JPH06132434A - Fan-mounted semiconductor device - Google Patents

Abstract

PURPOSE:To air-cool a semiconductor device by a fan with good efficiency and to easily replace the fan. CONSTITUTION:A metal sheet 2 is mounted on a semiconductor package 1, and a metal column 3 is mounted on it. In addition, an axial-flow fan 4 is mounted on the metal column 3. The axial-flow fan is composed of a wing part 5, a shaft part 6, a board 7, for fan use, which is used also as a bearing part and which is formed of an insulating material, a ring-shaped metal case 8, a pedestal part 9 for the metal case, and a connection part 10 which connects the pedestal part 9 to the case 8. Electric power is supplied to the fan by one pair of lead wires. The metal column 3 has a structure which is fitted to the pedestal part 9, and it can be attached and detached easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fan-mounted semiconductor device, and more particularly to a fan-mounted semiconductor device suitable for cooling a semiconductor device which requires air cooling during operation.

[0002]

2. Description of the Related Art In order to promote an increase in heat generation density of a semiconductor device, a reduction in thermal resistance of the semiconductor device is being promoted. For example, measures are taken such that a part of the tab on which the semiconductor element is mounted is exposed to the outside similarly to the outer lead, or the surface of the tab on which the semiconductor element is not mounted is exposed to the outside. The allowable heat generation density of the resin-sealed semiconductor device having such a heat dissipation structure is 0.2 W / cm under natural convection cooling.
It is about ² .

However, under forced convection cooling with a wind speed of 5.0 m / s, the allowable heat generation density improves to 0.5 W / cm ² . As described above, since the allowable heat generation density can be increased by air cooling, various electronic devices equipped with a semiconductor device are provided with an air cooling system for cooling.

However, the provision of the air cooling system has hindered the miniaturization of electronic devices. Therefore, there is a method of locally cooling by focusing on a semiconductor device that needs cooling.
It is disclosed in Japanese Patent No. 83958 and the like. Further, as in the individual chip cooling device described in Japanese Patent Laid-Open No. 2-83958, a method is known in which a small fan driven by ultrasonic waves is provided in the vicinity of the chip to individually cool the chip.

Further, as a conventional technique using a fan, the technique described in JP-A-2-196454 and JP-A-62-4
There is a technique described in Japanese Patent Publication No. 9700.

[0006]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the prior art typified by the description of the publication, a fan is mounted on the upper surface of the semiconductor device while being supported at four corners in individual cooling of the semiconductor device. However, in this conventional technique, the heat transfer path is not directly above the heat generating portion such as the semiconductor element but around the module, so that not only the heat is not efficiently transferred to the fan case, but also directly below the hub of the fan and the semiconductor device. A stagnant region of the air flow is formed between them, and heat may be trapped in the central portion of the semiconductor device surface even though the temperature is highest.

Neither Japanese Patent Laid-Open No. 2-196454 nor Japanese Patent Laid-Open No. 62-49700 has examined the effective use of cooling air.

An object of the present invention is to provide a fan-mounted semiconductor device which can efficiently perform air cooling by a fan.

[0009]

The object of the invention is to provide the axial flow fan with its bearing portion (the bottom of the pedestal or the fan case. The bottom of the fan case may double as the pedestal) via a metal member. This is achieved by mounting the device in the center of the surface of the semiconductor device, and fan replacement in the event of a fan failure is achieved by providing a metal member with a fitting structure that can mechanically and electrically separate the fan. .

The fan-mounted semiconductor device of the present invention has a semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame. A package is formed by sealing the element and the connecting means, and
It is a combination of fans for cooling the package and is characterized by any of the following configurations.

In the present specification, the axial fan is
A hub serving as the center of the shaft, a blade body located around the hub, and a fan case surrounding the blade body are provided, and a pedestal for receiving the rotation of the hub or the shaft is provided. The fan case is further outside the pedestal. It may have a bottom, or it may be a pedestal and a fun case. Further, each contact of the metal pillar or metal plate, the pedestal, the hub and the fan case described below may be direct contact or indirect contact by interposing an adhesive or the like.

(1) A metal column comes into contact with the hottest portion of at least one surface of the package, and the axial fan is arranged at the other end of the metal column with the base of the axial fan or the bottom surface of the fan case. The fan case that covers the periphery of the fan is arranged with a gap from one surface of the package, and is more preferably connected to a metal column or a pedestal by a heat transfer member.

(2) The metal column comes into contact with the hottest portion of at least one surface of the package, and the axial fan is arranged at the other end of the metal column with the base of the axial fan or the bottom surface of the fan case. The horizontal cross section of the hub overlaps the hub projection area, and the overlapping area occupies the hub projection area even if the metal column is located in the hub projection outside area on the package surface facing the hub. The total horizontal cross-sectional area of the metal columns in the non-projection area is larger than the proportion in the hub non-projection area.

That is, the ratio of the total horizontal cross-sectional area of the metal columns to the area of the package directly below the hub is mounted on the package other than directly below the hub, occupying the area of the package excluding directly below the hub. It is larger than the ratio of the total horizontal cross-sectional area of fins (metal columns).

Of course, the metal column is not limited to the one that is in contact with the base of the pedestal or the bottom surface of the fan case and does not need to exist outside the hub, and a plurality of metal columns are provided both inside and outside the region of the hub. Is also good.

(3) The metal column comes into contact with the hottest part of at least one surface of the package, and the pedestal of the axial fan or the bottom of the fan case is arranged at the other end of the metal column to dispose the axial fan, and the package upper surface. Further, a power supply means such as an electrode for supplying power to the axial fan is provided. Alternatively, an axial fan is mounted on the upper part of the package, and power is supplied to the axial fan via the lead frame.

In this case, the electrode is connected to the substrate through a lead wire or is connected to the substrate through a lead wire and a lead frame, and the substrate supplies power to the axial fan. Is effective. The electrodes may be concave or convex.

(4) The metal column comes into contact with the hottest portion of at least one surface of the package, and the axial fan is arranged at the other end of the metal column with the base of the axial fan or the bottom surface of the fan case. The fan case that covers the periphery of the fan is arranged with a gap from one surface of the package and is connected to the metal column or the pedestal by a heat transfer member, and the horizontal cross section of the metal column exists in the hub projection area. Even if the metal column is located in the non-projected area of the hub on the package surface facing the hub, the area should be larger than the total horizontal cross-sectional area of the metal column occupying the non-projected area, and the axial fan should be placed on the upper surface of the package. Means for supplying power to

(5) A metal plate is provided on at least one surface of the package where the temperature becomes the highest, and an axial fan is mounted on the metal plate. In this case, it is effective that the metal plate is provided with fins, and it is preferable that the fins are arranged along a circumference centered on the rotation axis of the fan or arranged in a spiral shape.

The metal plate may be embedded in the package, in which case it is desirable that the semiconductor element is bonded to the metal plate.

(6) An axial fan is mounted on the upper part of the package, and the distance between the lower end of the blade of the axial fan or the lower end of the fan case and the upper surface of the package is set to 2 to 5 mm. Alternatively, (5) the axial fan is mounted on the upper part of the package via a metal plate, and the distance between the lower end of the blade of the axial fan and the metal plate is in the range of 2 to 5 mm.

