JPH06124811A - Method and device for measuring electric property of circuit board and its formation - Google Patents

Abstract

PURPOSE:To measure the electric properties such as resistance value, etc., of a thin-film element, etc., formed on a circuit board by forming a film having a specified shape, peeling off a part of a resist before removing the resist, and measuring the electric property of the film while a measuring head is brought into contact with the exposed part. CONSTITUTION:A thin-film resistance layer 2 and a conductive layer 3 are piled up on a board 1 successively. In order to measure the sheet resistance of the layer 2 and separate a plurality of product element parts 6, a resist 7 is applied with coating and light-exposure/developing. Then the layer 3 is applied with etching and the etching removal is performed between the parts 6 and a thin-film resistor 8 for resistance measurement and on the layer 3 in the resistor 8. Further, a part of the resist is peeled off to expose a part of the layer 3 and a measuring head 10 for resistance measurement is brought into contact with the exposed part to measure the sheet resistance of the layer 2 in the layer 8 with a measuring device 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board formed by forming a conductive film on a substrate and then removing the film into a predetermined pattern to form an electric circuit. The present invention relates to a method and apparatus for measuring electrical characteristics and a method for forming a circuit board.

[0002]

2. Description of the Related Art In the process of manufacturing a circuit board on which a wiring pattern is formed, a step of inspecting the electrical characteristics such as the resistance value of a thin film resistor and the continuity or short circuit state of the wiring pattern before mounting a circuit component such as an LSI. May be required.

For example, in a manufacturing process for forming a thin film resistor in a circuit board, a thin film resistance layer 2 of Cr or the like is formed on an insulating circuit board 1 as shown in the partial sectional view of FIG. Then, after continuously laminating the conductor layer 3 such as Cu on the resistance layer 2, the conductor layer 3 having a predetermined size is formed.
Is patterned into a shape as illustrated by photoetching or the like to form an electrode, and then the lower resistance layer 2 is separated into a plurality of regions by etching to form a plurality of thin film resistors 4. Is taking.

In this case, in order to prevent the surface of the resistance layer 2 from being oxidized and having a large resistance at the interface with the conductor layer 3, the resistance layer 2 and the conductor layer 3 are continuously formed in a vacuum chamber. I am trying to do it. A sputtering method is mainly used as a film forming method of the resistance layer 2.

The resistance value R of the thin film resistor 3 thus formed is R = (1 / 2π) (ρ / t) ln (b / a) ρ = specific resistance of the thin film resistance layer t = thin film resistance The film thickness of the layer is expressed by a = outer diameter of inner electrode b = inner diameter of outer electrode.

However, the sheet resistance value of the resistance layer 2 formed by the sputtering method often varies from substrate to substrate due to variations in residual gas partial pressure or substrate potential. For this reason, the conductor layer 3 should have a uniform size determined in advance.
There is a problem in that the resistance value of the resistance layer 2 varies and the desired resistance value cannot be obtained only by patterning the electrodes by photo-etching or the like to form the electrodes.

Therefore, if an electrode is formed by patterning the conductor layer 2 by photoetching or the like, a voltage is applied through the electrode, the resistance value of the thin film resistor 4 is measured, and according to the measurement result. Therefore, it becomes necessary to adjust the shape (area) of the electrode.

[0008]

However, when the resistance value of the thin film resistor 4 is measured and the shape (area) of the electrode is to be adjusted according to the measurement result, it is necessary to measure the resistance value. Two resist processes are required.

That is, as shown in the process diagram of FIG.
A laminated film of the resistance layer 2 and the conductor layer 3 is formed on the substrate 1 (step 220), and then a resist 6 for patterning the conductor layer 3 is formed (step 221). And
The conductor layer 3 is etched according to the resist film 6 and patterned into a predetermined shape (step 22).
2).

Subsequently, the resist 6 in the upper layer of the conductor layer 3 is removed (step 223), and thereafter, another resist process is performed again for the purpose of separating the thin film resistors from each other.
Is formed (step 224) and the resistance layer 2 is etched according to the resist 7 to divide the resistance layer 2 into a plurality of regions (step 225). Next, the resist 7 must be removed to expose the upper surface of the conductor layer 3 (step 226), and a measurement terminal must be brought into contact with the exposed portion of the conductor layer 3 to measure the sheet resistance value. . Therefore, two resist processes are required before the resistance value can be measured, which causes a problem of increasing the number of processes, which is not preferable.

An object of the present invention is to provide a circuit board electrical characteristic measuring method and apparatus capable of measuring the electrical characteristics such as the resistance value of a thin film element formed on the circuit board without increasing the number of manufacturing steps, and the circuit substrate. It is to provide a method of forming.

