JPH0611594B2 - IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention is an IC which enables self-output of stored information by arranging electronic parts also in an embossed area of an IC card.
It's about cards.

(Prior Art) An IC card in which a microprocessor and a memory IC are embedded in a plastic card is used for a cash card, a credit card, etc., but this one has an information recording capacity of 100 times or more compared to a magnetic stripe card. Since it has a large security function, it is expected to have a wide range of usages from electronic passbooks, electronic securities, OA / FA data files, process control cards to medical charts, etc. It is being advanced.

As for this IC card, the standard size of the conventional magnetic stripe card is 0.76 mm in thickness and 54.
It is said that a small printed board on which a microprocessor and a memory IC and I / O terminal electrodes are mounted is embedded in 0 mm and a width of 85.6 mm so that only the I / O terminal electrodes are exposed. In order to maintain compatibility with a magnetic stripe card, this one uses a magnetic stripe card standard (ISO 3554, embossed characters).
It is formed in a region defined by JIS X6301) with a defined dimension.

Further, as shown in FIG. 2, this IC card is composed of a sheet-like core material 22 occupying most of the thickness and two thin overlay films 23 and 24 laminated on both front and back surfaces thereof. This is a completed IC
It is necessary to emboss the name, code, symbol, etc. of the user himself / herself on the card.
The standard for magnetic stripe cards is a height of 0.
It is defined as 48+ (0 to -0.05) mm, and as shown in FIG. 2 in an ordinary IC card, avoid the embossed character area so that the printed board portion 26 in the core material is not destroyed by embossing. It is designed to be stored in the open part.

However, in order to expand the range of use of the IC card, the printed circuit board of this core material is pre-embossed by arranging electronic parts such as a liquid crystal display and a solar cell for driving them up to the embossed character area. A method of adhering an overlay film has been proposed.

Explaining the necessity of this method, the IC card user can now exchange information with the IC card application system owned by the service provider using the IC card reader / writer as an interface.
However, since the current IC card does not have a display function, there is a disadvantage that the information record stored in the IC card cannot be known while staying. In other words, taking a bank card as an example, the user needs to go to the place where the ATM / CD device is installed in order to know the deposit balance, which is an IC card having a much larger storage capacity than a magnetic stripe card. The characteristics of are not fully utilized. In order to give the above display function to the IC card,
In addition to the microprocessor and memory IC, it is necessary to mount a printed circuit board on which finger input keys are mounted, a liquid crystal display, and electronic parts such as a solar cell for driving these. However, since the IC card has a limited size, it is necessary to dispose electronic components such as a printed circuit board even in the embossed character area defined in the card standard.
Therefore, if the finished card is embossed by a method similar to that of the current IC card, the worst disadvantage is that the electronic components in the IC card are destroyed.
Therefore, as described above, a method of adhering an overlay film that has been embossed in advance is required, but in this case, since the thickness of the overlay film is about 50 to 100 μm, strength of the overlay film is increased. It is not possible to obtain a certain embossed character, and since it is bonded and integrated with the core material, there is the disadvantage that the embossed character will be crushed by this pressure when applying a hot pressing with a packing material such as a rubber cushion. Even if the embossed characters are not crushed by this bonding and integration, there is a drawback that it is difficult to adopt this method because they are crushed by the pressure at the time of imprinting when using the IC card.

(Structure of the Invention) The present invention relates to an IC card which solves such a disadvantage, in which embossed characters are formed on the surface by uneven deformation processing, and the recesses of the embossed characters are crosslinked by heat, ultraviolet rays or an electron beam. An overlay film filled with a resin is bonded and integrated with a core material having an integrated circuit.

That is, as a result of various studies on the improvement of the overlay film that is integrally bonded to the core material having the integrated circuit, the present inventors formed an embossed character on the surface thereof by a known uneven deformation process, and then formed a concave portion of this embossed character. heat,
It was found that this overlay film has a high compression resistance when it is filled with a resin that is cross-linked by ultraviolet rays or electron beams, and even if this overlay film is bonded and integrated using a hot press of the core material, the embossed characters will remain. The present invention has been completed by confirming that the IC card thus obtained is not crushed and that the embossed characters are not crushed by the pressure during imprinting during use.

The IC card of the present invention is, for example, the one shown in FIG. The core material 2 of the card constituting the IC card 1 is formed by laminating a contact sheet 4 with a spacer and a decorative film 5 on a printed circuit board 3 and a reinforcing plate 6 on the lower surface thereof. Is provided with an IC 7 and an I / O terminal 8. An overlay film 9 is engraved on the upper surface of the core material 2, and an embossed character 10 is engraved on the lower surface in advance by embossing.
The IC card 1 is formed by integrally bonding the overlay film 12 charged with the resin 11 that is cross-linked by heat, ultraviolet rays or electron beams according to the present invention to the recessed portion of the lower surface of No. 0 .

The IC card of the present invention is one in which the core material having the integrated circuit and the embossed overlay film are bonded and integrated as described above. The core material of the present invention is used in a usual magnetic stripe card. Unlike insulating plates made by molding resins such as vinyl chloride resin and vinyl chloride-vinyl acetate copolymer resin, printed circuit boards and contact sheets with spacers, decorative films, reinforcing plates, liquid crystal displays, solar cells as described above. It is said that these are bonded and integrated. This printed circuit board is made by wiring a copper-clad glass cloth epoxy laminated board, a copper-clad glass cloth polyimide laminated board, etc., and mounting a microprocessor and memory IC, condenser, LED, etc. on a part of this wiring board. Most of the area is occupied by the comb-shaped electrodes for finger input keys and the wiring pattern. This core material is practically the first
As shown in the figure, a contact sheet with an insulating spacer is placed on the comb-teeth type electrode of the printed circuit board, and a decorative film on which finger input key characters are printed is laminated on the contact sheet. Includes vinyl chloride resin, vinyl chloride-vinyl acetate copolymer resin, polycarbonate resin, polyacrylate resin, ABS resin, polyethylene terephthalate resin, polybutylene terephthalate resin, methyl methacrylate resin and other plastics, or metal such as stainless steel, iron and brass. The reinforcing plates made of thin plates are laminated.

On the other hand, the overlay film that is adhesively integrated with the core material is a material that can be embossed by an ordinary embosser for magnetic stripe cards, such as vinyl chloride resin, vinyl chloride-vinyl acetate copolymer resin, polycarbonate resin, polyarylate. It may be made from resin, ABS resin, polyethylene terephthalate resin, polybutylene terephthalate resin, methyl methacrylate resin, etc. However, if this product is too thin, it will be difficult to handle, and embossing plasticity will occur when embossed. There is a drawback that the deformed portion is easily broken, and if it is too thick, the thickness of the printed circuit board and other core materials is limited, so the card standard is 0.76 + (+ 0.04 to −0.
Since it deviates from 08) mm, it is preferable that the thickness is in the range of 25 to 100 μm.

The concavo-convex deformation process for forming embossed characters on this overlay film may be performed using a known embosser, and this may be performed at room temperature under a pressure of 10 kg / cm ² . This overlay film is engraved with the card user's name, various codes, symbols, etc. as embossed characters by this unevenness deformation process, and this embossed character is the one in which the character is projected on the card surface. When the part is hot pressed, the protrusion is pressed and the embossed characters are erased.

