JPH06148671A - Mounting structure for panel - Google Patents

Abstract

PURPOSE:To provide mounting structure by which a panel is mounted to be small in size and reliability is improved. CONSTITUTION:The panel 90 which should be mounted is provided with circuit wirings 11 and 13 on a peripheral part B and a wiring terminal part 17 on the outermost periphery connected to the wiring 13. In the case of mounting, a specified part 3 is installed on the circuit wirings 11 and 13 through an electrode for connection 8 to the panel 90. An input terminal part 15 provided on one-side periphery of a circuit substrate for inputting an external signal 4 is connected to the terminal part 17. Then, the circuit 4 is superposed on the peripheral part of the panel 90 so that the part 3 may be covered. The part 3 installed on the peripheral part B of the panel 90 is covered with both resin for protection 6 and the circuit substrate 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel mounting structure. More specifically, the present invention relates to a panel mounting structure in which components such as a driving IC (integrated circuit) are mounted and connected to a panel such as a liquid crystal panel in which circuit wiring is formed in a peripheral portion.

[0002]

2. Description of the Related Art Recently, as shown in FIGS. 5 and 6, as a method for mounting a liquid crystal panel 100, a COG (chip on glass) method in which a driving IC 103 is directly mounted on a peripheral portion B of the panel is practically used. Has been converted. Liquid crystal panel 100
Is a liquid crystal 120 between two glass substrates 101 and 102.
The outermost wiring terminal portion 117, the circuit wiring 113 connected to the wiring terminal portion 117, and the circuit wiring 1 extending in the display portion A on the peripheral portion B of the one glass substrate 101.
11 is formed (121 indicates a sealing material). In this COG type mounting structure, a driving IC
The glass substrate 1 is provided with bump electrodes 108 on the substrate 103 in advance.
Face down bonding on the circuit wirings 111 and 113 of No. 01, and further on the wiring terminal portion 117 via an anisotropic conductive material (anisotropic conductive film, anisotropic conductive adhesive, etc.) 109. Input terminal portion 11 of the input circuit board 104
5 are connected. As shown in FIG. 4, the circuit board 104 is provided with an input terminal portion 115 on one side edge and the rest as a wiring portion C connected to the input terminal portion 115.
During operation, an external signal is input to the wiring portion C of the circuit board 104, and the driving IC 103 drives the display portion A based on this external signal.

Conventionally, as shown in FIGS. 5 and 6, the wiring portion C of the circuit board 104 is arranged outside the liquid crystal panel 100. In addition, the bump electrode 10 of the driving IC 106
8 is covered with a protective resin 106.

[0004]

However, in the above-mentioned conventional mounting structure, the circuit board 1 is provided outside the liquid crystal panel 100.
There is a problem that the size of the mounting state (module) becomes large because the wiring portion C of 04 is protruding. In addition, the electrode 108 of the driving IC 103 has a protective resin 106.
However, in a harsh environment, water may pass through the resin 106 to corrode the electrodes 108 or cause insulation failure.

Therefore, an object of the present invention is to provide a panel mounting structure capable of mounting a panel in a small size and improving reliability.

[0006]

In order to achieve the above object, the mounting structure of the panel of the present invention is such that a panel having circuit wiring in the peripheral portion and outermost wiring terminal portions connected to the circuit wiring is provided. While mounting a predetermined component on the circuit wiring via the connection electrode, the wiring terminal portion,
In a mounting structure of a panel in which an input terminal portion provided on one peripheral edge of an external signal input circuit board is connected, the circuit board is arranged so as to overlap the panel so as to cover the components, and the circuit board is It is characterized in that a protective resin is sealed in a portion covering the above-mentioned parts.

