JPH06125210A - Coupler - Google Patents
CouplerInfo
- Publication number
- JPH06125210A JPH06125210A JP4273306A JP27330692A JPH06125210A JP H06125210 A JPH06125210 A JP H06125210A JP 4273306 A JP4273306 A JP 4273306A JP 27330692 A JP27330692 A JP 27330692A JP H06125210 A JPH06125210 A JP H06125210A
- Authority
- JP
- Japan
- Prior art keywords
- main signal
- dielectric substrate
- line
- coupler
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、マイクロ波回路で、誘
電体基板に導体パターンを形成したマイクロストリップ
線路型の結合器に関する。マイクロストリップ線路型の
結合器は、マイクロ波の検波器や増幅器など様々なマイ
クロ波回路に用いられているが、そのマイクロ波回路の
特性の調整時に、その結合器の結合量も調整される場合
が多い。その際、その結合量の調整に手間が掛からず、
其の再現性,精度も良いことが必要である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microstrip line type coupler in which a conductor pattern is formed on a dielectric substrate in a microwave circuit. Microstrip line type couplers are used in various microwave circuits such as microwave detectors and amplifiers. When adjusting the characteristics of the microwave circuit, the coupling amount of the coupler is also adjusted. There are many. At that time, there is no need to adjust the amount of binding,
Its reproducibility and accuracy must be good.
【0002】[0002]
【従来の技術】従来の結合器の構造の一例を図9に示
す。図中、1 は誘電体基板2 の表面に形成されてマイク
ロ波の主信号を伝送する導体パターンによる主信号伝送
線路、3は該主信号線路1 に結合する導体パターンの結
合線路、5 は誘電体基板2 の裏面の接地面である。即
ち、図9の従来の結合器は、同一の誘電体基板2 の上に
主信号伝送線路1 と結合線路3 の2つの導体パターンを
形成しただけの構造であった。また、他の結合器の2分
岐型結合器の構造を図10に示す。図中、51は誘電体基板
2 に形成された導体パターンによる主信号線路兼結合線
路であり、その53は主信号線路のRF入力ポート, 54は主
信号線路のRF出力ポート、55は主信号線路に結合した結
合線路のRF出力ポート、56は結合線路を線路インピーダ
ンスで終端するアイソレーションポートである。図10の
結合器も、同一の誘電体基板2 の上に主信号線路兼結合
線路51の導体パターンを形成しただけの構造である。ま
た、図11に、図10の結合器の部分を、大きな誘電体基板
12と同一面上の異なる誘電体基板2 の上に形成した2分
岐型結合器を示す。誘電体基板2 は、誘電体基板12に、
図示しないがネジにより固定されており、誘電体基板12
の主信号線路58,59,60,61が、誘電体基板2 上の各ポー
ト53,54,55,56 に銅箔22で半田付けして接続されてい
た。2. Description of the Related Art FIG. 9 shows an example of the structure of a conventional coupler. In the figure, 1 is a main signal transmission line formed by a conductor pattern that is formed on the surface of a dielectric substrate 2 and transmits a main signal of a microwave, 3 is a coupling line of a conductor pattern that is coupled to the main signal line 1, and 5 is a dielectric line. This is the ground plane on the back surface of the body substrate 2. That is, the conventional coupler shown in FIG. 9 has a structure in which only two conductor patterns of the main signal transmission line 1 and the coupling line 3 are formed on the same dielectric substrate 2. The structure of a two-branch coupler, which is another coupler, is shown in FIG. In the figure, 51 is a dielectric substrate
The main signal line and the coupled line are formed by the conductor pattern formed in 2.53 is the RF input port of the main signal line, 54 is the RF output port of the main signal line, and 55 is the RF of the coupled line connected to the main signal line. The output port, 56 is an isolation port that terminates the coupled line with line impedance. The coupler of FIG. 10 also has a structure in which the conductor pattern of the main signal line / coupling line 51 is simply formed on the same dielectric substrate 2. Further, in FIG. 11, the coupler portion of FIG. 10 is replaced with a large dielectric substrate.
