JPH06122084A - Method for controlling laser beam machine - Google Patents

Method for controlling laser beam machine

Info

Publication number
JPH06122084A
JPH06122084A JP4300573A JP30057392A JPH06122084A JP H06122084 A JPH06122084 A JP H06122084A JP 4300573 A JP4300573 A JP 4300573A JP 30057392 A JP30057392 A JP 30057392A JP H06122084 A JPH06122084 A JP H06122084A
Authority
JP
Japan
Prior art keywords
position sensor
laser processing
laser beam
processed
processing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4300573A
Other languages
Japanese (ja)
Inventor
Tetsuo Kiyofuji
哲生 清藤
Yuji Saito
雄二 斉藤
Naohito Soma
直仁 相馬
Yukihisa Fukuda
幸久 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP4300573A priority Critical patent/JPH06122084A/en
Publication of JPH06122084A publication Critical patent/JPH06122084A/en
Withdrawn legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To machine with a laser beam more precisely over a total length of a subject to be machined by controlling a position of machining head with a preliminarily stored profile data of the subject to be machined. CONSTITUTION:In a laser beam machining device having a main shaft bed 2, a laser beam machining head 7 and a position sensor 12, and machining by controlling so that an interval between the laser beam machining head 7 and a surface to be machined is kept in a specified value based on a signal of the position sensor, against the territory that the position sensor 12 can not detect, the position of the laser beam machining head 7 is controlled based on the profile data preliminarily inputted. In such a way, the machining can be steadily executed also even on the portion so as to be made impossible for machining because a size of area to be measured opposing to the position sensor 12 is not enough, and the highly precise machining over the total length of the subject to be machined can be realized.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、圧延ロール等に用いる
ための円筒状回転体の表面に、微細な凹凸や孔を形成す
るためのレーザ加工装置の制御方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling a laser processing apparatus for forming fine irregularities and holes on the surface of a cylindrical rotating body for use in rolling rolls and the like.

【0002】[0002]

【従来の技術】レーザ光束により、円筒体の表面に微細
な凹凸を形成したり、微細な孔を穿ったりする技術が、
既に実用化されている(特開平2−11285号公報、
特開昭55−94790号公報など参照)。このような
レーザ加工装置に於ける加工精度は、レーザ光の焦点距
離の精度に依存するので、集光レンズと被加工面との間
隔を、加工作業中は常に所定の範囲内に保つ必要があ
る。
2. Description of the Related Art A technique for forming fine irregularities on a surface of a cylindrical body or forming fine holes with a laser beam is known.
It has already been put into practical use (Japanese Patent Laid-Open No. 11285/1990,
See JP-A-55-94790). Since the processing accuracy in such a laser processing apparatus depends on the accuracy of the focal length of the laser light, it is necessary to always keep the distance between the condenser lens and the surface to be processed within a predetermined range during the processing operation. is there.

【0003】集光レンズと被加工面との間隔を一定に保
つ手法としては、集光レンズを内蔵したレーザ加工ヘッ
ドに隣接する位置に例えば電磁式の位置(距離)センサ
を設け、この位置センサの出力に基づくフィードバック
制御にてレーザ加工ヘッドの位置調節制御を行うように
したものが知られている。
As a method for keeping the distance between the condenser lens and the surface to be processed constant, for example, an electromagnetic position (distance) sensor is provided at a position adjacent to a laser processing head having a condenser lens built therein, and this position sensor is used. It is known that the position adjustment control of the laser processing head is performed by feedback control based on the output of the laser.

【0004】[0004]

【発明が解決しようとする課題】しかるに、レーザ加工
ヘッドと位置センサとを同一位置に設けることは実質的
に不可能であり、また位置センサの感度特性から、位置
センサの感応部に対向する被測定面の面積が不十分であ
ると、必要な信号を得ることができなくなる。そのた
め、特に熱膨張差を考慮して中央部と軸方向端部とに径
寸法差を備えさせたロールの場合には、軸方向端部に於
ける集光レンズと被加工面との間隔を位置センサによっ
て測定することができないことから、集光レンズと被加
工面との間隔を所定の精度に保つことができなかった。
However, it is practically impossible to dispose the laser processing head and the position sensor at the same position, and the sensitivity characteristic of the position sensor makes it possible to face the sensitive portion of the position sensor. If the area of the measurement surface is insufficient, it will not be possible to obtain the required signal. Therefore, in particular, in the case of a roll having a diameter difference between the central portion and the axial end portion in consideration of the difference in thermal expansion, the distance between the condensing lens and the processed surface at the axial end portion is Since it cannot be measured by the position sensor, the distance between the condenser lens and the surface to be processed cannot be maintained at a predetermined accuracy.

