JPH06104362A - Hybrid module - Google Patents
Hybrid moduleInfo
- Publication number
- JPH06104362A JPH06104362A JP4251104A JP25110492A JPH06104362A JP H06104362 A JPH06104362 A JP H06104362A JP 4251104 A JP4251104 A JP 4251104A JP 25110492 A JP25110492 A JP 25110492A JP H06104362 A JPH06104362 A JP H06104362A
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- terminal
- connection terminal
- envelope
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はハイブリッドモジュ―ル
に係り、特に外囲器壁を貫挿突設された外部接続用端子
に対する接続リ―ドの信頼性の高い接続および維持を可
能にしたハイブリッドモジュ―ルの改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid module, and in particular, enables highly reliable connection and maintenance of a connection lead to an external connection terminal projecting through an envelope wall. Regarding the improvement of hybrid modules.
【０００２】[0002]
【従来の技術】たとえば、ベ―ス板上に厚膜基板など具
備して成る所要のハイブリッド回路板を配設するととも
に、前記ハイブリッド回路板を囲むように樹脂製筒状体
の一端を前記ベ―ス板に接着し、所要のリ―ド接続を行
った後、前記筒状体の開口端を蓋体で封止した構造のハ
イブリッドモジュ―ルが知られている。すなわち、図５
にその構成の要部を斜視的に示すように、ベ―ス板１上
に配設されたＩＣ素子などを実装したハイブリッド回路
板２と、前記ハイブリッド回路板２を内装するように、
ベ―ス板１面上に一体に配設された樹脂製の外囲器３の
一部を成す筒状体3a壁と、前記筒状体3a壁に貫挿突設さ
れている平板型の外部接続用端子（ターミナル）４と、
前記外部接続用端子４に一端が電気的に接続され、他端
がハイブリッド回路板２のリ―ド取り出し用パッド2aに
電気的に接続された接続リード（リード線）５と、前記
筒状体3aの開口部を封止する蓋体（図示せず）…この蓋
体は外囲器３の一部を成す…とを具備して成るハイブリ
ッドモジュ―ルが実用に供されている。2. Description of the Related Art For example, a required hybrid circuit board comprising a thick film substrate or the like is arranged on a base board, and one end of a resin cylindrical body is surrounded by the base board so as to surround the hybrid circuit board. There is known a hybrid module having a structure in which the open end of the tubular body is sealed with a lid after being bonded to a base plate and performing a required lead connection. That is, FIG.
As shown in a perspective view of the main part of the configuration, a hybrid circuit board 2 on which an IC element or the like disposed on the base board 1 is mounted, and the hybrid circuit board 2 are internally mounted,
A cylindrical body 3a wall forming a part of the resin-made envelope 3 integrally arranged on the surface of the base plate 1, and a flat plate type protruding through the cylindrical body 3a wall. External connection terminal (terminal) 4,
The connection lead (lead wire) 5 having one end electrically connected to the external connection terminal 4 and the other end electrically connected to the lead extraction pad 2a of the hybrid circuit board 2, and the tubular body. A hybrid module including a lid (not shown) that seals the opening of 3a ... This lid forms a part of the envelope 3 is put to practical use.
【０００３】そして、この種のハイブリッドモジュ―ル
においては、上記したように筒状体3a壁に貫挿凸設され
た平板型の外部接続用端子４は、筒状体3a内で接続リー
ド５のボンディング，溶接，もしくは半田付けにより、
ハイブリッド回路板２と電気的な接続が成されている。
図６はこの電気的な接続の態様を断面的に示したもので
ある。In this type of hybrid module, as described above, the flat plate-type external connection terminal 4 which is projectingly inserted through the wall of the tubular body 3a has the connecting lead 5 inside the tubular body 3a. By bonding, welding, or soldering of
An electrical connection is made with the hybrid circuit board 2.
FIG. 6 is a sectional view showing the mode of this electrical connection.
