JPH06100380A - Joint structure of ceramic material and metallic part - Google Patents

Abstract

PURPOSE:To obtain a joint structure resistant to corrosive gas and liquid, free from restriction on the kind of the material of ceramics and necessitating reduced time and labor by directly soldering with a gold or nickel-based soldering material incorporated with a specific amount of titanium hydride. CONSTITUTION:Metallic members 2, 3 are directly soldered to a ceramic member 1 with soldering materials 4, 5 containing gold or Ni as main component and incorporated with 1.0-40.0 pts.wt. of titanium hydride. The eutectic mixture of gold, Ni and Ti resistant to corrosive gas and liquid is active to all oxide, nitride and carbide ceramics to enable firm bonding to the ceramics. When the amount of titanium hydride is <1.0 pt.wt., the absolute amount of Ti-Au and Ti-Ni eutectic mixture is insufficient to get a firm bond and when the amount exceeds 40.0 pts.wt., the reaction of the eutectic mixture with the ceramic material takes place to form a large amount of fragile reaction layer and remarkably deteriorate the mechanical strength at the joint part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joint structure of a ceramic body and a metal member.

[0002]

2. Description of the Related Art Conventionally, a ceramic body is joined to a metal member by forming a paste by mixing an appropriate organic binder and a solvent with a refractory metal powder such as molybdenum or manganese on the surface of a raw or fired ceramic body. It is applied by a screen printing method, and this is fired in a reducing atmosphere to sinter and integrate the refractory metal powder and the ceramic body to deposit a metallized metal layer, and the metallized metal layer is coated with a silver brazing material ( (Copper-silver alloy).

[0003]

However, in the conventional joining of the ceramic body and the metal member, a metallized metal layer is applied to the ceramic body in advance, and the metal member is brazed to the metallized metal layer via a silver brazing material. Since the molybdenum, manganese, and copper, which form the brazing material, which compose the metallized metal layer, are vulnerable to corrosive gases such as chlorine gas and liquids, for example, semiconductor manufacturing equipment, etc. When it is applied as a part of an apparatus using corrosive gas, it has a drawback that the metallized metal layer and the brazing material are corroded and the bond between the ceramic body and the metal member is broken.

Further, in the conventional joining of a ceramic body and a metal member, a metallized metal layer must be previously deposited on the surface of the ceramic body. When the metallized metal layer is deposited on the surface of the ceramic body, the metal is previously deposited. It is necessary to prepare a paste, the metal paste is molybdenum, manganese, etc., finely pulverized so that the refractory metal powder has a particle size such that it passes through a mesh of a screen printing machine, and an organic binder and a solvent are added, It is manufactured by forming it into a paste, and it also has a drawback that it takes a lot of time and effort to manufacture the metal paste.

Further, the metallized metal layer using molybdenum, manganese, etc. is applied only to an oxide ceramic body represented by aluminum oxide, and a nitride ceramic body represented by silicon nitride or silicon carbide, or a carbide system. Since it is not adhered to the ceramic body, it has a drawback that the material on the ceramic body side is greatly restricted in joining the ceramic body and the metal member.

[0006]

DISCLOSURE OF THE INVENTION In view of the above-mentioned drawbacks, the present inventor has conducted various experiments and found that gold, nickel and titanium, which have resistance to corrosive gases, have all eutectic compounds of oxide type, nitride type and carbide type. It has been found that the ceramic body is active and firmly bonds to the metal member as well.

The present invention is based on the above findings,
It is an object of the present invention to provide a joint structure of a ceramic body and a metal member having resistance to a liquid.

Since the joint structure of the present invention has resistance to corrosive gases and liquids, it is preferably used for parts such as semiconductor manufacturing equipment using corrosive gases.

[0009]

The joining structure of a ceramic body and a metal member according to the present invention is a brazing material in which the metal member is mainly composed of gold or nickel and 1.0 to 40.0 parts by weight of titanium hydride is added to the ceramic body. It is characterized by being directly brazed through.

In the joining structure of the present invention, when the amount of titanium hydride added to the metal containing gold or nickel as the main component is less than 1.0 part by weight, the absolute content of the titanium-gold and titanium-nickel eutectic crystal is The amount is insufficient, the metal member cannot be firmly bonded to the ceramic body, and
If it exceeds the weight part, the eutectic of titanium-gold and titanium-nickel is excessively formed, and the eutectic of titanium-gold and titanium-nickel reacts with the ceramic body to form a large amount of brittle reaction layer. However, the mechanical strength at the joint between the ceramic body and the metal member is greatly deteriorated. Therefore, the addition amount of titanium hydride added to the metal containing gold or nickel as a main component is specified in the range of 1.0 to 40.0 parts by weight.