【0005】本発明は、このような従来技術の不都合を
解消すべく案出されたものであり、その主な目的は、位
置センサの被測定面との対向面積が十分に得られないた
めに加工不能となるような部位にも安定した加工が施せ
るように改良されたレーザ加工装置の制御方法を提供す
ることにある。
The present invention has been devised in order to eliminate such disadvantages of the prior art, and its main purpose is that the area of the position sensor facing the surface to be measured cannot be sufficiently obtained. It is an object of the present invention to provide a method for controlling a laser processing apparatus that is improved so that stable processing can be performed even on a portion that cannot be processed.

【0006】[0006]

【課題を解決するための手段】このような目的は、本発
明によれば、円筒体からなる被加工物の軸を回転自在に
支持しかつ回転駆動するための主軸ベッドと、被加工物
の回転軸線に沿って移動可能なテーブル上に被加工面に
対して接離可能なように載置されたレーザ加工ヘッド
と、被加工面の位置を検出する位置センサとを有し、レ
ーザ加工ヘッドと被加工面との間隔が所定値を保つよう
に位置センサの信号に基づいて制御しつつ被加工面に対
して周方向及び軸方向に連続的にレーザ加工を施すため
のレーザ加工装置に於て、位置センサが検出不能な領域
に於けるレーザ加工ヘッドと被加工面との間隔調節制御
を、被加工面に対するレーザ加工ヘッドの適正間隔の設
定を位置センサが検出可能な領域にて行った後、予め記
憶しておいた被加工物のプロフィルデータに従って行う
ことによって達成される。
According to the present invention, such a purpose is to provide a spindle bed for rotatably supporting and rotatably driving a shaft of a workpiece, which is a cylindrical body, and a workpiece. A laser processing head having a laser processing head mounted on a table movable along a rotation axis so as to be able to come in contact with and separate from the processing surface, and a position sensor for detecting the position of the processing surface. A laser processing apparatus for continuously performing laser processing on a surface to be processed in a circumferential direction and an axial direction while controlling the distance between the surface to be processed and a surface to be processed based on a signal from a position sensor. Then, in the region where the position sensor cannot detect, the gap adjustment control between the laser processing head and the surface to be processed was performed in the region where the position sensor can detect the setting of the proper distance between the laser processing head and the surface to be processed. Later, the workpiece to be stored in advance It is accomplished by performing in accordance with the profile data.

【0007】[0007]

【作用】このような構成によれば、位置センサによる検
出が可能な部位にて加工ヘッドと被加工面との間隔を適
正な値に調整した後、予め記憶してあるプロフィルデー
タに基づいて被加工面とレーザ加工ヘッドとの間隔調節
制御が行われる。即ち、位置センサによる検出が不能な
部位については、近似的な数値制御によって処理される
こととなる。
According to this structure, the distance between the machining head and the surface to be machined is adjusted to an appropriate value at a site that can be detected by the position sensor, and then the object to be machined is stored based on the profile data stored in advance. The distance adjustment control between the processing surface and the laser processing head is performed. That is, a portion that cannot be detected by the position sensor is processed by approximate numerical control.

【0008】[0008]

【実施例】以下に添付の図面に示された具体的な実施例
に基づいて本発明の構成を詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail below with reference to specific embodiments shown in the accompanying drawings.

【0009】図1は、本発明に基づき構成されたレーザ
加工装置を示している。この装置は、旋盤と概ね同様な
構成を有しており、被加工物としてのロール1を回転自
在に支持しかつ回転駆動するための主軸ベッド2と、旋
盤の刃物台の送り装置に相当する移動テーブル3とから
なっており、主にロール表面1aに微細な孔を等間隔を
おいて連続的に形成する加工が行えるようになってい
る。
FIG. 1 shows a laser processing apparatus constructed according to the present invention. This device has a structure similar to that of a lathe, and corresponds to a spindle bed 2 for rotatably supporting and rotationally driving a roll 1 as a workpiece, and a feed device for a tool rest of the lathe. The movable table 3 is used to mainly perform a process of continuously forming fine holes at regular intervals on the roll surface 1a.

