JPH0598133A - Production of inorganic molding and molding material therefor - Google Patents
Production of inorganic molding and molding material thereforInfo
- Publication number
- JPH0598133A JPH0598133A JP28355991A JP28355991A JPH0598133A JP H0598133 A JPH0598133 A JP H0598133A JP 28355991 A JP28355991 A JP 28355991A JP 28355991 A JP28355991 A JP 28355991A JP H0598133 A JPH0598133 A JP H0598133A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- molding
- inorganic
- inorganic particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、無機質成形体の製造方
法及びそれに用いる成形材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an inorganic molded body and a molding material used therefor.
【０００２】[0002]
【従来技術及びその問題点】無機質成形体を得るため
に、無機質粒子と液状のエポキシ樹脂組成物を混合し、
この混合物を成形し、硬化させる方法は知られている。
しかし、この方法の場合、バインダーとして用いるエポ
キシ樹脂組成物が粘稠な液状のものであるため、混合作
業性が悪いという問題がある上、その混合工程と成形工
程を同一場所において行わなければならないという不便
があった。2. Description of the Related Art In order to obtain an inorganic molded article, inorganic particles and a liquid epoxy resin composition are mixed,
Methods for shaping and curing this mixture are known.
However, in the case of this method, since the epoxy resin composition used as a binder is a viscous liquid, there is a problem that the mixing workability is poor, and the mixing step and the molding step must be performed at the same place. There was an inconvenience.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、従来技術に
見られる前記問題点を解決し、作業性にすぐれ、かつ無
機質粒子とエポキシ樹脂組成物との混合工程と、その混
合物の成形工程とを異った場所において実施することを
可能とする無機質成形体の製造方法及びそれに用いる成
形材料を提供することをその課題とする。DISCLOSURE OF THE INVENTION The present invention solves the above problems found in the prior art, is excellent in workability, and has a step of mixing inorganic particles and an epoxy resin composition, and a step of molding the mixture. It is an object of the present invention to provide a method for producing an inorganic molded body, which enables the manufacturing method to be carried out in different places, and a molding material used therefor.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、前記課題
を解決すべく鋭意研究を重ねた結果、本発明を完成する
に至った。即ち、本発明によれば、無機質粒子表面にエ
ポキシ樹脂組成物の微粉末を付着させる工程と、この工
程で得られた無機質粒子を所要形状に成形する工程と、
この工程で得られた成形体を加熱して、該成形体に含ま
れるエポキシ樹脂組成物を硬化させる工程からなる無機
質成形体の製造方法が提供される。また、本発明によれ
ば、無機質粒子表面にエポキシ樹脂組成物の微粉末を付
着させてなる成形材料が提供される。The present inventors have completed the present invention as a result of intensive studies to solve the above problems. That is, according to the present invention, a step of adhering a fine powder of the epoxy resin composition to the surface of the inorganic particles, a step of molding the inorganic particles obtained in this step into a required shape,
There is provided a method for producing an inorganic molded body, which comprises a step of heating the molded body obtained in this step to cure the epoxy resin composition contained in the molded body. Further, according to the present invention, there is provided a molding material obtained by adhering fine powder of an epoxy resin composition on the surface of inorganic particles.
【０００５】本発明で用いる無機質粒子としては、その
平均粒径が０．０３〜１０ｍｍ、好ましくは０．１〜７
ｍｍであるものが用いられる。その形状は、球状である
ことが好ましいが、必ずしも球状である必要はなく、岩
石等の破砕物であってもよい。また各種形状物を混合し
ても良い。このような無機質粒子としては、例えば、シ
リカビーズ、アルミナビーズ、ジルコニアビーズ、粘土
焼成体球状物、シラスバルーン、パーライト、ヒル石、
ゼオライト等が挙げられる。The inorganic particles used in the present invention have an average particle size of 0.03 to 10 mm, preferably 0.1 to 7 mm.
What is mm is used. The shape is preferably spherical, but is not necessarily spherical and may be a crushed material such as rock. In addition, various shapes may be mixed. As such inorganic particles, for example, silica beads, alumina beads, zirconia beads, clay fired body spherical material, shirasu balloon, pearlite, hil stone,
Examples thereof include zeolite.