[0012]

In order to achieve the above object, the present invention basically provides an electric circuit by forming a conductive film on a substrate and then removing the film into a predetermined pattern shape. When forming the, after forming the film in a predetermined pattern shape, before removing the resist for forming the predetermined pattern shape, a part of the resist is peeled off to expose a part of the film, A measurement head is brought into contact with this exposed portion to measure the electrical characteristics of the film formed in a desired pattern shape.

In this case, part of the resist is removed by a chemical method using a removing liquid, a mechanical method using a peeling pin, an optical method using a laser beam or the like.

[0014]

According to the above means, after forming the film in the desired pattern shape and before removing the resist for forming the desired pattern shape, a part of the resist is peeled off to expose a part of the film. Then, contact the measurement head with this exposed area,
Since the electrical characteristics of the film formed in the desired pattern shape are measured, the number of resist steps until the resistance value can be measured is reduced from twice to once.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to illustrated embodiments.

FIG. 1 is a process chart showing an embodiment in which the method for measuring electric characteristics of a circuit board according to the present invention is applied during a manufacturing process of a thin film resistor.

In manufacturing a thin film resistor, first, a thin film resistor layer 2 and a low resistance conductor layer 3 are formed by the same forming apparatus on a substrate 1 having a through hole 5 and made of an insulator. The layers are continuously laminated (step 101).

Next, in order to measure the sheet resistance of the thin film resistance layer 2 and to separate the plurality of product element parts 6, a resist 7 is applied and exposed and developed (step 102).

That is, a plurality of product element portions 6 are provided in one circuit board 1, and thin film resistors used as products are formed therein. Further, a thin film resistor 8 for resistance measurement is formed to representatively measure the resistance value of the thin film resistor formed in the product element portion 6.

Therefore, in order to form the thin film resistor formed on the product element portion 6 and the thin film resistor 8 for resistance measurement, the resist 7 is applied and exposed and developed.

After that, the conductor layer 3 is etched, and the conductor layer 4 between the plurality of product element portions 6 and the resistance measuring thin film resistor 8 and the conductor layer 4 in the resistance measuring thin film resistor 8 is illustrated. By etching (step 103).

As a result, the isolation region 9 is formed between the product element portions 6 and the resistance measuring thin film resistor 8.

Next, the sheet resistance of the thin film resistance layer 3 of the thin film resistor 8 is measured (step 104). Specifically, as shown in detail by enlarging the vicinity of the thin film resistor 8 for resistance measurement in FIG. 2, a part of the resist 7 is peeled off by a chemical, mechanical or optical method to form a conductor layer. Part 3 is exposed. Then, the measurement head 10 for resistance measurement is provided on the exposed portion.
And the sheet resistance of the thin film resistance layer 3 of the thin film resistor 8 is measured by the measuring device 11.

Next, with the resist 7 left, between the plurality of product element portions 6 and between the conductor layers 3 of the thin film resistor pair 8 for resistance measurement and between the conductor layers 3 of the thin film resistor pair 8. The thin-film resistance layer 2 is removed at a time by etching (step 105), and then the resist 7 is peeled off (step 10).
6).

As described above, the separation of the thin film resistors in the plurality of product element portions 6 and the actual measurement of the sheet resistance of the thin film resistor 8 for resistance measurement are completed in one resist process.

Subsequently, in order to set the resistance value of the product element portion 6 to a desired value, a resist 12 for forming a conductor pattern is applied, and then exposure and development are performed in a dimension optimized according to the measured resistance value. Then, the conductor layer 3 is etched (step 108), and the sizes of the electrodes 13 and 14 constituted by the remaining conductor layer 3 are measured as shown in the plan view of FIG. The shape is changed from (1) to (3) and (3) to optimize the distance between the electrodes 13 and 14.

Finally, the resist 12 is peeled off (step 1
08), the whole process is completed.

FIG. 4 shows the resist 7 when measuring the thin film resistance.
FIG. 3 is a schematic configuration diagram showing a configuration for chemically stripping a part of the liquid by using a liquid, in which the resist removal liquid contained in the tank 20 is discharged from the tip of the thin tube 21 to the stripped portion of the resist 7, A part of the resist 7 is removed. After this, in order to improve the electrical contact, the tank 2 is placed at the peeling site.
The cleaning liquid contained in 2 is discharged from the thin tube 23 to clean the peeled portion. Finally, the dry liquid (or gas) contained in the tank 24 is discharged from the thin tube 25 to dry the peeled portion.

This completes the peeling operation of the resist 7 for measuring the resistance value.

In FIG. 4, reference numeral 26 denotes a stage on which the circuit board 1 is placed.

When the peeling of the resist 7 is completed in this way, as shown in FIG. 5, the tip of the measuring head 10 of the measuring machine 11 is brought into contact with the exposed portion of the conductor layer 3 through the peeled portion of the resist 7. Measure the resistance.