【0010】移動テーブル3は、床上に固定される固定
ベッド4と、固定ベッド4上にてロール1の回転軸に平
行な方向に横移動するX軸テーブル5と、X軸テーブル
5上にてロール1の回転軸に直交する方向に前後移動す
るY軸テーブル6とからなり、集光レンズを内蔵したレ
ーザ加工ヘッド7、ビームエキスパンダ8、及びレーザ
発振器9等をY軸テーブル6上に搭載している。そして
X軸テーブル5にてロール1の回転に同期してレーザ加
工ヘッド7の横送りピッチを自動制御し、Y軸テーブル
6にてロール1とレーザ加工ヘッド7との間隔の初期位
置設定を行うようになっている。なお、主軸ベッド2並
びに移動テーブル3自体は、公知の工作機械の構造を流
用し得るものであり、また本発明の本質と直接関係しな
いので、その詳細な説明を割愛する。
The moving table 3 includes a fixed bed 4 fixed on the floor, an X-axis table 5 horizontally moving on the fixed bed 4 in a direction parallel to the rotation axis of the roll 1, and an X-axis table 5 on the X-axis table 5. A Y-axis table 6 that moves back and forth in a direction orthogonal to the rotation axis of the roll 1, and a laser processing head 7 with a built-in condenser lens, a beam expander 8, and a laser oscillator 9 are mounted on the Y-axis table 6. is doing. The X-axis table 5 automatically controls the lateral feed pitch of the laser processing head 7 in synchronization with the rotation of the roll 1, and the Y-axis table 6 sets the initial position of the distance between the roll 1 and the laser processing head 7. It is like this. The spindle bed 2 and the moving table 3 themselves can use the structure of a known machine tool, and are not directly related to the essence of the present invention, so a detailed description thereof will be omitted.

【0011】Y軸テーブル6上には、図2に併せて示す
ように、Y軸テーブル6の移動方向と同一方向にサーボ
モータ10にて駆動される追従テーブル11が搭載され
ている。そしてこの追従テーブル11上には、位置セン
サ12がレーザ加工ヘッド7と共に搭載されている。
As shown in FIG. 2, a follow-up table 11 driven by a servo motor 10 in the same direction as the moving direction of the Y-axis table 6 is mounted on the Y-axis table 6. The position sensor 12 is mounted on the tracking table 11 together with the laser processing head 7.

【0012】レーザ加工ヘッド7と位置センサ12と
は、ロール1の回転軸が直交する共通の平面上にてそれ
ぞれのロール表面1aとの対向面の中心が所定距離Lを
おいて隣接するように取付けられている。しかもロール
1の回転方向(図2に於ける矢印A)について手前側に
位置センサ12が置かれている。
The laser processing head 7 and the position sensor 12 are arranged so that the centers of the surfaces of the laser processing head 7 facing the roll surface 1a are adjacent to each other with a predetermined distance L on a common plane where the rotation axes of the rolls 1 are orthogonal to each other. Installed. Moreover, the position sensor 12 is placed on the front side in the rotation direction of the roll 1 (arrow A in FIG. 2).

【0013】さて、本装置に於ては、ロール1を所定の
速度で回転させつつレーザスポットをパルス的にロール
表面1aに照射することにより、所定のリード角をもつ
螺旋状の仮想線上に微細な孔を連続的に穿つ加工が行わ
れる。ここで孔径の精度は、焦点距離、即ち、レーザ加
工ヘッド7に内蔵された集光レンズ(図示せず)とロー
ル表面1aとの間隔の寸法精度に依存するので、これを
極めて高精度に維持する必要がある。
In the present apparatus, by rotating the roll 1 at a predetermined speed and irradiating the roll surface 1a with a laser spot in a pulsed manner, a fine phantom line having a predetermined lead angle is formed on the spiral virtual line. Processing is performed to continuously drill large holes. Here, the accuracy of the hole diameter depends on the focal length, that is, the dimensional accuracy of the distance between the condensing lens (not shown) built in the laser processing head 7 and the roll surface 1a. There is a need to.

【0014】位置センサ12は、渦電流を利用した非接
触式電磁近接センサ等からなり、ロール表面1aとの間
隔寸法に比例したアナログ出力を発する。このアナログ
出力は、A/D変換ユニット13にてディジタル出力に
変換され、位置決めユニット14に入力される。位置決
めユニット14に於ては、予め測定された適正焦点距離
(ロール表面1aとレーザ加工ヘッド7との間の適正間
隔データ)に対応する値と位置センサ12が検出した実
際の間隔寸法との偏差を演算し、必要な移動量をサーボ
ドライバ15へ出力する。この移動指令に応じてサーボ
モータ10を駆動し、追従テーブル11にロール1の軸
線に直交する向きの変位を与えることにより、ロール表
面1aとレーザ加工ヘッド7との間隔が規定値に保たれ
る。
The position sensor 12 is composed of a non-contact type electromagnetic proximity sensor utilizing an eddy current and the like, and produces an analog output proportional to the distance dimension with the roll surface 1a. This analog output is converted into a digital output by the A / D conversion unit 13 and input to the positioning unit 14. In the positioning unit 14, a deviation between a value corresponding to a proper focal length measured in advance (proper distance data between the roll surface 1a and the laser processing head 7) and an actual distance dimension detected by the position sensor 12 is detected. Is calculated and the required movement amount is output to the servo driver 15. The servo motor 10 is driven in accordance with this movement command, and the displacement in the direction orthogonal to the axis of the roll 1 is applied to the follow-up table 11, whereby the distance between the roll surface 1a and the laser processing head 7 is maintained at a specified value. .

