JPH06147848A - Visual inspection equipment - Google Patents

Abstract

PURPOSE:To provide a visual inspection equipment which allow automation of inspection while enhancing reliability through noncontact inspection regardless of the skill of worker. CONSTITUTION:In a visual inspection equipment for deciding pass/fail of the profile of lead in a surface mounted bidirectional flat package semiconductor device, a plurality of optical sensors 7 comprising emitting parts 5 and receiving parts 6 of single wave light 4 are arranged for the lead part 3 of a semiconductor integrated circuit device 2 mounted on a test board 1. The optical sensors 7 are constituted such that six sets of light emitting and light receiving parts 5, 6 are arranged on the outer peripheral side of regular lead forming position of the semiconductor integrated circuit device 2, e.g. on the upper/lower sides and outside of the lead parts 3 on the opposite sides, and a single wave light 4 emitted from the light emitting part 5 passes through the outer peripheral side of the lead part 3 and arrives at the light receiving part 6 thus inspecting pass/fail of lead profile.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead shape appearance inspection device, and particularly in a semiconductor integrated circuit device which requires lead molding or is provided with more leads, causes a trouble in appearance to the customer. The present invention relates to a technique effectively applied to a visual inspection device that can be improved in reliability and automated.

[0002]

2. Description of the Related Art In recent years, appearance inspections of semiconductor devices have become more and more diversified due to differences in the applications, functions, and characteristics of the target semiconductor devices. Particularly in semiconductor integrated circuit devices that require high integration. The lead shape of the outer lead formed by the lead molding is also very important.

Generally, such visual inspection of the lead shape is performed by the operator's visual inspection in many cases, but the influence of the operator such as oversight occurs on the work, or the operator's long time is spent. Considering the labor of visual inspection, etc., and considering the automation etc., a detection method using a sensor has been considered.

For example, in the lead pass / fail judgment device described in Japanese Patent Laid-Open No. 2-272367, a measuring plate is operated so as to come into contact with a semiconductor device to bring it into contact with a lead, and the operation amount of this measuring plate is detected by an optical sensor. Thus, the quality of the lead shape of the semiconductor device is determined.

[0005]

However, in the prior art as described above, when the measuring plate is brought into contact with the lead, the lead may be deformed depending on how the force is applied. Therefore, an inspection method that does not contact the leads is desired.

Therefore, an object of the present invention is to provide a visual inspection apparatus which is not affected by an operator and which improves the reliability of the lead shape by non-contact visual inspection and can automate the inspection. .

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the appearance inspecting apparatus of the present invention is an appearance inspecting apparatus for determining whether the lead shape of the semiconductor device with leads is good or bad. A single or multiple single wave light sensor is arranged on the outer peripheral side of the shape position, and the single wave light emitted from the light emitting section of this optical sensor passes through the outer peripheral side of the lead section and reaches the light receiving section of the optical sensor. It is a thing.

[0010]

According to the appearance inspection apparatus described above, since the optical sensor is arranged on the outer peripheral side of the regular lead shape position with respect to the lead portion of the semiconductor device, the operator is not affected and The reliability of the appearance inspection can be improved by the appearance inspection by contact, and the efficiency of the appearance inspection work can be improved by automation.

That is, by using an optical sensor based on single-wave light that is not affected by other optical sensors, it is possible to detect the bending of the lead portion of the semiconductor device, the distortion, and the rise of solder between the test board and the lead. When the single wave light emitted from the light emitting portion of the sensor is disturbed, it is determined as defective, and when the single wave light passes through the outer peripheral side of the lead portion and reaches the light receiving portion of the optical sensor, it can be determined as a good product.

[0012]

1 (a) and 1 (b) are a front view and a side view showing an essential part of an appearance inspection apparatus according to an embodiment of the present invention, and FIG. 2 shows an appearance inspection in the appearance inspection apparatus of this embodiment. It is a perspective view showing a modification of the inspection object.

First, the main structure of the appearance inspection apparatus of this embodiment will be described with reference to FIG.

The appearance inspecting apparatus of this embodiment is an appearance inspecting apparatus for determining whether the lead shape is good or bad in a semiconductor device with leads of a surface mounting type / two-way flat package, for example, a semiconductor integrated device mounted on the test board 1. Single-wave light 4 is applied to the lead portion 3 of the circuit device (semiconductor device) 2.
A plurality of optical sensors 7 each including a light emitting section 5 and a light receiving section 6
Is provided, and the quality of the lead shape is inspected by the single wave light 4 of the optical sensor 7.

This optical sensor 7 is a semiconductor integrated circuit device 2
Outer side of the regular lead shape position by lead molding, for example, the upper side of the lead portion 3 on both sides as shown in FIG. 1 (b),
Six sets of light-emitting units 5 and light-receiving units 6 are arranged on the lower side and the outer side, respectively, and the single-wave light 4 emitted from each of the light-emitting units 5 passes through the upper side, the lower side, and the outer side of the lead section 3 to correspond to each other. The structure is such that it reaches the light receiving section 6 of.