(6) In any one of (1) to (5), the casing of the axial flow fan is made of metal. It is also effective that the casing is provided with fins.

(7) In any one of (1) to (6), the axial fan is detachably provided on the metal column or the metal plate. The attachment / detachment mechanism may be screwed or plugged in, and is not mechanically limited. Incidentally, it is convenient to attach / detach along with electrical separation and connection.

(8) In any one of (1) to (7), the board is mounted. In this case, the substrate power supply is preferably 5V or 3.3V.

(9) In any one of (1) to (7), when the temperature of the semiconductor element exceeds 125 ° C., the power supply to the semiconductor element is stopped.

(10) The metal column comes into contact with the hottest portion of at least one surface of the package, and the pedestal of the axial fan or the bottom surface of the fan case is arranged at the other end of the metal column to dispose the axial fan. When the temperature reaches 125 ° C. or higher, the power supply to the semiconductor element is stopped.

(11) In any one of (1) to (7), the fan motor is rotated or stopped in response to the temperature of the semiconductor element.

(12) The metal column comes into contact with the hottest part of at least one surface of the package, and the pedestal of the axial fan or the bottom of the fan case is arranged at the other end of the metal column to dispose the axial fan. The fan motor rotates or stops in response to the temperature.

(13) Resin is preferably used as the sealing material.

The semiconductor device of the present invention is characterized in that a metal column having an axial fan attachment / detachment portion formed on the surface of a package containing a semiconductor element is arranged. The axial fan of the present invention includes the semiconductor element. The pedestal or the fan case is provided with a mechanism for attaching to and detaching from the built-in package, the motor is built in, and the fan case is cylindrical.

A method of using the semiconductor device of the present invention is a method of cooling the surface of a package containing a semiconductor element with an axial fan, and when the temperature of the semiconductor element reaches 125 ° C. or higher, the semiconductor element is exposed to the semiconductor element. It is characterized in that the power supply is stopped, or the motor of the fan is rotated or stopped in response to the temperature of the semiconductor element.

The electronic equipment of the present invention comprises a plate-shaped component, which is formed by mounting a plurality of packages having semiconductor elements mounted on a substrate, in a housing, and a package selected from the packages is selected. An axial fan with a built-in motor is mounted only on the upper surface of the package, and a gap is formed between the lower end of the axial fan and the upper surface of the package, which can be used for a workstation or the like.

The method of cooling a semiconductor device of the present invention is a method of cooling the surface of a package containing a semiconductor element with an axial flow fan, in which the heat generated in the chip is transferred from the top surface of the package to a metal column. The heat is transferred to the pedestal or the bottom of the fan case of the axial fan via the heat transfer member from the range of the metal column or the pedestal or the bottom of the fan case to the fan case of the axial fan. The cooling air flow descends on the air flow path formed between the hub and the hub and hits the upper surface of the package. The air flow hitting the upper surface of the package is the gap between the lower end of the axial fan and the upper surface of the package. It is characterized by going out from.

The axial fan according to the present invention has a pedestal or a fan case with a mechanism for attaching and detaching a package containing a semiconductor element to a pedestal or a fan case. The motor has a built-in fan case and is preferably made of metal. Is characterized in that.

[0035]

In the present invention, since the axial fan is mounted on the pedestal through the metal member in the high temperature region such as the central portion of the surface of the semiconductor device, the heat generated in the semiconductor package is spread by the heat conduction of the metal member. , Forced convection heat transfer from the entire surface of the semiconductor package to the air flow. Therefore, efficient cooling is performed.

When the fitting structure is provided on the metal member, no adhesive is required for connecting the fan, and the fan can be easily attached and detached.

[0037]

1 shows the structure of a fan-mounted semiconductor device according to a first embodiment of the present invention. The semiconductor package 1 includes a lead frame and a semiconductor element (not shown) inside. The metal plate 2 is mounted on the semiconductor package 1, and the metal columns 3 are mounted thereon. Further, the axial flow fan 4 has a bearing portion 7.
Is mounted on the metal pillar 3.

The axial fan 4 includes the blade portion 5, the shaft portion 6, and the hub 4.
1, a fan drive board 7 made of an insulating material that also serves as a bearing,
It comprises a ring-shaped metal fan case 8, a pedestal portion 9 of the metal case, and a connecting portion 10 connecting the pedestal portion 9 and the fan case 8. Electric power is supplied to the fan driving board 7 through a pair of lead wires 79. Further, the metal columns 3, the pedestal portion 9, and the driving substrate 7 are limited in size so as not to hinder the air blow by the blade portion 5.

The heat generated from the upper surface of the semiconductor package 1 is
The fan case 8 through the metal pillar 3, the pedestal portion 9 and the connecting portion 10.
(A shown by a thick black line in the figure). The cooling air flow B descends while flowing between the hub 41 and the fan case 8.
It reaches the upper surface of the package 1, and flows out from the lower end of the fan case 8 to the outside along the upper surface of the package 1. Further, heat is generated by forced convection cooling from the side surface of the metal column 3 and the inside of the fan casing 8 (thin arrow in the figure), and a high cooling effect is obtained.

Further, in the first embodiment, since the axial fan contacts the central portion of the semiconductor device through the metal member, heat is transferred from the central portion having the highest temperature on the surface of the semiconductor device to the package surface. Forced air cooling can be expected due to the air flow from the fan that spreads over the entire surface and collides with the surface of the metal member.

FIG. 2 shows a schematic cross section of the power supply path of the fan-mounted semiconductor device according to the second embodiment. Electric power for driving the axial fan 4 is generated by the substrate 11 on which the semiconductor package 1 is mounted.
Supplied by. The substrate 11 is made of a material such as glass epoxy and is a substrate for single-sided or double-sided mounting.
The substrate power supply is 5V or 3.3V.

FIG. 2 shows an example in which a pair of electrodes are coaxially arranged. First, the electric current passing through the center of the coaxial electrode is generated by the outer lead 12 of the package 1 and the metal plate 2 from the substrate 11.
From the conductive portion 13a of the coated lead wire 13 and the conductive portion 13b at the opposite end disposed above, the projection 15 for fitting into the hole (hole portion) 14 of the metal column 3, the pedestal 9, and the bearing portion 7 The lead is transmitted from the conductive portion 16a of the coated lead wire 16 embedded between the fan and the drive substrate 7 of the fan from the conductive portion 16b at the opposite end.
Is supplied to.

The current passing through the outside of the coaxial electrode is applied from the substrate 11, the outer lead 17 of the package to the wire 18,
The metal plate 2 and the protrusions 15 of the metal columns 3 are insulated from each other via the insulating layer 19, and the coaxial outer side 20 of the metal columns 3, the protrusions 15 and the conductive portions 16a of the lead wires are insulated from each other via the insulating layer 21. Conductive part 22 on the coaxial outer side of the pedestal 9 and the coated lead wire 2
3 through the conductive portion 23a and the opposite end conductive portion 23b, and is supplied to the fan drive substrate 7.

The conductive portion 13b of the lead wire is insulated from the metal plate 2 by the insulating layer 24.