12 shows a bifurcated coupler formed on a different dielectric substrate 2 on the same plane as 12. Dielectric substrate 2 is the same as dielectric substrate 12,
Although not shown, the dielectric substrate 12 is fixed with screws.
The main signal lines 58, 59, 60 and 61 of were connected to the ports 53, 54, 55 and 56 on the dielectric substrate 2 by soldering with copper foil 22.
【0003】[0003]
【発明が解決しようとする課題】また、上記の従来の結
合器を用いたマイクロ波の検波器を例にとると、検波器
の部品のバラツキ等により検波器出力の検波電圧が希望
値と異なる場合があるが、その場合は、その検波電圧の
調整を行う為に、結合器の結合量の調整が必要となる。
この様に、結合量の調整を必要とする従来のマイクロ波
回路の結合器は、図9の例の如く、誘電体基板2 の上に
主信号線路1 と結合線路3 の2つの導体パターンを形成
しただけの構造であったので、図12に示す如く、結合器
の結合量を変える為に結合線路3 に適当な銅箔13を半田
付けして主信号線路1 に対する結合量を試行錯誤的に変
えていた。この方法では調整の精度を上げることが困難
であり、また、調整に手間が掛かり、主信号線路1のイ
ンピーダンスも、前記の結合線路3 に銅箔13を半田付け
するので、所定の値から変ってしまい、その特性も保証
できなくなるといった問題があった。また、結合器を使
用したバランス型のマイクロ波の FET増幅器を例にとる
と、FET等のデバイスは、同じ特性のものが2つ揃うこ
とは少ないので、実際には特性の異なる2つのデバイス
をバランス型増幅器として組み込んでいる場合が多く、
その場合、結合器の結合量を調整する事により、バラン
ス型増幅器の特性を調整している。この様に、主信号と
の結合量の調整を必要とするマイクロ波増幅器にて、従
来の結合器は、上記の図10の例の如く、誘電体基板2上
に導体パターンを形成しただけの構造であったので、図
13に示す如く、その結合器51の結合量を増減する為に、
適当な銅箔13を主信号の入出力端の間の線路に半田付け
して結合量を試行錯誤的に変えていたが、この方法も、
図12の方法と同様に、調整の精度を上げることが困難で
あり、また、調整に手間が掛かり、主信号回路のインピ
ーダンスも、所定の値と変ってしまい、特性も保証でき
なくなるといった問題があった。また、上記の図11の如
く、2種類の誘電体基板2,12を使用した例でも、両者の
導体パターンを接続する為の銅箔22による接続部が有る
為に、所定のインピーダンスを悪化させている。さら
に、図9,図10,図11に示す如く、同一の誘電体基板2
の上に導体パターンを形成した従来の構造の結合器で
は、周囲からの RF 信号の飛びの影響を受けることも考
慮しなければならない。本発明の目的は、主信号伝送回
路との結合量の調整の精度が容易に上がり、調整に手間
が掛からず、主信号回路のインピーダンスも所定の値を
保持して特性も保証できる結合器を提供することにあ
る。Taking the microwave detector using the above-mentioned conventional coupler as an example, the detected voltage at the detector output differs from the desired value due to variations in the detector components. However, in that case, in order to adjust the detection voltage, it is necessary to adjust the coupling amount of the coupler.