【０００４】ところで、上記構成のハイブリッドモジュ
ールにおいては、実装具備するハイブリッドＩＣの電気
的な特性（たとえば大容量化）によって、平板型の外部
接続用端子４とハイブリッド回路板２とを電気的に接続
する接続リード５として太めリード線、たとえば直径 1
50〜 600μm 程度を要求されることが往々ある。そし
て、前記のごとく直径を太めに設定した場合、前記接続
リード５の接続は、一般的に超音波ウエッジボンディン
グよって行っている。図７はこの超音波ウエッジボンデ
ィングの実施態様を断面的に示したもので、外部接続用
端子（ターミナル）４面とボンディングツール６との間
に、太めの接続リード５端子部を介在させ、ボンディン
グツール６に、所要の荷重および振動を印加することに
より、平板型の外部接続用端子４と接続リード５との界
面に摩擦熱を発生させて両者を結合させている。In the hybrid module having the above structure, the flat type external connection terminal 4 and the hybrid circuit board 2 are electrically connected due to the electrical characteristics (for example, large capacity) of the mounted hybrid IC. A thicker lead wire, for example a diameter of 1
It is often required to have a thickness of 50 to 600 μm. When the diameter is set larger as described above, the connection lead 5 is generally connected by ultrasonic wedge bonding. FIG. 7 is a sectional view showing an embodiment of this ultrasonic wedge bonding, in which a thick connecting lead 5 terminal portion is interposed between the external connection terminal (terminal) 4 surface and the bonding tool 6. By applying a required load and vibration to the tool 6, frictional heat is generated at the interface between the flat plate type external connection terminal 4 and the connection lead 5 to couple the two.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記外部接続
用端子４と接続リード５とを対接させ、界面に摩擦熱を
発生させて両者を結合・一体化する接続構成の場合は、
次のような不都合がしばしば認められる。すなわち、平
板型の外部接続用端子４に超音波ウエッジボンディング
によって太めの接続リード５を結合・一体化する場合
は、ボンディングツール６に、大きな荷重および強度の
振動を印加する必要がある。しかしながら、前記図７か
らも分かるように、外部接続用端子４は筒状体3a壁に貫
挿突設されており、いわゆる片持ちばり構造を採ってい
るため、前記ボンディングツール６に大きな荷重および
強度の振動を印加すると、平板型の外部接続用端子４に
撓み振動が発生して、その外部接続用端子４と接続リー
ド５との十分、かつ強固な接合（結合）を達成し得ない
という問題がある。However, in the case of a connection structure in which the external connection terminal 4 and the connection lead 5 are brought into contact with each other and frictional heat is generated at the interface to bond and integrate the two,
The following inconveniences are often observed. That is, when the thick connecting lead 5 is joined and integrated with the flat plate-type external connection terminal 4 by ultrasonic wedge bonding, it is necessary to apply a large load and strong vibration to the bonding tool 6. However, as can be seen from FIG. 7, the external connection terminal 4 is projectingly inserted through the wall of the cylindrical body 3a and has a so-called cantilever structure, so that a large load and a large load are applied to the bonding tool 6. When strong vibration is applied, flexural vibration occurs in the flat plate-type external connection terminal 4, and it is impossible to achieve sufficient and strong bonding (coupling) between the external connection terminal 4 and the connection lead 5. There's a problem.
【０００６】前記問題に対して、平板型の外部接続用端
子（ターミナル）４の厚さを厚くし、曲げ剛性を高める
ことも試みられているが、外部接続用端子４の成型性お
よび加工性の点から実用に適さない。また、補強樹脂ブ
ロックを内装させて、突設する外部接続用端子（ターミ
ナル）４を下側から支持する構成も試みられているが、
外部接続用端子４を構成する金属に対し、補強樹脂の曲
げ剛性が劣るため（金属のヤング率10×1010 N／mm2 ，
樹脂のヤング率 1×1010 N／mm2 ）、前記ボンディング
ツール６に印加する大きな荷重によって容易に変形し、
所要の機能を果たさない。To solve the above problem, it has been attempted to increase the thickness of the flat plate type external connection terminal (terminal) 4 to increase the bending rigidity. However, the moldability and workability of the external connection terminal 4 have been tried. From the point of, it is not suitable for practical use. In addition, a structure in which a reinforcing resin block is internally provided and the protruding external connection terminal (terminal) 4 is supported from below has been attempted.