FIG. 6 is a schematic diagram showing a structure for mechanically peeling off a part of the resist 7 by using a peeling pin. The tip vibrates horizontally by a pair of vibration sources 27. A peeling pin 28 is prepared, and this peeling pin 2
After the tip of 8 is brought into contact with the peeled portion of the resist 7, the vibration of the vibration source 27 is started, and the target portion is mechanically peeled.

Thereafter, as shown in FIG. 7, the tip of the peeling pin 28 made of a good conductor is brought into contact with the exposed portion of the conductor layer 3, and the measuring terminal 29 of the measuring machine 11 is connected to the peeling pin 28.
Connect to a part of and measure the resistance.

In this case, the measuring terminal 2 of the measuring machine 11
9 is composed of a bar material of a good conductor with a sharp tip, which is shown in FIG.
The resist 7 is vibrated by the vibration source 27 as shown in FIG.
It is also possible to remove the necessary portion of the above and measure the resistance value after this.

FIG. 9 is a schematic diagram showing a structure for optically removing a part of the resist 7 by using laser light. The laser light output from the laser light source 30 is transmitted through the optical transmission line 31. By irradiating the peeled portion of the resist 7, the intended portion of the resist 7 is optically removed.

After that, the resistance value is measured in the same manner as in FIG.

As described above, according to this embodiment, after forming the conductor layer 3 as the upper layer of the thin film resistor 8 in a desired pattern shape, and before removing the resist 7 for forming the desired pattern shape, A part of the resist 7 is peeled off to expose a part of the upper conductor layer 3, a measurement head is brought into contact with this exposed portion, and the resistance value of the thin film resistor 8 formed between the thin film resistor layer 2 of the lower layer. In order to measure the resistance, the number of resist steps until the resistance value can be measured is reduced from the conventional two times to one time, and a thin film resistor having desired electric characteristics can be formed on a circuit board with a small number of steps. it can.

Although the above embodiment has described the case where the resistance value of the thin film resistor is measured, the present invention is not limited to the resistance value and may be used for measuring various electrical characteristics such as insulation performance and short circuit between lines. It can be used for controlling additional etching and half etching based on the measurement result.

Although the electrodes are formed after the element isolation in the embodiment, the element isolation may be performed after the electrodes are formed.

Further, the object to be measured is not limited to the thin film resistor, and various elements formed by laminating two or more thin films having different electric characteristics or thick film layers, or a circuit board without laminating films. It can also be applied to the case of forming an element having desired electric characteristics on the above.

FIG. 10 is an overall configuration diagram of an embodiment of a circuit board electrical characteristic measuring device according to the present invention. As shown in the plan view of FIG. 11, a plurality of product element parts 6 are provided on one circuit board 1. In the step of forming a required number of thin film resistors by the method described above, the resistance value of the thin film resistor for resistance measurement formed around the product element unit 6 is set to the product element unit 6 The thin film resistor is used as a representative measurement.

The electrical characteristic measuring apparatus of this embodiment stores and manages a plurality of magazines 40 capable of accommodating a plurality of circuit boards 1, and manages a loader / unloader 41 and a magazine 40 for automatically supplying / recovering to / from the measuring apparatus main body 42. Bar code reader 432 for identifying the lot number, which is information for performing the process, and substrate N
Identification camera 44 for reading and identifying O, station 4
A transfer robot 47 that transfers the substrates 1 to be measured one by one from the magazine 40 placed in 5 to the measurement table 46 is provided.

In this case, the hand portion of the transfer robot 47 is provided with a non-contact chuck 48 that chucks and conveys the substrate 1 to be measured in a non-contact manner.

Further, the measuring device main body 42 is provided with a measuring table 46 for supporting the substrate 1 to be measured and sequentially moving it to the positional deviation recognition section 49, the resist stripping section 50, and the resistance measuring section 51. . This measurement table 46
Has a recessed central portion so as not to contact the pattern surface of the substrate 1 to be measured.

Further, in front of the resistance measuring section 51, a head 5 for measuring the resistance by bringing a measuring pin into contact with the surface of the measuring portion.
Two are provided.

The loader / unloader 1 comprises a storage shelf 41b for storing and managing a plurality of magazines 40, and a magazine supply / collection mechanism 41a for moving the magazine 40 between the storage shelf 41b and the station 45.

The general operation of this configuration will be described with reference to the flowchart of FIG.

First, the substrate 1 to be measured is the magazine 40.
It is stored in the storage shelf 41b in a state of being stored in.

The magazine 40 to be processed is conveyed from the storage rack 41b to the station 45 by the magazine supply / collection mechanism 41a (step 111). Next, the barcode reader 43 reads the barcode attached to the magazine 40 and recognizes the lot number.