[0011]

The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. FIG. 1 shows an embodiment in which the joining structure of the ceramic body and the metal member of the present invention is applied to a vacuum terminal attached to a vacuum device of a semiconductor manufacturing apparatus, where 1 is a ceramic body, 2 is a sleeve, and 3 is It is a lead pin.

The ceramic body 1 has a collar portion 1a on the outer peripheral portion,
It has a through hole 1b in the center, and a cylindrical sleeve 2 is brazed to the collar 1a via a brazing material 4 and the through hole 1b
The lead pin 3 is inserted and fixed in this state with both ends thereof protruding.

The ceramic body 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a silicon nitride sintered body, or a silicon carbide sintered body, and has a function of holding the lead pin 3 with electrical insulation.

When the ceramic body 1 is made of an aluminum oxide sintered body, for example, alumina (Al ₂ O ₃ )
, Silica (SiO ₂ ), magnesia (MgO), calcia (CaO)
To prepare a raw material powder formed by adding and mixing a suitable organic solvent, a solvent, and the like, and then filling the raw material powder in a press die of a predetermined shape and pressing with a predetermined pressure to form the molded product at the end. Is produced by firing at a temperature of about 1600 ° C.

In the ceramic body 1, a sleeve 2 is directly brazed to a flange portion 1a on an outer peripheral portion of the ceramic body 1 through a brazing material 4, whereby the sleeve 2 is attached to the flange portion 1a of the ceramic body 1.

The sleeve 2 serves to attach the vacuum terminal to a vacuum device of a semiconductor manufacturing apparatus, and is formed of a metal material such as Kovar metal (Fe-Ni-Co alloy) or titanium (Ti). It is obtained by processing an ingot (lump) of Kovar metal, titanium or the like into a tubular shape by adopting a conventionally known metal processing method.

When the sleeve 2 is made of Kovar metal, a nickel plating layer having a thickness of 3 μm or more is layered on the surface of the sleeve 2 before brazing in order to improve corrosion resistance.

The brazing material 4 for brazing the sleeve 2 to the collar portion 1a of the ceramic body 1 is made of a metal containing gold or nickel as a main component and titanium hydride in an amount of 1.0 to 40.0 parts by weight. Place the brazing material 4 between the collar 1a of the body 1 and the sleeve 2 and keep it about 1000
When heated at a temperature of ° C, the titanium hydride of the brazing material 4 reacts with gold and nickel to form an active gold-titanium or nickel-titanium eutectic for the ceramic body 1 and sleeve 2, and the gold-titanium and nickel nickel The eutectic of ruthenium directly and firmly joins the sleeve 2 to the ceramic body 1.

Since the brazing material 4 is resistant to corrosive gas such as chlorine gas such as gold, nickel and titanium hydride, the brazing material 4 is made of the ceramic body 1 and the brazing material 4 After brazing through the brazing material, even if a corrosive gas such as chlorine gas comes into contact with the brazing material 4, etc., the brazing material 4 will not be corroded at all, and as a result, the ceramic body will not be corroded.
It is possible to maintain the strong joint of the sleeve 2 to the 1 as it is.

Further, the ceramic body 1 is inserted and fixed in the through hole 1b at the center thereof with the lead pins 3 protruding at both ends.

The lead pin 3 inserted into the through hole 1b of the ceramic body 1 serves to electrically connect a device inside the vacuum device and a device outside the vacuum device, and is made of a metal material such as Kovar metal or titanium. Has been formed.

When the lead pin 3 is made of Kovar metal, a nickel plating layer having a thickness of 3 μm or more is layered on the surface of the lead pin 3 before brazing in order to improve corrosion resistance.

The lead pin 3 is inserted into the through hole 1b of the ceramic body 1 and the through hole 1b of the ceramic body 1 is inserted.
It is fixed to the ceramic body 1 by brazing it around the brazing material 5.

The brazing material 5 for fixing the lead pin 3 to the ceramic body 1 is substantially the same as the brazing material 4 for brazing the sleeve 2 to the ceramic body 1, and the sleeve 2 is used for the ceramic body 1. The lead pins 3 are joined to the ceramic body 1 by the same method as for joining to the ceramic body 1.

Since the brazing material 5 has resistance to corrosive gas such as chlorine gas like the brazing material 4, after brazing the lead pins 3 to the ceramic body 1 through the brazing material 5, the brazing material 5 Even if a corrosive gas such as chlorine gas comes into contact with the above, the brazing material 5 is not corroded at all, and as a result, it is possible to maintain the strong bonding of the lead pin 3 to the ceramic body 1 as it is.

Thus, according to the above-mentioned vacuum terminal, the sleeve
2 is attached to a vacuum device such as a semiconductor manufacturing device, and the device inside the vacuum device and the device outside the vacuum device are electrically connected to the projecting ends of the lead pins 3 to electrically connect the device inside and outside the vacuum device. Functions as a terminal for transmitting signals.

(Experimental Example) Next, the operation and effect of the present invention will be described based on the experimental example shown below. First, an aluminum oxide sintered body (Al ₂ O ₃ ), a silicon nitride sintered body (Si ₃ N ₄ ), and a silicon carbide sintered body (SiC) are prepared as ceramic bodies,
Next, the diameter of the ceramic body was set by sandwiching a brazing material sample consisting of gold (Au) or nickel (Ni) powder as the main component with titanium hydride added externally in the amounts shown in Tables 1 and 2. A metal rod made of Kovar metal with a length of 5 mm and a length of 20 mm is placed, and this is fired at a temperature of about 1000 ° C. in a vacuum of 10 ^-5 Torr to react gold or nickel in the brazing material sample with titanium hydride. Then, a eutectic of gold-titanium or nickel-titanium is generated, and the eutectic is reacted with the ceramic body and the metal rod to bond the metal rod to the ceramic body.

Then, immediately after the metal rod is joined to the ceramic body and after being left in chlorine gas (concentration 20%) for 100 hours, the metal rod is pulled vertically to the ceramic body. The tensile strength when peeled off was examined, and the bonding strength per unit area was calculated.

In Tables 1 and 2, sample Nos. 17 to 19 are comparative samples for comparison with the present invention, and a metallized metal layer made of molybdenum-manganese is previously screen-printed on each ceramic body. The metallized metal layer is brazed to the metallized metal layer through silver brazing (silver-copper alloy). Table the above results
It is shown in 1 and Table 2.

[0030]

[Table 1]

[0031]

[Table 2]

[0032]

As can be seen from the above experimental results, a metallized metal layer such as molybdenum-manganese is deposited on a conventional ceramic body, and a metal member is brazed and bonded to the metallized metal layer. Although it adheres to the aluminum oxide sintered body, it does not adhere to the silicon carbide sintered body or the silicon nitride sintered body at all, and the ceramic body side is greatly restricted in joining the ceramic body and the metal member. On the other hand, according to the joining structure of the present invention, the metal member is bonded to any of the aluminum oxide sintered body, the silicon carbide sintered body, and the silicon nitride sintered body with a joint strength of 2 Kg / mm ² or more. By joining, it becomes possible to firmly join the metal member to any ceramic body.

In the conventional metallized metal layer to which a metal member is brazed and joined, the metallized metal layer and the brazing material are corroded by the chlorine gas when left to stand in chlorine gas for 100 hours. However, according to the joining structure of the present invention, only the metal having resistance to corrosive gas and liquid is used as the brazing material for joining the metal member to the ceramic body. Therefore, even if a corrosive gas or the like comes into contact with the brazing material, the brazing material is not corroded, and as a result, it becomes possible to maintain the bonding between the ceramic body and the metal member in a strong state.

Therefore, the joining structure of the ceramic body and the metal member according to the present invention is preferably applied to a device using a corrosive gas or a liquid, for example, a component used in a semiconductor manufacturing device or the like.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment in which the bonding structure of a ceramic body and a metal member according to the present invention is applied to a vacuum terminal attached to a vacuum device of a semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 ... Ceramic body 2 ... Sleeve 3 ... Lead pin 4, 5 ...

Claims (1)

[Claims] 1. A ceramic member comprising a metal member containing gold or nickel as a main component and titanium hydride in an amount of 1.0 to 40.
A joined structure of a ceramic body and a metal member, which is directly brazed through a brazing material added with 0 part by weight.