However, according to the present invention, heat is applied to the recess of this embossed character,
When the resin that is cross-linked with ultraviolet rays or electron beams is filled, the embossed characters are not pressed into the recesses even when they are hot pressed, so that the embossed characters are not erased. In addition, the resin that crosslinks with heat, ultraviolet rays, or electron beams is liquid and cures quickly, so filling in recesses is easy, and when the IC card issuer issues a card, the overlay film can be bonded and integrated to the core material. Can be done The embossed letters on the IC card are extremely hard and durable. Examples of the UV curable resin include acrylate oligomers such as polyester acrylate, polyester urethane acrylate, and epoxy acrylate, 1,6 hexanediol diacrylate (HDDA), tripropylene glycol diacrylate (TPGDA), and trimethylolpropane triacrylate (TMPTA). , And an acrylate monomer such as dipentaerythritol hexaacrylate (DPHA) mixed with a benzophenone-based or thioxant-based photopolymerization initiator and a photopolymerization accelerator. Examples of the electron beam curable resin include an ultraviolet curable resin. Examples of the acrylate oligomer and acrylate monomer used for the above are required. However, since these are required to have high hardness as described above, epoxy acrylate It is preferable to use a combination of a gomer and an acrylate monomer such as DPHA having a large number of functional groups, and from the viewpoint of the leveling property of the liquid resin, only the acrylate monomer having a low viscosity is used as a photopolymerization initiator and a photopolymerization accelerator. May be blended. When a resin having no heat resistance or a soft resin is filled in the concave portion of the embossed character, the embossed character is easily changed during thermocompression bonding of the overlay film and the core material.

The filling and curing of the embossed character concave portion of the resin that is cross-linked by heat, ultraviolet rays or electron beams can be automatically performed by injecting a fixed amount discharge device as a robot system from the place where this is a liquid resin and automatically performing leveling. After filling in this manner, it may be passed through an ultraviolet irradiation conveyor furnace to be cured, and thus the embossed character concave portion is filled with heat, ultraviolet rays or electron beam cross-linking resin and a core material. The adhesive can be adhered to the overlay film by applying an adhesive and heat-pressing, whereby an intended IC card can be easily and quickly obtained.

As described above, the IC card of the present invention is obtained by filling the concave portion of the embossed character on the surface with a resin that is crosslinked by heat, ultraviolet rays or electron beams, and then bonding and integrating this with a core material having an integrated circuit. , According to this, the embossed characters on the overlay film will not be crushed during adhesion with the core material, so that the printed circuit board, liquid crystal display, solar cell, etc. on the core material can be arranged on the entire surface of the card. It becomes possible to output and display the recorded information of the card, and since this does not erase the embossed characters even when pressed during imprinting during use, it is an advantage that it can be put to practical use in a wide range. Is given.

Next, examples of the present invention will be given.

(Example 1) Vinyl chloride resin film SP-307 having a thickness of 0.1 mm
[Shin-Etsu Polymer Co., Ltd. product name] coated on one side with a modified nylon resin material, FS175SV [Toagosei Chemical Industry Co., Ltd. product name] using a three-roll reverse coater, 7
After drying at 0 ° C. for 10 minutes to form a dry film having a thickness of 10 μm, the film is cut into a size of 54.0 × 85.6 mm, which is then embossed with a model 7980.
Embossed characters were formed using [West Germany, Pittney Bowes, trade name].

Next, 100 parts by weight of an acrylate monomer, DPCA-60 [trade name, manufactured by Nippon Kayaku Co., Ltd.], and a photopolymerization initiator, Irgacure 651 were provided in the recesses on the back surface of the embossed letters of this film.
[Product name of Ciba-Geigy, Switzerland] 4 parts by weight of liquid UV-curable resin mixed and dissolved is filled using a dispenser and leveled and flattened, and then ultraviolet rays from a high pressure mercury lamp 80 W / cm with the adhesive surface as the upper surface. Irradiation treatment 5
This resin was cured by irradiation from 0 mm for 80 seconds.

Next, the adhesive surface of the overlay film thus obtained was coated with a vinyl chloride resin film / S with a thickness of 0.56 mm.
54.0 for P-450WH [trade name of Shin-Etsu Polymer Co., Ltd.]
Put them on a card cut to 85.6 mm × 1
Using a heat roll of 25 ° C, hardness of 75 ° Hs, diameter of 60mm, temperature of 125 ° C, pressure of 2kg / cm ² and speed of 10mm / sec, the height of the embossed letters did not change and the card standard To obtain a card with embossed letters.

