JPH0613139A - Connector device for surface mounting - Google Patents

Abstract

PURPOSE:To bend a connector main body following the warp of a printed board so as not to separate a lead from a pad. CONSTITUTION:This connector device for on-surface-mounting is provided with plural printed board side notches 5, which are provided in the right angle direction to the longitudinal direction of a connector main body on the printed board 6 fitting side of the connector main body 1 and are wedgelikely in parallel mutually; and plural partner connector side notches 4, which are provided in the right angle direction to the longitudinal direction of the connector main body on the partner connector side of the connector main body and are wedgelikely in parallel mutually.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting connector device used in electronic equipment.

[0002]

2. Description of the Related Art Conventionally, a plastic molding material or a composite material with its glass fiber is indispensable as a molded article constituting a data communication terminal or an electronic computer. These parts have strict dimensional accuracy, dimensional stability, mechanical strength,
Abrasion characteristics are required, and many engineering plastics are used, and they are put into practical use as molded products by injection molding and transfer molding.

Generally, when a single thermoplastic fiber is reinforced with fibers, the elastic modulus is reduced by a factor of 2 to 3 and the fracture strain is reduced by 3 to 5%. Further, the molding shrinkage rate is reduced, the molding accuracy and dimensional stability are improved, and the creep characteristics are improved. Further, the thermal expansion coefficient is reduced, and the characteristics such as the heat deformation temperature are increased, but on the other hand, there are drawbacks such as the anisotropy of the molded product, damage to the mold and molding machine, and cost increase. Don't forget that there is. Table 9 summarizes examples of applying typical plastic materials to electronic devices and parts. The advantages and disadvantages of these materials are shown. It is important to select the optimum material that meets the required requirements according to the application target.

A printed wiring board is mounted with an element such as an LSI,
It is a mounted component that has functions such as wiring and insulation between conductors.
Phenolic resin used to occupy the mainstream as a substrate material in the past, but nowadays, epoxy resin replaces it especially in the field requiring high reliability such as industrial and communication, and polyimide etc. as heat resistant material. Also started to be used. With the high integration of semiconductor elements, the wiring density is becoming higher and the density is increasing, including multilayering. As a printed wiring board material, it has high dimensional accuracy and does not generate smear due to heat generated during drilling. , Heat resistance and flame resistance are required. Recently, new materials such as bismaleimide, alkyl ether phenols, and triazines have been introduced for the sake of economic efficiency.

Particularly in the future, there is a demand for high-speed signal processing and low dielectric constant materials. Currently, there are special grade materials using Teflon, but there are still problems with the adhesive strength of conductors, etc. Development is awaited.

[0006] As a method of constructing a device, electronic parts, systems, etc. are equipped with electronic parts in accordance with an electronic circuit and connected in order to function. This implementation has a hierarchical structure depending on the scale of the device, and is composed of the following four layers.

First level: At a package level, an integrated circuit is accommodated in the layer and has a lead wire for external connection. The shape is a lead insertion type.
remote mounting) DIP (dual inli)
ne package), PGA (pin grid)
array package, surface mount type (surf)
ACE (small) as ace mounting
outline package), QFP (quad)
flat package), LCC (leadle)
ss chip carrier), and the number of leads is increasing.

Further, among these, the unit circuits which are relatively integrated are mounted as a module on a small printed wiring board,
Sometimes it is placed on the second layer, and something in between the first and second layers is born. A hybrid circuit is an example of this.

Second layer: At the card level, integrated circuits, modules, etc. are mounted on a printed wiring board to form functional units.

Third layer: At the board level, cards are connected to each other by a wiring board, unit devices are configured, and they are housed in a housing.

Fourth layer: At the system level, devices are connected by cables.

In this mounting, the printed wiring is 2-4.
Various layers such as multilayer boards and ceramic boards are used in connection with each layer, and high-density connectors and wiring cables are used. With high density, heat dissipation measures become important,
Forced air cooling and liquid cooling are adopted, and the development of this aspect is remarkable.

A printed wiring board (PWB: pri)
A ted wiring board is a method component for interconnecting electronic components, and has made rapid progress with the development of electronic devices. A printed wiring board is indispensable for constructing electronic equipment. It forms wiring patterns for connecting electronic parts on the surface or inside of an insulator based on an electronic circuit, and at the same time supports electronic parts. It has become. It is classified as a single-sided, double-sided or multilayer board depending on the number of conductor layers. As a three-dimensional connection method, a plated through hole method
ole) dominates, but buildup (bui
The ld up) method, the print stacking method, etc. have been put to practical use.