Thus, the conventional microwave circuit coupler that requires adjustment of the coupling amount has two conductor patterns of the main signal line 1 and the coupling line 3 on the dielectric substrate 2 as shown in the example of FIG. Since it was a structure that was only formed, as shown in Fig. 12, in order to change the coupling amount of the coupler, an appropriate copper foil 13 was soldered to the coupling line 3 and the coupling amount to the main signal line 1 was tried and errored. Was changed to. With this method, it is difficult to improve the accuracy of adjustment, and it takes time to adjust, and the impedance of the main signal line 1 also changes from the predetermined value because the copper foil 13 is soldered to the above-mentioned coupling line 3. However, there is a problem that the characteristics cannot be guaranteed. Taking a balanced microwave FET amplifier that uses a coupler as an example, it is rare that two devices such as FETs have the same characteristics, so in reality two devices with different characteristics are used. Often built as a balanced amplifier,
In that case, the characteristic of the balanced amplifier is adjusted by adjusting the coupling amount of the coupler. As described above, in the microwave amplifier that requires adjustment of the amount of coupling with the main signal, the conventional coupler has only the conductor pattern formed on the dielectric substrate 2 as in the example of FIG. 10 described above. Since it was a structure, the figure
As shown in 13, in order to increase or decrease the coupling amount of the coupler 51,
Although an appropriate copper foil 13 was soldered to the line between the input and output ends of the main signal to change the coupling amount by trial and error, this method also
Similar to the method of FIG. 12, it is difficult to improve the accuracy of adjustment, and it takes time and effort to adjust, and the impedance of the main signal circuit also changes to a predetermined value, so that the characteristics cannot be guaranteed. there were. Further, as shown in FIG. 11 above, even in the case of using the two types of dielectric substrates 2 and 12, since there is a connection portion by the copper foil 22 for connecting the conductor patterns of both, the predetermined impedance is deteriorated. ing. Further, as shown in FIGS. 9, 10, and 11, the same dielectric substrate 2
It is also necessary to consider that the coupler with the conventional structure in which a conductor pattern is formed on the top is affected by the flight of RF signals from the surroundings. An object of the present invention is to provide a coupler that can easily improve the accuracy of adjustment of the amount of coupling with the main signal transmission circuit, does not require adjustment, and can maintain the impedance of the main signal circuit at a predetermined value and guarantee the characteristics. To provide.
【0004】[0004]
【課題を解決するための手段】この目的達成のための本
発明の結合器の基本構成を、図1の原理図に示す。接地
面5 を持つ誘電体基板2 に形成した導体パターンによる
主信号伝送線路1 と、該誘電体基板2 とは異なり接地面
の無い別の誘電体基板4 に形成した導体パターンにより
前記主信号と結合する結合線路3とを別々に有し、該結
合線路3 の誘電体基板4 が前記主信号伝送線路1 の誘電
体基板2 に対し可動して該結合線路3 の導体パターンと
主信号線路1 の導体パターンとの間の結合量が変化する
ように構成する。また、図2の原理図に示す如く、前記
結合線路3 の誘電体基板4 が接地面5 ′を有し、該結合
線路3 の接地面5 ′が主信号伝送線路1 の接地面5 と導
体ネジ6 により接続され、該結合線路3 の導体パターン
と主信号線路1 の導体パターンとが共に、両接地面5,5
′により外部から遮蔽されるように構成する。また、
図3の原理図に示す如く、接地面5 を持つ誘電体基板12
に形成した導体パターン60,61による主信号伝送線路1
と該誘電体基板12とは異なる接地面5 ′を持つ別の誘電
体基板2 に形成した導体パターンの結合器51(53,54,55,
56)の2種類の誘電体基板12,2の電気接続を、それぞれ
の導体パターン60,61 と51の機械接触により行うように
構成する。また、誘電体基板2 に形成した導体パターン
の結合器51を複数種類だけ用意し交換することにより、
主信号伝送線路60,61との結合量又は結合する信号の周
波数帯域を変えられるように構成する。The basic construction of the coupler of the present invention for achieving this object is shown in the principle diagram of FIG. The main signal transmission line 1 is formed of a conductor pattern formed on the dielectric substrate 2 having the ground plane 5, and the main signal is transmitted by the conductor pattern formed on another dielectric substrate 4 having no ground plane unlike the dielectric substrate 2. The coupling line 3 to be coupled is provided separately, and the dielectric substrate 4 of the coupling line 3 is movable with respect to the dielectric substrate 2 of the main signal transmission line 1 so that the conductor pattern of the coupling line 3 and the main signal line 1 It is configured such that the amount of coupling with the conductor pattern of is changed. Further, as shown in the principle diagram of FIG. 2, the dielectric substrate 4 of the coupling line 3 has a ground plane 5 ′, and the ground plane 5 ′ of the coupling line 3 is connected to the ground plane 5 of the main signal transmission line 1 and a conductor. Connected by screws 6, the conductor pattern of the coupling line 3 and the conductor pattern of the main signal line 1 are both ground planes 5,5.