Resin or ceramic is used as the sealing material of the package. The metal case of the fan is 0.5mm thick
It is made by punching and bending a copper plate of, and nickel plating is applied after this shape processing. In addition, the metal case of the fan may be press-molded after the thin-walled pipe is sliced.

FIG. 3 is a perspective view of the pedestal portion 9 of the fan-mounted semiconductor device shown in FIG. Conductive part 1 at the center of the coaxial electrode
5, the outer conductive portion 22 is formed via the insulating layer 21. In the coated lead wire 16 from the axial fan 4, the exposed portion 16a of the conductive portion is joined to the conductive portion 15 of the pedestal with solder or the like. In the coated lead wire 23, the exposed portion 23a of the conductive portion is joined to the outer conductive portion 22 by soldering or the like.

The pedestal portion 9 and the lead wire of the apparatus according to the example of FIG. 3 may be connected as shown in FIG. That is, the pedestal 9 is provided with a hole (through hole) 25 through which a lead wire passes, and the tip 16a of the lead is directly contacted with the conductive portion 13b of the covered lead wire 13 shown in FIG. In this case, the insulating portion 21 may be omitted.

The conductive portion of the pedestal 9 of the apparatus according to the example of FIG. 2 does not have to be coaxial as shown in FIG. That is, the two conductive parts 27 surrounded by the insulating layer 26 are used as a pair of electrodes, and the bipolar peripheral part 28 does not contribute to the supply of electric power.

The two coated lead wires 16 and 23 are connected to the conductive portion 27 of the pedestal 9 by soldering or the like at the stripped portions 16a and 23a.

The connection structure between the pedestal portion 9 in FIG. 5 and the lead wire from the axial fan 4 may be as shown in FIG. A through hole 25 is provided instead of the conductive portion 27, and the lead wire from the axial flow fan 4 penetrates through the covering portions 23 and 16 to directly receive electric power. In this case, the insulating layer 26 may be omitted.

The conductive portion of the pedestal portion 9 of FIG. 2 may be as shown in FIG. The pedestal portion 9 sandwiches the central insulating layer 29 and is divided into conductive portions 30 insulated from each other, and the conductive portions 23a and 16a of the lead wires are connected to the respective conductive portions by soldering or the like.

In the package having the structure shown in FIGS. 3 and 5, the power supply path from the substrate 11 to the conductive portion 16a of the lead wire may be any of those shown in FIGS.
In any case, the electric power to the axial fan 4 is transmitted from the substrate 11 through the outer lead 12, the coated lead wire 13, the protrusion 15 of the pedestal, and the conductive portion 16 at the tip of the coated lead wire 16.
is supplied to a.

In this case, in FIG. 8, the lead wire 13 passes through the guide hole 31 provided in the metal column 3 and reaches the protrusion 15 of the pedestal. An insulating layer 19 is provided inside the hole portion 14 of the metal column that houses the protrusion 15. In FIG. 9, the coated lead wire 13 is guided to the guide groove 32 provided in the metal plate 2, is arranged on the insulating layer 24, and has the conductive portion 1 at the tip thereof.
3b reaches the protrusion 15 of the pedestal. In FIG. 10, the coated lead wire 13 is arranged on the insulating layer 24 at the bottom of the guide groove 33 provided in the metal column 3, and the conductive portion 13b at the tip thereof reaches the protrusion 15 of the pedestal.

The power supply path of the package having the pedestal of the structure shown in FIGS. 4 and 6 is the projecting portion 15 of FIGS.
Corresponds to the case in which the coated lead wire 16 is extended to the lower part of the metal column by changing to a hole. In this case, the insulating layer 19 may be omitted.

In the package having the pedestal having the structure shown in FIGS. 3, 4 and 7, the power supply path from the substrate 11 to the conductive portion 23a of the coated lead wire may be any of those shown in FIGS.

In FIG. 11, the electric power to the axial fan 4 is supplied from the substrate 11 to the lead wire 23a through the outer lead 17, the coated lead wire 34, the metal column outer side 20 and the pedestal outer side 22. Incidentally, reference numerals 34a and 34b are conductive portions.

In the example of FIG. 12, the electric power to the axial fan 4 is supplied from the substrate 11 through the outer lead 17, the wire 18, the metal plate 2, the outer side of the metal column 20, the outer side of the pedestal 22, and the lead wire 2.
3a.

FIG. 13 shows a power supply path to the base 9 of the fan-mounted semiconductor device, the inside of the metal column 3 and the axial fan 4 according to the second embodiment.

A hole portion 36 is formed in the male screw portion 35 of the pedestal 9 of the fan case, and the coated lead wire 16 on one side of the pair of lead wires from the axial flow fan 4 travels through the groove portion 37 to the hole portion 36. It is passed.

The lead wire 16 is covered and the tip 1
In 6a, the conductive portion is exposed. The coated lead wire 13 is laid along the groove 32 via the insulating layer 24 on the metal plate 2 facing the hole 36. Lead wire 1
3 is covered and the conductive portion is exposed at the tip portion 13b. The male screw portion 35 of the metal column 3 is replaced with the female screw portion 39.
When the pedestal 9 and the metal column 3 are united with each other by screwing, the tip portion 16a of the coated lead wire comes into contact with the conductive portion 13b of the lead wire, and the electrical connection is simultaneously made.

The screw is formed so as to close in the rotation direction of the fan. The coated lead wire 13 is electrically connected to the lead 12 of the semiconductor package 1 at the opposite end 13a where the conductive portion is exposed.

The cover lead wire 23 of the axial fan 4 is connected to the pedestal 9 of the fan case. Therefore, when the pedestal 9 of the fan case is united with the metal column 3, the lead wire 23 passes through the fan case pedestal 9 and the metal column 3, and the metal plate 2
Electrically connected to.

The metal plate 2 is the outer side of the semiconductor package 1.
A wire 18 electrically connects to the lead 17.

In the example according to FIG. 13 of the second embodiment, a female screw may be formed on the base 9 of the fan case and a male screw may be formed on the metal column 3. 13, the pedestal 9 of the fan case is provided with the protrusion 15 as shown in FIG. 3 instead of the hole 36, and even if the protrusion 15 and the covering lead wire 13b are electrically connected. good.

Further, the metal column 3 and the pedestal 9 of the second embodiment may be constructed as shown in FIG. A plug 42 surrounded by an insulator 40 is formed on the fan case pedestal 9, and a small protrusion 80 is provided on the plug surface.
The lead wires 16 and 23 of the power supply supplied to the axial fan 4 are connected to the plug 42 through the groove portion 37.

The metal column 3 joined to the metal plate 2 has an outlet portion 43 which is united with the plug 42, and an insulator 81 is formed inside the outlet portion 43.

When the plug 42 is inserted into the outlet portion 43, a pressing force is generated by the projection 80, and the plug is fitted so as not to come out easily. An insulating layer 24 is formed between the metal plate 2 and the insulator 81, and one end of the coated lead wire 13 is arranged on the insulating layer 24 through the groove 32.