The hand portion of the transfer robot 47 is the magazine 4
The substrate 1 to be measured is moved to the position 0, the substrate 1 to be measured is chucked by the non-contact chuck 48, the substrate 1 to be measured is taken out from the magazine 40 (step 113), and is temporarily stopped while being transferred to the measurement table 46. The characters printed on the board 1 are read by the identification camera 441, and the board No.
Are identified (step 114).

At this time, the orientation of the substrate 1 is also determined depending on the orientation of the character and the presence / absence of the character at the predetermined printing position. Then, the substrate 1 is moved to the measurement table 46 (step 115). After the substrate 1 is positioned and fixed on the measurement table 46, the measurement pattern is imaged by the camera provided in the position shift recognition section 49, and the shift amount of the measurement point is recognized (step 116). Then, the position of the measurement table 46 is corrected by the amount of the deviation (step 117).

Next, using the measurement table 46, the substrate 1 is moved to just below the resist stripping section 50 to strip the resist film (step 118).

In this case, the resist stripping section 50 is constituted by chemical, mechanical or optical means as described above.

Then, the substrate 1 is measured by the measurement table 46.
Is moved to the position of the resistance measuring unit 51, the head 52 is lowered by a specified amount, and the measuring pin is brought into contact with the measurement site to measure the resistance (step 119).

When the resistance measurement is completed, the transfer robot 47
Moves, the non-contact chuck 15 chucks the substrate 1 on the measurement table 46, and collects it from the measurement table 46 into the magazine 40 (step 120).

The same operation is performed until all the processing of the substrate 1 to be measured stored in the magazine 40 is completed (step 112).

When the processing of one magazine 40 is completed, the measurement result is automatically reported online to the host controller (step 121). Then, the magazine 40 is returned to the storage rack 41b by the magazine supply / collection mechanism 41a of the loader / unloader 41 (step 122).

Thereafter, similarly, the magazine 40 to be processed next in the storage rack 41b is processed.

In this way, the loader / unloader 41
All the magazines 40 set in (1) are processed (step 110).

The electrical characteristic measuring apparatus of this embodiment is
The structure is such that the loader / unloader 41 can be operated separately from the apparatus main body 42. In the operation when the loader / unloader 41 is separated, the worker supplies / recovers the magazine 40 to / from the station 453, and the worker sets the magazine 40 in the station 45. After that, the barcode attached to the magazine 40 is read by the barcode reader 43, and the lot N
Recognize O. After that, the operation described above is performed. When the processing of one magazine 40 is completed, the measurement result is reported to the host controller, and the operator removes the magazine 40 from the station 45.

FIG. 13 shows a non-contact chuck 48 for carrying out non-contact between the magazine 40 and the measurement table 46.
The detailed structure of is shown. 13A shows a side view and FIG. 13B shows a front view. The non-contact chuck 48 suspends the air supply unit 53 for supplying clean air, the plate 54 for suspending the measurement target substrate 1 to form an air flow path, and the Bernoulli phenomenon to generate the measurement target substrate 1. Suspending suspension plate 55, front guide 5 for preventing lateral displacement of conveyed items
7, a rear guide 56. Further, since the suspended plate portion is very thin, a plurality of beams 58 are provided in parallel in the longitudinal direction in order to suppress the occurrence of bending, as shown in FIG. 13 (b).

FIG. 14 shows a state in which the non-contact chuck 48 attached to the hand of the transfer robot 47 is inserted between the substrates 1 to be measured stored in the magazine 40 and the substrates 1 are chucked. Since the processing of the first substrate 1 is completed and the second substrate 1 is being picked up, and the first substrate 1 is returned to the original shelf, there is a narrow space between the first and second substrates. The non-contact chuck 48 is inserted into the substrate, air is supplied from the air supply unit 53, negative pressure is generated by the suspension plate 55, and the substrate 1 is chucked and conveyed.

When the substrate 1 to be measured is returned to the magazine 40, the non-contact chuck 48 is inserted into the original shelf position of the magazine 402 while the substrate 1 to be measured is chucked by the reverse operation of taking out from the magazine 40. The supply air is stopped, the substrate 1 is placed on the shelf, and the non-contact chuck 48 is pulled out. This ends the operation.

Since the non-contact chuck 48 has a characteristic that the force for suppressing the lateral displacement does not work when the substrate 1 is suspended, guides 19 and 20 for preventing the lateral displacement of the substrate 1 are provided. However, since there is a gap between the guides 19 and 20 and the substrate 1, the lateral position of the substrate 1 with respect to the non-contact chuck 48 is not delicately determined. Therefore, when the measurement target substrate 1 is returned to the magazine 40, the magazine 4
A collision of 0 with the side surface of the shelf occurs and a state in which the magazine cannot be returned to the shelf of the magazine 40 occurs.

