JPH0596461A - Cutting method by multiwire saw - Google Patents
Cutting method by multiwire sawInfo
- Publication number
- JPH0596461A JPH0596461A JP28352091A JP28352091A JPH0596461A JP H0596461 A JPH0596461 A JP H0596461A JP 28352091 A JP28352091 A JP 28352091A JP 28352091 A JP28352091 A JP 28352091A JP H0596461 A JPH0596461 A JP H0596461A
- Authority
- JP
- Japan
- Prior art keywords
- work
- dummy member
- wire
- cutting
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体材料、磁性材
料、セラミックス等の脆性材料をワイヤにより薄厚の多
数のウエハに同時切断するマルチワイヤソーに係り、被
切断物（以下ワークと称する）の切断終了後にウエハを
簡易迅速に能率よく取り出せるようにするための切断方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-wire saw for simultaneously cutting brittle materials such as semiconductor materials, magnetic materials and ceramics into a large number of thin wafers by wires, and cutting an object to be cut (hereinafter referred to as a work). The present invention relates to a cutting method for easily, quickly and efficiently taking out a wafer after completion.
【０００２】[0002]
【従来の技術】例えば、半導体材料のシリコンインゴッ
トをウエハ状に切断するのに用いられるマルチワイヤソ
ーは、所定ピッチで多条掛けされたワイヤ列にワークを
押しつけ、砥粒を含む研削液（砥液と称する）を注いで
砥粒をワイヤ列とワークの間に介在させ、ワイヤとワー
クを相対運動させ研削作用によって切断する装置であ
る。ワイヤソーをワイヤの走行方式で分類すれば、一方
向式と往復式があり、前者は基本的には切断完了までワ
イヤを一方向に走行させる方式であり、後者はワイヤを
ワークに対して往復走行させる方式である。この発明は
前者に適用されるが、後者の片道のみで切断する場合に
は後者にも適用できる。2. Description of the Related Art For example, a multi-wire saw used to cut a silicon ingot of a semiconductor material into a wafer shape presses a work against a row of wires which are multi-threaded at a predetermined pitch, and a grinding liquid containing abrasive grains (abrasive liquid). (Hereinafter referred to as ") and pouring abrasive grains between the wire row and the work to relatively move the wire and the work to cut by the grinding action. If the wire saw is classified by the wire traveling method, it can be classified into a one-way type and a reciprocating type.The former is basically a method of traveling the wire in one direction until the cutting is completed, and the latter is the method of traveling the wire back and forth with respect to the workpiece. It is a method to let. The present invention is applied to the former, but can also be applied to the latter when cutting only the one way of the latter.
【０００３】図８は一般的なマルチワイヤソーの切断部
を例示したもので、回転自在に保持された３個の溝ロー
ラ１、２、３の外周に刻設された多数の溝に一本のワイ
ヤ４が巻き付けられて所定ピッチのワイヤ列５が形成さ
れ、ワーク６に砥液を注ぎながらワイヤ列５を走行させ
るとともにワーク押上台１０を徐々に押上げながら切断
していく方式である。ここで、ワーク６は脆性材料製の
ダミー板８に、ダミー板８は金属製のベース９にそれぞ
れ接着されており、ベース９はワーク押上台１０に締付
けねじ１１にて着脱自在に装着されている。この種のワ
イヤソーの場合、ワーク６の押上は、ワイヤ列５がダミ
ー板８の部分に切り込むまで続けられる。図９はその状
態を示し、（Ａ）はワーク全体の斜視図、（Ｂ）はワー
クの一部を拡大して示す側面図で、ワーク６はワーク両
端の余長部６−２を残して多数のウエハ６−１に切断さ
れている。この時、製品ウエハ６−１および余長部６−
２はダミー板８との接着部分が残っているので直立した
ままの状態にあり、ウエハとウエハの間には砥粒１２が
充満している。FIG. 8 exemplifies a cutting portion of a general multi-wire saw, in which a large number of grooves engraved on the outer periphery of three groove rollers 1, 2 and 3 which are rotatably held are provided. This is a method in which the wires 4 are wound to form the wire rows 5 of a predetermined pitch, the wire rows 5 are made to travel while pouring the abrasive liquid onto the work 6, and the work lifting table 10 is gradually pushed up and cut. Here, the work 6 is adhered to a dummy plate 8 made of a brittle material, and the dummy plate 8 is adhered to a metal base 9, and the base 9 is detachably attached to the work push-up base 10 with a tightening screw 11. There is. In the case of this type of wire saw, the pushing up of the work 6 is continued until the wire row 5 is cut into the dummy plate 8. FIG. 9 shows the state, (A) is a perspective view of the entire work, (B) is a side view showing a part of the work in an enlarged manner, and the work 6 is left with extra length portions 6-2 at both ends of the work. It is cut into a large number of wafers 6-1. At this time, the product wafer 6-1 and the extra length portion 6-
No. 2 remains in an upright state because the bonding portion with the dummy plate 8 remains, and the abrasive grains 12 are filled between the wafers.
