JPH06140645A - Assembly of optical semiconductor module - Google Patents

Abstract

PURPOSE:To obtain a method for assembling an optical semiconductor module having a receptacle for use in connection with an optical connector that makes it possible to improve mass-producibility and yield by simplifying assembly processes. CONSTITUTION:A reference surface 23 relative to a holder 21 is previously disposed symmetrical with respect to the light receiving or emitting center on the outer periphery of a package of an optical semiconductor element 15. The holder 21 is given an integrated structure so that a ferrule guide hole 6, a lens guide hole 13 and an element guide hole 22 can be accurately machined, whereby the adjustment of an optical axis required in an assembly stage is omitted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for assembling an optical semiconductor laser module or a photodiode module used for optical communication or the like.

[0002]

2. Description of the Related Art FIG. 6 is a sectional view of a conventional optical semiconductor laser module disclosed in, for example, Japanese Unexamined Patent Publication No. 2-293805. In the figure, 1 is a receptacle, and 2 is a male screw, which is coupled with a male screw 5 provided on a connection nut 4 of a connecting optical connector plug 3. 6 is a ferrule guide hole for guiding the ferrule 8 holding the optical fiber 7 incorporated in the connecting optical connector plug 3, 9 is a receiving wall which is a contact surface of the ferrule 8, 10 is a light passage hole, and 11 is a rod lens. A housing 12 holds the lens guide hole 13 in the lens guide hole 13 by adhesion or the like, and an adapter 14a holds an optical semiconductor element 15, and the housing 11 and the adapter 14a.
The outer cylinder 16 that engages in the same direction as the optical axis of the optical fiber 7.
And an inner cylinder 17 are provided respectively. Reference numeral 18 denotes a joint surface between the receptacle 1 and the housing 11, which are respectively provided in the direction orthogonal to the optical axis of the optical fiber 7.

The adapter 14a is positionally adjusted in the optical axis direction so that the optical coupling between the optical fiber 7 and the optical semiconductor element 15 is optimized, and the outer and inner cylinders 16 and 17 are laser-welded to each other by fusion welding 19 Is made a fixed number and fixed. Further, the receptacle 1 and the housing 11 are positionally adjusted in a direction orthogonal to the optical axis, and a predetermined number of fusion welded portions 20 are formed and fixed by laser welding.

Next, the operation will be described. The ferrule 8 is inserted into the ferrule guide hole 6 and is fixed to the receptacle 1 by the connection nut 4, and the optical fiber 7 and the optical semiconductor element 15 can be optically coupled via the condensing rod lens 12.

[0005]

The conventional optical semiconductor module is generally constructed as described above, and the mutual position of the optical semiconductor element 15 and the ferrule guide hole 6 is optically coupled via the rod lens 12. It took a lot of man-hours to adjust the position to be optimum. In particular, when the optical fiber used is a single mode or the like, the optical semiconductor element 15
Is a long-wavelength laser diode, these optical fibers 7,
The positional adjustment between the rod lens 12 and the optical semiconductor element 15 requires a setting accuracy of several μm or less because the light receiving diameter of the optical fiber 7 to be focused is 10 μm or less. But,
Since the parts that make up these have shape errors,
In particular, since it is necessary to search for the position adjustment range in the optical axis direction and the direction orthogonal to the optical axis within the shape error accumulated value of these parts, much assembly time is required.

Further, the receptacle 1 and the housing 11
When the housing 11 and the adapter 14a are fixed by welding, the melt-welded portions 19 and 20 are likely to be distorted, and the parts are inclined. This inclination changes the optical path length of the optical semiconductor element 15 and the rod lens 12 in the optical axis direction, and the optical axis shift is increased in the optical axis direction in the receiving wall 9 of the ferrule 8 according to the magnification of the rod lens 12. It has been a factor that deteriorates the manufacturing yield.

The present invention has been made in order to solve the above problems, and provides an economical method of assembling an optical semiconductor module which is efficient in assembly and can be obtained with a simple structure. .