The conductive portions are exposed at the end portions 13a and 13b of the covered lead wire 13, and the lead wire conductive portion 13b is provided.
Is electrically connected to the plug 42, and the lead wire conductive portion 13a is electrically connected to the outer lead 12 of the package.

In the example of FIG. 14, the socket portion 43 may be formed on the base 9 of the fan case and the plug 42 may be formed on the metal column 3. Further, in the example of FIG. 14, the electrodes may be provided not on one metal pillar but on divided metal pillars.

The metal column 3 and the pedestal 9 of the second embodiment may be constructed as shown in FIG. That is, the banana chip plug 43 surrounded by the insulator 26 is formed on the pedestal 9 of the fan case, and the lead wires 16 and 23 of the power supplied to the axial fan 4 are connected to the banana chip plug 43 through the groove portion 37. Has been done. The metal pillar 3 joined on the metal plate 2 has an outlet portion 44 which is combined with the banana chip plug 43, and the metal pillar 3 and the metal plate 2 are insulated from each other by an insulator 45.
Is insulated with.

Since the banana chip plug 43 has the gap 69, even if the diameter of the hole of the outlet portion 44 is smaller than the diameter of the plug, the banana chip plug 43 contracts when it is inserted to generate a pressing force, so that the banana chip plug 43 is fitted so as not to come out easily.

On the metal pillar 3, a covered lead wire 13 for connecting to the outer lead 12 of the package 1 is provided as an outlet portion 44.
A groove 33 that leads to the inside is formed.

In the example of FIG. 15, the socket portion 44 may be formed on the pedestal 9 of the fan case, and the banana chip plug 43 may be formed on the metal column 3. Further, the poles in the example of FIG. 15 may be provided not on one metal pillar but on divided metal pillars.

As a second embodiment, the metal pillar 3 and the pedestal 9 are
It may be configured as shown in FIG. That is,
First, the metal column 3 is joined to the metal plate 2 via the insulating film 24. The metal column 3 is composed of a pipe portion 46, a gap portion 47, a central convex portion 48, an insulating portion 49, a concave portion 50, an outer frame 51, and a lower lead wire guide groove 33 which are divided from the center.

The pedestal 9 of the fan case is the protrusion 5 at the center.
2, ring-shaped insulating protrusion 53 and ring-shaped conductive protrusion 5
4 and the lead wire guide groove 37. When the metal column 3 and the pedestal 9 are fitted together, the pipe portion 46 is opened a little and the protrusion is tightened, which makes it difficult to pull out.

One of the electrodes is connected to the outer lead 12 of the package 1 from the coated lead wire 16 along the guide groove 37, the projection 52, the pipe portion 46, and the lead wire 13.

The other electrode is connected to the outer lead 17 from the lead wire 23 via the ring-shaped conductive portion 54, the outer frame 51 of the metal column, the metal plate 2 and the wire 18.

In the apparatus shown in FIG. 16 of the second embodiment,
Instead of providing the guide groove 33 in the metal column 3, the guide groove 32 may be provided in the metal plate as shown in FIG. Also, FIG.
In the fitting structure of No. 6, the structure of the pedestal and the metal column may be reversed.

As a second embodiment, the pedestal 9 of the metal fan case and the metal column 3 may have the fitting structure shown in FIGS. 17 to 24. 17 to 24, only the fitting structure is focused on, and the electrical connection structure is omitted at all.
In the example of FIG. 17, the pedestal 9 of the metal fan case has a shape in which the cup is turned down, and the protrusions 5 are formed along the circumference inside the edge.
5 are continuously provided.

Outside the metal column 3, one or more protrusions 56 are provided.
Is provided. FIG. 18 shows the dimensions of the device of FIG. When the inner diameter of the protrusion of the pedestal 9 is a1, the other inner diameter is a2, the outer diameter of the protrusion 56 of the metal column 3 is b1, and the other outer diameters are b2, the following relationships are respectively established.

B2 ≦ a1 <b1 ≦ a2 Therefore, the pedestal 5 and the metal column 3 are fitted so that the projecting portion 55 is caught by the projecting portion 56 and does not come off easily.

FIG. 17 shows the structure of a metal column without electrodes, and the electrical connection structure is shown in FIGS.
It may be either. In the example of FIG. 17, the structures of the fan case pedestal 9 and the metal columns 3 may be reversed.

In the example of FIG. 17, one or more protrusions 55 may be formed and the protrusions 56 may be continuously formed along the circumference. In addition, in the example of FIG. 17, the protrusion 55
Also, both of the protrusions 56 may be continuously formed along the circumference.

In the example of FIG. 19, a part 57 of a ring having a half circumference or more is connected to the metal fan case pedestal 9 by an arm 58. A concave portion 59 is provided inside the ring portion 57, and a convex portion 60 is provided on the metal column 3.

The dimensions of the device of FIG. 19 are shown in FIG. The diameter of the metal column 3 is a1, and the inner diameter of the ring 57 is b1. Further, assuming that the distance between the concave portions of the ring is b2 and the distance between the convex portions of the metal column is a2, the following relationships are established.

A1≈b1 <a2≈b2 When the pedestal 9 is slid from the side of the metal column 3 or slid from above, the concave portion 59 and the convex portion 60 fit together.

In the example of FIG. 19, the convex portion 59 may be provided inside the ring portion 57, and the concave portion 60 may be provided in the metal column 3. In addition, the example shown in FIG. 19 is a structure of a metal column without electrodes, and the electrical connection structure is shown in FIG.
To any of FIG. Moreover, an electrical connection portion may be provided on the side surface of the metal column.

In FIG. 21, the base 9 of the metal fan case has a convex portion 61, and the convex portion 61 is provided with a constricted portion 62. The metal column is provided with a concave portion 63 at a position corresponding to the convex portion 61 of the pedestal, and a stopper plate 64 for catching the constricted portion 62.

FIG. 22 shows the dimensions of the apparatus shown in FIG. The width of the constricted portion 62 is a1, the maximum diameter of the convex portion 61 is a2, and the stopper plate 6
When the interval of 4 is b1 and the diameter of the concave portion 63 is b2, the following relationship is established.

B2>a2>b1> a1 In the example of FIG. 21, the concave portion 63 may be attached to the pedestal 9 and the convex portion 61 may be attached to the metal column 3. Further, FIG. 21 shows a structure of a metal column in which electrodes are omitted, and the electrical connection structure may be any of FIGS. 3 to 12. Further, it does not matter if the electric connection portion is provided on the side surface of the metal column.

In the example of FIG. 23, the base 9 of the metal fan case
Has a cup-like shape and is provided with a notch 65. The metal column 3 has a columnar shape.

FIG. 24 shows the device dimensions of FIG. Let the upper inner diameter of the fan case pedestal be a and the lower inner diameter be b. If the upper diameter of the metal column is c and the lower diameter is d, these dimensions have the following relationship.

A <c <b ≦ d In the second embodiment, the power supply to the axial fan is performed from the substrate via the leads of the semiconductor device. Therefore, the power supply to the fan can be provided only by mounting the fan-mounted semiconductor device on the substrate. The road can be secured. Further, since the attachment / detachment structure and the power supply path are provided on the metal member on which the fan is mounted, electrical connection can be made at the same time as mechanical attachment / detachment of the fan, and the fan can be easily replaced.