The application of the printed wiring board has enabled high-reliability mounting. However, the printed wiring board is required to have high density, high precision, high reliability, high density mounting, and high reliability. In other respects, it is advancing along the line of sophistication.

In particular, the rigid type printed wiring board is divided into one layer, two layers and multiple layers depending on the number of conductor layers. Material is 1
The single sided PWB is a paper phenol laminated board, and the double sided PW is a double sided board.
B) has many glass epoxy laminates, but paper epoxy and paper phenol laminates are also used. Multi-layer board (multi)
ilayer PWB) is often a glass epoxy laminate, a high heat resistant resin such as polyimide, or a glass laminate. Most of the three-dimensional connection of two or more layers is through-hole plating, but a multi-layer system in which a conductor paste and a resin are printed and stacked on a laminated board has also been developed.

In addition to the resin laminated plate as the insulating substrate, there is also a wiring board using a ceramic material, a metal core or a metal base material, a heat resistant thermoplastic resin, or the like. In addition, as a flexible printed wiring board (flexible PWB), an insulating substrate for printed wiring is flexible, and there are one, two, and multiple conductor layers. As a special shape, there are one in which both surfaces of one conductor layer are used for component connection, and one in which a rigid plate is integrated. Flexible boards are used for connecting parts that have moving parts and for mounting electronic circuits in fine spaces.

Next, as connection parts, most of the electronic equipment hardware is unitized by function unit, and a so-called module is used to complete the system by connecting the units with connectors and wiring materials. It consists of a mounting structure.

The reason for increasing the number of division units is that the number of connection points is increased to affect the reliability from one aspect, but it has the following merits.

(1) Improvement of maintainability: testing becomes easier,
If there is a defect, it can be replaced quickly.

(2) Improvement of mass productivity: The production process such as assembly and inspection can be divided into division of labor to improve efficiency.

(3) Correspondence to function expansion: The function can be expanded rapidly by simply plugging in an additional unit.

Particularly, in the computer system, the CPU and I /
Because O equipment is added and memory capacity is expanded,
Module mounting structure is essential.

The parts such as the LSI package mounted on the printed wiring board, the low resistance and the capacitor are in the first layer.
The connection technology used here is wire bonding, reflow bonding, or the like.

The second layer is a printed wiring board. The connection technology includes through-hole plating for connecting the front and back of the base material or interlayer connection, defect remedy, various reflows and welding used in the printed wiring board for design change. is there.

The third layer is a mounting layer relating to interconnection of printed wiring boards, and includes examination of power supply and cooling system. Here, the connection method between the printed wiring board by the connector and the mother board is examined. Wiring on the motherboard by wire wrapping, and a joining technique using screws, which are often used for power supply, are also important.

The fourth layer is a connection system within a device or between devices. In the past, this part relied on wiring materials and mechanical connectors, but recently, devices have been downsized using optical fibers and optical connectors. By utilizing the high speed of light and using the multiplexing technology, it is possible to reduce the number of connectors and cables themselves and further miniaturize them.

In the electronic equipment, various connection technologies suitable for each mounting hierarchy of the device are used. Since connection in an electronic device is always accompanied by requirements related to electric conduction of the connection part, it is important to select the optimum connection method in consideration of electrical and mechanical conditions.

The permanent connection is a connection method on the premise that once the connection is made, the connection is not permanently released, and wire bonding of an LSI chip is an example thereof. Although this method has the inconvenience that it is extremely difficult to change once connected, it is the most reliable connection method.

The semi-permanent connection can be separated if necessary, but it is usually a connection method which is used like a permanent connection, and soldering is a typical example.

The simple connection has the greatest feature that it can be easily attached and detached like a household outlet, but is slightly inferior in reliability as compared with the above two connection systems.

As described above, the conventional surface mounting connector used for electronic equipment is as shown in FIG. 4, and one surface mounting connector is soldered to the surface mounting printed board and fitted to the other connector. Let me connect the electric circuits on both sides.

In FIG. 4, reference numeral 1 is a main body of a conventional surface mount connector, which holds contacts inside the connector and electrically insulates them. Reference numeral 2 is a contact, the tip of which comes out under the connector body to become a lead. Also,
This contact comes into contact with the contact of the other connector and is electrically connected. 3 is a lead of the connector which is soldered and fixed to the pad of the surface mounting printed board.
Reference numeral 6 is a printed circuit board for surface mounting. Seven pads are provided on the surface-mounting printed board, and the leads of the surface-mounting connector are soldered to these pads.