[0008]

In the method of assembling an optical semiconductor module according to the present invention, a chip is soldered to a stem via a silicon substrate or a metal block for heat dissipation, so that a light emitting point or a light emitting point with respect to an outer shape is obtained. For optical semiconductor elements where the position accuracy of the light receiving point is very poor, positioning reference surfaces are provided in the optical axis direction and in the direction orthogonal to the optical axis on the outer circumference of the stem in accordance with the light emitting point or the light receiving point position,
Further, the receptacle and the housing are made of an integral structural member so that the ferrule guide hole, the lens guide hole, and the element guide hole can be machined with high precision. The assembling is such that the lens and the optical semiconductor element can be incorporated into a mechanical component that has been subjected to high-precision coaxial processing without special optical axis adjustment.

[0009]

Since the chip of the light emitting portion or the light receiving portion is usually assembled on the stem by soldering through the silicon substrate or the metal block for heat radiation in the optical semiconductor element, the error between the chip and the stem is several tens of μm. have. Furthermore, many rod lenses used in such optical semiconductor modules have a magnification of about 2 to 8 times, and the error of the error of several tens of μm is further magnified on the contact surface of the optical fiber, and the error of several hundred μm. There are many cases of error. Therefore, according to the present invention, optical axis adjustment can be made unnecessary by performing additional processing on the optical semiconductor element in advance in the optical axis direction and in the optical axis orthogonal direction, respectively.

[0010]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 21 denotes a holder, which is a ferrule guide hole 6 that serves as a fitting reference for an optical connector plug,
A lens guide hole 13 for positioning the lens 12 in the direction orthogonal to the optical axis, an element guide hole 22 for positioning the optical semiconductor element 15 in the direction orthogonal to the optical axis, and an optical axis of the optical semiconductor element 15 provided at the end of the element guide hole 22. A reference surface 23 for positioning in the same direction is provided in the same member, and the ferrule guide hole 6, the lens guide hole 13, and the element guide hole 22 are machined with good concentricity using a double-sided lathe. Keep it. Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, as shown in FIG. 2, an element 27 sealed by a cap 25 having a glass window 24 and a stem 26.
In the optical semiconductor element 15 consisting of, the stem 26 is concentric with the light emission center of the element 27, the shaft portion 28a having a radius R fitted into the element guide hole 22, and the light emission point of the element 27 are the light receiving wall 9.
The abutting surface 29a having a predetermined distance is additionally processed. First, the lens 1 is assembled at a predetermined distance from the reference plane 23.
After fixing 2 to the lens guide hole 13, the optical semiconductor element 1
5 is incorporated and fixed by using the element guide hole 22 and the reference surface 23 as guides, and the assembling of the optical semiconductor module is completed.

Example 2. Next, a second embodiment of the present invention will be described. The basic configuration of this embodiment is the same as the first embodiment. This is almost similar to the above and will be described with reference to FIGS. In FIG. 1, 2
Reference numeral 1 denotes a holder, which is made of a resin material and serves as a fitting reference for an optical connector plug, and a ferrule guide hole 6, a lens guide hole 13 for positioning the lens 12 in a direction orthogonal to the optical axis, or a lens guide hole 13 having a diameter slightly smaller than that of the lens 12, Semiconductor element 1
Element guide hole 22 for positioning 5 in the direction orthogonal to the optical axis, and optical semiconductor element 15 provided at the end of this element guide hole 22.
A reference surface 23 for positioning in the optical axis direction is provided in the same member, and the ferrule guide hole 6, the lens guide hole 13, and the element guide hole 22 are accurately formed by using a precision mold or the like in consideration of concentricity. Make a good hole.
Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, as shown in FIG. 4, an element 27 sealed by a cap 25 having a glass window 24 and a stem 26.
In the optical semiconductor element 15 consisting of the element 2, the stem 26 is concentric with the light emission center of the element 27, and the shaft portion 28a having the same radius as the element guide hole 22 or slightly larger radius R and the element 2
Abutment surface 29 where the light emitting point of 7 is at a predetermined distance from the receiving wall 9
A is additionally processed. Assembling is performed by first inserting the lens 12 into the lens guide hole 13 at a predetermined interval from the reference surface 23 with no gap, and then inserting and fixing the lens 12, and then the optical semiconductor element 15
Using the element guide hole 22 and the reference surface 23 as a guide, the device is assembled and fixed in the press-fitting groove without any gap, and the assembly of the optical semiconductor module is completed.