The bending rigidity of the reinforcing resin is inferior to that of the metal forming the external connection terminal 4 (Young's modulus of the metal is 10 × 10 10 N / mm 2 ,
Young's modulus of resin 1 × 10 10 N / mm 2 ), easily deformed by a large load applied to the bonding tool 6,
Does not perform the required function.
【０００７】本発明は上記事情に対処してなされたもの
で、ボンディングツールの印加振動などに基因する問題
を解消ないし低減しながら、信頼性の高い電気的な接続
を保持するハイブリッドモジュールの提供を目的とす
る。The present invention has been made in view of the above circumstances, and provides a hybrid module that maintains a highly reliable electrical connection while eliminating or reducing the problems caused by applied vibration of a bonding tool. To aim.
【０００８】[0008]
【課題を解決するための手段】本発明に係るハイブリッ
ドモジュールは、樹脂製の外囲器と、前記外囲器内に装
着・配置されたハイブリッド回路板と、前記外囲器壁を
貫挿突設された外部接続用端子と、前記外囲器内におい
て一端が外部接続用端子に接続し他端がハイブリッド回
路板に接続する接続リ―ドとを具備して成るハイブリッ
ドモジュ―ルにおいて、前記外囲器壁を貫挿突設された
外部接続用端子の外囲器内側突設部の断面形状をＴ字
型，逆Ｕ字型，逆Ｌ字型化して水平方向に対し補強した
ことを特徴とする。A hybrid module according to the present invention includes a resin envelope, a hybrid circuit board mounted and arranged in the envelope, and a protrusion penetrating the envelope wall. A hybrid module comprising: an external connection terminal provided; and a connection lead having one end connected to the external connection terminal and the other end connected to a hybrid circuit board in the envelope, wherein: That the cross-sectional shape of the protruding portion on the inside of the envelope of the external connection terminal projecting through the envelope wall is T-shaped, inverted U-shaped, inverted L-shaped and reinforced in the horizontal direction. Characterize.
【０００９】[0009]
【作用】上記のように、外囲器内側に突設する外部接続
用端子の断面形状を、Ｔ字型化，逆Ｕ字型化もしくは逆
Ｌ字型化などして補強した構成とすることにより、比較
的太い接続リ―ド（リード線）とを、ボンディングツー
ルに大きな荷重および強度の振動を印加して接続・一体
化した場合も、撓み振動の発生など回避されるので、信
頼性の高い電気的な接続の形成および保持される。As described above, the cross-sectional shape of the external connection terminal projecting inside the envelope is reinforced by making it T-shaped, inverted U-shaped or inverted L-shaped. As a result, even if a relatively thick connection lead (lead wire) is connected / integrated by applying a large load and strong vibration to the bonding tool, flexural vibration etc. are avoided and reliability is improved. Formation and retention of high electrical connections.
【００１０】[0010]
【実施例】以下図１〜図４を参照して本発明の実施例を
説明する。Embodiments of the present invention will be described below with reference to FIGS.
【００１１】本発明に係るハイブリッドモジュールは、
基本的な点において従来の場合と同様な構成を成してい
る。すなわち、前記図５にその構成の要部を斜視的に示
すように、ベ―ス板１上に配設されたＩＣ素子などを実
装したハイブリッド回路板２と、前記ハイブリッド回路
板２を内装するように、ベ―ス板１面上に一体に配設さ
れた樹脂製の外囲器３の一部を成す筒状体3a壁と、前記
筒状体3a壁に貫挿突設されている外部接続用端子（ター
ミナル）４′と、前記外部接続用端子４′に一端が電気
的に接続され、他端がハイブリッド回路板２のリ―ド取
り出し用パッド2aに電気的に接続された接続リード（リ
ード線）５と、前記筒状体3aの開口部を封止する蓋体
（図示せず）…この蓋体は外囲器３の一部を成す…とを
具備した構成を成している。The hybrid module according to the present invention is
The basic structure is similar to that of the conventional case. That is, as shown in a perspective view of the main part of the configuration in FIG. 5, a hybrid circuit board 2 on which an IC element or the like arranged on the base board 1 is mounted, and the hybrid circuit board 2 are installed. As described above, the cylindrical body 3a wall forming a part of the resin-made envelope 3 integrally arranged on the surface of the base plate 1 and the cylindrical body 3a are provided so as to penetrate and project. A connection in which one end is electrically connected to the external connection terminal (terminal) 4'and the external connection terminal 4'and the other end is electrically connected to the lead take-out pad 2a of the hybrid circuit board 2. A lead (lead wire) 5 and a lid (not shown) for sealing the opening of the cylindrical body 3a .. The lid forms a part of the envelope 3. ing.
【００１２】つまり、本発明に係るハイブリッドモジュ
―ルは、前記筒状体3a壁に貫挿突設されている外部接続
用端子（ターミナル）４′について、外囲器３の内側突
設部の断面形状を、Ｔ字型化，逆Ｕ字型化もしくは逆Ｌ
字型化し、水平方向に対する補強性を付与した点に特徴
付けられる。図１は、外囲器３の内側に突設した外部接
続用端子４′に、水平方向に対して補強手段を付与した
構造例を斜視的に示したものである。そして、この構造
例においては、外部接続用端子４′の外囲器３の内側に
突設した外部接続用端子４′部分を断面Ｔ字型化し、こ
の長さ l，平面部の幅 b，平面部厚さ h，脚部の高さ
h′，脚部の幅 c＝b/2 とそれぞれ設定されている。That is, in the hybrid module according to the present invention, with respect to the external connection terminal (terminal) 4'protruded through the wall of the cylindrical body 3a, the inner projecting portion of the envelope 3 is provided. The cross-sectional shape is T-shaped, inverted U-shaped or inverted L
It is characterized by being shaped like a letter and imparting reinforcement to the horizontal direction. FIG. 1 is a perspective view showing a structural example in which a reinforcing means is provided in the horizontal direction to an external connection terminal 4'protrudingly provided inside the envelope 3. In this structural example, the external connection terminal 4'protruding inside the envelope 3 of the external connection terminal 4'is made into a T-shaped cross section, and the length l, the width b of the flat portion, Plane thickness h, leg height
h'and leg width c = b / 2 are set.
【００１３】次に、上記構成の場合において、換言する
と外囲器３の内側に突設した外部接続用端子４′を断面
Ｔ字型化して補強したとき、ボンディングツールによる
接合で外部接続用端子４′の不用振動が軽減され、ボン
ディング性が向上する理由について説明する。先ず、こ
の構成において、外囲器３の内側に突設した外部接続用
端子４′に対する超音波ボンディングは、片持ちばりに
おける強制振動と考えることができる。したがって、外
部接続用端子４′に定常振動が引起されることになり、
この強制定常振動の振幅は、外部接続用端子４′の質量
(M) ，バネ定数(k)，強制振動の周波数（ω）とし、質
量(M) および強制振動の周波数（ω）を一定として、バ
ネ定数 (k)を求めると、断面２次極モーメント I2 は、
I2 ＝bh3 ／ 4となり、この系のバネ定数 k2 は、k2 ＝
3bh3 ／4l3 ×104 、 k2 ＝3k1 となって、図２に示さ
れる強制定常振動の周波数特性において、Ａ点で示され
る振幅を採っている。Next, in the case of the above construction, in other words, when the external connection terminals 4'protruding inside the envelope 3 are reinforced by making them T-shaped in section, the external connection terminals are joined by a bonding tool. The reason why the unnecessary vibration of 4'is reduced and the bondability is improved will be described. First, in this configuration, ultrasonic bonding to the external connection terminals 4'protruding inside the envelope 3 can be considered as forced vibration in a cantilever beam. Therefore, a steady vibration is generated in the external connection terminal 4 ',
The amplitude of this forced steady vibration is the mass of the external connection terminal 4 '.
