JPH0613524A - Package - Google Patents

Abstract

PURPOSE:To solve the difficulty of quality control of very small conductor pins in huge quantity resulting from a dramatic increase in package size and higher integration induced by a larger-sized and higher integrated electronic components, and what is more, tendency toward multiple chips and the difficulty caused by an increase in the number of mounting processes to a package and, moreover, solve the difficulty of a mounting technique which installs the package to a printed wiring board. CONSTITUTION:For a package loaded with electronic components and surface- mounted on a printed wiring board by way of an outside connection pin, there are provided a plurality of core-conductor-formed flexible pins which insulate the outside connection pins connected to the outer end of leads electrically connected to the electronic components, thereby forming this package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package on which electronic parts are mounted and which is surface-mounted on a printed wiring board via external connection pins.

[0002]

2. Description of the Related Art Conventionally, a package having several hundreds of conductor pins to be external connection terminals has been used as a package on which electronic parts are mounted and which is surface-mounted on a printed wiring board through external connection pins. There is.

[0003]

In the conventional package having the conductor pins, the leads electrically connected to the mounted electronic components are printed wiring through the individually formed conductor pins for external connection. Connected to the circuit on the board. That is, as many conductor pins for external connection as the number of terminals of electronic parts are required, which makes quality control of conductor pins difficult.
This increases the number of man-hours for mounting the package and further makes it difficult to mount the package on a printed wiring board.

According to the present invention, it is difficult to control the quality of a minute and enormous number of conductor pins, which remarkably appears due to the increase in the size and the degree of integration of the electronic parts to be mounted and the increase in the size and the degree of integration of the package by the multichip. The purpose is to improve the number of man-hours required for mounting the package on a printed wiring board, and to increase the number of man-hours for mounting the package on a printed wiring board.

[0005]

SUMMARY OF THE INVENTION According to the present invention, in a package in which an electronic component is mounted and surface-mounted on a printed wiring board via an external connection pin, outer ends of leads electrically connected to the electronic component. A package is characterized in that the external connection pin connected to the portion is a flexible pin formed with a plurality of core conductors insulated from each other.

[0006]

According to the present invention, the external connection pins connected to the outer ends of the leads electrically connected to the electronic parts are formed with a plurality of core conductors which are insulated from each other. Since the plurality of leads that are individually connected are collected in one external connection pin, the number of external connection conductor pins that must be formed in the package can be extremely reduced. Moreover, since the external connection pin connected to the outer end of the lead electrically connected to the electronic component is a flexible pin formed with a plurality of core conductors insulated from each other, an electronic component having an enormous total number of terminals While mounting
It can be easily mounted on a printed wiring board, and is not affected by mechanical shock given to electronic equipment or stress strain due to the difference in coefficient of thermal expansion between the package and the printed wiring board on which it is mounted. It is possible to cope with the large size and high integration of the package, and also the large size and high integration of the package due to the multi-chip.

[0007]

EXAMPLES The present invention will be specifically described with reference to the following examples.

(Embodiment 1) This embodiment is an LSI mounting package, which will be described with reference to FIGS. 1 and 2. FIG. 1 is a vertical sectional view of the completed package, and FIG. 2 is a top view, a side view, and a bottom view of an external connection pin used in this embodiment. First, this example was formed by the following steps. 1: A 50-micrometer-thick structure that protects the upper and lower leads by forming the upper and lower leads made of copper foil with a thickness of 35-micrometers through the middle insulating layer made of a flexible fluorine-based resin material with a thickness of 50-micrometers. Reel to the substrate with the upper and lower insulating layers made of fluorine resin
Step of forming a plurality of continuous reel-to-reel methods, 2: LSI is mounted on an aluminum cap whose surface that dissipates heat outside the package is anodized, and the cap is on the lower insulating layer that protects the lower lead. A step of bonding and electrically connecting the inner ends of the upper and lower leads formed above and below via the middle insulating layer and the terminals on the LSI via a gold-tin alloy bond or a connecting conductor such as solder. 3: A step of filling the cap with the sealing resin and sealing the LSI and the inner ends of the upper and lower leads with the resin. 4: The middle insulating layer of the package outer periphery is sandwiched between the upper and lower molds, and a filler or the like is put into the molds to pressurize and heat-fill the cap with a fluorine-based resin having a matched coefficient of thermal expansion. As a result, the structure shown by the molding resin in FIG. 1 is provided, which covers the side surface of the cap and the sealing resin, and has convex portions at four corners of the package for controlling the distance between the connection pad on the printed wiring board and the lower end surface of the external connection pin. Step 5: Insert 100: 100 external connection pins and expose the upper end of each external connection pin 4
Step of electrically connecting the core conductor of the four and the four outer ends of the upper and lower leads through the connecting conductor, 6: the sealing resin used in the step 3 at the insertion / connection part of the external connection pin Or a step of filling a sealing resin having the same kind as the molding resin used in the above step 4 but a small amount of filler content and a little flexibility to seal the connection portion and fix the external connection pin,
7: A step of individually separating a plurality of continuous substrates and completing a package having two external LSIs having 100 terminals and 100 external connection pins. As shown in FIG. 2, the external connection pins are formed by covering four core conductors made of a copper wire having a diameter of 0.3 mm with a flexible fluorine resin so as to electrically insulate each of the four core conductors. , Overall, diameter is 1.5
It has a flexible cylindrical structure with a millimeter and a length of 5.0 millimeters. In particular, the upper surfaces of the external connection pins are exposed at the upper surfaces of the individual core conductors through the walls of the insulator for electrical connection with the outer ends of the upper and lower leads. Further, at the lower end portion of the external connection pin, the lower surface of the core conductor is exposed for electrical connection with the connection pad on the printed wiring board, and the side surface is exposed through the wall of the insulator. In addition, the external connection pin is formed into a wire in the shape of an electric wire cord and wound on a reel, and cut into a suitable size.
It was processed into a desired shape with a laser whose output could be adjusted.

[0009]

Industrial Applicability The present invention improves the difficulty in quality control of minute and enormous numbers of conductor pins, the increase in the number of man-hours for mounting to a package, and the difficulty in mounting the package on a printed wiring board. However, there is a remarkable effect that the size and the degree of integration of the mounted electronic components can be increased, and the size and the degree of integration of the package can be increased by the multi-chip.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a package that is an embodiment of the present invention.

FIG. 2 is a top view, a side view, and a bottom view of an external connection pin used in an example of the present invention.

Claims (1)

[Claims] 1. A package in which an electronic component is mounted and which is surface-mounted on a printed wiring board via an external connection pin, wherein the external connection pin is connected to an outer end portion of a lead electrically connected to the electronic component. Is a flexible pin having a plurality of core conductors insulated from each other.