It is configured to be shielded from the outside by ′. Also,
As shown in the principle diagram of FIG. 3, the dielectric substrate 12 having the ground plane 5
Main signal transmission line 1 with conductor patterns 60 and 61 formed on
And a conductor pattern coupler 51 (53, 54, 55, 55) formed on another dielectric substrate 2 having a ground plane 5 ′ different from that of the dielectric substrate 12.
The electrical connection between the two types of dielectric substrates 12 and 2 of 56) is made by mechanical contact of the respective conductor patterns 60, 61 and 51. In addition, by preparing and exchanging a plurality of types of couplers 51 having a conductor pattern formed on the dielectric substrate 2,
It is configured so that the amount of coupling with the main signal transmission lines 60, 61 or the frequency band of the coupled signal can be changed.
【0005】[0005]
【作用】本発明では、図1,図2に示すように、主信号
を伝送する導体パターンによる主信号伝送線路1 と該主
信号に結合する導体パターンによる結合線路3 とが別々
の誘電体基板2,4 に形成され、結合線路3 の誘電体基板
4 が主信号伝送線路1 の誘電体基板2 に対して可動する
構造となっているので、主信号伝送線路1 の導体パター
ンと結合線路3 の導体パターンの間隔により定まる結合
量を可変とすることが出来るし、また、図2のように、
結合線路3 の誘電体基板4 の接地面5 ′が主信号伝送線
路1 の誘電体基板2 の接地面5 と導体ネジ6 により接続
されている場合は、結合線路3 の導体パターンと主信号
線路1 の導体パターンとが共に両接地面5,5 ′により遮
蔽されて外部から影響を受けることが無くなる。また、
図3に示すように、主信号のRF信号の伝送線路60,61 と
結合器51の導体パターンとを、別々の誘電体基板12,2に
それぞれ形成し、それらの両接地面5,5 ′を導体ネジに
6より接続し、導体パターン60,61 と導体パターン51の
機械接触により2種類の誘電体基板12,2の電気接続を行
う。そして結合器51が形成されている誘電体基板2のみ
を複数種類だけ用意し、それらを交換することで結合量
等を変えることが出来る。また、2種類の誘電体基板1
2,2の電気接続が、其の機械接触のみとなるので、必要
とする結合器51の結合量の調整も基板2 の交換も容易と
なり、特性の再現性も良くなる。In the present invention, as shown in FIGS. 1 and 2, the main signal transmission line 1 having a conductor pattern for transmitting a main signal and the coupling line 3 having a conductor pattern for coupling to the main signal are different dielectric substrates. Dielectric substrate of coupled line 3 formed on 2,4
Since 4 is movable with respect to the dielectric substrate 2 of the main signal transmission line 1, the coupling amount determined by the distance between the conductor pattern of the main signal transmission line 1 and the conductor pattern of the coupling line 3 should be variable. Can be done, and as shown in Figure 2,
If the ground plane 5'of the dielectric substrate 4 of the coupling line 3 is connected to the ground plane 5 of the dielectric substrate 2 of the main signal transmission line 1 by the conductor screw 6, the conductor pattern of the coupling line 3 and the main signal line Both the conductor pattern of 1 and the conductor pattern of 1 are shielded by both ground planes 5 and 5 ', and are not affected by the outside. Also,
As shown in FIG. 3, the transmission lines 60 and 61 for the RF signal of the main signal and the conductor pattern of the coupler 51 are formed on different dielectric substrates 12 and 2, respectively, and their ground planes 5 and 5 ' To the conductor screw
6, the two conductors 60, 61 and the conductor pattern 51 are mechanically contacted to electrically connect the two types of dielectric substrates 12, 2. Then, by preparing only a plurality of types of the dielectric substrate 2 on which the coupler 51 is formed and exchanging them, the coupling amount and the like can be changed. Also, two types of dielectric substrates 1
Since the electrical connection of 2 and 2 is made only by the mechanical contact, the required adjustment of the coupling amount of the coupler 51 and the replacement of the substrate 2 are facilitated, and the reproducibility of the characteristics is improved.
