JPH06129787A - Heat dissipating wall structure - Google Patents

Abstract

PURPOSE:To provide a wall of a strength member having a heat dissipating function by vertically arranging a plurality of heat pipes, disposing lower ends of the pipes disposed at an upper side and upper ends of the pipes disposed at a lower side substantially in parallel, and holding a heat insulator therebetween. CONSTITUTION:A wall structure material 1 is formed at a wall of a platelike member of a rigid structure in which a plurality of heat pipes 10 bent in a crank state and a heat insulator 20 are integrated. Each heat absorption units 12 provided with wicks in this state are disposed inside a room, heat radiators 11 are disposed in a higher position than the unit 12 out of the room. Accordingly, when the temperature in the room becomes higher than the atmospheric temperature, hydraulic fluids in the pipes 10 are evaporated by heat in the room, and the vapor flows to the radiator 11 having a lower temperature and a low pressure. Thus, since the material 1 has a function as a heat radiator and a function as a wall member, a load for an air conditioner for cooling in a room can be alleviated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wall structure having a function of automatically radiating heat inside a room to the outside.

[0002]

2. Description of the Related Art The temperature of a room in which large-capacity electronic equipment such as a large computer and a digital telephone exchange is installed is because these electronic equipment are easily affected by heat and generate a large amount of heat. It is necessary to control the temperature mainly for cooling. Therefore, in general, air conditioning equipment for building structures is generally used to control the temperature inside the electronic equipment room. When it becomes necessary to increase the size, and when the electronic devices are distributed and arranged, it is necessary to provide air conditioning equipment individually at the installation location of each electronic device, and in any case the equipment cost required for temperature control of the electronic device. And, there is a problem that the running cost becomes high.

By the way, the room temperature in which electronic equipment such as a digital telephone exchange is installed may be maintained below the outside air temperature even in the summer, so that a heat pump using a drive device such as a compression refrigerator is conventionally used. Instead, a device has been proposed in which heat is carried out indoors by a heat pipe to control the temperature.

FIG. 7 shows an outline of such an air conditioner.
This air conditioner includes an indoor heat absorbing portion 101 and an outdoor heat radiating portion 1
02 is connected with pipes 103 and 104 to form a loop-shaped heat pipe 100, and the fan 110 is configured to positively send the air in the room to the heat absorbing portion 101. The fan 110 blows the air to the heat absorbing portion 101. The heat that the air has has is the heat absorbing portion 101 of the heat pipe 100.
Is absorbed by the heat absorbing portion 101, the working fluid in the heat absorbing portion 101 evaporates, the vapor moves to the heat radiating portion 102, and then the heat radiating portion 102 radiates heat to condense and liquefy. In this way, heat is carried from the room to the outside as the latent heat of vaporization of the working fluid to cool the room. The liquefied working fluid is automatically returned to the heat absorbing portion 101 by gravity by providing the heat absorbing portion 101 at a position lower than that of the heat radiating portion 102. The pipe 100 continuously transfers heat.

[0005]

In the above-mentioned conventional apparatus, since the heat hype 100 automatically operates to transport heat due to a temperature difference between the inside and the outside,
No running cost or very cheap,
In addition to the wall structure and heat pipe being completely separate,
Since the heat pipe is of a loop type, it is necessary to connect the heat pipe container at the installation site, to degas the heat pipe, and to enclose the working fluid, which makes the construction difficult and costly.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a wall structure having both a function as a strength member and a function of radiating heat to the outside.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention arranges the upper end of a deaerated and working fluid-sealed outer container on the outside of the room, and the lower end of the closed container. It is bent to the outside of the room and placed on the inside, and a wick is provided on the inner surface of the lower end of the closed container to form a heat diode type heat pipe. It is characterized in that the lower end of the heat pipe and the upper end of the heat pipe located on the lower side are arranged substantially in parallel and a heat insulating material is sandwiched between them.