Furthermore, a sensor for detecting the temperature of the semiconductor element is provided, and when the temperature of the semiconductor element becomes 125 ° C. or higher due to a fan stop during operation of the semiconductor device, power is supplied to the semiconductor device. A function of stopping may be provided.
Further, the fan may be turned on and off in response to the temperature of the semiconductor element.

As a third embodiment, in a fan-mounted semiconductor device, when the fan is supported by the support rod 66 by the metal case portion 8, the distance a between the blade lower end of the fan and the semiconductor device 1 is 2 as shown in FIG. A range of 5 mm is desirable.

The reason for this will be described with reference to FIG. Figure 4
2 shows an example of the thermal resistance measurement result of the fan-mounted semiconductor device. According to FIG. 42, when the distance from the lower end of the fan case is 1 mm, the thermal resistance is as large as 13.5 ° C./W, but when it is 2 mm or more, the thermal resistance drops sharply. This is because if a is small, the flow path resistance is large, and the performance of the fan cannot be sufficiently exhibited. Further, when a is 5 to 9 mm, the thermal resistance does not change. This is because the influence of flow path resistance is reduced.

Since the electronic device adopting local cooling is small, it is desirable that the semiconductor device is as small as possible. Therefore, it is desirable that a is 2 to 5 mm from the result of experiment. Also,
Even when the bearing is supported by a metal column, the distance a between the lower end of the fan case and the semiconductor device 1 is 2 to 5 mm as shown in FIG.
It is desirable that the range is.

In the example of FIG. 26, when a metal plate is provided on the semiconductor device 1, the distance a between the lower end of the fan casing and the metal plate is preferably in the range of 2 to 5 mm. In the third embodiment, the distance between the lower end of the fan case and the upper surface of the package is 2
Since it is set to 5 mm, the cooling effect by the fan can be sufficiently obtained and a compact fan-mounted semiconductor device can be obtained.

As a fourth embodiment, as shown in FIG. 27, fins (metal columns, etc.) 67 are attached to the metal plate 2 of the fan-mounted semiconductor device.
May be provided.

The arrangement of the fins 67 shown in FIG. 27 is shown in FIG.
Alternatively, a plurality of columnar fins 67 may be mounted concentrically as shown in FIG. When the fin height is l, the fin thickness is a, and the space between adjacent fins is b, the fin dimensions are preferably in the following relationship. 2 mm≤l≤5 mm, and a≤b This is because the distance cannot be larger than the distance between the lower end of the fan case and the surface of the semiconductor device shown in FIGS.

In FIG. 28, the fins 67 may be arranged in a spiral pattern, a lattice pattern, or a staggered pattern. Further, the fin may be a prism or a cone.

In FIG. 27, the metal plate 2 may be one in which continuous fins 67 are spirally mounted as shown in FIG. At this time, if the fin height is 1, the fin width is w, the fin thickness is t, the spacing between adjacent fins is b1, and the distance between facing fins is b2, the fin dimensions have the following relationship. desirable.

2 mm ≦ l ≦ 5 mm, b1 ≧ w, and b2
≧ t In FIG. 29, continuous fins may be mounted in a rectangular array.

Further, in the example of FIG. 27, continuous rectangular wave incisions may be spirally formed in the metal plate 2, and the rectangular incision may be raised to provide the fin 67 having the shape shown in FIG. In this case, a rectangular drop 68 occurs in the metal plate 2. In addition, in FIG. 30, the fins may not be cut out continuously. Further, in the example of FIG. 30, the fins may be triangular.

In the example of FIG. 27, as shown in FIG. 31, a coil made of a metal wire may be annularly mounted on the metal plate 2 as the fin 67. When the height of the coil is 1, the thickness of the metal wire is t, and the spacing between the coils is b, the fin dimensions are preferably in the following relationship.

2 mm ≦ l ≦ 5 mm, and b ≧ t In the example of FIG. 31, the shape of the coil may be elliptical. Further, in the example of FIG. 31, the shape of the coil may be a half-moon shape whose bottom surface is flat, or a rectangular shape. Further, in the example of FIG. 31, the coil shape is not uniform, for example, the length of a may be maximum at the four corners and minimum at the center of each side according to the open surface shape of the metal plate. .

In the fourth embodiment, since the metal plate is provided with the fins, the cooling effect under the forced air cooling becomes large. Further, since the mounting directions of the fins are arranged in a circle around the rotation axis of the fan or on a spiral, efficient cooling is performed by the air flow around the rotation axis of the fan.

Further, in FIGS. 29 to 31, the fins can be continuously formed and mounted, so that the cost is low.

As a fifth embodiment, in a fan-mounted semiconductor device, fins 70 may be provided on the metal case 8 of the fan as shown in FIG.

In the fifth embodiment, since metal is used for the case of the axial flow fan, the heat absorbed by the metal column is transferred to the metal case, and the forced air cooling effect by the air flow from the fan colliding with the case can be expected.

As a sixth embodiment, in a fan-mounted semiconductor device, as shown in FIG. 33, the metal plate 2 may be integrated with the metal pillar 3 and embedded in the package, and the semiconductor element 71 may be bonded. In this example, the metal plate 2 and the metal column 3 do not have to be integrated. Further, in the example of FIG. 33, the semiconductor element 71 may not be bonded to the metal plate 2.

In the sixth embodiment, since the metal plate is embedded in the package, it is closer to the semiconductor element than it is externally attached to the package surface, so that the heat diffusion effect is large and the internal thermal resistance can be reduced. is there.

Further, since the semiconductor element is bonded to the embedded metal plate, the heat from the semiconductor element is directly received, so that the diffusion effect is large and the internal thermal resistance can be reduced. Reference numeral 72 is a wire.

As a seventh embodiment, as shown in FIG. 34, a metal plate 7 in which a metal column 2 and a metal plate 3 are integrally embedded.
It is also possible to introduce a power supply path for driving the fan from the inside of the package 3 and connect it to the inner lead 74 not connected to the electrode of the semiconductor element 71 with the wire 75. Reference numeral 76 is a signal inner lead.

An internal perspective view of FIG. 34 is shown in FIG. Figure 3
The manufacturing procedure of the semiconductor device having the structure shown in FIG. 5 is as follows. The semiconductor element 71 is mounted on the tab 77, the metal plate 73 having the structure shown in FIG. 7 is mounted on the back surface of the tab via the insulating layer 78, and each electrode on the semiconductor element 71 and the metal plate 73 are respectively connected to the wire 72. , 75 to connect to the inner leads 76, 74.

As a seventh embodiment, the semiconductor element 71 may be directly bonded to the metal plate 73 via the insulating layer 78 as shown in FIG. In this case, the signal inner leads 76 connected to the electrodes of the semiconductor element 71 are joined to the metal plate 73 via the insulating layer 82, and the power supply inner leads 74 to the fan are directly connected to the metal plate 73 by soldering or the like. Will be done.

