JPH0611576Y2 - Semiconductor circuit device - Google Patents

Semiconductor circuit device

Info

Publication number
JPH0611576Y2
JPH0611576Y2 JP1983175790U JP17579083U JPH0611576Y2 JP H0611576 Y2 JPH0611576 Y2 JP H0611576Y2 JP 1983175790 U JP1983175790 U JP 1983175790U JP 17579083 U JP17579083 U JP 17579083U JP H0611576 Y2 JPH0611576 Y2 JP H0611576Y2
Authority
JP
Japan
Prior art keywords
main circuit
wiring board
terminals
same plane
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1983175790U
Other languages
Japanese (ja)
Other versions
JPS6083292U (en
Inventor
▲えい▼寿 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1983175790U priority Critical patent/JPH0611576Y2/en
Publication of JPS6083292U publication Critical patent/JPS6083292U/en
Application granted granted Critical
Publication of JPH0611576Y2 publication Critical patent/JPH0611576Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
  • Inverter Devices (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は、端子と取付面間の寸法の異なる複数の主回路
部品と、この主回路部品の動作を制御する制御素子とを
配設したプリント配線板とを備えたインバータ装置等の
半導体回路装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention has a plurality of main circuit parts having different sizes between terminals and mounting surfaces and a control element for controlling the operation of the main circuit parts. The present invention relates to a semiconductor circuit device such as an inverter device including a printed wiring board.

[従来の技術] 従来のこの種装置として、第1図乃至第4図に示すよう
なインバータ装置が知られる。
[Prior Art] As such a conventional device, an inverter device as shown in FIGS. 1 to 4 is known.

第1図は回路図を示すもので、図において1は商用周波
数の3相交流を直流に変換するダイオードモジュール、
2は直流を所望周波数の3相交流に変換するトランジス
タモジュール、3は平滑用コンデンサである。上記ダイ
オードモジュール1、トランジスタモジュール2、平滑
用コンデンサ3は主回路部品であり、半導体回路装置の
主回路の主要部を構成する。4は電源側端子、5は負荷
側端子、6はトランジスタモジュール2の動作を制御す
る制御素子(図示せず)を内蔵する制御装置である。
FIG. 1 shows a circuit diagram, in which 1 is a diode module for converting three-phase alternating current at a commercial frequency into direct current,
Reference numeral 2 is a transistor module for converting direct current into three-phase alternating current having a desired frequency, and 3 is a smoothing capacitor. The diode module 1, the transistor module 2, and the smoothing capacitor 3 are main circuit components and constitute a main part of the main circuit of the semiconductor circuit device. Reference numeral 4 is a power supply side terminal, 5 is a load side terminal, and 6 is a control device incorporating a control element (not shown) for controlling the operation of the transistor module 2.

第2図は以上のような回路構成からなる装置の縦断面図
で、第1図と同一符号は同一または相当部分を示す。こ
の図において7は前記ダイオードモジュール1、トラン
ジスタモジュール2、コンデンサ3及び端子台8を内側
面に支持するベース、9は前記主回路の電流による各部
品1,2,3の温度上昇を低下させる放熱フィン、10
は支持板11を介してベース7に支持され、前記主回路
部品の動作を制御する制御素子(図示せず)を配設した
プリント配線板、12は主回路部品間を接続する主回路
接続線、13は電源側端子4ならびにトランジスタモジ
ュール2とプリント配線板10とをコネクタ14を介し
て接続する制御用接続線、15はベース7の開口部を閉
塞する前面カバーである。
FIG. 2 is a vertical cross-sectional view of a device having the above-described circuit configuration, and the same reference numerals as those in FIG. 1 denote the same or corresponding parts. In this figure, 7 is a base for supporting the diode module 1, the transistor module 2, the capacitor 3 and the terminal block 8 on the inner side surface, and 9 is heat radiation for reducing the temperature rise of each component 1, 2, 3 due to the current of the main circuit. Fins, 10
Is a printed wiring board supported by the base 7 via a support plate 11 and provided with a control element (not shown) for controlling the operation of the main circuit components, and 12 is a main circuit connecting line for connecting the main circuit components. , 13 are control connection lines for connecting the power supply side terminal 4 and the transistor module 2 to the printed wiring board 10 via the connector 14, and 15 is a front cover for closing the opening of the base 7.