[0008]

In the present invention, the plurality of heat pipes arranged vertically form the wall surface with the heat insulating material sandwiched between them. The heat pipe has a structure in which the working fluid is enclosed in a closed container having a bent structure in which the lower end portion is arranged on the indoor side and the upper end portion is arranged on the outside. Therefore, when the indoor temperature becomes higher than the outdoor temperature. The working fluid evaporates and flows to the upper end of the outdoor side, where the working fluid radiates heat and condenses. That is, the working fluid transports the heat in the room as the latent heat of vaporization to the outside of the room. Further, the condensed working fluid is returned to the lower end portion where evaporation occurs by gravity.
Further, since the wick is provided at the lower end portion, the working fluid is dispersed in a wide area, and the evaporation area of the working fluid is widened.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a transverse sectional view taken along the line II-II, and FIG. 3 shows a wall structure material 1 shown in FIGS. It is a perspective view of the heat pipe 10 used. The heat pipe 10 has a heat radiating portion 11 arranged outside the upper part.
And a heat absorbing portion 12 and a heat radiating portion 11 provided on the indoor side of the wall.
1 for connecting the lower end of the heat sink to the upper end of the heat absorbing part 12
3 is a thermal diode type heat pipe in which a working fluid M is enclosed in a vacuum degassed state inside a plate-shaped hermetic container having a large dimension in the width direction W with respect to the dimension in the thickness direction T. is there. This closed container is made of a metal material such as copper, aluminum, or stainless steel, and is formed as a container having a flat oval cross section as shown in FIG. 4 and bent like a crank as shown in FIG. A fluid that evaporates and condenses in the intended temperature range, for example, water, is used as the working fluid M sealed in. Further, the heat absorbing section 1
Among the two, a wick 14 for generating a capillary pressure such as a mesh is provided on the inner wall surface 12a on the indoor side.

The wall structure material 1 shown in FIG. 1 is constructed by arranging the plurality of heat pipes 10 described above in a vertical and horizontal direction with a heat insulating material 20 sandwiched therebetween. That is, as shown in FIG. 1, the heat absorbing portion 12 of the upper heat pipe 10 and the heat radiating portion 11 of the lower heat pipe 11 are spaced by the length of the connecting portion 13 (that is, the dimension T in the thickness direction). The heat insulating material 20 is sandwiched between the heat absorbing portion 12 and the heat radiating portion 11 facing each other. Further, the heat insulating material 20 is closely attached to each of the indoor side of the heat radiating portion 11 of the uppermost heat pipe 10 and the outdoor side of the heat absorbing portion 12 of the lowermost heat pipe 10, and as a result, as a whole. A rectangular plate-shaped wall structure material 1 is configured. Further, in the wall structure material 1 shown in FIG. 1, the finned plate 22 that is in close contact with the outer surface of each heat dissipation portion 11 and connects each heat dissipation portion 11
The fin-equipped plate 2 is also provided for each heat-absorbing portion 12 and closely connects the heat-absorbing portion 12 to the outer surface thereof.
1 is provided. The wall structure material 1 is fixed to the body portion by a mounting member such as an angle 23.

Next, the operation of the wall structure material 1 described above will be described. The wall structure material 1 is a combination of a plurality of heat pipes 10 bent in a crank shape and a heat insulating material 20, and is made of a rigid material. Since it is a plate-shaped member having a structure, it is attached to a predetermined portion of a building structure to form a wall surface as shown in FIG. In this state, each heat absorbing portion 12 provided with the wick 14 is located on the indoor side, and each heat radiating portion 11 is located higher than the heat absorbing portion 12 and outside the room. Therefore, when the room temperature becomes higher than the outside air temperature, the working fluid M in each heat pipe 10 is evaporated by the heat in the room, and the steam flows to the heat radiating portion 11 having low temperature and pressure. In that case, since the wick 14 is provided on the inner wall surface of the heat absorbing portion 12, the liquid-phase working fluid M is dispersed and supplied to a wide range of the inner surface of the heat absorbing portion 12, and therefore the heat absorbing portion 12 is provided.
The working fluid M evaporates over a wide range on the inner surface of the. That is, the substantial heat absorption area can be increased. On the other hand, since the heat radiating portion 11 is cooled by the outside air and its temperature and pressure are low, the working fluid vapor flows from the heat absorbing portion 12 to the heat radiating portion 11, where it contacts the inner wall surface thereof to remove heat to the outside air. It radiates heat and condenses. That is, since the working fluid M carries the heat inside the room as its latent heat of vaporization and releases it, the room is cooled. The condensed working fluid M flows back to the heat absorbing portion 12 via the connecting portion 13 due to gravity.