Therefore, as shown in FIG. 15, when the non-contact chuck 48 returns the substrate 1 to be measured to the magazine 40,
A fan-shaped guide 592 is provided on the front of the magazine 40 to guide the magazine 40 to be easily stored in the shelf of the magazine 40.

FIG. 15A is a cross-sectional view of the fan-shaped magazine 59 with the magazine 40 positioned, in which the substrate 1 to be measured enters the magazine 40 as seen from above.
(B) is a cross-sectional view of the state viewed from the side.

Further, as shown in FIG. 16, since the measurement target substrate 1 is stored on the shelf 60 of the magazine 40, when the measurement target substrate 1 is taken out, the height position of the measurement target substrate 1 is set. However, when the substrate 1 is stored in the shelf 60 of the magazine 40, the upper surface of the shelf 60 and the lower surface of the measurement target substrate 1 are in contact with each other at the height of the position taken out by the non-contact chuck 48. Since it becomes impossible to store, the substrate 1 can be inserted without colliding with the shelf 60 by raising it to the center position between the pitches of the shelf 60 and storing it, as shown by the dotted line. Has become.

FIG. 17 shows the structure of the substrate NO reading section. The identification camera 44 for reading the substrate NO, the drive unit 59 for driving the identification camera 44, and the image processing device 6 for processing the image data captured by the identification camera 44.
0, a ring illumination 61 that illuminates a printed portion of the measurement target substrate 1, and an illumination power source 62 that drives the ring illumination 61.

The substrate NO reading unit is provided between the station 45 and the measurement table 46, the temporary conveyance is stopped while the measurement target substrate 1 is conveyed to the measurement table 46, and the identification camera 44 captures an image of the substrate NO. Then, it is transferred to the measurement table 46 with the consistency with the substrate NO input in advance in the image processing device 60.

FIG. 18 shows an example of the character pattern of the board No. printed on the board 1 to be measured. Since the substrate 1 to be measured is divided into four during the cutting process, printing is performed at four positions so that each can grasp the substrate NO63 even after the division. The code content of the board No. 63 is printed with the year, month, day, and the order of loading, and can be managed for each board. After that, the computer displays the year, month, day,
By printing the sum check code, which is the sum of the data of the loading order, when the board No. of the measurement target board 1 is read, it is possible for the device itself to check whether the data was correctly read based on the sum check code, year, month, day, and loading order. It is a code system that makes decisions and eliminates mistakes in data exchange.

If the substrate 1 to be measured is divided into four,
Since it is not possible to know which position it was in before the division, that position is displayed in a pattern of A, B, C, and D, and this is printed after the sum check code.

FIG. 19 shows the details of the positional deviation recognition section 49 for recognizing the positional deviation of the measurement pattern on the measurement target substrate 1, the resist peeling section 50 for peeling the resist, and the resistance measuring section 51 for measuring the resistance of the measurement pattern. Fig. 19
(A) shows a front view and (b) shows a side view.

Measurement table 46 on which the substrate 1 to be measured is placed
Is composed of four axes of an X-axis table 64, a Y-axis table 65, a Z-axis table 66, and a θ-axis table 67.

The misregistration recognizing section 49 has a CCD camera 68.
And a lens 69.

The resist stripping section 50 includes a laser oscillator 70 for irradiating a laser for stripping the resist, an imaging camera 71 for monitoring, a microscope 72 equipped with these.
It is composed of an objective lens 73 for focusing the laser.

The resistance measuring section 51 is composed of a measuring pin 74 for measuring resistance, a head 52 for fixing the measuring pin 74, and an up / down cylinder 76 for vertically descending the head 52.

In this structure, the substrate 1 to be measured positioned on the measurement table 46 has the position shift recognition unit 4
9, the CCD camera 68 recognizes the shift amount of the measurement pattern, transfers the data to the main controller, corrects the shift amount, and gives it as a drive signal for the measurement table 46, and strips the measurement target substrate 1 from the resist. It is moved to the position of the section 50.

Laser light is emitted from the laser oscillator 70 to peel off the resist on the surface of the measurement pattern. Then, it moves to the position of the resistance measuring unit 51 and moves up and down the cylinder 7
6, the head 52 is lowered to raise the measuring pin 74 on the surface of the measurement pattern, and the resistance is measured.

FIG. 20 shows the detailed structure of the head 52. Since the substrate 1 to be measured has a warp, the head upper and lower parts 77 for fixing the measuring pin 74 for measuring the resistance are structured to absorb the warp by the spring 79 from the fixing part 81 fixed to the base 78. It is pushed out and held by the stopper 80.

In this structure, when the base 78 descends, the measuring pin 74 comes into contact with the measurement pattern, the head upper and lower parts 77 are pushed, and when the base 78 descends, the fixing part 81 is gently moved. Spring 79 contracts, measuring pin 7
A constant pressure is applied to the tip of No. 4.

