JPH0610661Y2 - 高圧コンデンサ - Google Patents

Info

Publication number

JPH0610661Y2

JPH0610661Y2 JP5971788U JP5971788U JPH0610661Y2 JP H0610661 Y2 JPH0610661 Y2 JP H0610661Y2 JP 5971788 U JP5971788 U JP 5971788U JP 5971788 U JP5971788 U JP 5971788U JP H0610661 Y2 JPH0610661 Y2 JP H0610661Y2

Authority

JP

Japan

Prior art keywords

container

cylinder

gas

resin liquid

insulating gas

Prior art date

1988-05-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 239000003990 capacitor Substances 0.000 title claims description 68
• 239000007788 liquid Substances 0.000 claims description 43
• 229920003002 synthetic resin Polymers 0.000 claims description 29
• 239000000057 synthetic resin Substances 0.000 claims description 29
• 238000004804 winding Methods 0.000 claims description 19
• 229920005989 resin Polymers 0.000 claims description 6
• 239000011347 resin Substances 0.000 claims description 6
• 239000003822 epoxy resin Substances 0.000 description 19
• 229920000647 polyepoxide Polymers 0.000 description 19
• 238000004519 manufacturing process Methods 0.000 description 5
• 230000004308 accommodation Effects 0.000 description 4
• 238000009413 insulation Methods 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 239000000243 solution Substances 0.000 description 3
• RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
• 238000005266 casting Methods 0.000 description 2
• 239000003063 flame retardant Substances 0.000 description 2
• 230000005484 gravity Effects 0.000 description 2
• 238000002347 injection Methods 0.000 description 2
• 239000007924 injection Substances 0.000 description 2
• 239000011104 metalized film Substances 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 238000007789 sealing Methods 0.000 description 2
• 238000004891 communication Methods 0.000 description 1
• 230000006835 compression Effects 0.000 description 1
• 238000007906 compression Methods 0.000 description 1
• 230000007423 decrease Effects 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000011256 inorganic filler Substances 0.000 description 1
• 229910003475 inorganic filler Inorganic materials 0.000 description 1
• 230000014759 maintenance of location Effects 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 239000002985 plastic film Substances 0.000 description 1
• 229920006255 plastic film Polymers 0.000 description 1
• 238000012805 post-processing Methods 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000005507 spraying Methods 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1
• 238000009423 ventilation Methods 0.000 description 1