【0006】[0006]
【実施例】図4と図5は、それぞれ本発明の請求項1お
よび2に対応する実施例の結合器の構成図である。図
中、1は誘電体基板2 に形成された導体パターンによる
主信号伝送線路、3 は誘電体基板4 に形成された導体パ
ターンによる結合線路、5,5′は接地面、6 は誘電体基
板4 を誘電体基板2 に固定するネジ、7 はガイド用バカ
穴であって、ネジ6 をガイドとして、誘電体基板4 を誘
電体基板2 に対し可動することにより、主信号伝送線路
1 と結合線路3 の間隔を可変とし、結合量を可変する構
造となっており、接地面5,5 ′にて導体パターンを挟ん
だ状態のままで、結合量を可変できる様になっている。
また、図7は、図4又は図5の結合器を利用した検波器
の構成図であり、図中、8 は実施例の結合器、9 は終端
ポート、10は検波回路、11は主信号線路のRF入力ポー
ト、21はRF出力ポートである。実施例の結合器8 を用い
ることで、主信号との結合量が可変となるので、検波回
路10に入力されるRF電力も可変されて、出力の検波電圧
も可変されることになる。また、結合器8 は、その主信
号伝送線路1 の導体パターンと結合線路3 の導体パター
ンが、それぞれの接地面5,5 ′により所謂シールドされ
るので、周囲回路の電力からの影響を受けず一定の検波
電圧が得られる。図6は本発明の請求項3および4に対
応する実施例の結合器で2分岐型結合器の構成図であ
る。図中、51は誘電体基板2 に形成された導体パターン
による主信号の伝送線路、53は其のRF入力ポート、54は
RF出力ポート、55は主信号に結合し2分岐したRF信号の
出力ポート、56は線路終端用のアイソレーションポー
ト、5,5 ′は誘電体基板12,2の接地面である。58は誘電
体基板2 に形成された結合器51のRF入力ポート53に接続
される主信号入力線路、59,60,61は58と同様に、それぞ
れRF出力ポート54,結合RF出力ポート55,アイソレーショ
ンポート56に接続される誘電体基板12側の伝送線路であ
る。図6の実施例の結合器は、RF信号の伝送線路58,59,
60,61 と結合器51とを別々の誘電体基板12,2に形成し、
結合器51の誘電体基板2 は、其の接地面5 ′を誘電体基
板12の接地面5 に導通する導体ネジ6 により、誘電体基
板12に固定しているので、それぞれの導体パターン同志
が機械的に接触し電気的に接続される。従って、結合器
51が形成されている誘電体基板2 として、結合量の異な
る複数種類の誘電体基板21〜2 n を用意し交換できる様
にして置けば、結果的に結合量を容易に調整できること
になる。また、図8は、図6の実施例の結合器を用いた
バランス型 FET増幅器の構成図であり、2個の2分岐型
結合器64,65 を、FET増幅器68,69 の入力側の分岐用と
出力側の合成用とに用いている。結合器64,65 の結合量
が可変となるので、FET増幅器68,69 に入出力するRF電
力が可変されるので、良好な特性のバランス型 FET増幅
器を得ることが出来る。4 and 5 are block diagrams of a coupler of an embodiment corresponding to claims 1 and 2 of the present invention, respectively. In the figure, 1 is a main signal transmission line formed by a conductor pattern formed on a dielectric substrate 2, 3 is a coupling line formed by a conductor pattern formed on a dielectric substrate 4, 5 and 5'are ground planes, and 6 is a dielectric substrate. 4 is a screw for fixing the dielectric substrate 2, 7 is a guide hole, and by moving the dielectric substrate 4 with respect to the dielectric substrate 2 using the screw 6 as a guide, the main signal transmission line is moved.