(M), spring constant (k), frequency of forced vibration (ω), mass (M) and frequency of forced vibration (ω) are constant, spring constant (k) is calculated. 2 is
I 2 = bh 3/4, and the spring constant k 2 of this system, k 2 =
3bh 3 / 4l 3 × 10 4 , k 2 = 3k 1, and the amplitude indicated by point A is taken in the frequency characteristic of the forced steady vibration shown in FIG. 2.
【００１４】比較のため、図５に斜視的に示すごとく、
外囲器３の内側に突設した平板型の外部接続用端子４の
長さ l，平面部の幅 b，平面部厚さ hとそれぞれ設定し
た場合においては、外部接続用端子４の質量(M) ，バネ
定数 (k)，強制振動の周波数（ω）とし、質量(M) およ
び強制振動の周波数（ω）を一定とすると、バネ定数(k
1 ）は、k1 ＝ 3 E1 I 1 ／ l3 で表される。ここで、
E1 は外部接続用端子４のヤング率（ 1×104 (kg/c
m2 ）、I 1 は外部接続用端子４の断面２次極モーメン
トであり、このI 1 は、外部接続用端子４の形状により
変化し、この例ではバネ定数k1 は、k1 ＝bh3 ／4l3 ×
104 となり、前記図２に示される強制定常振動の周波数
特性において、Ｂ点で示される振幅を採っている。For comparison, as shown in a perspective view in FIG.
When the length l, the width b of the flat surface portion, and the thickness h of the flat surface portion of the flat plate type external connection terminal 4 projecting inside the envelope 3 are set respectively, the mass of the external connection terminal 4 ( M), spring constant (k), forced vibration frequency (ω), and mass (M) and forced vibration frequency (ω) are constant, spring constant (k
1) it is expressed by k 1 = 3 E 1 I 1 / l 3. here,
E 1 is the Young's modulus of the external connection terminal 4 (1 × 10 4 (kg / c
m 2 ), I 1 is the second moment of inertia of area of the external connection terminal 4, and this I 1 changes depending on the shape of the external connection terminal 4. In this example, the spring constant k 1 is k 1 = bh 3 / 4l 3 x
This is 10 4 , and in the frequency characteristic of the forced steady vibration shown in FIG. 2, the amplitude shown at point B is adopted.
【００１５】前記説明および図２から分かるように、本
発明に係る構成の場合は、外囲器３の内側に突設した外
部接続用端子４′のバネ定数が、従来の場合に比べて３
倍になっており、また、外部接続用端子４′の振動の周
波数および振幅も大幅に低減（軽減）している。このた
め、たとえばボンディンクツールによる超音波ウエッジ
ボンディングの場合、外囲器３の内側に突設した外部接
続用端子４′への不用振動も軽減され、常に確実な接合
を達成し得る。また、ハイブリッドモジュールとして実
用段階での、外部衝撃ないし振動などに対しても、信頼
性の高い電気的な接続を保持発揮する。As can be seen from the above description and FIG. 2, in the case of the structure according to the present invention, the spring constant of the external connection terminal 4'protruding on the inner side of the envelope 3 is 3 as compared with the conventional case.
In addition, the frequency and the amplitude of the vibration of the external connection terminal 4'are significantly reduced (reduced). Therefore, for example, in the case of ultrasonic wedge bonding using a bonding tool, unnecessary vibration to the external connection terminals 4'protruding inside the envelope 3 is reduced, and reliable bonding can always be achieved. In addition, as a hybrid module, it retains and demonstrates a highly reliable electrical connection against external shocks or vibrations at the practical stage.