An internal perspective view of FIG. 36 is shown in FIG. Figure 3
The manufacturing procedure of the semiconductor device having the structure shown in FIG. 7 is as follows. Insulating layers 82 and 78 are formed on the metal plate 73, the semiconductor element 71 and the lead frame are mounted, and the inner lead 74
Is directly soldered to the metal plate 73, and the electrode of the semiconductor element 71 and the signal inner lead 76 are connected by the wire 72.

As a seventh embodiment, FIG. 38 shows a case where a fan is mounted on a semiconductor device having a lead-on-chip structure and an inner lead is used for supplying power to the fan.

In the semiconductor device of the lead-on-chip structure,
The signal inner lead 76 extends to the central portion of the semiconductor element 71, is joined to the semiconductor element 71 via the insulating layer 84, and is connected to the electrode provided in the central portion of the element by the wire 72. Similarly to the signal inner lead 76, the power supply inner lead 74 is extended to the central portion, and the insulating layer 84 is formed.
It is joined to the semiconductor element 71 via. Metal plate 73
An arm 83 that reaches the inner lead 74 for power supply is locally provided in the electric power source for electrical connection.

An internal perspective view of FIG. 38 is shown in FIG. Figure 3
The manufacturing procedure of the semiconductor device having the structure shown in FIG. 9 is as follows. The semiconductor element 71 is mounted on the metal plate 73 via the insulating layer 78 to form the insulating layer 84. The inner leads are mounted on the semiconductor device via the insulating layer 84. At this time, the inner leads 74 contacting the arms 83 of the metal plate 73 are for power supply. The arm 83 and the inner lead 74 are connected by soldering or the like. The signal inner lead 76 is connected to the semiconductor element 71.
The wire 72 is connected to the electrode.

The metal plate used in FIGS. 34 to 39 of the seventh embodiment may have a structure in which the outer contour of the metal column 3 does not serve as a power supply path as shown in FIGS. 40 and 41. Figure 40
The metal plate 2 and the metal column 3 shown in FIG. 2 receive the electrodes of the pedestal 9 having the structure shown in FIGS.
With two holes. Groove 3 from the hole to the outside of metal column 3
3 is formed, the lead wire 85 is guided, folded back at the end of the metal plate 2, and extended to the back surface.

The metal plate 2 and the metal column 3 having the structure shown in FIG.
Also, it has two holes having an insulating layer 19 inside, which receives the electrodes of the pedestal 9 having the structure shown in FIGS. 5 and 6, and further extends to the metal plate 2. The lead wire 86 is led from the back surface of the metal plate to the holes.

In the seventh embodiment, since power is supplied to the fan through the inner leads, it is not necessary to wire the outer leads to the upper surface of the package.

Although each of the embodiments described above relates to a plastic package, the present invention is not limited to this, but can be applied to a ceramic package and a can type package. In addition, each of the embodiments described above describes the case where one axial fan is mounted on one surface side of the package or the substrate, but the present invention is not limited to this.
For example, an axial fan may be provided on both front and back surfaces of one package, and it is effective to provide a plurality of fans on one surface.

[0125]

Since the present invention is configured as described above, it has the following effects.

When the axial fan is in contact with the central portion of the semiconductor device through the metal member, heat spreads from the central portion of the surface of the semiconductor device having the highest temperature due to heat conduction, and the fan collides with the surface of the metal member. Forced air cooling can be expected due to the air flow.

When power is supplied to the axial fan from the substrate via the leads of the semiconductor device, the fan-mounted semiconductor device can be handled in the same manner as a conventional semiconductor device when mounted on the substrate. ◆
If an electrode for supplying power is provided on the upper surface of the package, it is possible to make electrical connection on the upper surface of the package.

If the mounting / detaching structure and the power supply path are provided on the metal member on which the fan is mounted, the fan can be mechanically attached / detached and electrically connected at the same time, and the fan can be easily replaced. ◆ By setting the distance between the bottom of the fan case and the top of the package to 2 to 5 mm, the cooling effect of the fan can be sufficiently obtained and a compact fan-mounted semiconductor device can be obtained.

If the metal plate is provided with fins, the cooling effect under forced air cooling becomes large. ◆ If the fins are installed in a circle or spiral around the fan rotation axis, efficient cooling is achieved by the airflow around the fan rotation axis.

An example in which fins can be continuously formed and mounted is as follows:
It is cheap. ◆ When metal is used for the axial fan case, the heat absorbed by the metal columns is transferred to the metal case, and the forced air cooling effect due to the air flow from the fan colliding with the case can be expected.

When the metal plate is embedded in the package, it is closer to the semiconductor element than when it is externally attached to the surface of the package, so that the heat diffusion effect is large and the internal thermal resistance can be reduced. ◆ When the semiconductor element is bonded to the embedded metal plate, heat from the semiconductor element can be directly received, so that the diffusion effect is large and the internal thermal resistance can be reduced. ◆ If power is supplied to the fan via the inner leads, it is not necessary to wire the outer leads to the upper surface of the package.

At present, a microprocessor for high speed processing,
All semiconductor elements such as gate arrays and microcomputers that generate a few watts of heat are housed in a ceramic PGA package with external fins, which is expensive, and requires a cooling system. However, by using the present invention, such a semiconductor element having a large heat generation amount can be housed in a plastic package, and an inexpensive product can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a fan-mounted semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a sectional view illustrating a power supply path of a fan-mounted semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a perspective view of a connecting portion of a lead wire in the case where an electrode is provided at the center of the pedestal and the outer portion according to the second embodiment of the present invention.

FIG. 4 is a perspective view of a connecting portion of a lead wire when a hole is provided at the center of a pedestal and an electrode is provided at an outer portion according to a second embodiment of the present invention.

FIG. 5 is a perspective view of a connecting portion with a lead wire when there is a pair of electrodes in the center of the pedestal according to the second embodiment of the present invention.

FIG. 6 is a perspective view of a connecting portion with a lead wire when there is a pair of holes in the center of the pedestal according to the second embodiment of the present invention.

FIG. 7 is a perspective view of a connecting portion with a lead wire when the pedestal according to the second embodiment of the present invention is divided into two poles.

FIG. 8 is a cross-sectional view illustrating a power supply path when a hole for guiding a lead wire is provided in a metal column according to a second embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating a power supply path when a groove for guiding a lead wire is provided in a metal plate according to a second embodiment of the present invention.

FIG. 10 is a cross-sectional view illustrating an electric power supply path when a groove for guiding a lead wire is provided in a metal pillar according to a second embodiment of the present invention.

FIG. 11 is a cross-sectional view illustrating a power supply path when a lead wire is used to connect to a package lead from the outer shape of a metal pillar according to a second embodiment of the present invention.

FIG. 12 is a cross-sectional view illustrating a power supply path in the case where a wire is connected to the package lead from the outer shape of the metal pillar according to the second embodiment of the present invention.

FIG. 13 is a perspective view of a fitting structure and a power supply path of a fan-mounted semiconductor device having a pedestal having a screw-type fitting structure and a metal column according to a second embodiment of the present invention.

FIG. 14 is a perspective view of a fitting structure and a power supply path of a fan-mounted semiconductor device having a pedestal having a plug-type fitting structure and a metal column according to a second embodiment of the present invention.

