JPH06116416A - Resin-impregnated base and electrical laminate - Google Patents

Resin-impregnated base and electrical laminate

Info

Publication number
JPH06116416A
JPH06116416A JP26498492A JP26498492A JPH06116416A JP H06116416 A JPH06116416 A JP H06116416A JP 26498492 A JP26498492 A JP 26498492A JP 26498492 A JP26498492 A JP 26498492A JP H06116416 A JPH06116416 A JP H06116416A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
impregnated
impregnated base
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26498492A
Other languages
Japanese (ja)
Inventor
Shoji Fujikawa
彰司 藤川
Sunao Ikoma
直 生駒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP26498492A priority Critical patent/JPH06116416A/en
Publication of JPH06116416A publication Critical patent/JPH06116416A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide an electrical laminate having a high antistat effect and to provide a resin-impregnated base therefor. CONSTITUTION:The resin-impregnated base is one obtained by impregnating a base with an epoxy resin varnish comprising an epoxy resin, an aminated polysiloxane, an organopolysiloxane containing an epoxypolyether group, and a hardener and optionally containing a curing accelerator, a solvent, etc., and drying the resulting base. The electrical laminate is one obtained by superposing a necessary number of sheets of the resin-impregnated base, disposing a metal foil on at least one side of the pile, and uniting the laminae.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

【0002】[0002]

【従来の技術】近年、電気、電子機器の高信頼化対策と
して帯電不良をなくすることが試みられている。帯電防
止手段としては導電性カーポンや帯電防止剤を添加して
いるが、電気絶縁性が低下する欠点があった。
2. Description of the Related Art In recent years, attempts have been made to eliminate charging defects as a measure for increasing the reliability of electrical and electronic equipment. Although an electrically conductive carbon or an antistatic agent is added as an antistatic means, it has a drawback that the electric insulation is lowered.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、帯電不良をなくすることは容易なことではない。
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは帯電不良のない樹
脂含浸基材、電気用積層板を提供し電気、電子機器の高
信頼化を向上させることにある。
As described in the prior art, it is not easy to eliminate the charging failure.
The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a resin-impregnated base material that does not have a charging failure and an electrical laminate to improve reliability of electrical and electronic devices. To improve.

【0004】[0004]

【課題を解決するための手段】本発明はエポキシ樹脂
に、アミノ基含有ポリシロキサンとエポキシポリエーテ
ル基含有オルガノポリシロキサン、硬化剤を加え、更に
必要に応じて硬化促進剤、溶剤等を添加したエポキシ樹
脂ワニスに基材を含浸、乾燥した樹脂含浸基材、及び該
樹脂含浸基材の所要枚数の上面及び又は下面に金属箔を
配設ー体化してなることを特徴とする電気用積層板のた
め、上記目的を達成することができたもので、以下本発
明を詳細に説明する。
According to the present invention, an amino group-containing polysiloxane, an epoxy polyether group-containing organopolysiloxane, and a curing agent are added to an epoxy resin, and a curing accelerator, a solvent, and the like are further added if necessary. An epoxy resin varnish is impregnated with a base material and dried, and a resin-impregnated base material, and a metal foil is disposed on and integrated with a required number of upper and / or lower surfaces of the resin-impregnated base material. Therefore, the above-mentioned object can be achieved, and the present invention will be described in detail below.