The reason why the light source of the single wave light 4 is used as the light emitting section 5 of the optical sensor 7 is to make it less susceptible to the influence of the other optical sensors 7 arranged in close proximity. A light source is used, and a light source with a smaller beam diameter is desirable.

Next, with respect to the operation of this embodiment, the quality judgment of the lead shape will be described.

First, when each lead of the lead portion 3 has a regular lead shape formed by lead molding, the single wave light 4 emitted from the light emitting portion 5 passes through the upper side, the lower side and the outer side of each lead, respectively. Since it reaches the light receiving portion 6 of No. 3, it is determined that the lead shape is non-defective.

On the other hand, when the single wave light 4 emitted from the light emitting section 5 does not reach the light receiving section 6, for example, the lead bends,
Since there is lead distortion or the like, and the single-wave light 4 is blocked by the lead of this deformed portion and does not reach the light receiving portion 6, it can be determined that the lead shape is defective.

Therefore, according to the appearance inspection apparatus of this embodiment, the six sets of optical sensors 7 each including the light emitting section 5 and the light receiving section 6 for the single wave light 4 are provided to the lead section 3 of the semiconductor integrated circuit device 2. By being provided, it is possible to determine the quality of the lead shape by the arrival or blocking of the single wave light 4 emitted from the light emitting unit 5 to the light receiving unit 6 without being affected by the worker as in the conventional case. By automating this, it becomes possible to perform a visual inspection of the lead shape in a non-contact state, which is favorable for improving efficiency.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the embodiments and can be variously modified without departing from the scope of the invention. Needless to say.

For example, in the appearance inspection apparatus of this embodiment, the case where the optical sensors 7 are arranged on the upper side, the lower side and the outer side of the lead portions 3 on both sides has been described, but the present invention is not limited to the above embodiment. However, the present invention can be widely applied to the case where the optical sensor is provided only on one side and the lead shape on the other side is inspected while rotating the semiconductor integrated circuit device by 180 degrees.

Regarding the position of the optical sensor 7,
When inspecting the floating or the like due to soldering of the test board 1 and the lead portion 3, it becomes possible by additionally disposing the optical sensor 7 at the position shown by the alternate long and short dash line in FIG. As described above, in the case of inspecting the lead shape in detail, by arranging a larger number of optical sensors on the outer peripheral side of the lead portion, a highly reliable appearance inspection can be performed.

Further, as the inspection object of the visual inspection,
The semiconductor integrated circuit device 2 is not limited to the surface mount type / two-way flat package semiconductor integrated circuit device 2. In addition to the surface mount type such as a four-way flat package and PLCC (Plastic Leaded Chip Carrier), pin insertion as shown in FIG. Type PGA (Pin Grid Array), such as a semiconductor integrated circuit device 2a that allows single-wave light 4 to pass from the light emitting portion 5 to the light receiving portion 6 between regularly arranged leads, such as a lead molding Needless to say, the present invention can be applied to various semiconductor integrated circuit devices with leads regardless of the presence or absence.

In the above description, the case where the invention made by the present inventor is mainly applied to the appearance inspection apparatus used for the semiconductor integrated circuit devices 2 and 2a, which is the field of use of the invention, has been described, but the invention is not limited to this. Instead, it is widely applicable to other semiconductor devices having leads such as diodes and transistors.

[0026]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, with respect to the lead portion of the semiconductor device with leads, an optical sensor for a single wave or a plurality of single wave lights is arranged on the outer peripheral side of the regular lead shape position of the lead portion, and the light is emitted from the light emitting portion of the optical sensor. By adopting a structure in which the received single wave light reaches the light receiving part of the optical sensor through the outer peripheral side of the lead part, the good or defective lead shape is judged by the arrival or blocking of the single wave light emitted from the light emitting part to the light receiving part. Therefore, the appearance of the lead shape can be inspected by non-contact.

As a result, since the reliability can be improved by the non-contact appearance inspection and the inspection can be automated, it is possible to obtain the appearance inspection apparatus which can improve the efficiency of the inspection work.

[Brief description of drawings]

1A and 1B are a front view and a side view showing a main part of an appearance inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing a modified example of the inspection object of the appearance inspection in the appearance inspection device of the present embodiment.

[Explanation of symbols]

 1 Test board 2, 2a Semiconductor integrated circuit device (semiconductor device) 3 Lead part 4 Single wave light 5 Light emitting part 6 Light receiving part 7 Optical sensor

Claims (1)

[Claims] 1. A visual inspection apparatus for determining whether a lead shape of a semiconductor device with leads is good or bad, wherein a single unit is provided on the outer peripheral side of a regular lead shape position of the lead portion with respect to the lead portion of the semiconductor device with leads. Alternatively, a structure is provided in which an optical sensor for a plurality of single wave lights is provided, and the single wave light emitted from the light emitting portion of the light sensor reaches the light receiving portion of the optical sensor through the outer peripheral side of the lead portion. Appearance inspection device.