The distance between 1 and the coupling line 3 is variable, and the coupling amount is variable, and the coupling amount can be varied with the conductor pattern sandwiched between the ground planes 5 and 5 '. .
7 is a block diagram of a detector using the coupler of FIG. 4 or FIG. 5, where 8 is the coupler of the embodiment, 9 is the termination port, 10 is the detection circuit, and 11 is the main signal. The line RF input port, 21 is the RF output port. By using the coupler 8 of the embodiment, the amount of coupling with the main signal is variable, so the RF power input to the detection circuit 10 is also variable, and the detection voltage of the output is also variable. Further, the coupler 8 is not affected by the power of the surrounding circuit because the conductor pattern of the main signal transmission line 1 and the conductor pattern of the coupling line 3 are so-called shielded by the respective ground planes 5 and 5 '. A constant detection voltage is obtained. FIG. 6 is a configuration diagram of a two-branch type coupler of an embodiment corresponding to claims 3 and 4 of the present invention. In the figure, 51 is a main signal transmission line by the conductor pattern formed on the dielectric substrate 2, 53 is its RF input port, and 54 is
An RF output port, 55 is an RF signal output port coupled to the main signal and branched into two, 56 is an isolation port for terminating the line, and 5 and 5'are ground planes of the dielectric substrates 12 and 2. 58 is the main signal input line connected to the RF input port 53 of the coupler 51 formed on the dielectric substrate 2, and 59, 60 and 61 are the RF output port 54, the coupled RF output port 55, and the same as 58, respectively. A transmission line on the side of the dielectric substrate 12 connected to the isolation port 56. The coupler of the embodiment shown in FIG. 6 includes RF signal transmission lines 58, 59,
60, 61 and the coupler 51 are formed on separate dielectric substrates 12 and 2,
The dielectric substrate 2 of the coupler 51 is fixed to the dielectric substrate 12 by the conductor screw 6 which conducts the ground plane 5 ′ to the ground plane 5 of the dielectric substrate 12, so that the conductor patterns are It makes mechanical contact and is electrically connected. Therefore, the combiner
As the dielectric substrate 2 on which 51 is formed, if a plurality of types of dielectric substrates 2 1 to 2 n having different coupling amounts are prepared and placed so that they can be exchanged, the coupling amount can be easily adjusted as a result. . FIG. 8 is a block diagram of a balanced FET amplifier using the coupler of the embodiment of FIG. 6, in which two two-branch couplers 64 and 65 are connected to the input side of the FET amplifiers 68 and 69. It is used for both output and output side synthesis. Since the coupling amount of the couplers 64 and 65 is variable, the RF power input to and output from the FET amplifiers 68 and 69 is variable, so that a balanced type FET amplifier with good characteristics can be obtained.
【0007】[0007]
【発明の効果】以上説明した如く、本発明によれば、結
合器の導体パターンを変更すること無く主信号線路に結
合する結合量を可変できるので、結合量の調整に要する
時間を短縮することが出来る。また、結合するRF信号周
波数が同じ周波数帯域ならば、必要とする結合量に応じ
て其の都度、導体パターンを設計する必要が無くなり、
また、異なる周波数帯域でも、結合器の導体パターンの
みを設計すればよいので、設計時間を短縮できる。ま
た、結合器の導体パターンが、2 つの誘電体基板の接地
面で挟まれ外部からシールドされるので、周囲からのRF
信号の飛びの影響を受けずに一定の結合量を得る効果が
得られる。As described above, according to the present invention, the coupling amount to be coupled to the main signal line can be changed without changing the conductor pattern of the coupler, so that the time required for adjusting the coupling amount can be shortened. Can be done. Also, if the RF signal frequencies to be coupled are in the same frequency band, there is no need to design the conductor pattern each time according to the required coupling amount,
Also, even in different frequency bands, only the conductor pattern of the coupler needs to be designed, so that the design time can be shortened. Also, since the conductor pattern of the coupler is sandwiched between the ground planes of the two dielectric boards and shielded from the outside,
The effect of obtaining a certain amount of coupling can be obtained without being affected by signal jumps.
【図1】 本発明の請求項1の結合器の基本構成を示す
原理図FIG. 1 is a principle diagram showing a basic configuration of a coupler according to claim 1 of the present invention.
【図2】 本発明の請求項2の結合器の構成を示す原理
図FIG. 2 is a principle diagram showing a configuration of a coupler according to claim 2 of the present invention.
【図3】 本発明の請求項3及び4の結合器の基本構成
を示す原理図FIG. 3 is a principle diagram showing a basic configuration of a coupler according to claims 3 and 4 of the present invention.
【図4】 本発明の請求項1に対応する実施例の結合器
の構成図FIG. 4 is a configuration diagram of a coupler of an embodiment corresponding to claim 1 of the present invention.
【図5】 本発明の請求項2に対応する実施例の結合器
の構成図FIG. 5 is a configuration diagram of a coupler of an embodiment corresponding to claim 2 of the present invention.
【図6】 本発明の請求項3及び4に対応する実施例の
結合器の構成図FIG. 6 is a configuration diagram of a coupler of an embodiment corresponding to claims 3 and 4 of the present invention.
【図7】 本発明の実施例の結合器を用いた検波器の構
成図FIG. 7 is a block diagram of a wave detector using a coupler according to an embodiment of the present invention.
【図8】 本発明の実施例の結合器を用いたバランス型
FET増幅器の構成図FIG. 8 is a balanced type using the coupler according to the embodiment of the present invention.
FET amplifier block diagram
【図9】 従来の結合器の一例の構成図FIG. 9 is a configuration diagram of an example of a conventional coupler.
【図10】 従来の結合器の2分岐型結合器の構成例FIG. 10 is a configuration example of a conventional two-branch coupler.
【図11】 従来の結合器の2分岐型結合器の構成例FIG. 11 is a configuration example of a conventional two-branch coupler.
【図12】 従来の結合器の結合量の調整法を示す図FIG. 12 is a diagram showing a conventional method for adjusting the coupling amount of a coupler.
【図13】 従来の2分岐型結合器の結合量の調整法を示
す図FIG. 13 is a diagram showing a method of adjusting the coupling amount of a conventional two-branch coupler.
1 は主信号伝送線路、3 は結合線路、2,4,12は誘電体基
板、5,5 ′は接地面、6 はネジ、51は2分岐型結合器で
ある。1 is a main signal transmission line, 3 is a coupling line, 2, 4 and 12 are dielectric substrates, 5 and 5'are ground planes, 6 is a screw and 51 is a bifurcated coupler.
Claims (4)
よる主信号の伝送路と其の主信号に結合する結合線路と
からなる結合器において、接地面(5)を持つ誘電体基板
(2)に形成した導体パターンによる主信号伝送線路(1)
と、其の誘電体基板(2)とは異なる別の接地面の無い誘
電体基板(4)に形成した導体パターンにより前記主信号
と結合する結合線路(3)とを有し、該結合線路(3)の誘電
体基板(4)が前記主信号伝送線路(1)の誘電体基板(2)に
対し可動して該結合線路(3)の導体パターンと主信号伝
送線路(1)の導体パターンとの間の結合量が変化するよ
うにしたことを特徴とする結合器。1. A dielectric substrate having a ground plane (5) in a coupler comprising a main signal transmission line formed of a conductor pattern formed on a dielectric substrate and a coupling line coupled to the main signal.