【0005】本発明に用いるエポキシ樹脂は、ビスフェ
ノ−ルA型エポキシ樹脂、フェノ−ルノボラック型エポ
キシ樹脂、クレゾールノボラック型エポキシ樹脂、グリ
シジルエステル型エポキシ樹脂、グリシジルアミン型エ
ポキシ樹脂、線状脂肪族エポキシ樹脂、脂環式エポキシ
樹脂、複素環型エポキシ樹脂、ハロゲン化エポキシ樹脂
等のようにエポキシ樹脂全般を用いることができる。本
発明ではアミノ基含有ポリシロキサンとエポキシポリエ
ーテル基含有オルガノポリシロキサンとを含有すること
が必要で、その添加量は溶剤を除く全量の0.05〜3
重量%(以下単に%と記す)であることが好ましい。即
ち0.05%未満では帯電防止効果が少なく、3%をこ
えるとブリードする傾向にあるからである。硬化剤とし
てはフェノ−ル樹脂、イソシアネート、アミン系硬化
剤、酸無水物、ルイス酸錯化合物、イミダゾール系化合
物等が用いられ特に限定しない。必要に応じて硬化促進
剤としては、燐系、3級アミン系硬化促進剤が用いられ
る。必要に応じて用いられる溶剤としてはケトン系、ア
ルコール系等のように樹脂と相溶するものであればよく
特に限定しない。更に必要に応じてタルク、クレー、シ
リカ、炭酸カルシュウム、水酸化アルミニゥム、三酸化
アンチモン、五酸化アンチモン等の無機質粉末充填剤、
ガラス繊維、アスベスト繊維、パルプ繊維、合成繊維、
セラミック繊維等の繊維質充填剤、着色剤等を添加する
ことができる。基材としてはガラス、アスベスト等の無
機質繊維、ポリエステル、ポリアミド、ポリアクリル、
ポリビニルアルコール、ポリイミド、フッ素樹脂等の有
機質繊維、木綿等の天然繊維の織布、不織布、紙、マッ
ト等を用いることができる。基材に対する含浸は同一の
樹脂のみによる含浸でもよいが、同系樹脂又は異系樹脂
による1次含浸、2次含浸というように含浸を複数に
し、より含浸が均一になるようにすることもできる。か
くして基材に樹脂を含浸、乾燥して樹脂含浸基材を得る
ものである。金属箔としては銅、アルミニュウム、真
鍮、ニッケル、鉄等の単独、合金、複合箔を用いること
ができる。このようにして上記樹脂含浸基材の所要枚数
の上面及び又は下面に金属箔を配設ー体化して電気用積
層板を得るものである。以下本発明を実施例に基づいて
説明する。
The epoxy resin used in the present invention is a bisphenol A type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a linear aliphatic epoxy resin. It is possible to use general epoxy resins such as alicyclic epoxy resin, heterocyclic epoxy resin, halogenated epoxy resin, and the like. In the present invention, it is necessary to contain an amino group-containing polysiloxane and an epoxy polyether group-containing organopolysiloxane, and the addition amount thereof is 0.05 to 3 of the total amount excluding the solvent.
It is preferably wt% (hereinafter simply referred to as%). That is, if it is less than 0.05%, the antistatic effect is small, and if it exceeds 3%, bleeding tends to occur. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. The solvent used as needed is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. Further, if necessary, an inorganic powder filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide, antimony pentoxide, etc.,
Glass fiber, asbestos fiber, pulp fiber, synthetic fiber,
Fibrous fillers such as ceramic fibers, colorants and the like can be added. As the base material, glass, inorganic fibers such as asbestos, polyester, polyamide, polyacrylic,
Woven cloth, non-woven cloth, paper, mat and the like of organic fibers such as polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.

【0006】[0006]