FIG. 5 shows an example in which a conventional surface mounting printed board to which a conventional surface mounting connector is soldered is warped downward due to thermal stress or external force, and the body of the surface mounting connector does not follow the warp of the printed board. , The soldered part is peeled off. FIG. 6 shows an example in which the surface mounting printed board is warped upward, which is the opposite of FIG. 5. Similarly, the body of the surface mounting connector does not follow the warp of the printed board, and the soldered portion is peeled off.

[0034]

The printed board is made by laminating epoxy resin containing glass fiber and copper foil, and has a property of being easily bent by thermal stress or external force. On the other hand, the connector body is made of resin only and has a box-like structure that does not easily bend due to thermal stress or external force. When soldering by inserting the lead of a conventional connector into the through hole of a through-hole type printed circuit board, the connector body was fixed relatively firmly to the printed circuit board, so the printed circuit board may warp due to thermal stress or external force. Also, since the connector does not follow and warp, the printed circuit board also does not warp, but when mounted on the surface mounting printed circuit board, the leads are soldered to the pad of the surface mounting printed circuit board. Therefore, there is a problem that it is easily peeled off.

It is an object of the present invention to provide a surface mounting connector device having high reliability in a surface mounting connector used for electronic equipment.

[0036]

SUMMARY OF THE INVENTION The present invention is a surface mounting connector body having a guide function for inserting a mating connector device that is electrically insulated from another adjacent connector device. The surface of a printed circuit board that is embedded in this connector body and is mechanically fixed, and that makes electrical contact by making contact with the mating contact mounted on the mating connector device and making an electrical circuit. A pad formed on the connector, a lead having one end soldered to the pad and the other end connected to a contact, and provided on the printed board mounting side of the connector main body in a direction perpendicular to the longitudinal direction of the connector main body and having a wedge shape with respect to each other. A plurality of parallel cuts on the printed board side and the mating connector side of the connector body are provided at right angles to the longitudinal direction of the connector body and are wedge-shaped and parallel to each other. Comprises a plurality of mating connector side cut, a lead surface mount connector apparatus characterized in that the connector body so as not to peel from the pad is curved to follow the warpage of the printed circuit board.

[0037]

In the surface real device connector device according to the present invention, the mating connector device is electrically insulated from the adjacent other connector device, and the mating connector device is inserted, embedded in the connector body and mechanically fixed, A pad is formed on the surface of a printed circuit board that mounts electronic components and constitutes an electric circuit by contacting and electrically connecting to the mating contact mounted on the mating connector device, and soldering one end of the lead to this pad Connect the other end to the contact, and make a printed board side cut on the printed board mounting side of the connector body in the direction perpendicular to the longitudinal direction of the connector body, make them parallel to each other in a wedge shape, and connect them to the mating connector side of the connector body. Make a cut in the mating connector side in the direction perpendicular to the longitudinal direction of the connector and make them parallel with each other in a wedge shape so that the leads do not separate from the pad. There is bent to follow the warpage of the printed circuit board.

[0038]

EXAMPLE An example of the present invention will be described below. In FIG. 1, reference numeral 1 is a surface-mounting connector body that is electrically insulated from another adjacent connector device and has a guide function when inserting a mating connector device, and 2 is embedded in the connector body 1. Is mechanically fixed and contacts with the mating contact mounted on the mating connector device to make an electrical connection, and 7 is formed on the surface of the printed board 6 on which electronic parts are mounted and which constitutes an electric circuit. pad,
3 has one end soldered to the pad 7 and the other end has a contact 2
Leads 5 connected to the connector body 1 are provided on the printed board mounting side of the connector body 1 at right angles to the longitudinal direction of the connector body 1, and a plurality of cuts parallel to each other in a wedge shape and 4 are provided on the mating connector side of the connector body 1. A plurality of wedge-shaped cuts that are provided in the direction perpendicular to the longitudinal direction of the connector body 1 and are parallel to each other.

That is, reference numeral 1 denotes a surface mounting connector main body, which mechanically holds the contacts 2 and electrically insulates the adjacent contacts, and also serves as a guide when inserting the other connector. .