FIG. 15 is a perspective view of a fitting structure and a power supply path of a fan-mounted semiconductor device having a pedestal having a banana chip plug-type fitting structure and a metal column according to a second embodiment of the present invention.

FIG. 16 is a perspective view of a fitting structure and a power supply path of a fan-mounted semiconductor device having a pedestal having a coaxial plug type fitting structure and a metal column according to a second embodiment of the present invention.

FIG. 17 is a perspective view illustrating a cap-type fitting portion structure of a pedestal and a metal column according to a second embodiment of the present invention.

FIG. 18 is a dimensional drawing of a cap-type fitting structure for a pedestal and a metal column according to the second embodiment of the present invention.

FIG. 19 is a perspective view illustrating a slide-type fitting structure of a pedestal and a metal column according to a second embodiment of the present invention.

FIG. 20 is a dimensional drawing of a slide-type fitting structure for a pedestal and a metal column according to the second embodiment of the present invention.

FIG. 21 is a perspective view illustrating a hook-type fitting structure for a pedestal and a metal column according to a second embodiment of the present invention.

FIG. 22 is a dimensional instruction diagram of a hook-type fitting structure for a pedestal and a metal column according to the second embodiment of the present invention.

FIG. 23 is a perspective view illustrating a cap-type fitting structure for a pedestal and a metal column according to a second embodiment of the present invention.

FIG. 24 is a dimensional drawing of a cap-type fitting structure for a pedestal and a metal column according to the second embodiment of the present invention.

FIG. 25 is a view showing the gap between the lower end of the fan and the upper surface of the semiconductor device according to the third embodiment of the present invention.

FIG. 26 is a view showing the distance between the lower end of the fan case and the upper surface of the semiconductor device when there is a metal column according to the third embodiment of the present invention.

FIG. 27 is a cross-sectional view of a fan-mounted semiconductor device in which fins are provided on a metal plate according to the fourth embodiment of the present invention.

FIG. 28 is a perspective view of a metal plate provided with fins arranged concentrically according to a fourth embodiment of the present invention.

FIG. 29 is a perspective view of a metal plate in which continuous rectangular fins are spirally arranged according to a fourth embodiment of the present invention.

FIG. 30 is a perspective view of a metal plate having rectangular fins formed by spirally cutting rectangular cutouts according to a fourth embodiment of the present invention.

FIG. 31 is a perspective view of a metal plate provided with an annular coil fin according to a fourth embodiment of the present invention.

FIG. 32 is a cross-sectional view of a fan-mounted semiconductor device when fins are provided on the fan case according to the fifth exemplary embodiment of the present invention.

FIG. 33 is a cross-sectional view of a fan-mounted semiconductor device when a metal plate according to a sixth embodiment of the present invention is embedded.

34 is a cross-sectional view of a fan-mounted semiconductor device when a metal plate is embedded in a semiconductor device having tabs and an inner lead is used as a power supply path according to a seventh embodiment of the present invention. FIG.

FIG. 35 is a perspective view of an internal structure of a fan-mounted semiconductor device when a metal plate is embedded in a tabbed semiconductor device according to a seventh embodiment of the present invention and an inner lead is used as a power supply path.

FIG. 36 is a cross-sectional view of a fan-mounted semiconductor device when a metal plate is embedded in a tabless semiconductor device according to a seventh embodiment of the present invention and an inner lead is used as a power supply path.

FIG. 37 is a perspective view of an internal structure of a fan-mounted semiconductor device when a metal plate is embedded in a tabless semiconductor device according to a seventh embodiment of the present invention and an inner lead is used as a power supply path.

FIG. 38 is a cross-sectional view of a fan-mounted semiconductor device when a metal plate is embedded in a semiconductor device having a lead-on-chip structure and an inner lead is used as a power supply path according to a seventh embodiment of the present invention.

FIG. 39 is a perspective view of an internal structure of a fan-mounted semiconductor device when a metal plate is embedded in a semiconductor device having a lead-on-chip structure and an inner lead is used as a power supply path according to a seventh embodiment of the present invention.

FIG. 40 is a perspective view of a metal column having holes for receiving a pair of electrodes and a metal plate according to a seventh embodiment of the present invention.

FIG. 41 is a perspective view of a metal column and a metal plate having holes for receiving a pair of electrodes according to the seventh embodiment of the present invention.

FIG. 42 is a characteristic diagram showing the thermal resistance measurement results of the fan-mounted semiconductor device according to the third embodiment of the present invention.

[Explanation of symbols]

1 ... Semiconductor package, 2 ... Metal plate, 3 ... Metal column, 4 ...
Axial flow fan, 5 ... Fan blade part, 6 ... Fan shaft part, 7 ... Fan drive board, 8 ... Fan case, 9 ... Fan case pedestal part, 10 ... Connection part, 11 ... Board, 12, 17 ... Outer leads , 13, 16, 23, 34 ... Coated lead wire,
13a, 13b, 16a, 16b, 23a, 23b, 3
4a, 34b ... Conductive portion, 14 ... Hole (hole portion), 52, 5
5, 56, 80 ... Protrusions, 18, 72, 75 ... Wires,
19, 21, 24, 26, 78, 82, 84 ... Insulating layer,
20, 22 ... Outside of coaxial electrode, 25 ... Hole (through hole), 1
5, 27 ... Conductive part of pedestal, 28 ... Peripheral part of bipolar, 29 ...
Insulating layer of pedestal, 30 ... Conductive parts insulated from each other, 31 ...
Guide hole of metal column, 32 ... Guide groove of metal plate, 33 ... Guide groove of metal column, 35 ... Male screw part, 36 ... Hollow part, 37
... Groove part of base, 39 ... Female thread part, 40, 45, 81 ... Insulator, 41 ... Hub, 42 ... Plug, 43 ... Banana tip plug, 44 ... Outlet part, 46 ... Pipe part, 47,
69 ... Gap part, 48 ... Central convex part, 49 ... Insulating part, 50 ...
Recesses, 51 ... Outer frame, 53 ... Ring-shaped insulating protrusions, 54 ...
Ring-shaped conductive protrusion, 57 ... Part of ring, 58, 83
... Arms, 59, 63 ... Recesses, 60, 61 ... Convex parts, 62 ... Constricted parts, 64 ... Stoppers, 65 ... Notches, 66 ... Support rods, 67, 70 ... Fins, 68 ... Pullouts, 73 ... Metal to be embedded Plates, 71 ... Semiconductor elements, 74 ... Driving power supply inner leads, 77 ... Tabs, 76 ... Signal inner leads, 79, 85, 86 ... Lead wires.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideaki Nagashima 502 Jinritsu-cho, Tsuchiura-shi, Ibaraki Machinery Research Institute, Hiritsu Seisakusho Co., Ltd. In the Semiconductor Design and Development Center (72) Inventor Kazuo Shimizu 111 Nishiyote-cho, Takasaki-shi, Gunma Hitachi Ltd. Semiconductor Design and Development Center

Claims (28)