When the optical tolerance is gentle, the lens 12 or the optical semiconductor element 15 is set in a press-fitted state, but either one may be configured with a clearance fit.

Example 3. FIG. 3 is a diagram showing another embodiment of the present invention. The basic configuration is the same as in the first embodiment. Is almost the same as. In FIG. 3, reference numeral 21 denotes a holder, which is a ferrule guide hole 6 and a lens 12 which are fitting standards of the optical connector plug.
The lens guide hole 13 for positioning the optical semiconductor element 15 in the direction orthogonal to the optical axis, the element guide hole 22 for positioning the optical semiconductor element 15 in the direction orthogonal to the optical axis, and the optical semiconductor element 15 provided at the end of the element guide hole 22 in the optical axis direction. A reference surface 23 for positioning is provided in the same member, and the ferrule guide hole 6, the lens guide hole 13, and the element guide hole 22 are machined with a good concentricity using a double-sided lathe or the like. . Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, as shown in FIG. 4, a cap 25 having a glass window 24 and an element 27 sealed by a stem 26.
In the optical semiconductor element 15 consisting of, the cap 25 is concentric with the light emission center of the element 27, the shaft portion 28b having the same radius as the element guide hole 22 or a radius R slightly larger, and the light emitting point of the element 27 is the receiving wall 9. Abutting surface 2 with a predetermined interval
9b is additionally processed. Assembling is performed by first inserting the lens 12 into the lens guide hole 13 at a predetermined interval from the reference surface 23 with no gap, and then inserting and fixing the lens 12, and then the optical semiconductor element 1
5 is installed and fixed in the press-fitting groove with the element guide hole 22 and the reference surface 23 as a guide without a gap, and the assembling of the optical semiconductor module is completed.

Embodiment 4. Next, a fourth embodiment of the present invention will be described. The basic configuration is the third embodiment. Is almost the same as
Will be explained. In FIG. 3, reference numeral 21 denotes a holder, which is made of a resin material and is a ferrule guide hole 6 which serves as a fitting reference of an optical connector plug, and a lens guide hole which is the same as or slightly smaller than the outer diameter of the lens 12 for positioning the lens 12 in the direction orthogonal to the optical axis. 13, an element guide hole 22 for positioning the optical semiconductor element 15 in the direction orthogonal to the optical axis, and this element guide hole 2
The reference surface 23 for positioning in the optical axis direction of the optical semiconductor element 15 provided at the end of 2 has an integrated structure in the same member,
The ferrule guide hole 6, the lens guide hole 13, and the element guide hole 22 are machined with high precision by using a precision mold or the like in consideration of concentricity. Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, as shown in FIG. 4, an element 27 sealed by a cap 25 having a glass window 24 and a stem 26.
In the optical semiconductor element 15 made of, the cap 25 is concentric with the light emission center of the element 27, the end portion 28b having the same radius as the element guide hole 22 or slightly larger radius R, and the light emission point of the element 27 is the receiving wall 9. Abutting surface 2 with a predetermined interval
9b is additionally processed. Assembling is performed by first inserting the lens 12 into the lens guide hole 13 at a predetermined interval from the reference surface 23 with no gap, and then inserting and fixing the lens 12, and then the optical semiconductor element 1
5 is installed and fixed in the press-fitting groove with the element guide hole 22 and the reference surface 23 as a guide without a gap, and the assembling of the optical semiconductor module is completed.

When the optical tolerance is gentle, the lens 12 or the optical semiconductor element 15 is set in a press-fitted state, but either one may be fitted with a gap.