【００１６】なお、上記では外囲器３の内側に突設した
外部接続用端子４′を断面形状をＴ字型化した構成例を
示したが、図３および図４にそれぞれ斜視的に示すごと
く、外囲器３の内側に突設した外部接続用端子４′を断
面形状を逆Ｌ字型化、もしくは逆Ｕ字型化した場合も、
同様な作用・効果が認められた。In the above description, the external connection terminals 4'protrudingly provided inside the envelope 3 are shown in a T-shaped cross-section, but they are shown in perspective in FIGS. 3 and 4, respectively. As described above, when the external connection terminals 4'protruding inside the envelope 3 are formed into a reverse L-shape or a reverse U-shape,
Similar actions and effects were observed.
【００１７】[0017]
【発明の効果】上記説明からも分るように、本発明方法
に係るハイブリッドモジュ―ルにおいては、接続リード
（リ―ド線）による外部接続用端子とハイブリッド回路
板との電気的な接続が確実、かつ安定した状態で達成・
保持される。つまり、上記ハイブリッド回路板に一端が
接続するリ―ド線を溶接接続する外部接続用端子につい
て、その断面形状を平板型からＴ字型化などに変えて、
上面に垂直方向に印加される荷重や振動に対する補強が
付与されている。このため、リ―ド線との接続において
は、振動の影響などが大幅に軽減され、信頼性の高い接
続が成されるとともに、たとえば車載用のハイブリッド
モジュ―ルとして実用に供した場合も、安定した機能を
常に呈し得ることになる。As can be seen from the above description, in the hybrid module according to the method of the present invention, the electrical connection between the external connection terminal and the hybrid circuit board by the connection lead (lead wire) is established. Achieved in a reliable and stable state
Retained. That is, regarding the external connection terminal for welding and connecting the lead wire whose one end is connected to the hybrid circuit board, the cross-sectional shape is changed from a flat plate type to a T-shaped type,
Reinforcement against the load and vibration applied in the vertical direction is given to the upper surface. For this reason, in connection with the lead wire, the influence of vibration is greatly reduced, and a highly reliable connection is made, and when it is put into practical use as a hybrid module for vehicles, for example. A stable function can always be exhibited.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明に係るハイブリッドモジュールの要部構
成例を示す斜視図。FIG. 1 is a perspective view showing a configuration example of a main part of a hybrid module according to the present invention.
【図２】本発明に係るハイブリッドモジュールにおける
外囲器の内側に突設した外部接続用端子の強制定常振動
の周波数特性を従来の構成の場合と比較して示す曲線
図。FIG. 2 is a curve diagram showing a frequency characteristic of forced steady vibration of an external connection terminal projecting inside an envelope in a hybrid module according to the present invention in comparison with a case of a conventional configuration.
【図３】本発明に係るハイブリッドモジュールの他の要
部構成例を示す斜視図。FIG. 3 is a perspective view showing another structural example of the main part of the hybrid module according to the present invention.
【図４】本発明に係るハイブリッドモジュールのさらに
他の要部構成例を示す斜視図。FIG. 4 is a perspective view showing still another example of the main configuration of the hybrid module according to the present invention.
【図５】従来のハイブリッドモジュールの要部構成例を
示す斜視図。FIG. 5 is a perspective view showing a configuration example of a main part of a conventional hybrid module.
【図６】従来のハイブリッドモジュールにおいて外囲器
の内側に突設した外部接続用端子と接続リードとの接続
状態を示す断面図。FIG. 6 is a cross-sectional view showing a connection state between an external connection terminal and a connection lead, which are provided to project inside the envelope in a conventional hybrid module.
【図７】従来のハイブリッドモジュールにおいて外囲器
の内側に突設した外部接続用端子と接続リードとを接続
する状態を模式的に示す断面図。FIG. 7 is a cross-sectional view schematically showing a state in which a connection lead is connected to an external connection terminal projecting inside an envelope in a conventional hybrid module.