【０００４】上記マルチワイヤソーにて切断された製品
ウエハ６−１の取出しは、従来以下の方法で行われてい
る。第１の方法は、図９において、ワイヤ列５をワーク
６の両側で切断し、締付けねじ１１を緩めてベース９を
押上台１０から取外し、ワーク６内に残ったワイヤ一本
ずつ抜き取った後、端部の余長部６−２から順にダミー
板８の切込み溝底部で折り取っていく方法である。第２
の方法は、押上台１０を停止したままワイヤ４を走行さ
せ、ワイヤ巻取リール（図示せず）にワイヤをすべて巻
取り、しかる後前記第１の方法と同様にして製品ウエハ
６−１を採取する方法である。第３の方法は、ワイヤ列
５を低速で走行させながら押上台１０を降下させ、ワイ
ヤ列５をワーク６の上方に抜き取った後、前記第１の方
法と同様にして製品ウエハ６−１を採取する方法であ
る。第４の方法は、特開昭６１−１２５７６号公報に示
されるように、ワイヤ列５をダミー板８内に残したま
ま、ウエハ間に充満している砥粒１２を洗浄除去し、端
部の余長部から順に吸着パッドで折取っていく方法であ
る。第５の方法は、特開昭６１−１８２７６１号公報に
示されるように、ワーク６の両サイド側面を全長にわた
って把持し、締付けねじ１１を緩め、ワイヤ列５を走行
させながら、別設の駆動装置によりベース９を徐々にス
ライドさせ、ダミー板８をワイヤ列５で横切り分断し、
全ウエハを一括して取出す方法である。The product wafer 6-1 cut by the above multi-wire saw is conventionally taken out by the following method. The first method is to cut the wire row 5 on both sides of the work 6 in FIG. 9, loosen the tightening screws 11 to remove the base 9 from the push-up base 10, and pull out the wires remaining in the work 6 one by one. In this method, the excess length portion 6-2 at the end is sequentially cut off at the bottom of the cut groove of the dummy plate 8. Second
In this method, the wire 4 is run while the push-up table 10 is stopped, all the wire is wound on a wire winding reel (not shown), and then the product wafer 6-1 is processed in the same manner as the first method. It is a method of collecting. In the third method, the push-up table 10 is lowered while the wire row 5 is traveling at a low speed, the wire row 5 is pulled out above the work 6, and then the product wafer 6-1 is obtained in the same manner as in the first method. It is a method of collecting. In the fourth method, as shown in Japanese Patent Laid-Open No. 61-12576, the abrasive grains 12 filled between the wafers are washed and removed while leaving the wire rows 5 in the dummy plate 8, and the end portions are removed. It is a method of breaking off with an adsorption pad in order from the extra length of. In the fifth method, as shown in Japanese Patent Laid-Open No. 61-182761, the side surfaces of the work 6 are gripped over their entire lengths, the tightening screws 11 are loosened, and the wire row 5 is run, while separately driving. The base 9 is gradually slid by the device, the dummy plate 8 is cut across the wire row 5, and
This is a method of collectively taking out all the wafers.