Example 5. FIG. 5 is a diagram showing a fifth embodiment of the present invention. The basic configuration is the third embodiment. Is almost the same as.
In FIG. 5, reference numeral 21 denotes a holder, which is a ferrule guide hole 6 serving as a fitting reference of the optical connector plug, a lens guide hole 13 for positioning the lens 12 in the direction orthogonal to the optical axis, and an optical semiconductor element 15 in the direction orthogonal to the optical axis. The element guide hole 22 and the reference surface 23 for positioning in the optical axis direction of the optical semiconductor element 15 provided at the end portion of the element guide hole 22 are provided in the same member to have an integrated structure, and the ferrule guide hole 6 and the lens guide hole are provided. The 13 and the element guide hole 22 are machined with good concentricity using a double-sided lathe or the like.
Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, the optical semiconductor element 15 is attached to the cylindrical adapter 30 in advance, and the optical semiconductor element 15 of the third embodiment. Similarly to the above, the shaft portion 28c and the abutting surface 29c are provided on the outer peripheral portion of the adapter 30. First, the lens 12 is inserted and fixed in the lens guide hole 13 at a predetermined distance from the reference surface 23, and then the optical semiconductor element 15 attached to the adapter 30 is incorporated and fixed using the element guide hole 22 and the reference surface 23 as guides. Then, the assembly of the optical semiconductor module is completed.

Embodiment 6. Next, a sixth embodiment of the present invention will be described. The basic configuration is the same as in Embodiment 5. This is almost the same as the above and will be described with reference to FIG. In FIG. 5, reference numeral 21 denotes a holder, which is made of a resin material and is a ferrule guide hole 6 serving as a fitting reference of an optical connector plug, and a lens guide hole having the same or slightly smaller outer diameter than the lens 12 for positioning the lens 12 in the direction orthogonal to the optical axis. 13, an element guide hole 22 for positioning the optical semiconductor element 15 in a direction orthogonal to the optical axis, and a reference surface 23 for positioning the optical semiconductor element 15 at the end of the element guide hole 22 in the optical axis direction are provided in the same member. The ferrule guide hole 6, the lens guide hole 13, and the element guide hole 22 are machined with high precision using a precision mold or the like in consideration of concentricity. Further, the distance between the reference surface 23 and the receiving wall 9 at the bottom of the ferrule guide hole 6 is also processed to have a predetermined optical length.

On the other hand, the optical semiconductor element 15 is attached to the tubular adapter 30 in advance, and the optical semiconductor element 15 of the fifth embodiment. Similarly to the above, an outer peripheral portion of the adapter 30 is provided with a shaft portion 28c and an abutting surface 29c having the same diameter as or slightly larger than the element guide hole 22. First, the lens 1 is assembled at a predetermined distance from the reference plane 23.
2 is inserted into the lens guide hole 13 with no gaps and fixed therein, and then the optical semiconductor element 15 attached to the adapter 30 is incorporated and fixed by using the element guide hole 22 and the reference surface 23 as a guide to fix the optical semiconductor module. Complete the assembly.

When the optical tolerance is gentle, the lens 12 or the optical semiconductor element 15 is set in a press-fitted state, but either one may be fitted with a gap.

[0025]

As described above, according to the present invention, the first embodiment
As shown in FIGS. 6 to 6, in each case, the shape of each component may be simple, and the number of parts can be reduced. High precision processing is required for processing the holder and the optical semiconductor element, but it is easily available as a dedicated automatic processing machine due to the development of machine tools in recent years, and mass production is possible. Therefore, conventionally, the optical axis adjustment was required at the time of assembling, a lot of assembling time was required, and the complicated adjustment was required, so that the production yield was poor and there was a problem in mass productivity. Since it is finished at the parts stage, it has excellent mass productivity.

Further, according to the second, fourth and sixth embodiments, when the lens and the optical semiconductor element are incorporated, the positional displacement due to the gap can be eliminated by the press-fitting utilizing the elasticity of the resin, and the tolerance of the molding process of the holder is relaxed. It is also possible to provide an economical optical semiconductor module.

[Brief description of drawings]

FIG. 1 is a sectional view of an optical semiconductor module for explaining an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of the main parts of FIG. 1 for explaining another embodiment of the present invention.