【実施例】エポキシ樹脂(シエル化学株式会社製、エピ
コート1001)100重量部(以下単に部と記す)に
対し、アミノ基含有ポリシロキサン0.2部、エポキシ
ポリエーテル基含有オルガノポリシロキサン0.2部、
ジシアンジアミド4部、ベンジルジメチルアミン0.2
部、メチルオキシトール100 部を添加したエポキシ樹
脂ワニスに、厚み0.018mmの平織ガラス布を樹脂
付着量が45%になるように含浸、乾燥して樹脂含浸基
材を得た。次に該樹脂含浸基材8枚を重ねた上下面に厚
み0.035mmの銅箔を各々配設した積層体を成形圧
力40Kg/cm2 、160℃で90分間加熱加圧成形
して厚み1.6mmの両面銅張り積層板を得た。
EXAMPLES Amino group-containing polysiloxane 0.2 part and epoxy polyether group-containing organopolysiloxane 0.2 per 100 parts by weight (hereinafter simply referred to as “part”) of an epoxy resin (Epicoat 1001 manufactured by Shell Chemical Co., Ltd.) Department,
Dicyandiamide 4 parts, benzyldimethylamine 0.2
Part of the epoxy resin varnish containing 100 parts of methyl oxitol was impregnated with a 0.018 mm-thick plain woven glass cloth so that the amount of resin adhered was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm 2 , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate was obtained.

【0007】[0007]

【比施例】エポキシ樹脂(シエル化学株式会社製、エピ
コート1001)100部に対してジシアンジアミド4
部、ベンジルジメチルアミン0.2部、メチルオキシト
ール100部を添加したエポキシ樹脂ワニスを用いた以
外は実施例と同様に処理して樹脂含浸基材を得ると共に
厚み1.6mmの両面銅張り積層板を得た。
[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Parts, benzyl dimethylamine 0.2 parts, and methyl oxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad laminate having a thickness of 1.6 mm by the same procedure as in Example except that an epoxy resin varnish was used. I got a plate.

【0008】実施例及び比較例の電気用積層板の性能は
表1のようである。帯電量はパッケージパーツフィーダ
10分間での帯電量である。
Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. The charge amount is the charge amount within 10 minutes of the package parts feeder.

【0009】[0009]

【表1】 [Table 1]

【0010】[0010]

【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は帯電防止効果が大きく、本発明の
優れていることを確認した。
The present invention is constructed as described above.
It was confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has a large antistatic effect and is excellent in the present invention.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08G 59/50 NJJ 8416−4J C08L 63/00 NKB 8830−4J H05K 1/03 D 7011−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location C08G 59/50 NJJ 8416-4J C08L 63/00 NKB 8830-4J H05K 1/03 D 7011-4E

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】エポキシ樹脂に、アミノ基含有ポリシロキ
サンとエポキシポリエーテル基含有オルガノポリシロキ
サン、硬化剤を加え、更に必要に応じて硬化促進剤、溶
剤等を添加したエポキシ樹脂ワニスに基材を含浸、乾燥
したことを特徴とする樹脂含浸基材。
1. A base material for an epoxy resin varnish obtained by adding an amino group-containing polysiloxane, an epoxy polyether group-containing organopolysiloxane, and a curing agent to an epoxy resin, and further adding a curing accelerator, a solvent, etc., if necessary. A resin-impregnated base material characterized by being impregnated and dried.
【請求項2】エポキシ樹脂に、アミノ基含有ポリシロキ
サンとエポキシポリエーテル基含有オルガノポリシロキ
サン、硬化剤を加え、更に必要に応じて硬化促進剤、溶
剤等を添加したエポキシ樹脂ワニスに基材を含浸、乾燥
した樹脂含浸基材の所要枚数の上面及び又は下面に金属
箔を配設ー体化してなることを特徴とする電気用積層
板。
2. A base material for an epoxy resin varnish obtained by adding an amino group-containing polysiloxane, an epoxy polyether group-containing organopolysiloxane, and a curing agent to an epoxy resin, and further adding a curing accelerator, a solvent, etc., if necessary. An electrical laminate comprising an impregnated and dried resin-impregnated base material on which a required number of upper and / or lower surfaces are provided with metal foil.
JP26498492A 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate Pending JPH06116416A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26498492A JPH06116416A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26498492A JPH06116416A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Publications (1)

Publication Number Publication Date
JPH06116416A true JPH06116416A (en) 1994-04-26

Family

ID=17410952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26498492A Pending JPH06116416A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Country Status (1)

Country Link
JP (1) JPH06116416A (en)

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