[Claims] 1. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The axial fan is arranged at the other end of the metal column with the base of the axial fan or the bottom surface of the fan case, and the fan case covering the periphery of the axial fan is arranged with a gap from one surface of the package. Characteristic fan-mounted semiconductor device. 2. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The axial fan is arranged on the other end of the metal column with a base of the axial fan or the bottom surface of the fan case, and the fan case covering the periphery of the axial fan is arranged with a gap from one surface of the package and A fan-mounted semiconductor device, which is connected to a metal pillar or the pedestal by a heat transfer member. 3. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The pedestal of the axial fan or the bottom surface of the fan case is arranged on the other end of the metal column to dispose the axial fan, and the horizontal cross section of the metallic column is overlapped with the hub projection area. Even if a metal column is located in a region outside the hub projection on the package surface facing the hub, the percentage of the region occupies the area outside the projection. Fan mounting semiconductor device total horizontal cross-sectional area of the column is equal to or greater than the proportion of the hub projection area outside. 4. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The semiconductor is characterized in that the axial fan is arranged with the base of the axial fan or the bottom surface of the fan case at the other end of the metal column, and an electrode for supplying power to the axial fan is provided on the upper surface of the package. apparatus. 5. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The axial fan is arranged with the base of the axial fan or the bottom surface of the fan case at the other end of the metal column, the axial fan is mounted on the upper part of the package, and a power source is supplied to the axial fan via the lead frame. A fan-mounted semiconductor device characterized by being supplied. 6. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan that cools the package is combined, a metal column comes into contact with the hottest part of at least one surface of the package, The axial fan is arranged on the other end of the metal column with a base of the axial fan or the bottom surface of the fan case, and the fan case covering the periphery of the axial fan is arranged with a gap from one surface of the package and The metal column or the pedestal is connected to the pedestal by a heat transfer member, and the horizontal cross section of the metal column overlaps with the hub projection area, and the overlapping surface Occupy the hub projection area, even if the metal column is located in the hub projection outside area on the facing package surface of the hub, the total horizontal cross-sectional area of the metal pillar occupying the outside projection area is outside the hub projection area. A fan-mounted semiconductor device, characterized in that the power supply means for supplying power to the axial fan is arranged on the upper surface of the package so as to be larger than the area. 7. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connection means and a fan for cooling the package is combined, a metal plate is provided on at least one of the surfaces of the package where the temperature is the highest. A fan-mounted semiconductor device in which an axial fan is mounted on a metal plate. 8. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, a part of the lead frame, the semiconductor element and the lead frame. In a fan-mounted semiconductor device in which a package is formed by sealing the connecting means and a fan for cooling the package is combined, an axial fan is mounted on the upper part of the package,
A fan-mounted semiconductor device characterized in that a distance between a lower end of a blade or a lower end of a fan case of the axial fan and the upper surface of the package is in a range of 2 to 5 mm. 9. The fan-mounted semiconductor device according to claim 7, wherein the axial fan is mounted on the package upper part through the metal plate, and the blade lower end or fan case lower end of the axial fan and the metal plate. The fan-mounted semiconductor device is characterized in that the distance between the two is in the range of 2 to 5 mm. 10. The fan-mounted semiconductor device according to claim 1, wherein the casing of the axial fan is made of metal. 11. The fan-mounted semiconductor device according to claim 1, wherein the axial fan is detachably provided on the metal column or the metal plate. apparatus. 12. The fan-mounted semiconductor device according to claim 7, wherein the metal plate is provided with fins. 13. The fan-mounted semiconductor device according to claim 12, wherein the fins are arranged along a circumference around a rotation axis of the fan or arranged in a spiral shape. Semiconductor device. 14. The fan-mounted semiconductor device according to claim 10, wherein the casing is provided with fins. 15. The fan-mounted semiconductor device according to claim 7, wherein the metal plate is embedded in the package. 16. The fan-mounted semiconductor device according to claim 15, wherein the semiconductor element is bonded to the metal plate. 17. A fan-mounted semiconductor device according to claim 1, wherein the fan-mounted semiconductor device is mounted on a substrate. 18. The fan-mounted semiconductor device according to claim 17, wherein the substrate power source is 5V or 3.3V. 19. The fan-mounted semiconductor device according to claim 1, wherein the power supply to the semiconductor element is stopped when the temperature of the semiconductor element reaches 125 ° C. or higher. Semiconductor device. 20. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. A package is formed by sealing the connection means and the package.
In a fan-mounted semiconductor device in which a fan for cooling a fan is combined, a metal column comes into contact with the hottest portion of at least one surface of the package, and the other end of the metal column has a pedestal of an axial fan or a bottom surface of a fan case. And the axial fan is arranged so that the temperature of the semiconductor element is 125
A fan-mounted semiconductor device, characterized in that power supply to the semiconductor element is stopped when the temperature rises to or above ° C. 21. A method of using a semiconductor device in which the surface of a package containing a semiconductor element is cooled by an axial fan, and when the temperature of the semiconductor element reaches 125 ° C. or higher, power supply to the semiconductor element is stopped. A method of using a semiconductor device, comprising: 22. The fan-mounted semiconductor device according to claim 1, wherein a fan motor is rotated or stopped in response to a temperature of the semiconductor element. 23. A semiconductor element, a lead frame composed of an assembly of leads, and means for electrically connecting the semiconductor element and the lead frame, and a part of the lead frame, the semiconductor element and the lead frame. A package is formed by sealing the connection means and the package.
In a fan-mounted semiconductor device in which a fan for cooling a fan is combined, a metal column comes into contact with the hottest portion of at least one surface of the package, and the other end of the metal column has a pedestal of an axial fan or a bottom surface of a fan case. And a fan-equipped semiconductor device in which the motor of the fan is rotated or stopped in response to the temperature of the semiconductor element. 24. A method of using a semiconductor device, wherein a surface of a package containing a semiconductor element is cooled by an axial fan, wherein a fan motor rotates or stops in response to the temperature of the semiconductor element. Using the semiconductor device. 25. A plate-shaped component having a plurality of packages containing semiconductor elements mounted on a substrate is housed in a housing, and a package selected from among the packages is mounted on an upper surface of the package. An electronic device, comprising an axial fan having a built-in motor only, wherein a gap is formed between a lower end of the axial fan and an upper surface of the package. 26. In a method of cooling a semiconductor device, wherein a surface of a package containing a semiconductor element is cooled by an axial fan, heat generated in a chip is passed from the upper surface of the package through a metal column to the axial flow. The heat is transferred to the pedestal of the fan or the bottom of the fan case, and the heat is transferred to the fan case of the axial fan from the range of the metal pillar to the pedestal or the bottom of the fan case by the heat transfer member, and the fan case is The cooling airflow descends through the air flow path formed between the hubs and hits the upper surface of the package, and the airflow hitting the upper surface of the package is the lower end of the axial fan and the package.
A method for cooling a semiconductor device, characterized in that the semiconductor device is exposed to the outside through a gap with the upper surface of the semiconductor device. 27. A semiconductor device, comprising: a metal column having an axial fan attachment / detachment portion formed on the surface of a package containing a semiconductor element. 28. An axial fan characterized in that a pedestal or a fan case is provided with a mechanism for attaching to and detaching from a package containing a semiconductor element, the motor is built in, and the fan case is cylindrical.