FIG. 3 is a partial cross-sectional view of an optical semiconductor module for explaining another embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of the main parts of FIG. 3 for explaining another embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of an optical semiconductor module for explaining another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of an optical semiconductor module for explaining a conventional example.

[Explanation of symbols]

 6 ferrule guide hole 12 lens 13 lens guide hole 15 optical semiconductor element 21 holder 22 element guide hole 23 reference surface 30 adapter

Claims (4)

[Claims] 1. An optical semiconductor element sealed by a cap having a light transmitting window, a receptacle for fitting a connecting optical connector plug, and an optical axis connecting the optical semiconductor element and the receptacle. Lens provided like this,
In an optical semiconductor module including a holder for holding these, the holder includes a receptacle portion having a ferrule guide hole that serves as a fitting reference of an optical connector plug, a lens guide hole for positioning a lens in a direction orthogonal to an optical axis, and an optical semiconductor element. An element guide hole for positioning in the direction orthogonal to the optical axis and a reference surface for positioning in the optical axis direction of the optical semiconductor element provided at the end of the element guide hole are provided in the same member in an integrated structure. After sealing with a cap, a shaft and abutting surface are provided on the outer circumference of the stem in accordance with the light emitting or light receiving point position so that a predetermined coupling efficiency with the lens can be obtained by using the element guide hole and the reference surface as a guide. The lens is fixed at a predetermined position in the optical axis direction from the reference surface of the holder, and then the optical semiconductor element is incorporated and fixed. Assembly method of the optical semiconductor module that. 2. An optical semiconductor element sealed by a cap having a light transmission window, a receptacle for fitting a connecting optical connector plug, and an optical axis connecting the optical semiconductor element and the receptacle. Lens provided like this,
In an optical semiconductor module including a holder for holding these, the holder includes a receptacle portion having a ferrule guide hole that serves as a fitting reference of an optical connector plug, a lens guide hole for positioning a lens in a direction orthogonal to an optical axis, and an optical semiconductor element. An element guide hole for positioning in the direction orthogonal to the optical axis and a reference surface for positioning in the optical axis direction of the optical semiconductor element provided at the end of the element guide hole are provided in the same member in an integrated structure. After sealing with a cap, a shaft and abutting surface are provided on the outer periphery of the cap in accordance with the light emitting or light receiving point position so that a predetermined coupling efficiency with the lens can be obtained by using the element guide hole and the reference surface as a guide. The lens is fixed at a predetermined position in the optical axis direction from the reference surface of the holder, and then the optical semiconductor element is incorporated and fixed. Assembly method of the optical semiconductor module. 3. An optical semiconductor element sealed by a cap having a light transmitting window, a receptacle for fitting an optical connector plug for connection, and an optical axis connecting the optical semiconductor element and the receptacle. Lens provided like this,
In an optical semiconductor module including a holder for holding these, the holder includes a receptacle portion having a ferrule guide hole that serves as a fitting reference of an optical connector plug, a lens guide hole for positioning a lens in a direction orthogonal to an optical axis, and an optical semiconductor element. An element guide hole for positioning in the direction orthogonal to the optical axis and a reference surface for positioning in the optical axis direction of the optical semiconductor element provided at the end of the element guide hole are provided in the same member in an integrated structure. Preliminarily attached to a cylindrical adapter, the shaft and abutting surface are fitted to the outer peripheral part of the adapter in accordance with the light emitting or light receiving point position so that a predetermined coupling efficiency with the lens can be obtained by using the element guide hole and the reference surface as a guide. , The lens is fixed at a predetermined position in the optical axis direction from the reference surface of the holder, and then the optical semiconductor element attached to the adapter is assembled. Method of assembling an optical semiconductor module, characterized in that so as to see fixed. 4. The holder is formed of a resin material, the lens guide hole is formed to be equal to or slightly smaller than the lens outer diameter, and the shaft portion is formed to be equal to or slightly larger than the element guide hole diameter. The method for assembling the optical semiconductor module according to any one of claims 1 to 3, wherein: