JPH06118100A - Probe card - Google Patents

Abstract

PURPOSE:To give the predetermined needle pressure to a probe, position the probe accurately and opposingly on a bump of IC chip, make mutual position between probes accurate, and prevent the probe from slipping down from the bump when overdrive is applied when the probe card which has extremely thin probes which are arranged across minute space contacts the bump of IC chip. CONSTITUTION:A probe card is provided with a frame 20 in which a through hole 24 which is engaged with an opening 11 of a substrate 10 and has a difference of step 26 between a large opening 24a and a small opening 24b and both openings 24a, 24b is formed, a groove 23 which is formed in a peripheral section 25 of the small opening 24b of the frame 20, in the direction of thickness of the peripheral section 25, and over the total length of the thickness, and a frame 40 which is fixed on the frame 20. Further, it is provided with a probe 30 which is fixed between the frames 20 and 40 and whose vicinity of tip 32 is inserted into the groove 23, elastic synthetic resin 70 which is filled in the large opening 24a and an opening 41 of the frame 40 so as to imbed a part of the probe 30, and a pressing plate 60 which is adhered and accumulated on the synthetic resin 70.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for measuring the electrical characteristics of a semiconductor chip having a high density and miniaturization.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to FIG. The probe card used to measure the electrical characteristics of the IC chip 90 includes a substrate 1 on the surface of which a wiring pattern 1a is formed, and an opening 1b formed at substantially the center of the substrate 1.
It has an insulative frame (also called a ring) 2 fitted in and a plurality of probes 3 attached to an inclined surface 2a of this frame 2 with an epoxy resin 4 or the like.

The tip 3a of the probe 3 is formed in a substantially V-shape so as to project from the through hole 2b formed in the substantially central portion of the frame 2 toward the back side of the substrate 1 by a predetermined dimension. ,
The rear end 3b of the probe 3 is connected to the wiring pattern 1a.

The probe card thus constructed is connected to a measuring device (not shown) called a prober, and the tip 3a of the probe 3 is applied to the bump 91 which is an electrical input / output portion of the IC chip 90 with a predetermined contact pressure. The electrical characteristics of the IC chip 90 are measured by bringing them into contact with each other.

[0005]

However, the above-mentioned conventional probe card has the following problems.
That is, as the density and the size of the IC chip 90 increase, it becomes difficult to properly contact the probe 3 with the bump 91 of the IC chip 90.

For example, when the dimension between the bumps 91 becomes about 75 μm, an extremely fine probe 3 having a diameter of about 30 μm must be used. However, with such a probe pressure of the thin probe 3 itself,
It is difficult to obtain a predetermined contact pressure between the probe 3 and the bump 91. For example, even if a 1 mil overdrive is applied to the probe card, only a contact pressure of about 5 g / mm ² can be obtained, and the contact resistance between the probe 3 and the bump 91 becomes high. Difficult to do.

Further, if each probe 3 is arranged at a position that exactly opposes a predetermined bump 91, and the mutual position between the probes 3 is not accurately maintained even when the above-mentioned overdrive is applied. I won't.

Further, since the heights of the bumps 91 and the protruding dimensions of the probes 3 do not always make contact, that is, not all the probes 3 and the bumps 91 are in contact with each other at the same time. The probe 3 that comes into contact with the bump 3 may slip off the bump 91. In this case, the tip 3a of the probe 3 may be deformed.

The present invention was devised in view of the above circumstances, and even in a probe card provided with a large number of extremely fine probes at minute intervals, a predetermined electric input / output section of a semiconductor chip is provided. Contact is made with contact pressure, the position of each probe with respect to the electrical input / output section and the mutual position between the probes are accurately maintained, and the tip of the probe is electrically connected even when overdrive is applied. It is an object of the present invention to provide a probe card that does not slip off from the output section.

[0010]

In order to solve the above-mentioned problems, a probe card according to a first aspect of the present invention is a probe for measuring electrical characteristics of a semiconductor chip by bringing a probe into contact with the electrical input / output portion of the chip. In the card, an insulating first substrate provided with a predetermined wiring pattern and a through hole fitted into an opening of the substrate and having a large opening, a small opening and a step between the both openings are provided. A frame, a plurality of grooves formed in the peripheral portion of the small opening of the first frame in the thickness direction of the peripheral portion and over the entire length of this thickness, and an insulating second portion fixed on the first frame. Fixed between the first frame and the second frame,
A plurality of probes with the tip vicinity inserted into the groove and the tips protruding from the lower surface of the first frame, and filling into the opening of the second frame and the large opening so as to embed a part of the probes. The insulating synthetic resin having elasticity and a pressing plate closely adhered on the synthetic resin are provided.

According to a second aspect of the probe card of the first aspect, the probe card is arranged so as to close the small opening and the groove of the first frame between the step of the through hole of the first frame and the synthetic resin. It is equipped with an insulating film. The probe card according to claim 3 is the probe card according to claim 1 or 2, wherein the first frame and the second frame are both rectangular, square, or annular.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 7 are drawings for explaining an embodiment of the present invention, FIG. 1 is a sectional explanatory view, FIG. 2 is a plan view of a first frame, and FIG. 3 is a frame constituting the first frame. Plan view of the member, FIG.
3 is a sectional view taken along the line AA of FIG. 3, FIG. 5 is a sectional view taken along the line BB of FIG. 3, FIG. 6 is a partial plan view of the first frame, and FIG. 7 is a modified first frame. It is a partial perspective view.

The probe card of this embodiment is a probe card used when an electrical characteristic of an IC chip is measured by bringing a tip of a probe into contact with a bump formed on the IC chip as an electrical input / output section. That is, the board 10 having a predetermined wiring pattern 81 formed on the upper surface and the stepped opening 11 of the board 10 are fitted to each other, and the large opening 24a and the small opening 24b and the step 26 between the openings 24a and 24b are formed. An insulative frame 20 (first frame) having a through-hole 24 having an insulative film 50, an insulative film 50 provided on the step 26 so as to cover the step 26 and the small opening 24b, and a frame In the peripheral portion 25 of the small opening 24b of 20, in the thickness direction of the peripheral portion 25 (Z-Z direction shown in FIGS. 1 and 5),
It has a plurality of grooves 23 formed over the entire length of this thickness.

Further, in this probe card, an insulative frame 40 (second frame) adhered and fixed on the frame 20 by epoxy resin or the like and a portion 32 near the tip are bent in a substantially V shape. , Near the tip 32 penetrates the film 50 and is inserted into the groove 23 of the frame 20 so that the tip 31 projects from the lower surface of the frame 20,
The rear end is connected to the wiring pattern 81 of the substrate 10 by soldering 82, and the arm portion (the tip 31 and the vicinity of the tip) is provided between the frame 20 and the frame 40.
(Except for 32) 33 The probe (probe) 30 to which a part of it is fixed, the large opening 24a of the frame 20 and the opening 41 of the frame 40 on the film 50 An elastic synthetic resin 70 filled so as to embed a part thereof and a part of the vicinity 32 of the tip, and is adhered and laminated on the synthetic resin 70 and fixed to the frame 40 so as to cover the opening 41 of the frame 40. And a pressing plate 60.

The frames 20 and 40 are made of synthetic resin, quartz, glass or the like, and usually thermosetting transparent insulating synthetic resin is used. However, the surface of the metal may be coated with an insulating synthetic resin or the like. For the film 50, synthetic resin such as Saran wrap (trade name) is used. The probe 30 is made of metal, and the pressing plate 60 is made of transparent and hard synthetic resin or glass. The tip 30 has its tip 31.
Are brought into contact with the bumps 91 provided on the IC chip 90 shown in FIG.

In the present embodiment, the frame 20 has a rectangular shape in a plan view, and the frame 40 also has a rectangular shape corresponding to the shape of the frame 20, but depending on the case, both the frames 20 and 40 may have a square shape, or a circular shape. A ring or the like having an appropriate shape can be used.

A method of manufacturing the frame 20 will be described. As shown in FIG. 2, the frame 20 includes a pair of frame members 21 and 21 arranged to face each other and a pair of frame members arranged to face each other.
22 and 22, and frame members 21 and 22 are alternately connected to form a frame 20. The frame member 21 is shown in FIGS.
As shown in FIG. 5, the cross-section is a substantially L-shaped frame member having the above-mentioned step 26, and has a rectangular planar shape, and a plurality of it is formed over the entire length in the thickness direction (Z-Z direction in FIG. 5). The groove 23 is formed.

These grooves 23 can be cut by a cutter 90 shown in FIG. The cutter 90 is provided with a disk-shaped diamond blade 91, and is a cutter that rotates in the XX direction, the YY direction shown in FIG. 3, and the ZZ direction in FIG. 5 perpendicular to these directions. A plurality of grooves are formed by moving 90 to scrape the frame member 21 (in this embodiment, nine grooves are formed for convenience of understanding, but actually, for example, several tens to several hundreds of grooves are formed. Groove 23)
Can be easily formed. Further, both end portions of the frame member 21 are cut at the positions indicated by the dotted line 27.

The frame member 22 is also manufactured in the same manner as the frame member 21, and a groove 23 similar to the groove 23 provided in the frame member 21 is formed. In this embodiment, the frame member 22 is longer than the frame member 21, and therefore, the frame member 22 has a groove formed in the frame member 21.
More grooves 23 than 23 are formed. And the frame member
The ends of 21 and 22 are alternately adhered to complete the production of the frame 20 shown in FIG. Each groove 23 of the frame 20 is cut at a position that exactly corresponds to the position of the bump 91 of the IC chip 90 with which each probe 30 contacts.

Next, a method of assembling the probe card of this embodiment will be described. After fitting the frame 20 in which the groove 23 is cut and formed by the cutter 90 into the opening 11 of the substrate 10, the film 50 is placed on the step 26 of the frame 20. Then, the tip 31 of the probe 30 is pierced into the film 50, and is further inserted into the groove 23 of the frame 20 to project the tip 31 from the lower surface of the frame 20 by a predetermined length. Further, a part of the arm portion 33 of the probe 30 is placed on the frame 20, fixed to the frame 20 with epoxy resin or the like, and the rear end 33 of the probe 30 is connected to the wiring pattern 81 by soldering 82. .

After that, the frame 40 is attached and fixed on the frame 20 with an epoxy resin or the like. And the frame 20 on the film 50
The synthetic resin 70 in a fluidized state is injected into the large opening 24a and the opening 41 of the frame 40. In this case, since the film 50 is present, the synthetic resin 70 does not drop downward. Then the pressing plate
60 is adhered and laminated on the synthetic resin 70, and the periphery of the pressing plate 60 is fixed to the upper surface of the frame 40.

Instead of providing the film 50, a probe
After installing 30 as described above, the small opening 24b and the groove 23 of the frame 20 are filled with paraffin 29 as shown in FIG. 6, and then, into the large opening 24a of the frame 20 and the opening 41 of the frame 40. After the synthetic resin 70 is injected and the pressing plate 60 is installed, the temperature may be applied to soften and drop the paraffin 29 to remove it.

When the film 50 is not provided in this way, as shown in FIG. 7, a groove is formed on the upper surface of the peripheral portion 25 of the frame 20.
A groove 28 intersecting with 23 is provided, and the tip 31 side is grooved from the bent portion of the tip portion 32 of the probe 30 which is bent in a substantially V shape.
The rear end 34 side can be housed in the groove 28 in the groove 23.

Next, the operation of this embodiment will be described.
When the probe card of this embodiment is arranged so as to face the IC chip 90, each probe 30 is held in the groove 23 of the frame 20, so that it exactly faces the bump 91 corresponding to each probe 30. To do. Then, lower the probe card to remove each probe 30.
The tip 31 of the is contacted with the bump 91 of the IC chip 90. Further, the probe card is lowered, that is, overdrive is applied.

In this case, the stylus pressure applied to the bumps 91 of the probe 30 is a predetermined stylus pressure, because the stylus 30 itself has an elastic force due to the deformation of the synthetic resin 70 pressed by the pressing plate 60. And the stylus pressure becomes almost equal through all the probes 30. Moreover, since the pressing plate 60 is in close contact with the synthetic resin 70, the deformation of the synthetic resin 70 is within a predetermined range.

The arm portion 33 of each probe 30 is made of synthetic resin 70.
Since it is held inside, and the vicinity 32 of the tip of the probe 30 is held in the groove 23 of the frame 20, each probe 30 is accurately arranged to face the bump 91 corresponding to the probe 30. And the mutual position of the probes 30 is accurate. Then, even when the probe card is overdriven, the mutual position of the probe 30 is still kept accurate and the tip 31 of the probe 30 does not slip off the bump 91.

[0027]

As described above, the probe card according to claim 1 includes a substrate on which a predetermined wiring pattern is formed,
An insulating first frame provided with a through hole having a large opening, a small opening, and a step between the both openings fitted into the opening of the substrate, and a peripheral portion of the small opening of the first frame. , A plurality of grooves formed in the thickness direction of the peripheral portion over the entire length of this thickness, and an insulating second frame fixed on the first frame,
A plurality of probes fixed between the first and second frames, having a tip end inserted into the groove and a tip projecting from the lower surface of the first frame, and a second probe so as to embed a part of the probe. The frame is provided with an elastic synthetic resin filled in the opening of the frame and the large opening, and a pressing plate adhered and laminated on the synthetic resin.

The probe card according to claim 2 is the probe card according to claim 1, wherein the small opening and the groove of the first frame are closed between the step of the through hole of the first frame and the synthetic resin. Is provided with an insulating film. The probe card according to claim 3 is the probe card according to claim 1 or 2, wherein the first frame and the second frame are both rectangular, square, or annular.

Therefore, although the probe card according to claims 1 and 2 is a probe card provided with a large number of extremely fine probes at minute intervals when measuring the electrical characteristics of the semiconductor chip, the pressing force is applied by the pressing plate. Due to the elasticity of the synthetic resin applied, all the probes come into contact with the electrical input / output portion of the semiconductor chip with a predetermined and substantially equal contact pressure, and the inside of the synthetic resin and the groove of the first frame Since each probe is inserted and held in the probe, the position of each probe with respect to the electrical input / output section of the semiconductor chip and the mutual position between the probes are accurately maintained, and an overdrive is added to the probe card. Even when the probe is used, the mutual position between the probes is accurately maintained, and the tip of the probe does not slip off from the electrical input / output section.

The probe card according to claim 3 is
In addition to the advantages of the probe card according to the first or second aspect, there is an advantage that the probe 30 can be arranged appropriately corresponding to the arrangement of the electrical input / output section of the semiconductor chip to be measured.

[Brief description of drawings]

FIG. 1 is a sectional explanatory view of an embodiment of the present invention.

FIG. 2 is a plan view of a first frame according to an embodiment of the present invention.

FIG. 3 is a plan view of a frame member that constitutes a first frame of the exemplary embodiment of the present invention.

4 is a sectional view taken along the line AA of FIG.

5 is a sectional view taken along the line BB of FIG.

FIG. 6 is a partial plan view of the first frame of the embodiment of the present invention.

FIG. 7 is a partial perspective view of a modified first frame of the embodiment of the present invention.

FIG. 8 is a cross-sectional explanatory view of a conventional probe card.

[Explanation of symbols]

 10 Substrate 11 Opening 20 Frame 23 Groove 24 Through hole 24a Large opening 24b Small opening 25 Peripheral part 26 Step 30 Tip 31 Tip 32 Near tip 33 Arm 40 Frame 41 Opening 50 Film 60 Pressing plate 90 IC chip 91 Bump

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshi Sugaya 3-1, Nishi-Nagasumotodori, Amagasaki City JEOL Materials Co., Ltd.

Claims (3)

[Claims] 1. A probe card for measuring electrical characteristics of a chip by bringing a probe into contact with an electrical input / output section of a semiconductor chip, and a substrate having a predetermined wiring pattern and an opening of the substrate. An insulating first frame provided with a through hole having a large opening, a small opening, and a step between the both openings and a peripheral portion of the small opening of the first frame. Direction, the plurality of grooves formed over the entire length of this thickness, the insulating second frame fixed on the first frame, the first frame and the second frame are fixed, and the vicinity of the tip is A plurality of probes inserted into the groove and having their tips protruding from the lower surface of the first frame, and elasticity filled in the opening of the second frame and the large opening so as to embed a part of the probes. And an insulative synthetic resin having a pressure-sensitive adhesive and a pressing plate closely adhered on the synthetic resin. Probe card to do. 2. The probe card according to claim 1, further comprising an insulating film arranged between the step and the synthetic resin so as to close the small opening and the groove of the first frame. 3. The probe card according to claim 1, wherein both the first frame and the second frame are rectangular, square or annular.