JPH06112383A - Equipment case inner temperature lowering means - Google Patents

Abstract

PURPOSE:To notably enhance the temperature performance while miniaturizing a sealed equipment case for making it light weighted by applying a heat sink comprising a spiky fin group as a radiator. CONSTITUTION:The radiating surface 3-3 of a cooled element 3 is bonded onto the inner wall surface of the specific part of a case wall 1 while the heated surface 2-4 of the heated flat plate 2-2 of a spiky heat sink 2 is bonded onto the outer wall surface exactly corresponding to the bonded surface of the radiating surface 3-3 of the cooled element 3. At this time, the radiating surface 3-3 of the cooled element 3 and the heated surface 2-4 of the heated flat plate 2-2 of the heat sink 2 are provided with almost the same shape and area. Furthermore, at least the bonded part of the radiating surface 3-3 and the heated surface 2-4 are to be formed of thin and high thermal conductive metal e.g. aluminum thin sheet. Through these procedures, not only the temperature lowering performance can be notably enhanced but also the sealed equipment case can be miniaturized to the light weighted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a means for lowering the internal temperature of a sealed device housing, and more particularly to a device housing internal temperature lowering means in which a sword-shaped heat sink is effectively used.

[0002]

2. Description of the Related Art A typical example of a casing cooling device as a casing internal temperature rise preventing means for making it possible to seal a device casing and prevent contamination by dust is shown in FIGS. Shown in. In FIG. 5, the convection control housing 10 has a flow path through which a high temperature convection 4-7, which is the flow of air inside the equipment housing, and a low temperature convection that is the flow of air outside the equipment housing, depending on the bent separator panel. It is hermetically separated from the flow path through which 2-7 flows. When the high temperature convection 4-7 and the low temperature convection 2-7 flow through the respective flow paths by the high temperature convection generating means 4-6 and the low temperature convection generating means 2-6, a thin metal plate having good thermal conductivity is formed by bending. Due to the relatively good heat exchange performance of the separator panel 9 having the expanded heat transfer area, the high temperature convection 4-7 is cooled by the low temperature convection 2-7, and as a result, the air temperature in the equipment casing is lowered. To be

FIG. 6 shows an example of a case cooling device used when a large capacity and high performance are required as compared with the case of FIG. 5, and the heat exchange penetrates through the separator panel 9 to obtain high temperature convection 4-7 and low temperature. The heat transfer is performed by the heat transport of the heat pipe group 8 which is arranged across the convection 2-7. The separator panel 9 is not required to have a heat exchange function, and is merely provided with the role of simply separating the high temperature convection flow path and the low temperature convection flow path. The heat pipe group 8 absorbs the amount of heat from the high temperature convection 4-7, transports it to the low temperature convection side, and radiates heat into the low temperature convection 2-7. This heat exchange performance is increased by the fin group 8-1 provided in each heat pipe.

[0004]

In the case of FIG. 5, there is an advantage that it is simple and inexpensive, but since the heat exchange performance is low, the area of the bending type separator panel is increased when high performance is required. It was necessary, and the problem was that the device was large.

In the case of FIG. 6, since the heat is exchanged by the heat transfer of the heat pipe, the performance is high, but the structure of the apparatus is complicated and the manufacturing cost is high, which is a problem.

A common problem of both the examples of FIGS. 5 and 6 is that when the external atmosphere is bad and the inside of the low temperature passage is contaminated and cleaning is required, it is necessary to disassemble the entire casing cooling device. was there. Particularly in the case of FIG. 6, cleaning the fin group 8-1 of the heat pipe 8 was a difficult and complicated task.

Further, as another important problem in the heat pipe type cooling device for the case, if the heat pipe used is a normal two-phase flow heat pipe, it cannot operate in the top heat mode, and the holding posture There is a point that the heat transport capacity is halved when the heat pipe is leveled due to the drastic change in performance. Therefore, the heat pipe type housing cooling device has a large restriction on the posture when it is mounted on the device, and this also restricts the arrangement of parts in the device. The problems to be solved by the invention are various problems as described above.

[0008]

[Means for Solving the Problems] Basic means for solving the problems will be described in the following sections. (1) A sword-shaped heat sink is used as a means for dissipating heat into the outside air of the housing. Kenzan-shaped heat sinks have been improved in response to the recent rapid progress of semiconductors, and in particular, the development in recent years has been remarkable, and a small and light-weighted heat-sink-shaped heat sink has emerged.

Conventionally, the aluminum heat sink has not been used as a heat radiating portion in a case cooling device because of its poor heat radiating performance, large size and heavy weight. However, the recent high-density Kanayama-shaped heat sink has a heat dissipation capacity several times that of conventional aluminum heat sinks, and is made compact and lightweight by a fraction, and if applied to the internal temperature lowering means of the equipment case, It is possible to exert a great effect on the reduction in size and weight.

In particular, Japanese Patent Application No. 4-135507 and Japanese Patent Application No.
-214456 applied using a capillary heat pipe
The sword-shaped heat sink having the V-shaped pin group is 1.5 to 2.0 times stronger than the ordinary sword-shaped heat sink. It is possible to construct a case cooling device having a much smaller size and higher performance than a conventional case cooling device using a heat pipe.

(2) A predetermined portion of the housing wall or a separator panel corresponding to the predetermined portion, which blocks mutual flow of air inside and outside the housing, is formed of a thin metal plate having excellent heat conductivity. , The body to be cooled is adhered to the surface corresponding to the inside of the housing, and the sword-shaped heat sink is adhered to the surface corresponding to the outside of the housing corresponding to the case where the cooled body and the sword-shaped heat sink are directly bonded. Similarly, close and adhere. This structure minimizes the heat transport distance from the object to be cooled to the sword-shaped heat sink, which is the heat radiating portion, and makes the thermal resistance for heat transport extremely small.

(3) Kenzan-shaped heat sink, and a group of heat absorption fins when the object to be cooled is a Kenyama-shaped heat absorption element,
A convection generation means and a convection control means for improving the heat radiation and heat absorption efficiency of the Kenzan-shaped fin group, etc.

The combined use of the above-mentioned three means is a basic means for solving all the problems in the conventional means for preventing the internal temperature rise of the equipment case using the case cooling device. An example of the application structure of this basic means is illustrated in FIG. 1, and the details thereof will be described in the first embodiment.

[0014]

(1) When the sword-shaped heat sink having the l-shaped pin group is applied as the heat radiating portion, the heat receiving flat plate 10
Only one heat sink of 0 mm × 100 mm and fin height of 40 mm can exhibit the heat radiation capacity of 300 W. Therefore, in order to construct a case cooling device with a heat dissipation capacity of 500 W, it is only necessary to use two small heat sinks as a heat dissipation part, and the part of the case cooling device case exposed to the outside of the device case is Except for the fan of the convection generating means, the height is approximately 60 mm, the length is 250 mm, and the width is 150 mm.
The volume ratio is reduced to about one-fifth, and miniaturization and weight reduction are extremely remarkable.

(2) When the casing wall or the separator panel is made of a material having a thin wall and good thermal conductivity, the contact thermal resistance between the object to be cooled and the sword-shaped heat sink bonded to each other with the material interposed therebetween is The impact is extremely small. The material of the casing wall or the separator panel is aluminum (thermal conductivity λ = 228 W / m ° C.), its thickness is 1 mm, and the increased thermal resistance due to the intervening aluminum when the adhesive area is 100 mm × 200 mm is R = 2.193. × 10 ^-4 ° C / W
The thermal resistance value is extremely small and can be ignored.

(3) The Kenzan-shaped fin group gives high performance to the heat sink, but the fin group has a high density, and therefore cannot exhibit high performance under natural convection conditions. Therefore, it is indispensable to install a forced convection generating means for the Kenzan-shaped heat sink. In the case of a Kenzan-shaped heat sink, the performance of heat dissipation by forced convection parallel to the fins is often much better than that of heat dissipation by forced convection perpendicular to the fins. If convection control is appropriate, heat transfer capacity is 1. 5
~ 2.0 times improved. Therefore, it is indispensable for the sword-shaped heat sink to have an appropriate convection control means.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 is an explanatory view common to the basic structure of the device housing internal temperature lowering means and the first and second embodiments. Reference numeral 1 denotes a housing wall that hermetically separates a housing outside C and a housing inside H of the sealed device housing. The heat radiation surface 3-3 of the cooled body 3 is adhered to the inner wall surface of a predetermined portion of the housing wall 1, and the heat radiation surface 3-3 of the cooled body 3 of the same portion of the housing wall 1 is bonded. On the outer wall that correctly corresponds to the adhesive surface, the sword-shaped heat sink 2
The heat receiving surface 2-4 of the heat receiving flat plate 2-2 is adhered. The heat radiating surface 3-3 of the cooled body 3 and the heat receiving surface 2-4 of the heat receiving flat plate 2-2 of the sword-shaped heat sink 2 have substantially the same shape and substantially the same area. Further, in the housing wall 1, at least the portion where the heat radiating surface 3-3 and the heat receiving surface 2-4 are bonded is formed of a thin metal having good heat conductivity, such as an aluminum thin plate. .

Reference numeral 2-6 denotes a forced convection generating means, which is generally an axial flow fan, and the low temperature forced convection generated by this 2
By -7, the heat dissipation capability of the sword-shaped fin group 2-1 of the sword-shaped heat sink 2 is enhanced. The fan may be arranged so as to blow forced convection, or may be arranged so as to generate forced convection by air suction of the fan.

2-5 is a convection control means, which is generally formed of a metal plate, prevents forced convection from escaping in a direction that does not contribute to heat exchange, and controls the flow direction of convection to control the heat flow. Improves exchange efficiency. Although FIG. 1 shows an example in which convection is controlled so as to be orthogonal to the fin group, the flow direction may be parallel to the fin group or oblique. In some cases, a large amount of convection having a large cross-sectional area is narrowed down to a small cross-sectional area to increase the flow velocity and introduce it into the fin group to significantly enhance the heat dissipation capability of the fin group. Therefore, as the shape of the convection control means, a wide variety of shapes are adopted corresponding to the respective control purposes.

In such an embodiment, the thermal resistance of heat transport from the object to be cooled to the heat sink is kept extremely small, and the excellent heat dissipation characteristics of the sword-shaped heat sink are effectively utilized, so that the object to be cooled in the enclosure housing is sealed. It is possible to efficiently dissipate the amount of heat of the outside of the housing through the housing wall. Such a cooling method is much more efficiently cooled than the method of cooling the air inside the equipment housing with a bent separator panel or the indirect cooling method of exchanging the heat quantity of the air inside and outside the housing by heat transfer of a heat pipe. Can cool the body.

Second Embodiment In this embodiment, the main heat-generating component in the component group in the enclosure housing is bonded to the inner wall surface of the enclosure wall 1 as the cooled object 3. When there are a plurality of main heat-generating components, there are a plurality of objects to be cooled 3, and correspondingly, there are also a plurality of sword-shaped heat sinks bonded to the outer wall surface of the housing wall 1. With this configuration, most of the heat generated inside the device housing is discharged from the blade-shaped heat sink 2 to the outside of the device housing through the housing wall 1. The small amount of heat generated by the remaining parts in the parts group
Although not shown in FIG. 1, the heat absorption capacity of the inner wall surface of the equipment casing is increased by the forced convection caused by the forced convection generating means provided in a predetermined portion inside the equipment casing,
It passes through all the housing walls of the equipment housing and is discharged from all the outer wall surfaces of the housing.

Third Embodiment In the third embodiment, a method of cooling the air in the closed casing is adopted as the internal temperature lowering means of the equipment casing. Therefore, the Kenzan-shaped heat absorbing element 4 is used as the object to be cooled. The sword-shaped heat absorbing element 4 includes a sword-shaped fin group 4-1 and a heat dissipation plate 4-2. The amount of heat of the high temperature forced convection 4-7 generated by the forced convection generating means 4-6 is the Kenyama-shaped fin group 4-.
1 is absorbed by the heat radiating plate 1, flows through the housing wall 1 from the heat radiating plate 4-2, and is discharged to the outside of the device housing through the sword-shaped heat sink 2. Although functionally different, the sword-shaped heat absorbing element 4 and the sword-shaped heat sink 2 have exactly the same structure.

Convection control means 4-5 is also provided on the sword-shaped heat absorbing element 4 in order to increase the heat absorbing capacity. This convection control means 4-5 also has the same structure and function as the convection control means 2-5 of the sword-shaped heat sink 2.

Fourth Embodiment This embodiment is an embodiment in which the above-mentioned temperature lowering means of the equipment casing is constructed as a detachable unit as illustrated in FIG. 3 and FIG. In FIG. 4, a predetermined portion of the housing wall 1 is provided with an opening 1-1 having a predetermined area and a predetermined shape, and the opening 1-1 is a detachable separator panel. 5 is attached airtightly. The separator panel 5 is a separator for airtightly separating and separating the convective air inside and outside the equipment casing, and is formed of a thin metal plate having good heat conductivity. On the surface of the separator panel 5 that contacts the air convection outside the housing, a sword-shaped heat sink 2 is adhered, and a forced convection generating means 2-6 and a convection control means 2-5 are provided adjacent to this. is there. Further, in the surface of the separator panel 5 that contacts the air convection in the housing, at a position that exactly corresponds to the position where the sword-shaped heat sink 2 is adhered, the cooled object 3 or the sword-shaped heat absorbing element 4 is provided. In the case where the bonded body is the sword-shaped heat absorbing element 4, the forced convection generating means 4-6 and the convection control means 4-5 are provided in parallel with it.

The combined structure of the separator panel, the sword-shaped heat sink, the body to be cooled (or the sword-shaped heat absorbing element), the forced convection generating means and the convection control means is constructed as a temperature drop unit inside the equipment casing as a whole. is there. In FIGS. 3 and 4, the temperature lowering unit inside the equipment housing is housed in the convection control housing 10 which also serves as the convection control means.

In this embodiment, either the heat-receiving flat plate 2-2 of the sword-shaped heat sink 2 or the heat-dissipating flat plate 4-2 of the sword-shaped heat-absorbing element 4 is made larger to serve also as the separator panel 5. You can also Alternatively, by forming the sword-shaped fins directly on the separator panel 5, the heat-receiving flat plate 2 of the sword-shaped heat sink 2 can be formed.
-2, the heat dissipation flat plate 4-2 of the Kenzan-shaped heat absorption element 4 can be omitted.

[0027]

By applying the temperature lowering means inside the equipment casing configured as described above, the temperature lowering performance is greatly improved as compared with the case where the conventional temperature lowering means inside the equipment casing is applied. Not only can it be done, but it can also contribute to the miniaturization and weight reduction of the sealed equipment housing. Further, when it is applied as a temperature lowering unit inside a device case such as a conventional case cooling device, the performance of the unit is improved, and the size and weight can be greatly reduced. Further, since the performance of the temperature lowering unit inside the equipment casing does not change in any arrangement posture, there is an advantage that the degree of freedom in equipment design is increased. As a further great advantage, it is not necessary to disassemble all of the units when cleaning the units, and it is sufficient to remove only the radiating blade-shaped heat sink 2 for cleaning, and the time required for cleaning can be reduced to a fraction. .

[Brief description of drawings]

FIG. 1 is an explanatory view of a basic structure of a device casing internal temperature lowering means of the present invention, and a first embodiment and a second embodiment.

FIG. 2 is an explanatory view of a third embodiment of the temperature lowering means inside the equipment casing of the present invention.

FIG. 3 is an explanatory diagram of an example of a fourth embodiment of the temperature lowering means inside the equipment casing of the present invention.

FIG. 4 is an explanatory view of another example of the fourth embodiment of the temperature lowering means inside the equipment casing of the present invention.

FIG. 5 is an explanatory diagram showing an example of the structure of a conventional casing cooling device that is a temperature lowering means inside the device casing.

FIG. 6 is an explanatory view showing another example of the structure of a conventional casing cooling device that is a temperature lowering means inside the device casing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing wall 1-1 Opening 2 Kenzan-shaped heat sink 2-5 Convection control means 2-6 Forced convection generation means 2-7 Low temperature convection 3 Cooled body 4 Kenzan-shaped heat absorption element 4-5 Convection control means 4-6 Forced convection generating means 4-7 High temperature convection 5 Separator panel 7 Bent type separator panel 8 Heat pipe group 9 Separator panel 10 Convection control case C Case outside H Case inside

Claims (4)

[Claims] 1. A heat-receiving flat plate made of a thin metal plate is provided with fin-shaped fins on the heat-radiating surface, and the heat-receiving flat plate is adhered to the heat-radiating surface of an object to be cooled arranged in the housing. Effectively applying the Kenyama-shaped heat sink that radiates the absorbed heat of the cooled object to the convection outside air from the Kenyama-shaped fin group to cool the cooled object, effectively lowering the internal temperature of the sealed device housing. This is a means for lowering the temperature, in which the heat-receiving surface of the sword-shaped heat sink and the heat-dissipating surface of the object to be cooled have almost the same shape and area, and they sandwich a predetermined part of the housing wall of the target device to cool it. The body is bonded to the inner wall surface of the housing wall, and the sword-shaped heat sink is bonded to the outer wall surface of the housing wall so as to correspond to each other and as close as possible to each other, and further, on the housing wall of the sealed device housing. At least the object to be cooled and the shape of the sword The part where the heat sink is bonded inside and outside is formed of a thin metal plate with good thermal conductivity, and the sword-shaped heat sink is equipped with a forced convection generation means and a convection control means to increase its heat dissipation capability. The temperature lowering means inside the equipment casing is characterized by being provided. 2. The object to be cooled, which is adhered to the inner wall of a predetermined portion of the housing wall of the hermetically sealed equipment housing, is the main heat-generating component in the component group of the device, and the small amount of heat generated by the remaining component group is 2. The temperature drop inside the equipment housing according to claim 1, wherein the forced convection generating means provided in a predetermined portion in the housing radiates heat to the outside of the housing through all wall surfaces of the hermetically sealed housing. means. 3. The sealed object housing has a body to be cooled, which is adhered and attached to the housing wall, which absorbs heat from convective air in the equipment and discharges heat from the radiating surface by means of a group of fins. 2. The device casing according to claim 1, wherein the device is a heat absorption element, and a forced convection generation means and a convection control means for increasing the heat absorption capacity are provided in parallel with the sword-shaped heat absorption element. Means for lowering body temperature. 4. An opening of a predetermined shape having a predetermined area is provided in a predetermined portion of a housing wall of the hermetically sealed equipment housing, and a detachable separator panel is mounted in the opening. This separator panel is a separator that shields convective air inside and outside the equipment casing from each other and secretly, and is formed of a thin metal plate having good thermal conductivity. A sword-shaped heat sink is adhered to the surface that comes into contact with the air convection, and a forced convection generating means and a convection control means are attached to the heat sink in parallel with it. An object to be cooled or a sword-shaped heat absorbing element is adhered at a position that exactly corresponds to the position where the stencil-shaped heat sink is adhered. strength The control convection generating means and the convection control means are mounted, and the combined structure of the separator panel, the sword-shaped heat sink, the cooled object (or the sword-shaped heat absorbing element), the forced convection generation means and the convection control means is the whole. The device housing internal temperature lowering unit according to claim 1, which is configured as a device housing internal temperature lowering unit.