Main signal transmission line with conductor pattern formed in (2) (1)
And a coupling line (3) that is coupled to the main signal by a conductor pattern formed on a dielectric substrate (4) having no ground plane different from the dielectric substrate (2). The dielectric substrate (4) of (3) is movable with respect to the dielectric substrate (2) of the main signal transmission line (1), and the conductor pattern of the coupling line (3) and the conductor of the main signal transmission line (1) A coupler characterized in that the amount of coupling with the pattern is changed.
面(5′)を有し該結合線路(3)の接地面(5′)が主信号伝
送線路(1)の接地面(5)と導体ネジ(6)により接続され、
該結合線路(3)の導体パターンと主信号伝送線路(1)の導
体パターンとが共に両接地面(5,5′)により外部から遮
蔽されるようにしたことを特徴とする請求項1記載の結
合器。2. The dielectric substrate (4) of the coupling line (3) has a ground plane (5 ′), and the ground plane (5 ′) of the coupling line (3) is the main signal transmission line (1). Connected to ground plane (5) with conductor screw (6),
The conductor pattern of the coupling line (3) and the conductor pattern of the main signal transmission line (1) are both shielded from the outside by both ground planes (5, 5 '). Combiner.
した導体パターンによる主信号伝送線路(1)と該誘電体
基板(12)とは別の接地面(5′)を持つ誘電体基板(2)に形
成した導体パターンの結合器(51)の2種類の誘電体基板
(12,2)の電気接続を、それぞれの導体パターンの機械接
触により行うようにしたことを特徴とする結合器。3. A main signal transmission line (1) formed of a conductor pattern formed on a dielectric substrate (12) having a ground plane (5) and a ground plane (5 ') different from the dielectric substrate (12). Two types of dielectric substrates of the conductor pattern coupler (51) formed on the dielectric substrate (2)
A coupler characterized in that the electrical connection of (12, 2) is made by mechanical contact of respective conductor patterns.
ーンの結合器(51)を複数種類だけ用意し交換することに
より、主信号に対する結合器(51)の結合量又は結合する
信号の周波数帯域を変えられるようにしたことを特徴と
する請求項3記載の結合器。4. A plurality of types of couplers (51) having a conductor pattern formed on the dielectric substrate (2) are prepared and exchanged so that the coupling amount of the coupler (51) with respect to the main signal or the signal to be coupled can be changed. 4. The coupler according to claim 3, wherein the frequency band can be changed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4273306A JPH06125210A (en) | 1992-10-13 | 1992-10-13 | Coupler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4273306A JPH06125210A (en) | 1992-10-13 | 1992-10-13 | Coupler |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06125210A true JPH06125210A (en) | 1994-05-06 |
Family
ID=17526034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4273306A Withdrawn JPH06125210A (en) | 1992-10-13 | 1992-10-13 | Coupler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06125210A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10190321A (en) * | 1996-12-20 | 1998-07-21 | Nec Corp | Coupling element provided with dielectric insulation film |
JP2000134012A (en) * | 1998-07-07 | 2000-05-12 | Murata Mfg Co Ltd | Directional coupler, antenna device and transmitter- receiver |
JP2010088011A (en) * | 2008-10-02 | 2010-04-15 | Panasonic Corp | Directional coupler |
-
1992
- 1992-10-13 JP JP4273306A patent/JPH06125210A/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10190321A (en) * | 1996-12-20 | 1998-07-21 | Nec Corp | Coupling element provided with dielectric insulation film |
JP2000134012A (en) * | 1998-07-07 | 2000-05-12 | Murata Mfg Co Ltd | Directional coupler, antenna device and transmitter- receiver |
JP2010088011A (en) * | 2008-10-02 | 2010-04-15 | Panasonic Corp | Directional coupler |
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Legal Events
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---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000104 |