As a result, even if the measurement points in the vertical direction are displaced, the height of the surface of the measurement portion is aligned, the contact pressure is always constant, and stable contact resistance can be obtained. Further, the measuring pin 74 has a structure that can be freely inserted and removed, so that it can be easily replaced and can be easily fitted to the measurement pattern by being inserted and removed. Furthermore, the resistance measuring cable 82 has a structure that is not exposed to the outside, and suppresses the generation and deterioration of dust.

FIG. 21 shows another embodiment of the resistance measuring section 51. In this embodiment, the resist breaking pin and the resistance measuring pin are commonly used to simplify the measuring head unit. The measuring table unit includes an X-axis table 64, a Y-axis table 65, and a Z-axis. The table 66 and the θ-axis table 67 are composed of four axes, and the positional deviation recognition unit 49
It is composed of a CCD camera 68 and a lens 69, and the resist peeling unit 50 and the resistance measuring unit 51 are combined to form a rotation measuring pin 83 and a head 52 for fixing the rotation measuring pin.

FIG. 22 shows the details of the rotation measuring pin 83. The rotation measuring pin 83 is in contact with a measurement pattern, and has a center pin 84 for measuring resistance, a lens barrel 85 for guiding the center pin 84, a protrusion 86 for preventing the center pin 84 from tilting with respect to the lens barrel 85, and a mirror. It is composed of a spiral groove 87 for rotating the center pin 84 with respect to the cylinder 85, and a rotation protrusion 88 for rotating the center pin 84 following the groove 87.

Further, the tip is provided with a plurality of protrusion ridges in order to break the resist and to obtain a stable contact resistance.
When the rotation measuring pin 83 is fixed to the head 52, and the tip of the rotation measuring pin 83 comes into contact with the measurement pattern and further descends, the rotation measuring pin 83 is provided on the center pin 84 with reference to the rotation protrusion 88 provided on the lens barrel 85. Since the groove 87 slides and the center pin 55 rotates, the resist reaches the measurement pattern surface while peeling off the resist. If the resist does not peel off by this series of operations, the resist can be peeled off and come into contact with the surface of the measurement pattern by changing the pressure applied to the center pin 84 or performing the upward and downward movements a plurality of times.

FIG. 23 is an overall configuration diagram showing another embodiment of the apparatus. In this embodiment, the substrate whose electrical characteristics have been measured is returned to another magazine to improve the throughput. It was done.

In this configuration, the loader / unloader 41 dispenses the magazine 40a containing the substrate 1 before measurement and the magazine 40b containing the substrate 1 after measurement.

Next, the lot number is recognized by the bar code reader 43a of the magazine 40a before measurement. next,
While the transfer robot 47 is transferring the measurement target substrate 1 from the magazine 40a before measurement to the measurement table 46,
The identification camera 44 identifies the substrate number. afterwards,
The measurement target substrate 1 is moved to the measurement table 46.

Then, the displacement amount of the measurement point is recognized by the camera 34 provided in the position displacement recognizing section 49, and the position of the measurement table 46 is corrected by the displacement amount. Then, the substrate 1 is moved to the resist stripping section 50 by the measurement table 46 to strip the resist. Then, the measurement table 46 is moved to the resistance measuring section 51, the head 52 is lowered by a specified amount, and the measurement pin is brought into contact with the measurement pattern to measure the resistance.

When the measurement is completed, the transfer robot 47 stores the measured substrate 1 in the magazine 40b.

When the magazine 40a before measurement is empty, the loader / unloader 41 temporarily stores this magazine as an empty magazine for housing the substrate 1 for which measurement has been completed.

This empty magazine is used as a magazine 40b for accommodating the substrate 1 for which measurement has been completed at the time of the next measurement.

When the measured substrate 1 is stored in the magazine 40b and one magazine is completed, this magazine 40b is
It is stored by the loader / unloader 41. Thereafter, all magazines are processed in the same manner.

As described above, according to the electrical characteristic measuring apparatus of this embodiment, the resist stripping section 50 and the resistance measuring section 51 have the same head configuration, so that the resist stripping and the resistance measurement are performed on the same table 40. Therefore, the mechanism of the measuring head unit can be simplified, and the resistance of the thin film resistor of the target circuit board can be measured in the same process in a short time.

Further, by providing the position shift recognition camera 69 in the measurement head portion, the shift of the measurement pattern is recognized, and the resist is stripped by performing the position correction according to the shift amount of the measurement pattern. The contact position of the measuring pin can be made accurate, and the electrical characteristics such as the resistance value can be accurately measured.

In addition, since a plurality of substrates 1 are stored in the magazine 40, supply / recovery to / from the measuring device is performed in magazine units, and the substrate 1 is taken in and out from the magazine 40 by the thin non-contact chuck 48 without contact. In addition, it is possible to prevent dust from adhering to or damage the product pattern surface during transfer, which can contribute to an improvement in yield.