【0015】なお、レーザ加工ヘッド7と位置センサ1
2とは、上記したように、ロール1の回転軸が直交する
共通の平面上に互いに隣接して置かれているが、上記仮
想線のリード角が極く小さい場合には、レーザ加工ヘッ
ド7と位置センサ12との中心と上記仮想線とのずれは
無視し得ると言える。
The laser processing head 7 and the position sensor 1
As described above, 2 is placed adjacent to each other on a common plane in which the rotation axes of the rolls 1 are orthogonal to each other. However, when the lead angle of the imaginary line is extremely small, the laser processing head 7 It can be said that the deviation between the center of the position sensor 12 and the virtual line can be ignored.

【0016】一方、図3に示したように、ロール1の軸
方向両端部が中央部よりも大径である場合、ロール1の
軸方向両端部および輪郭の曲率が変化する部分(図3に
於けるB〜C並びにD〜Eの領域)は、位置センサ12
の感応部に対向するロール表面1aの面積が小さくなる
ため、正確な距離信号が得られなくなる。そこで本発明
に於ては、このような、位置センサ12の信号に信頼性
が得られなくなる領域に於ける追従テーブル11の制御
に、予め記憶しておいたロール1のプロフィルデータを
用いるものとしている。
On the other hand, as shown in FIG. 3, when both ends of the roll 1 in the axial direction are larger in diameter than the central part, both ends of the roll 1 in the axial direction and a portion where the curvature of the contour changes (see FIG. 3). Areas B to C and D to E) are position sensors 12
Since the area of the roll surface 1a facing the sensitive section of 1 becomes small, an accurate distance signal cannot be obtained. Therefore, in the present invention, it is assumed that the profile data of the roll 1 stored in advance is used for the control of the follow-up table 11 in the region where the signal of the position sensor 12 becomes unreliable. There is.

【0017】先ず、位置センサ12による検出が可能な
部位(A点)で追従テーブル11の位置決めを行い、ロ
ール表面1aとレーザ加工ヘッド7との間隔が適正な値
となるようにレーザ加工ヘッド7を位置決めする。それ
と同時に、この時の位置センサ12の出力値(適正間隔
データ)を位置決めユニット14内の追従データメモリ
に格納しておく。
First, the follow-up table 11 is positioned at a portion (point A) that can be detected by the position sensor 12, and the laser processing head 7 is adjusted so that the distance between the roll surface 1a and the laser processing head 7 becomes an appropriate value. To position. At the same time, the output value (appropriate interval data) of the position sensor 12 at this time is stored in the follow-up data memory in the positioning unit 14.

【0018】次いでX軸テーブル6によってレーザ加工
ヘッド7を加工開始点(B)に移動して加工を開始する
が、B〜Cの領域は位置センサ12の信号に基づくフィ
ードバック制御を行わず、プロフィルデータ及び適正間
隔データに基づく近似補正追従制御を行い、レーザ加工
ヘッド7の位置を制御する。そしてC〜Dの区間は、位
置センサ12の出力が有効となる領域なので、適正間隔
データと位置センサ出力との比較によるフィードバック
制御を行う。そしてD〜Eの区間は、再び近似補正追従
制御を行う。
Next, the laser processing head 7 is moved to the processing start point (B) by the X-axis table 6 to start the processing, but in the areas B to C, the feedback control based on the signal of the position sensor 12 is not performed, and the profile is obtained. The position of the laser processing head 7 is controlled by performing approximate correction follow-up control based on the data and the proper interval data. Since the section from C to D is an area in which the output of the position sensor 12 is valid, feedback control is performed by comparing the proper interval data with the position sensor output. Then, in the sections D to E, the approximate correction follow-up control is performed again.

【0019】[0019]

【発明の効果】このように本発明によれば、位置センサ
が検出できない領域は、予め与えておいたプロフィルデ
ータに基づいて加工ヘッドの位置を制御するので、被加
工物の全長に渡って高精度なレーザ加工を施すことが可
能となる。
As described above, according to the present invention, since the position of the machining head is controlled based on the profile data given in advance in the area where the position sensor cannot detect, it is possible to increase the height over the entire length of the workpiece. It is possible to perform accurate laser processing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明が適用されるレーザ加工装置の模式的な
斜視図。
FIG. 1 is a schematic perspective view of a laser processing apparatus to which the present invention is applied.

【図2】本発明装置の要部構成図。FIG. 2 is a configuration diagram of a main part of the device of the present invention.

【図3】制御領域区分を示す説明図FIG. 3 is an explanatory diagram showing control area divisions.

【符号の説明】[Explanation of symbols]

1 ロール 1a ロール表面 2 主軸ベッド 3 移動テーブル 4 固定ベッド 5 X軸テーブル 6 Y軸テーブル 7 レーザ加工ヘッド 8 ビームエキスパンダ 9 レーザ発振器 10 サーボモータ 11 追従テーブル 12 位置センサ 13 A/D変換ユニット 14 位置決めユニット 15 サーボドライバ 1 Roll 1a Roll Surface 2 Spindle Bed 3 Moving Table 4 Fixed Bed 5 X-Axis Table 6 Y-Axis Table 7 Laser Machining Head 8 Beam Expander 9 Laser Oscillator 10 Servo Motor 11 Tracking Table 12 Position Sensor 13 A / D Conversion Unit 14 Positioning Unit 15 Servo driver

───────────────────────────────────────────────────── フロントページの続き (72)発明者 福田 幸久 北九州市戸畑区大字中原46−59 日鐵プラ ント設計株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yukihisa Fukuda 46-59 Nakahara, Tobata-ku, Kitakyushu City Nittetsu Plant Design Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 円筒体からなる被加工物の軸を回転自在
に支持しかつ回転駆動するための主軸ベッドと、前記被
加工物の回転軸線に沿って移動可能なテーブル上に被加
工面に対して接離可能なように載置されたレーザ加工ヘ
ッドと、前記被加工面の位置を検出する位置センサとを
有し、前記レーザ加工ヘッドと前記被加工面との間隔が
所定値を保つように前記位置センサの信号に基づいて制
御しつつ前記被加工面に対して周方向及び軸方向に連続
的にレーザ加工を施すためのレーザ加工装置の制御方法
であって、 前記位置センサが検出不能な領域に於ける前記レーザ加
工ヘッドと前記被加工面との間隔調節制御を、前記被加
工面に対する前記レーザ加工ヘッドの適正間隔の設定を
前記位置センサが検出可能な領域にて行った後、予め記
憶しておいた前記被加工物のプロフィルデータに従って
行うことを特徴とするレーザ加工装置の制御方法。
1. A spindle bed for rotatably supporting and rotatably driving a shaft of a workpiece, which is a cylindrical body, and a workpiece surface on a table movable along the rotation axis of the workpiece. It has a laser processing head mounted so as to be able to come in contact with and separate from it, and a position sensor for detecting the position of the surface to be processed, and the distance between the laser processing head and the surface to be processed maintains a predetermined value. Is a control method of a laser processing apparatus for continuously performing laser processing in the circumferential direction and the axial direction on the surface to be processed while controlling based on the signal of the position sensor, wherein the position sensor detects After adjusting the distance between the laser processing head and the surface to be processed in an impossible area, after setting the proper distance of the laser processing head to the surface to be processed in the area where the position sensor can detect. , Remember in advance Control method for a laser machining apparatus which is characterized in that in accordance with profile data of the workpiece are.
JP4300573A 1992-10-14 1992-10-14 Method for controlling laser beam machine Withdrawn JPH06122084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4300573A JPH06122084A (en) 1992-10-14 1992-10-14 Method for controlling laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4300573A JPH06122084A (en) 1992-10-14 1992-10-14 Method for controlling laser beam machine

Publications (1)

Publication Number Publication Date
JPH06122084A true JPH06122084A (en) 1994-05-06

Family

ID=17886471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4300573A Withdrawn JPH06122084A (en) 1992-10-14 1992-10-14 Method for controlling laser beam machine

Country Status (1)

Country Link
JP (1) JPH06122084A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110000639A (en) * 2019-04-26 2019-07-12 合肥工业大学 A kind of roller diameter based on roll grinder and taper on-position measure device and measurement method
US11241757B2 (en) 2004-01-09 2022-02-08 Hamamatsu Photonics K.K. Laser processing method and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11241757B2 (en) 2004-01-09 2022-02-08 Hamamatsu Photonics K.K. Laser processing method and device
CN110000639A (en) * 2019-04-26 2019-07-12 合肥工业大学 A kind of roller diameter based on roll grinder and taper on-position measure device and measurement method

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