[考案が解決しようとする課題] 以上のような構成の従来のインバータ装置によれば、主
回路を構成するダイオードモジュール1、トランジスタ
モジュール2、コンデンサ3、端子台8等の部品間を主
回路接続線12で接続する必要があり、またトランジス
タモジュール2と制御装置用プリント配線板10間は第
1図に示されるように多数の制御用接続線13により接
続する必要があり、多量の接続線を必要とするとともに
組立時間が長くかかる等の欠点があった。
[Problems to be Solved by the Invention] According to the conventional inverter device having the above-mentioned configuration, the main circuit is connected between the components such as the diode module 1, the transistor module 2, the capacitor 3, and the terminal block 8 which form the main circuit. It is necessary to connect the lines 12 and between the transistor module 2 and the printed wiring board 10 for the control device by a large number of control connecting lines 13 as shown in FIG. There is a drawback that it is necessary and requires a long assembling time.

[課題を解決するための手段] 本考案は上記従来装置の欠点を解消することを目的とす
るもので、端子と取付面間の寸法の異なる複数の主回路
部品と、この主回路部品の動作を制御する制御素子を配
設したプリント配線板とを備えた半導体回路装置におい
て、上記複数の主回路部品の各端子が略同一平面上に位
置するように上記複数の主回路部品を支持配設する主回
路部品を支持配設手段と、略同一平面上にある上記各端
子を一括配線する主回路配線板と、上記プリント配線板
と上記主回路配線板とを電気的に接続し且つ機械的に固
定するコネクタとを設けたことを特徴とする半導体回路
装置を提供するものである。
[Means for Solving the Problems] The present invention is intended to eliminate the drawbacks of the above-described conventional device, and a plurality of main circuit components having different sizes between terminals and mounting surfaces and the operation of the main circuit components. In a semiconductor circuit device including a printed wiring board having a control element for controlling the plurality of main circuit components, the plurality of main circuit components are supported and arranged so that the terminals of the plurality of main circuit components are located on substantially the same plane. The main circuit component for supporting and arranging the main circuit component, the main circuit wiring board for collectively wiring the terminals on substantially the same plane, the printed wiring board and the main circuit wiring board are electrically connected and mechanically A semiconductor circuit device is provided with a connector for fixing to the.

[実施例] 以下、本考案の一実施例を第5図に基づいて説明する。[Embodiment] An embodiment of the present invention will be described below with reference to FIG.

ここで、第1図乃至第4図と同一符号は同一または相当
部分を示す。
Here, the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding portions.

この第5図において、16は主回路部品1,2,3間を
接続する配線を施した一括配線を行う主回路配線板で、
主回路部品1,2,3の各端子17にねじ18により固
定する。19は主回路配線板16とプリント配線板10
とを電気的に接続し且つ機械的に固定するコネクタであ
る。
In FIG. 5, reference numeral 16 is a main circuit wiring board for carrying out collective wiring in which wiring for connecting the main circuit components 1, 2 and 3 is provided.
The terminals 17 of the main circuit components 1, 2 and 3 are fixed with screws 18. Reference numeral 19 is the main circuit wiring board 16 and the printed wiring board 10.
Is a connector for electrically connecting and mechanically fixing.

第5図では、ベース7における主回路部品であるダイオ
ードモジュール1、トランジスタモジュール2、平滑用
コンデンサ3の取付面を、端子と取付面間の寸法が異な
る上記主回路部品1,2,3の各端子17が略同一平面
上に位置するような段付きの取付面に形成している。即
ち、ベース7の底部である主回路部品取付部は複数の主
回路部品をそれらの各端子17が略同一平面上に位置す
るように配設する主回路部品支持配設手段を構成する。
In FIG. 5, the mounting surfaces of the main circuit components of the base 7, which are the diode module 1, the transistor module 2, and the smoothing capacitor 3, are shown in FIG. The terminal 17 is formed on a stepped mounting surface such that the terminals 17 are located on substantially the same plane. That is, the main circuit component mounting portion, which is the bottom of the base 7, constitutes a main circuit component supporting and arranging means for arranging the plurality of main circuit components so that their respective terminals 17 are located on substantially the same plane.

ダイオードモジュール1、トランジスタモジュール2、
平滑用コンデンサ3等の各主回路部品はベース7底面の
所定の位置に取付け固定されているので、上記主回路部
品の各端子17の同一平面上の位置関係は略定まってお
り、主回路配線板16には板上の所定の位置に上記各端
子17を貫挿する穴が形成されている。上記主回路配線
板16の端子穴の位置は当然のことながら主回路配線板
16上に形成された通電路の終端もしくは途中に位置し
ている。
Diode module 1, transistor module 2,
Since each main circuit component such as the smoothing capacitor 3 is attached and fixed to a predetermined position on the bottom surface of the base 7, the positional relationship of each terminal 17 of the main circuit component on the same plane is substantially fixed, and the main circuit wiring is The plate 16 is formed with holes through which the terminals 17 are inserted at predetermined positions on the plate. The position of the terminal hole of the main circuit wiring board 16 is naturally located at the end or in the middle of the current-carrying path formed on the main circuit wiring board 16.

上記主回路配置板16の通電路は制御素子が配設された
プリント配線板10とは異なり、比較的高い電圧、例え
ばAC200V〜440V、DC 等の電圧が加わり、プリント配線板10に流れる制御電
流とは比較にならない大きな電流が流れるので、当然の
ことだが、板状導電材の貼付もしくは埋込等の処置が施
されている。
Unlike the printed wiring board 10 in which the control elements are arranged, the energization path of the main circuit arrangement board 16 is relatively high voltage, for example, AC200V to 440V, DC. Since a large current, which is incomparable with the control current flowing through the printed wiring board 10, flows due to the application of such voltage as described above, it is natural that a measure such as sticking or embedding a plate-shaped conductive material is applied.

主回路部品の各端子17は上記のごとく主回路配線板1
6にねじ18で固定される。上記ダイオードモジュール
1、トランジスタモジュール2、平滑用コンデンサ3等
の各主回路部品のベース7の段付底面への取付、上記主
回路部品の各端子17への主回路配線板16の取付けと
ねじ18による固定作業は全て一方向から行なうので組
立作業の自動化が可能である。
Each terminal 17 of the main circuit component is connected to the main circuit wiring board 1 as described above.
It is fixed to 6 with screws 18. Attachment of main circuit components such as the diode module 1, transistor module 2, smoothing capacitor 3 and the like to the stepped bottom surface of the base 7, attachment of the main circuit wiring board 16 to each terminal 17 of the main circuit component, and screws 18 Since the fixing work by all is done from one direction, the assembling work can be automated.

第5図において、制御素子(図示せず)を配設したプリ
ント配線板10と主回路配線板16にはこれらを電気的
に接続し且つ機械的に固定するためのコネクタ19を構
成するプラグとソケットのいずれかが一体に結合されて
おり、これらプラグとソケットを結合させることによ
り、コネクタ19を介してプリント配線板10は主回路
配線板16に電気的に接続し且つ機械的に固定される。
In FIG. 5, a printed wiring board 10 having a control element (not shown) and a main circuit wiring board 16 are provided with a plug constituting a connector 19 for electrically connecting them and mechanically fixing them. Any one of the sockets is integrally connected, and by connecting the plug and the socket, the printed wiring board 10 is electrically connected to the main circuit wiring board 16 via the connector 19 and mechanically fixed. .

以上のように構成することによりインバータ装置として
の機能をもった半導体回路装置を得ることができる。
With the above configuration, a semiconductor circuit device having a function as an inverter device can be obtained.

尚、上記実施例においては、主回路部品の各端子を略同
一平面上に位置するように上記主回路部品を支持配設す
る主回路部品支持配設手段として上記主回路部品の取付
面が段付上に形成されたベース7を用いたが、このベー
ス7における上記主回路部品取付面が段付でなく同一平
面の場合には上記各端子が同一平面となるように上記主
回路部品の取付面とベース7間に挿入するスペーサであ
ってもよい。
In the above embodiment, the mounting surface of the main circuit component is stepped as the main circuit component supporting and arranging means for supporting and arranging the main circuit component so that the terminals of the main circuit component are located on substantially the same plane. Although the base 7 formed as above is used, when the main circuit component mounting surface of the base 7 is not stepped and is on the same plane, the main circuit component is mounted so that the terminals are on the same plane. It may be a spacer inserted between the surface and the base 7.

上記実施例においては、インバータ装置としての半導体
回路装置について述べたが、これに限るものではなく、
その他の主回路と制御回路とからなる半導体回路装置に
ついても同様に実施することができる。
Although the semiconductor circuit device as the inverter device is described in the above embodiment, the invention is not limited to this.
The same can be applied to other semiconductor circuit devices including a main circuit and a control circuit.

[考案の効果] このように、本考案によるときは、複数の主回路部品の
各端子が略同一平面上に位置するように上記複数の主回
路部品を支持配設する主回路部品支持配設手段と、略同
一平面上にある上記各端子を一括配線する主回路配線板
と、主回路部品の動作を制御する制御素子を配設したプ
リント配設板と上記主回路配線板とを電気的に接続し且
つ機械的に固定するコネクタとを設けたので、接続線に
よる配線の必要がなくなり、組立が容易な半導体回路を
提供することができる。
[Effects of the Invention] As described above, according to the present invention, the main circuit component supporting arrangement for supporting and arranging the plurality of main circuit components so that the terminals of the plurality of main circuit components are located on substantially the same plane. Means, a main circuit wiring board for collectively wiring the terminals on substantially the same plane, a printed circuit board on which a control element for controlling the operation of the main circuit component is arranged, and the main circuit wiring board. Since the connector which is connected to and mechanically fixed is provided, it is possible to provide a semiconductor circuit which is easy to assemble without the need for wiring by a connecting line.

【図面の簡単な説明】[Brief description of drawings]

第1図乃至第4図は従来例を示し、第1図は回路図、第
2図は縦断面図、第3図は外観を示す斜視図、4図は前
面カバーを取除いて示す斜視図である。 第5図は本考案の一実施例を示す縦断面図である。1…
…ダイオードモジュール(主回路部品)、2……トラン
ジスタモジュール(主回路部品)、3……平滑用コンデ
ンサ(主回路部品)、7……ベース(主回路部品支持配
設手段)、8……端子台、10……プリント配線板、1
6……主回路配線板、17……端子、19……コネク
タ。
1 to 4 show a conventional example, FIG. 1 is a circuit diagram, FIG. 2 is a vertical sectional view, FIG. 3 is a perspective view showing the appearance, and FIG. 4 is a perspective view showing a front cover removed. Is. FIG. 5 is a vertical sectional view showing an embodiment of the present invention. 1 ...
... diode module (main circuit part), 2 ... transistor module (main circuit part), 3 ... smoothing capacitor (main circuit part), 7 ... base (main circuit part supporting and arranging means), 8 ... terminal Table 10 ... Printed wiring board, 1
6 ... Main circuit wiring board, 17 ... Terminal, 19 ... Connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】端子と取付面間の寸法の異なる複数の主回
路部品と、この主回路部品の動作を制御する制御素子を
配設したプリント配線板とを備えた半導体回路装置にお
いて、上記複数の主回路部品の各端子が略同一平面上に
位置するように上記複数の主回路部品を支持配設する主
回路部品支持配設手段と、略同一平面上にある上記各端
子を一括配線する主回路配線板と、上記プリント配線板
と上記主回路配線板とを電気的に接続し且つ機械的に固
定するコネクタとを設けたことを特徴とする半導体回路
装置。
1. A semiconductor circuit device comprising: a plurality of main circuit components having different sizes between terminals and mounting surfaces; and a printed wiring board provided with a control element for controlling the operation of the main circuit components. Main circuit component supporting and arranging means for supporting and arranging the plurality of main circuit components so that the respective terminals of the main circuit component are located on substantially the same plane, and the terminals on substantially the same plane are collectively wired. A semiconductor circuit device comprising: a main circuit wiring board; and a connector for electrically connecting and mechanically fixing the printed wiring board and the main circuit wiring board.
JP1983175790U 1983-11-14 1983-11-14 Semiconductor circuit device Expired - Lifetime JPH0611576Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983175790U JPH0611576Y2 (en) 1983-11-14 1983-11-14 Semiconductor circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983175790U JPH0611576Y2 (en) 1983-11-14 1983-11-14 Semiconductor circuit device

Publications (2)

Publication Number Publication Date
JPS6083292U JPS6083292U (en) 1985-06-08
JPH0611576Y2 true JPH0611576Y2 (en) 1994-03-23

Family

ID=30382351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983175790U Expired - Lifetime JPH0611576Y2 (en) 1983-11-14 1983-11-14 Semiconductor circuit device

Country Status (1)

Country Link
JP (1) JPH0611576Y2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247714U (en) * 1975-10-01 1977-04-05
JPS5915397B2 (en) * 1977-09-28 1984-04-09 ヤマハ株式会社 Electric instrument control unit
JPS5855767Y2 (en) * 1978-12-25 1983-12-21 富士通株式会社 Printed board mounting structure on back panel

Also Published As

Publication number Publication date
JPS6083292U (en) 1985-06-08

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