Further, the non-contact chuck 48 uses the measured substrate 1
By providing a fan-shaped guide on the front of the magazine when the wafer is returned to the magazine 40, the condition that the measured substrate 1 comes into contact with the magazine 40 and does not enter the magazine 40 is eliminated, and the apparatus stops abnormally and the measured substrate 1 This has the effect of preventing damage.

Furthermore, information such as the substrate number is printed in alphanumeric characters on the substrate 1 to be measured, and the printed portion is recognized with a film. Since the measurement target substrate 1 can be visually identified without using the conversion function, the measurement target substrate 1 can be easily managed even if a person intervenes, and even if the line is stopped due to an abnormality or the like, the measurement can be performed quickly. Can recover.

Further, the measurement pin is arranged in a pin arrangement for one measurement point, and the measurement pin is provided with a stroke so that the measurement pin expands and contracts, and the head portion is rotated, so that measurement can be performed in response to the deviation of the measurement pattern. Since the pin can be moved, it can be brought into contact with the measurement pattern accurately, and by having a stroke, the pressure between the measurement pin and the measurement pattern can be made constant and a stable contact resistance can be obtained.

Further, by stocking a plurality of magazines 40 in the main body of the measuring apparatus and allowing the loader / unloader 41 to be managed to be attached / detached, the magazines 40 can be automatically supplied / recovered, and long-term continuous automatic operation is unmanned. It will be possible with the above, and labor cost can be reduced.

[0100]

As described above, according to the present invention, basically, two thin film layers having different electric characteristics are continuously formed on the substrate by the same forming apparatus, and then the upper thin film layer is desired. In a circuit board formed by removing a pattern shape and forming a thin film body having desired electric characteristics between a remaining portion and a lower thin film layer, after forming the upper thin film layer into a desired pattern shape, the desired pattern is formed. Before removing the resist for forming the shape, a part of the resist is peeled off to expose a part of the upper thin film layer, and a measurement head is brought into contact with the exposed portion to form an upper layer having a desired pattern shape. Since the electrical characteristics between the thin film layer and the lower thin film layer are measured, the electrical characteristics such as the resistance value of the thin film element formed on the circuit board can be measured without increasing the manufacturing process. can do.

[Brief description of drawings]

FIG. 1 is a process diagram showing an example in which a method for measuring electric characteristics of a circuit board according to the present invention is applied during a manufacturing process of a thin film resistor.

FIG. 2 is an enlarged cross-sectional view of a measurement target portion.

FIG. 3 is an explanatory diagram showing that the size of an electrode is changed according to a measurement result.

FIG. 4 is a configuration diagram showing an example of means for peeling a resist at a measurement target portion by a chemical method.

FIG. 5 is an explanatory diagram showing a state in which a measuring head is brought into contact with a portion where the resist is peeled off and electric characteristics are measured.

FIG. 6 is a configuration diagram showing an embodiment of means for peeling the resist at the measurement target site by a mechanical method.

FIG. 7 is an explanatory diagram showing a state in which the measuring head is brought into contact with the portion where the resist is peeled off in FIG. 6 to measure the electrical characteristics.

FIG. 8 is a configuration diagram showing another embodiment of means for peeling the resist at the measurement target site by a mechanical method.

FIG. 9 is a configuration diagram showing an example of means for peeling the resist at the measurement target site by an optical method.

FIG. 10 is an overall configuration diagram showing an embodiment of an electrical characteristic measuring device of the present invention.

FIG. 11 is a plan view showing an example of a circuit board for measuring electrical characteristics.

FIG. 12 is a flowchart showing an operation in the configuration of FIG.

FIG. 13 is a detailed configuration diagram of a non-contact chuck.

FIG. 14 is an operation explanatory view of the non-contact chuck.

FIG. 15 is a configuration diagram of a fan-shaped guide for safely returning the circuit board to the magazine.

FIG. 16 is an explanatory diagram of a state where the circuit board is taken in and out.

FIG. 17 is a configuration diagram of a substrate NO identification device.

FIG. 18 is a schematic diagram of board information.

FIG. 19 is a detailed configuration diagram of a measurement head unit and a table.

FIG. 20 is a detailed configuration diagram of a head.

FIG. 21 is a detailed configuration diagram showing another example of the measurement head.

FIG. 22 is a detailed configuration diagram of a measurement pin.

FIG. 23 is an overall configuration diagram showing another embodiment of the electrical characteristic measuring device.

FIG. 24 is a cross-sectional view showing an example of a thin film resistor formed in a circuit board.