【０００６】本発明において用いるバインダーは、エポ
キシ樹脂組成物の微粉末である。この場合のエポキシ樹
脂組成物としては、常温で固体状を示すものであれば任
意のものが用いられる。このものは、エポキシ樹脂と硬
化剤、必要に応じて硬化促進剤や無機充填剤等の補助成
分を含む。本発明においては、加熱硬化時におけるエポ
キシ樹脂組成物の溶融液が無機質粒子表面からその重力
により流下しないように、溶融時粘度の高いもの、通
常、１５０℃における溶融液の粘度が５００ポイズ以上
のもの、好ましくは、１０００ポイズ以上のものの使用
が好ましい。本発明においては、このエポキシ樹脂組成
物は、微粉末状で用いることが必要で、その平均粒径は
５０μｍ以下、好ましくは３０μｍ以下である。このエ
ポキシ樹脂組成物の粉末の平均粒径が前記範囲より大き
くなると、無機質粒子表面に対する付着結合性が悪くな
り、振動等の外力により、無機質粒子表面から容易に剥
離するようになる。The binder used in the present invention is a fine powder of an epoxy resin composition. In this case, any epoxy resin composition may be used as long as it is solid at room temperature. This contains an epoxy resin and a curing agent, and if necessary, auxiliary components such as a curing accelerator and an inorganic filler. In the present invention, in order to prevent the melt of the epoxy resin composition at the time of heat curing from flowing down from the surface of the inorganic particles due to its gravity, one having a high viscosity during melting, usually, the viscosity of the melt at 150 ° C. is 500 poise or more. It is preferable to use one having a porosity of 1,000 poise or more. In the present invention, this epoxy resin composition needs to be used in the form of fine powder, and its average particle size is 50 μm or less, preferably 30 μm or less. When the average particle size of the powder of the epoxy resin composition is larger than the above range, the adhesive bondability to the surface of the inorganic particles is deteriorated, and the particles are easily separated from the surface of the inorganic particles by an external force such as vibration.
【０００７】本発明においては、先ず、無機質粒子とエ
ポキシ樹脂組成物の微粉末とを混合する。この混合は、
従来公知の各種混合機を用いて行うことができる。エポ
キシ樹脂組成物の微粉末の使用割合は、無機質粒子１０
０重量部に対し、２〜３０重量部、好ましくは３〜２０
重量部の割合である。この混合工程により、表面にエポ
キシ樹脂組成物の微粉末が強固に付着結合した無機質粒
子が得られる。このものは、これに振動等の外力を与え
ても、その表面に付着したエポキシ樹脂組成物の微粉末
が容易に剥離するようなことはない。従って、このもの
は、成形材料として市場を流通させることができ、その
成形工程は別の場所において行うことができる。In the present invention, first, the inorganic particles and the fine powder of the epoxy resin composition are mixed. This mixture is
It can be performed using various conventionally known mixers. The use ratio of the fine powder of the epoxy resin composition is 10
0 to 30 parts by weight, preferably 3 to 20 parts by weight
The ratio is parts by weight. By this mixing step, inorganic particles in which fine powder of the epoxy resin composition is firmly adhered and bonded to the surface can be obtained. With this product, even if an external force such as vibration is applied to it, the fine powder of the epoxy resin composition attached to the surface thereof does not easily peel off. Therefore, this product can be distributed on the market as a molding material, and the molding process can be performed in another place.
【０００８】次に、前記のようにして得られる成形材料
は、これを所要の形状に成形し、加熱し、全体が一体に
結合した成形体とする。加熱温度は、無機質粒子表面に
付着したエポキシ樹脂組成物の微粉末が溶融硬化する温
度である。成形は金型や型枠を用いて行うことができ
る。寸法精度の良い成形体を得る場合には、その加熱成
形に、加熱加圧プレスを用いるのが好ましい。また、成
形体の加熱は、加熱炉において行うこともできる。金型
を用いて成形する場合、金型を用いる成形を加熱下で短
時間の条件で行ない、エポキシ樹脂組成物をゲル化させ
た状態で成形体を脱型し、次いでこの成形体をさらに加
熱してエポキシ樹脂組成物を完全に硬化させることもで
きる。この場合には、金型を短時間で開放することがで
きるので、金型の使用効率が向上する。Next, the molding material obtained as described above is molded into a desired shape and heated to obtain a molded body in which the whole is integrally bonded. The heating temperature is the temperature at which the fine powder of the epoxy resin composition attached to the surface of the inorganic particles melts and cures. The molding can be performed using a mold or a mold. In the case of obtaining a molded product with high dimensional accuracy, it is preferable to use a heating and pressing press for the heat molding. The heating of the molded body can also be performed in a heating furnace. When molding using a mold, the molding using the mold is performed under heating for a short period of time, the molded body is demolded while the epoxy resin composition is gelled, and this molded body is further heated. Then, the epoxy resin composition can be completely cured. In this case, since the mold can be opened in a short time, the use efficiency of the mold is improved.
【０００９】[0009]
【発明の効果】本発明においては、無機質粒子とエポキ
シ樹脂組成物との混合工程は、乾燥条件下で行われるこ
とから、作業性良く行うことができる上、得られる混合
物は、無機質粒子表面にエポキシ樹脂組成物が微粉末状
で強く付着結合したものであるから、これを成形材料と
して流通販売し、別の場所において成形することができ
る利点がある。本発明の無機質成形体は、無機質粒子の
集合体からなり、かつその粒子がその接触表面において
エポキシ樹脂組成物の硬化体を介して接合した構造する
ものである。このものは、すぐれた通気性及び透水性を
有し、床材や壁材として用いられる他、舗装道路におけ
る表面構造材等として利用される。INDUSTRIAL APPLICABILITY In the present invention, the mixing step of the inorganic particles and the epoxy resin composition is carried out under dry conditions, so that the workability can be improved and the resulting mixture can be applied to the surface of the inorganic particles. Since the epoxy resin composition is in the form of fine powder and strongly adhered and bonded, it has an advantage that it can be distributed and sold as a molding material and molded at another place. The inorganic molded body of the present invention is composed of an aggregate of inorganic particles, and has a structure in which the particles are bonded on the contact surface via a cured body of the epoxy resin composition. This material has excellent air permeability and water permeability, and is used as a floor material and a wall material, and is also used as a surface structural material in a paved road.
【００１０】[0010]
【実施例】次に本発明を実施例によりさらに詳細に説明
する。 実施例 エポキシ樹脂組成物の微粉末として、平均粒径が約９μ
ｍの難燃性エポキシ樹脂組成物の微粉末を用いた。ま
た、無機質粒子として、粘土焼成体球状物（「セラパー
ル」、新日本製鉄社製、平均粒径約２．０ｍｍ）を用い
た。前記無機質粒子１００重量部とエポキシ樹脂組成物
の微粉末１０重量部を粉体混合機に入れ、混合撹拌を行
った。このようにして得られた混合物は、無機質粒子表
面にエポキシ樹脂組成物の微粉末が均一にかつ強く付着
結合したものであることが確認された。次に、この混合
物を成形材料として用い、これを、縦：４０ｍｍ、横：
１６０ｍｍ、深さ：４０ｍｍの箱状金型に充填し、その
上から熱プレスを用い、温度：１５０℃、圧力：５ｋｇ
／ｃｍ2の条件で６０分間加熱加圧した。このようにし
て得られた成形体は、その無機質粒子の集合体が一体に
接合した構造を有し、かつその表面にはエポキシ樹脂組
成物が均一にコーティングされた無機質粒子が露出した
ものであり、そして透水性を有するものであることが確
認された。EXAMPLES Next, the present invention will be described in more detail by way of examples. Example As an epoxy resin composition fine powder, the average particle size is about 9μ.
The fine powder of the flame-retardant epoxy resin composition of m was used. Further, as the inorganic particles, a spherical clay-fired body (“Cerapearl”, manufactured by Nippon Steel Corporation, average particle diameter of about 2.0 mm) was used. 100 parts by weight of the inorganic particles and 10 parts by weight of fine powder of the epoxy resin composition were put into a powder mixer and mixed and stirred. It was confirmed that the mixture thus obtained was one in which fine powder of the epoxy resin composition was uniformly and strongly adhered to the surface of the inorganic particles. Next, this mixture was used as a molding material, which was 40 mm long and 40 mm wide.