１…ベース板 ２…ハイブリッド回路板 2a…リー
ド取出用パッド ３…外囲器 3a…筒状体 ４…
平板型の外部接続用端子 ４′…補強型の外部接続用
端子 ５…接続リード（リード線） ６…ボンディ
ングツール1 ... Base plate 2 ... Hybrid circuit board 2a ... Lead extraction pad 3 ... Enclosure 3a ... Cylindrical body 4 ...
Flat type external connection terminal 4 '... Reinforcement type external connection terminal 5 ... Connection lead (lead wire) 6 ... Bonding tool
Claims (1)
・配置されたハイブリッド回路板と、前記外囲器壁を貫
挿突設された外部接続用端子と、前記外囲器内において
一端が外部接続用端子に接続し他端がハイブリッド回路
板に接続する接続リ―ドとを具備して成るハイブリッド
モジュ―ルにおいて、 前記外囲器壁を貫挿突設された外部接続用端子の外囲器
内側突設部の断面形状をＴ字型，逆Ｕ字型，逆Ｌ字型化
して水平方向に対し補強したことを特徴とするハイブリ
ッドモジュ―ル。1. An envelope made of resin, a hybrid circuit board mounted and arranged in the envelope, an external connection terminal projecting through the envelope wall, and the envelope. A hybrid module comprising: a connection lead having one end connected to an external connection terminal and the other end connected to a hybrid circuit board in a container, wherein an outer wall projecting through the envelope wall is provided. A hybrid module characterized in that the projecting portion of the connecting terminal inside the envelope is T-shaped, inverted U-shaped, or inverted L-shaped to be reinforced in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4251104A JPH06104362A (en) | 1992-09-21 | 1992-09-21 | Hybrid module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4251104A JPH06104362A (en) | 1992-09-21 | 1992-09-21 | Hybrid module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06104362A true JPH06104362A (en) | 1994-04-15 |
Family
ID=17217709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4251104A Pending JPH06104362A (en) | 1992-09-21 | 1992-09-21 | Hybrid module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06104362A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195263B1 (en) | 1998-03-20 | 2001-02-27 | Aisin Aw Co., Ltd. | Electronic control unit |
-
1992
- 1992-09-21 JP JP4251104A patent/JPH06104362A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6195263B1 (en) | 1998-03-20 | 2001-02-27 | Aisin Aw Co., Ltd. | Electronic control unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2939614B2 (en) | Stacked semiconductor package | |
| US5686711A (en) | Semiconductor acceleration sensor | |
| JPH06104362A (en) | Hybrid module | |
| JP2000068777A (en) | Piezoelectric vibrator | |
| JP2578530Y2 (en) | Terminal connection structure | |
| WO2001029509A1 (en) | Angular speed sensor | |
| JPS62274Y2 (en) | ||
| US6757946B2 (en) | Wire bonding method | |
| JP3072632B2 (en) | Piezoelectric oscillator | |
| JPH07297666A (en) | Surface mounted type piezoelectric oscillator | |
| JPH018071Y2 (en) | ||
| JP3201946B2 (en) | Semiconductor package | |
| JP3007806B2 (en) | Semiconductor device, method of manufacturing the same, and lead frame used therefor | |
| JP3291910B2 (en) | SAW device and manufacturing method thereof | |
| JP2599581Y2 (en) | Support structure for piezoelectric vibrator | |
| JP3265488B2 (en) | Manufacturing method of force / moment detecting device | |
| JPH0722896A (en) | Surface acoustic wave generator and its assembling method | |
| JPS6012339Y2 (en) | piezoelectric tuning fork | |
| JPH057771Y2 (en) | ||
| JP2689799B2 (en) | Acceleration sensor | |
| JP2522210B2 (en) | Integrated circuit device | |
| JPH07211560A (en) | Ignition equipment for internal combustion engine | |
| JP2021184565A (en) | Crystal oscillator | |
| JPH06278393A (en) | Ic module and its production | |
| JPS6024014Y2 (en) | Stem of crystal holder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20001003 |