[0007]

Since the circuit board for inputting an external signal is overlapped with the peripheral portion of the panel, there is nothing protruding outside the panel. Therefore, the panel is mounted in a smaller size than the conventional one. Further, since the components mounted on the peripheral portion are covered with both the protective resin and the circuit board, moisture intrusion between the components and the panel, that is, the place where the connection electrode is provided. The route is reduced. Therefore, reliability is increased.

[0008]

EXAMPLES The panel mounting structure of the present invention will be described in detail below with reference to examples.

FIG. 1 is a perspective view of an active matrix type liquid crystal module of an embodiment, FIG. 2 is a front view of the above module, and FIG.
A cross section taken along line III is shown. As shown in FIG. 3, the liquid crystal panel 90 constituting the above liquid crystal module has the liquid crystal 20 sandwiched between two glass substrates 1 and 2, and the outermost wiring is provided on the peripheral portion B of one glass substrate 1. The terminal portion 17, the circuit wiring 13 connected to the wiring terminal portion 17, and the circuit wiring 11 extending in the display portion A are formed (21 indicates a sealing material). In this COG type mounting structure, bump electrodes 8 are provided in advance on the driving IC 3 and face down bonding is performed on the circuit wirings 11 and 13 of the glass substrate 1. Further, the input terminal portion 15 of the external signal input circuit board 4 is connected to the wiring terminal portion 17 via an anisotropic conductive material (anisotropic conductive film, anisotropic conductive adhesive, etc.) 9. . This circuit board 4 is similar to that shown in FIG. 4, in which the input terminal portion 15 is provided on the peripheral edge of one side and the rest is the wiring portion C connected to the input terminal portion 15. Here, the circuit board 4 is arranged so as to overlap the glass substrate 1 so that the wiring portion C covers the driving IC 3. In addition, a protective resin 6 is formed on the portion where the circuit board 4 covers the driving IC 3.
Is enclosed. The protective resin 6 is used as the driving IC 3
And the bump electrode 8 is also wrapped with the protective resin 6.

As described above, in this liquid crystal module, since the external signal input circuit board 4 is superposed on the peripheral portion of the glass substrate 1, there is nothing protruding outside the panel 90. Therefore, the liquid crystal panel can be mounted in a smaller size than the conventional one. Further, since the driving IC 3 is covered with both the protective resin 6 and the circuit board 4, the driving IC 3
3 and the glass substrate 1, that is, the moisture intrusion route to the place where the bump electrode 8 is provided can be reduced. Therefore, reliability can be improved.

[0011]

As is apparent from the above, in the panel mounting structure of the present invention, since the external signal input circuit board is superposed on the peripheral portion of the panel, it is possible to eliminate the one protruding outside the panel. Therefore, the panel can be mounted in a small size, and the handling becomes easy. Further, since the components mounted on the peripheral portion of the panel are covered with both the protective resin and the circuit board, between the components and the panel,
That is, it is possible to reduce the moisture intrusion route to the place where the connection electrode is provided. Therefore, reliability can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a liquid crystal module of an embodiment to which the present invention is applied.

FIG. 2 is a front view of the liquid crystal module.

FIG. 3 is a sectional view taken along the line III-III in FIG.

FIG. 4 is a diagram showing an external signal input circuit board.

FIG. 5 is a front view of a conventional liquid crystal module.

6 is a sectional view taken along the line VI-VI in FIG.

[Explanation of symbols]

 1, 2 glass substrate 3 driving IC 4 external signal input circuit substrate 90 liquid crystal panel A display portion B peripheral portion

Claims (1)

[Claims] 1. A predetermined component is mounted on the circuit wiring via a connecting electrode on a panel having a circuit wiring on the peripheral portion and a wiring terminal portion on the outermost periphery connected to the circuit wiring. In a mounting structure of a panel in which an input terminal portion provided on one peripheral edge of an external signal input circuit board is connected to the wiring terminal portion, the circuit board is arranged so as to overlap with the panel so as to cover the component. A mounting structure of a panel, wherein a protective resin is sealed in a portion where the circuit board covers the component.