It is filled in a box-shaped mold having a depth of 160 mm and a depth of 40 mm, and a heat press is used on the box-shaped mold to obtain a temperature of 150 ° C. and a pressure of 5 kg.
It was heated and pressed for 60 minutes under the condition of / cm 2 . The molded body thus obtained has a structure in which the aggregates of the inorganic particles are integrally bonded, and the surface of which the inorganic particles coated uniformly with the epoxy resin composition are exposed. , And was confirmed to have water permeability.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 昌視 東京都中央区銀座四丁目11番２号 ソマー ル株式会社内 (72)発明者 北川 勝治 東京都中央区銀座四丁目11番２号 ソマー ル株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Masami Nakamura, 4-11-12 Ginza, Chuo-ku, Tokyo Somer Co., Ltd. (72) Inventor, Katsuji Kitagawa 4-1-2-1, Ginza, Chuo-ku, Tokyo Somer Within Le Co., Ltd.
Claims (2)
微粉末を付着させる工程と、この工程で得られた無機質
粒子を所要形状に成形する工程と、この工程で得られた
成形体を加熱して、該成形体に含まれるエポキシ樹脂組
成物を硬化させる工程からなる無機質成形体の製造方
法。1. A step of adhering a fine powder of an epoxy resin composition to the surface of inorganic particles, a step of molding the inorganic particles obtained in this step into a required shape, and heating the molded body obtained in this step. And a method for producing an inorganic molded body, which comprises a step of curing the epoxy resin composition contained in the molded body.
微粉末を付着させてなる成形材料。2. A molding material comprising fine particles of an epoxy resin composition adhered to the surface of inorganic particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283559A JP2566858B2 (en) | 1991-10-03 | 1991-10-03 | Method for producing inorganic civil engineering building structural material and molding material used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283559A JP2566858B2 (en) | 1991-10-03 | 1991-10-03 | Method for producing inorganic civil engineering building structural material and molding material used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0598133A true JPH0598133A (en) | 1993-04-20 |
| JP2566858B2 JP2566858B2 (en) | 1996-12-25 |
Family
ID=17667101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3283559A Expired - Lifetime JP2566858B2 (en) | 1991-10-03 | 1991-10-03 | Method for producing inorganic civil engineering building structural material and molding material used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2566858B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012017571A1 (en) * | 2010-08-05 | 2013-09-19 | 住友ベークライト株式会社 | Functional particle, functional particle group, filler, resin composition for electronic component, electronic component and semiconductor device |
| CN103627145A (en) * | 2013-10-22 | 2014-03-12 | 江苏博思源防火材料科技有限公司 | Flame-retarding and heating curtain wall material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226264A (en) * | 1975-08-25 | 1977-02-26 | Yoshio Makita | Vibration sensing element |
| JPS60207302A (en) * | 1984-03-08 | 1985-10-18 | ゼネラル モーターズ コーポレーシヨン | Rare earth element-iron magnet coupled with epoxy resin |
-
1991
- 1991-10-03 JP JP3283559A patent/JP2566858B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226264A (en) * | 1975-08-25 | 1977-02-26 | Yoshio Makita | Vibration sensing element |
| JPS60207302A (en) * | 1984-03-08 | 1985-10-18 | ゼネラル モーターズ コーポレーシヨン | Rare earth element-iron magnet coupled with epoxy resin |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012017571A1 (en) * | 2010-08-05 | 2013-09-19 | 住友ベークライト株式会社 | Functional particle, functional particle group, filler, resin composition for electronic component, electronic component and semiconductor device |
| CN103627145A (en) * | 2013-10-22 | 2014-03-12 | 江苏博思源防火材料科技有限公司 | Flame-retarding and heating curtain wall material |
| CN103627145B (en) * | 2013-10-22 | 2016-02-24 | 江苏博思源防火材料科技有限公司 | A kind of curtain wall material of anti-flaming thermal-insulation |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2566858B2 (en) | 1996-12-25 |
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