Reference numeral 2 denotes a contact of the surface mounting connector, which is embedded in the connector body 1 and has a lead 3 at the end of the contact.
Next, it is soldered to the printed board 6. Also, by fitting the other connector, it is electrically contacted with the contact of the other connector to connect the two circuits. A lead portion 3 of the surface-mounting connector is soldered to the pad 7 of the printed board 6 to be mechanically fixed, and electrically connects a circuit. Reference numeral 4 denotes a wedge-shaped cut on the insertion side of the surface mounting connector, which has the effect of facilitating bending of the connector body 1 toward the lead side. Reference numeral 5 denotes a wedge-shaped cut on the lead side of the surface-mounting connector, which has the effect of facilitating the connector body 1 to bend toward the insertion side. Reference numeral 6 denotes a surface mounting printed board on which electronic components are mounted and which constitutes an electric circuit.

Reference numeral 7 denotes a pad formed on the surface of the surface-mounting printed board, to which a lead of the connector is soldered to mechanically hold the connector and to be electrically connected.

Next, FIGS. 2 and 3 will be described in detail. When thermal stress or external force is applied to the printed board, the printed board warps upward or downward. At this time, the warping force of the printed board is also applied to the surface mounting connector soldered to the printed board, and the connector also tries to warp upward or downward. Since there are wedge-shaped cuts on the insertion side and the lead side of the connector, one cut moves so as to open and the other cut closes. When the wedge-shaped cut is opened or closed, the connector body follows the warp of the printed board and warps upward or downward. Therefore, the leads of the connector maintain a stable electric circuit without being separated from the pads of the printed board.

The surface mounting connector has been described above, but the present invention can also be applied to a mating connector that fits into the surface mounting connector. By providing a wedge-shaped cut also on the mating connector, the connector bends due to the force at the time of mating, and both connectors fit in, and optimal mating can be obtained in a desired state. Further, it is possible to provide a connector which can be mounted on a printed board having a curved surface by positively applying this warp.

That is, (1) By providing the wedge-shaped cut 4 on the insertion side of the surface mounting connector, the printed board can be bent following the downward warp.

(2) By providing the wedge-shaped cut 5 on the lead side of the surface mounting connector, the printed board can be bent following the upward warp.

(3) Since the surface mounting connector bends following the warp of the surface mounting printed board, it is possible to prevent the leads from peeling off from the pad of the printed board.

As described above, according to the present invention, the following connector can be implemented.

(1) A surface mounting connector having a plurality of wedge-shaped cuts parallel to the longitudinal direction of the connector.

(2) A surface mount connector having a wedge-shaped cut on the insertion side of the connector.

(3) A connector having a wedge-shaped cut on the lead side of the connector.

(4) A connector which can be bent in the longitudinal direction of the connector.

(5) A connector that can be bent on both the insertion side and the lead side of the connector.

The following points can be cited as the effect.

(1) By providing a wedge-shaped cut on the insertion side, the printed board can be bent following the warp.

(2) By providing a wedge-shaped cut on the lead side, it is possible to bend following the warp of the printed board.

(3) Since the connector body also bends following the warp of the printed board, it is possible to prevent the leads from peeling from the pad of the printed board.

[0057]

According to the present invention, it is possible to provide a surface-mounting connector device characterized in that the connector body is curved so as to follow the warpage of the printed board so that the leads are not separated from the pad.

[Brief description of drawings]

FIG. 1 is a perspective view of a connector device according to an embodiment of the present invention.

FIG. 2 is a front view showing the operation of FIG.

3 is a front view showing the operation of FIG. 1. FIG.

FIG. 4 is a perspective view of a conventional connector device.

5 is a front view showing the operation of FIG. 4. FIG.

FIG. 6 is a front view showing the operation of FIG.

[Explanation of symbols]

 1 Connector body 2 Contact 3 Lead 4 Cut 5 Cut 6 Printed board 7 Pad

Claims (1)

[Claims] 1. A connector body for surface mounting, which is electrically insulated from another adjacent connector device and has a guide function when inserting a mating connector device, and a machine embedded in the connector body. Fixedly fixed, a contact for contacting and electrically connecting with a mating contact mounted on the mating connector device, and a pad formed on the surface of a printed board on which an electronic component is mounted and which constitutes an electric circuit, A lead having one end soldered to the pad and the other end connected to the contact, and a plurality of wedge-shaped parallel pieces provided on the printed board mounting side of the connector body in a direction perpendicular to the longitudinal direction of the connector body. On the printed board side cut and the mating connector side of the connector body,
The connector body is provided at right angles to the longitudinal direction of the connector body and has a plurality of wedge-shaped parallel connector side cuts, and the connector body prevents the leads from being separated from the pad. A surface-mounting connector device characterized in that it bends following warping.