【０００５】[0005]
【発明が解決しようとする課題】しかし、前記第１〜第
５のウエハ取出方法には、以下に記載する問題点があっ
た。第１の方法は、１回の切断でワイヤを廃却する場合
には簡便であるが、ワイヤの損傷が少なくて再使用でき
る場合には大きな損失となる。また、ワイヤを再びワイ
ヤソーにセッティングするのに工数がかかる。第２の方
法は、ワイヤを再使用できるが、切断完了時点でのワイ
ヤの残り量が多い場合には巻取に時間がかかる。第３の
方法は、ワイヤ列がそのままワイヤソー内に残るので、
引き続いて別のワークの切断を行うことができ、ワイヤ
ソーを効率的に稼働させることができるという利点があ
るが、ワークを降下させる過程でウエハの表面にソーマ
ークが入るおそれがある。すなわち、ウエハの切断面が
平坦でない場合には、ワイヤ列が切断面をこすりながら
ワークを降下させることになり、ソーマークが発生する
のである。ソーマークの程度によっては、ウエハを不良
品として廃却せざるを得ないこともあり得る。第４の方
法は、ワークの材質が特に脆い場合には、ダミー板の切
込み溝底部で折れずにウエハ自体が折れる可能性があ
る。また、ウエハの取出しはワイヤソーを停機して行う
ため、ウエハの枚数が多い場合にはワイヤソーの停機時
間が長くなり稼働率が低下する。なお、前記第１〜第３
の方法においても、ワイヤソーから取出したダミー板の
部分から製品ウエハを折取っていく際に、第４の方法と
同様、ウエハの折損のおそれがあることはいうまでもな
い。第５の方法は、全ウエハを一括して取出すので効率
的ではあるが、横切り分断のための装置が複雑で製作費
がかさむ。However, the first to fifth wafer extraction methods have the following problems. The first method is convenient when the wire is discarded by cutting once, but it causes a large loss when the wire is less damaged and can be reused. Further, it takes a lot of time to set the wire on the wire saw again. In the second method, the wire can be reused, but if the remaining amount of the wire at the time of completion of cutting is large, winding takes time. In the third method, the wire row remains in the wire saw, so
Although another work can be subsequently cut and the wire saw can be efficiently operated, a saw mark may be formed on the surface of the wafer in the process of lowering the work. That is, when the cut surface of the wafer is not flat, the wire array lowers the work while rubbing the cut surface, and a saw mark is generated. Depending on the degree of the saw mark, the wafer may have to be discarded as a defective product. In the fourth method, when the material of the work is particularly brittle, the wafer itself may be broken without being broken at the bottom of the cut groove of the dummy plate. Further, since the taking-out of the wafer is performed by stopping the wire saw, when the number of wafers is large, the stopping time of the wire saw becomes long and the operation rate decreases. The first to third
It goes without saying that in the method (3) as well, when the product wafer is broken from the portion of the dummy plate taken out from the wire saw, the wafer may be broken as in the case of the fourth method. The fifth method is efficient because all the wafers are taken out at one time, but the device for cross cutting is complicated and the manufacturing cost is high.
【０００６】この発明は、マルチワイヤソーにおける切
断後の製品ウエハの取出しにかかわる前記の問題点を解
決するもので、簡易な手段で切断後の製品ウエハを能率
的に回収でき、しかも次の切断の準備が簡単で、ワイヤ
ソーの稼働率を大幅に向上できる切断方法を提案しよう
とするものである。The present invention solves the above-mentioned problems relating to the taking out of the product wafer after cutting in a multi-wire saw, and the product wafer after cutting can be efficiently collected by a simple means, and the next cutting It aims to propose a cutting method that is easy to prepare and that can significantly improve the operating rate of the wire saw.
【０００７】[0007]
【課題を解決するための手段】この発明は、ワイヤ走行
による研削加工が一方向に限定されたマルチワイヤソー
において、ワーク押上台に装着されたベースに底板部と
側板部とからなるＬ字形断面のダミー部材を固定し、該
Ｌ字形ダミー部材の上にワークを載置し、該ワークに作
用する研削抵抗をこのダミー部材の側板部で支持しつつ
切断を行い、ダミー部材底板部までワイヤにて切込み切
断した後、ウエハをダミー部材から取り出すことを特徴
とする切断方法を要旨とするものである。According to the present invention, in a multi-wire saw in which grinding by wire running is limited to one direction, an L-shaped cross section consisting of a bottom plate and a side plate is attached to a base mounted on a work lifting table. A dummy member is fixed, a work is placed on the L-shaped dummy member, cutting is performed while supporting the grinding resistance acting on the work by the side plate portion of the dummy member, and the dummy member bottom plate portion is cut with a wire. A gist of the cutting method is that the wafer is taken out from the dummy member after cutting and cutting.