When the card thus obtained was applied to an imprinting device, the embossed characters of the card were not erased and the imprinted characters were clearly obtained (Example 2). 1mm vinyl chloride resin film SP-307 with modified nylon adhesive FS175
After the SV was coated, dried, and cut into a predetermined size, embossed characters were formed with an embosser model 7980.

Thermosetting epoxy resin Epicoat 1004 [Okaka Shell Epoxy Co., melting point 97 [deg.] C.] 100 parts by weight is mixed with 40 parts by weight of a curing agent B-002 [Okaka Shell Epoxy Co.] and heated to 110 [deg.] C. After filling the recesses on the back surface of the embossed letters of the film, the film was cured by heating at 50 ° C. for 1 day.

The adhesive surface of the overlay film thus obtained,
It was placed on a vinyl chloride resin film SP-450WH having a thickness of 0.56 mm and a size of 54.0 × 85.6 mm, and these were laminated under the same conditions as in Example 1.

The obtained card had embossed characters according to the card standard, and imprinted characters using the imprinting device were also clearly obtained.

(Comparative Example 1) As in Example 2, embossed characters were formed on a vinyl chloride resin film having a thickness of 0.1 mm by using an embosser model 7980.

Epoxy resin Epicoat 1004 used in Example 2
The mixture was heated and melted at 110 ° C. without being mixed with the curing agent, filled in the recesses on the back surface of the embossed letters of the film, and then cooled to room temperature and solidified.

The overlay film thus obtained was used in Example 2
When it was placed on the same vinyl chloride resin film SP-450WH as in the above, and these were laminated under the same conditions as in Example 2, the epoxy resin was cured by the heat of the heat roll and the height of the embossed letters was the standard value. Since it was less than half of the above, imprint characters using the imprint device could not be identified.

(Comparative Example 2) 0.1 mm thick polyester resin film ST-10
In the same manner as in Example 1 except that [Toray Industries, Ltd.] was used, a modified nylon adhesive was applied, dried, cut into a predetermined size, and then embossed characters were formed by an embossing machine.

An attempt was made to heat and fill the thermoplastic acrylic resin Delpet 60N (manufactured by Asahi Kasei Kogyo Co., Ltd., heat distortion temperature 89 ° C) to 120 ° C, but the resin did not flow and could not be filled. Therefore, the heating temperature of the resin was set to 200 ° C. to improve the fluidity of the resin, and after filling the recesses on the back surface of the embossed letters of the film, it was cooled to room temperature and solidified.

In the overlay film thus obtained, the polyester resin film was deformed by the heat when the acrylic resin was filled, and the convex portion on the surface of the embossed character was distorted and the character could not be discriminated.

(Effect of the Invention) Since the resin that is crosslinked by heat, ultraviolet rays or electron beams is liquid before curing, it can be easily injected into the embossed portion of the overlay film, and the workability is significantly improved. Further, since these resins can be cured at room temperature or at a temperature that does not thermally affect the overlay film, problems such as shrinkage or deformation of the overlay film due to heat, and discoloration do not occur.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an IC card of the present invention, and FIG. 2 is a vertical sectional view of a conventionally known IC card. 1, 21 ... IC card, 2, 22 ... core material, 3, 26 ... printed circuit, 4 ... spacer contact sheet, 5 ... decorative film, 6 ... reinforcing plate, 7, 27 ... IC , 8 ... I / O terminal, 9, 12, 23, 24 ... Overlay film, 10, 25 ... Embossed character, 11 ... Resin that is cross-linked by heat, ultraviolet ray or electron beam.

Claims (2)

[Claims] 1. An overlay film in which embossed characters are formed on the surface by a concavo-convex deformation process, and the recesses of the embossed characters are filled with a resin that crosslinks by heat, ultraviolet rays, or an electron beam is bonded and integrated with a core material having an integrated circuit. An IC card characterized by: 2. The IC card according to claim 1, wherein the core material contains an electronic component in the embossed area of the card.