FIG. 25 is a process chart showing a conventional electrical characteristic measuring method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circuit board, 2 ... Thin film resistance layer, 3 ... Conductor layer, 4 ... Thin film resistor, 7 ... Resist, 10 ... Measuring head, 11 ... Measuring machine, 20 ... Removal liquid tank, 27 ... Vibration source, 30 ... Laser light source, 40 ... Magazine, 41 ... Loader / unloader,
43 ... Bar code reader, 44 ... Identification camera, 46 ... Measurement table, 47 ... Transfer robot, 48 ... Non-contact chuck, 49 ... Misalignment recognition section, 50 ... Resist stripping section, 5
1 ... Resistance measuring part, 83 ... Rotation measuring pin.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nao Nakayama 2-9-1 Aise-cho, Hitachi City, Ibaraki Hitachi Equipment Engineering Co., Ltd. (72) Inventor Masahiro Umeda 1 Horiyamashita, Hadano City, Kanagawa Japan (72) Inventor Izumi Shimizu 1 Horiyamashita, Hadano City, Kanagawa Pref., Kanagawa Factory, Hitate Manufacturing Co., Ltd. (72) Akihiro Kusomogi, 1 Horiyamashita, Hadano City, Kanagawa, Ltd.

Claims (16)

[Claims] 1. After forming a conductive film on a substrate,
What is claimed is: 1. An electrical property measuring method for measuring an electrical property of a film on a circuit board formed by removing the film into a predetermined pattern shape, the method comprising: forming the film into a predetermined pattern shape; Before removing the resist for forming the shape, a part of the resist is peeled off to expose a part of the film, and the measurement head is brought into contact with the exposed portion, and the electrical characteristics of the film formed into a desired pattern shape. A method for measuring electrical characteristics of a circuit board, comprising: 2. An electrical property measuring method for measuring electrical properties of a lower layer film after laminating and forming two or more films having different electrical properties by the same forming apparatus on a substrate, and at least an upper layer film having a predetermined pattern shape. After the formation, the resist for forming the predetermined pattern shape is removed, a part of the resist is peeled off to expose a part of the upper layer film, and the measurement head is brought into contact with the exposed portion, A method for measuring electrical characteristics of a circuit board, characterized by measuring electrical characteristics of a lower layer film through an upper layer film formed in a predetermined pattern shape. 3. The method for measuring electrical characteristics of a circuit board according to claim 1, wherein a part of the resist is chemically removed by a removing liquid. 4. The method for measuring electrical characteristics of a circuit board according to claim 1, wherein a part of the resist is mechanically removed by a peeling pin. 5. The method for measuring electric characteristics of a circuit board according to claim 1, wherein a part of the resist is optically removed by light such as laser light. 6. The method for measuring electric characteristics of a circuit board according to claim 1, wherein a part of the resist is mechanically removed by a measuring head for measuring electric characteristics. 7. After forming a conductive film on the substrate,
In a method for forming a circuit board by removing the film into a predetermined pattern shape to form an electric circuit, after forming the film into a predetermined pattern shape and before removing a resist for forming the predetermined pattern shape, A part of the resist is peeled off to expose a part of the film, a measurement head is brought into contact with the exposed part, the electrical characteristics of the film formed into a desired pattern shape are measured, and the circuit forming condition is determined based on the measurement result. A method for forming a circuit board, characterized in that the method is defined. 8. The method for forming a circuit board according to claim 7, wherein a part of the resist is chemically removed by a removing liquid. 9. The method for forming a circuit board according to claim 7, wherein a part of the resist is mechanically removed by a peeling pin. 10. The part of the resist is optically removed by light such as laser light.
A method for forming a circuit board as described above. 11. The method for forming a circuit board according to claim 7, wherein a part of the resist is mechanically removed by a measuring head for measuring electrical characteristics. 12. An electrical property measuring device for measuring electrical properties of a lower layer film after continuously laminating two or more films having different electrical properties on a substrate by the same forming device, and measuring at least the upper layer film. After forming the film in a predetermined pattern shape and before removing the resist for forming the predetermined pattern shape, a peeling means for peeling a part of the resist to expose a part of the upper layer film, and the peeling means. Positioning means for bringing the measuring head into contact with the portion where the resist is peeled off by means, and measuring means for measuring the electrical characteristics of the lower layer film through the upper layer film formed in a predetermined pattern shape through the positioned measuring head; An electric characteristic measuring apparatus for a circuit board, comprising: 13. The peeling means chemically removes a part of the resist with a removing liquid.
A circuit board electrical characteristic measuring device as described. 14. The peeling means mechanically removes a part of the resist with a peeling pin.
A circuit board electrical characteristic measuring device as described. 15. The circuit board electrical characteristic measuring device according to claim 12, wherein the peeling means optically removes a part of the resist by light such as laser light. 16. The circuit board electrical characteristic measuring apparatus according to claim 12, wherein the stripping means mechanically removes a part of the resist by a measuring head.