisture. It has excellent heat resistance. Further, the moisture resistance reliability is improved, and the reliability is further enhanced under severe usage conditions.

Next, examples will be described together with comparative examples.

First, the following components were prepared.

[Polymaleimide compound a] 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane

[Polymaleimide Compound b] N, N ′-(4,4′-diphenylmethane) bismaleimide

[Allylated phenol novolac resin c] An allylated phenol novolac resin having a repeating unit represented by the following formula (3).

[Chemical 3]

[Silicone compound d]

[Chemical 4] Hydrogen type

[Silicone compound e]

[Chemical 5] Hydrogen type

[Silicone compound f]

[Chemical 6] Amino group type amine equivalent: 2000

[Silicone compound g]

[Chemical 7] Epoxy group type Epoxy equivalent: 2000

[Cresol Novolac Epoxy Resin j] Epoxy Equivalent: 195

[Phenol novolac resin k] Hydroxyl equivalent: 117

[Release agent j] Carnauba wax

[Release Agent k] Zinc Stearate

[Release Agent 1] Pentacontanoic acid

[Release Agent m] Caproic Acid

[Release agent n] Montanic acid ethylene glycol ester

[Release Agent o] Stearic acid amide

[Release agent p] n-dodecyl stearate

[Release agent q] Polyethylene wax (molecular weight 9000)

[Release Agent r] Polyethylene oxide wax (molecular weight 6000)

[Release Agent s] Stearyl alcohol

[Release Agent t] Lauric Acid

[Release Agent u] Calcium palmitate

[Release Agent v] Stearic acid

[Release Agent w] Linoleic Acid

[Release Agent x] Calcium stearate

[Release Agent y] Magnesium stearate

[Release Agent z] Magnesium behenate

[Release Agent α] Montanic Acid

[Release Agent β] Calcium montanate

[Release Agent γ] Tetracontanoic Acid

[Release Agent δ] Zinc Stearate

[Organic Peroxide] [1,3-Phenylenebis (1-methylethylidene)]
Bis [(1,1-dimethylethyl) peroxide]

[0082]

Examples 1 to 18 and Comparative Examples 1 to 11 Tables 1 to 5 below
The components shown in Table 1 were blended in the proportions shown in the same table, and kneaded for 3 minutes with a mixing roll machine (temperature: 110 ° C.) to prepare a sheet-like material. Then, after cooling and pulverizing the sheet-like material, a target powdery resin composition was obtained.

[0083]

[Table 1]

[0084]

[Table 2]

[0085]

[Table 3]

[0086]

[Table 4]

[0087]

[Table 5]

Using the powdery resin compositions obtained in the above Examples and Comparative Examples, semiconductor elements were subjected to transfer molding (conditions: 175 ° C. × 2 minutes) and post-curing at 200 ° C. × 5 hours to obtain semiconductor devices. Got This package is an 80-pin QFT (quad flat package, size: 20 × 14 × 2 mm), and the die pad size is 8 × 8 mm.

The semiconductor device thus obtained was left to stand in a constant temperature bath of 85 ° C./85% RH for 96 hours to absorb moisture, and then immersed in a solder melt at 260 ° C. for 10 seconds. The number of cracks generated was measured. In addition, 10 by the pressure cooker in the voltage applied state
A 00-hour reliability test (PCBT test) was performed to measure the number of defects. This is transfer molding (conditions: 175 ° C. × 2 minutes) using a powdery resin composition on a square semiconductor element having a side of 2 mm, followed by curing at 200 ° C. × 5 hours to form a molded product. A test piece was prepared by. Then, the mold release load between the molded product and the molding die was measured. The results are shown in Tables 6 to 10 below.
The release weights shown in Tables 6 to 10 below are the values for the fifth shot.

[0090]

[Table 6]

[0091]

[Table 7]

[0092]

[Table 8]

[0093]

[Table 9]

[0094]

[Table 10]

From the results of Tables 6 to 10 above, the comparative example products showed many cracks and defective products in the TCT test and the PCBT test, and further many cracks occurred in the crack resistance test. Moreover, Comparative Examples 5-1
The three products had a high mold release load and were inferior in mold releasability. On the other hand, in the example products, cracks and defective products were not generated at all or were slight in the TCT test, the crack resistance test and the PCBT test. Moreover,
The mold release weight was low. From this, it is understood that the product of Example has excellent heat resistance and moisture resistance reliability, and that the cured resin body as the sealing resin has high adhesiveness.

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Claims (6)

[Claims] 1. A semiconductor device obtained by encapsulating a semiconductor element with a resin composition containing the following components (A) to (E). (A) A polymaleimide compound having two or more maleimide groups in one molecule. (B) Allylated phenolic resin. (C) Curing catalyst. (D) At least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid. (E) Inorganic filler. 2. A polymaleimide compound as the component (A) is 2,2-bis [4- (4-maleimidophenoxy)
The semiconductor device according to claim 1, which is phenyl] propane. 3. The semiconductor device according to claim 1, wherein a resin composition containing a silicone compound as a component (G) in addition to the components (A) to (E) is used. 4. The silicone compound which is the component (G),
A hydrogen organopolysiloxane.
The semiconductor device described. 5. A resin composition for semiconductor encapsulation containing the following components (A) to (E). (A) A polymaleimide compound having two or more maleimide groups in one molecule. (B) Allylated phenolic resin. (C) Curing catalyst. (D) At least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid. (E) Inorganic filler. 6. The resin composition for semiconductor encapsulation according to claim 5, further comprising a silicone compound as a component (G) in addition to the components (A) to (E).