In each of the above heat pipes 10, the working fluid M in the liquid phase is not retained in the heat radiating portion 11, so that the working fluid M evaporates when the outside air temperature is relatively higher than the room temperature. Does not occur. That is, since the heat pipe 10 does not transport heat, the room is not heated by the outside air.

Since the above-described wall structure material 1 has a function as a heat dissipation device and a function as a wall member, the load on the air conditioner for cooling the room can be reduced, or the air conditioner for cooling can be provided. Since it can be abolished and can be made a prefabricated structure, it is possible to simplify the site work and at the same time reduce the installation space of the cooling device. Further, since the heat is transported by the heat diode type heat pipe, the running cost can be made zero or extremely low.

[0014]

As is apparent from the above description, according to the present invention, the upper end of the deaerated and sealed working fluid is placed outside and the lower end of the closed vessel is placed outside. A heat diode type heat pipe is formed by bending it and arranging it on the indoor side, and by providing a wick on the inner surface of the lower end portion of the closed container, and further arranging the plurality of heat pipes vertically and arranging the heat pipes on the upper side. Since the lower end of the heat pipe and the upper end of the heat pipe located on the lower side are arranged substantially parallel to each other and the heat insulating material is sandwiched between them, it is possible to give the wall as a strength member a heat radiation function. Therefore, the cost and the running cost for the cooling equipment in the room where the electronic device is installed can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is a perspective view showing one of the heat pipes.

FIG. 4 is a transverse sectional view of the heat pipe.

FIG. 5 is a cross-sectional view for explaining the action of the heat pipe.

FIG. 6 is a side view of the heat pipe.

FIG. 7 is a schematic view showing an example of a conventional heat pipe type radiator.

[Explanation of symbols]

 1 Wall Structure Material 10 Heat Pipe 11 Heat Dissipation Section 12 Heat Absorption Section 20 Thermal Insulation Material

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Koji Nishizaki 4-9-25 Shibaura, Minato-ku, Tokyo Shibaura Squire Building Tokyo Communication Network Co., Ltd. (72) Inventor Hiroshi Iseki 4--9, Shibaura, Minato-ku, Tokyo No. 25 Shibaura Squair Tokyo Communication Network Co., Ltd. (72) Inventor Isao Kaji 1-5-1, Kiba, Koto-ku, Tokyo Fujikura Ltd. (72) Inventor Shinichi Sugihara 1-5, Kiba, Koto-ku, Tokyo No. 1 in Fujikura Ltd. (72) Inventor Koichi Masuko 1-5-1, Kiba, Koto-ku, Tokyo Inside Fujikura Ltd.

Claims (1)

[Claims] 1. An airtight container, which is deaerated and has a working fluid sealed therein, has an upper end portion arranged on the outside of the room, a lower end portion of the closed container is bent to the outside of the room, and is arranged on the inner side of the container. A wick is provided on the inner surface of the lower end to form a heat diode type heat pipe, and a plurality of heat pipes are arranged vertically, and the lower end of the heat pipe located above and the upper end of the heat pipe located below A heat dissipation wall structure characterized in that and are arranged substantially in parallel, and a heat insulating material is sandwiched between them.