【０００８】[0008]
【作用】この発明におけるＬ字形ダミー部材はベースに
接着等の方法で固定する。ワークはこのＬ字形ダミー部
材の上に該部材の底板部と側板部に当接するごとく載置
する。ワイヤは研削加工に際してワークに対して一方向
に走行するので、ワークに作用するワイヤ通線方向の研
削力はワイヤ走行方向のみであり、Ｌ字形ダミー部材の
側板部でこの研削力を受けとめることにより、該ダミー
部材の底板上のワークを接着することなしに静止安定さ
せることができる。また、ワイヤがワークをウエハ状に
切り進んだ段階においても、ウエハ間には砥粒が充満し
ているのでウエハが倒れることはない。切断が完了した
ウエハは、前記ダミー部材の底板上に乗っているだけで
あり、ウエハは数枚から数十枚の単位で簡単にワイヤソ
ーから取出すことができる。１回使用したダミー部材は
底板部の厚さ途中までワイヤにて切り込まれているが、
同一ワイヤピッチでの切断であれば、繰り返して使用す
ることができ、ダミー部材へのワークのセットも単に乗
せるだけであるから極めて能率的である。The L-shaped dummy member of the present invention is fixed to the base by a method such as adhesion. The work is placed on the L-shaped dummy member so as to abut the bottom plate and the side plate of the member. Since the wire travels in one direction with respect to the work during grinding, the grinding force acting on the work in the wire passing direction is only in the wire travel direction, and the side plate of the L-shaped dummy member receives this grinding force. It is possible to stabilize the work on the bottom plate of the dummy member without adhering the work. Further, even when the wire cuts the work into a wafer shape, the abrasive grains are filled between the wafers so that the wafer does not fall. The cut wafer is simply placed on the bottom plate of the dummy member, and the wafer can be easily taken out from the wire saw in units of several to several tens. The dummy member used once is cut with a wire up to the middle of the thickness of the bottom plate,
If the cutting is performed at the same wire pitch, it can be repeatedly used, and the work set on the dummy member is simply placed, which is extremely efficient.
【０００９】[0009]
【実施例１】図１はこの発明の一実施例を示すもので、
（Ａ）はワーク切断部の正面図、（Ｂ）は同上側面図で
あり、２０はＬ字形ダミー部材である。ここでは、ワイ
ヤ４が矢印イ方向（図Ａの左方向）に走行して研削する
場合を示す。Embodiment 1 FIG. 1 shows an embodiment of the present invention.
(A) is a front view of the work cutting part, (B) is a side view of the same, and 20 is an L-shaped dummy member. Here, a case is shown in which the wire 4 travels in the direction of arrow A (leftward in FIG. A) and grinds.
【００１０】Ｌ字形ダミー部材２０は、底板部２０−１
と側板部２０−２とからなり、ワイヤソーのワーク押上
台１０に締付けねじ１１で固定された鋼製のベース９上
に、例えば接着により固定されている。ワーク６は、例
えば単結晶シリコンインゴットのごとく一部に平坦面６
−３を有する円柱形状であり、セットに際しては安定性
の点から平坦面６−３を下にしてＬ字形ダミー部材２０
の底板部２０−１上に載置するとともに、ワーク６の一
方の側面６−４を側板部２０−２に全長にわたって当接
させる。ワーク６の平坦面６−３の幅ｗが小さく安定し
ない場合や、平坦面が全くない円柱形状のワークの場合
には、例えばクサビ２１を使用してワークが右方向に転
がるのを防止すればよい。この場合、クサビ２１はダミ
ー部材に必ずしも接着する必要はない。Ｌ字形ダミー部
材２０およびクサビ２１の材質は、特に限定するもので
はないが、例えばガラスあるいはセラミックスのごと
く、砥粒による切断が容易な脆性材料で製作するのが好
ましい。砥液は、ワーク６およびダミー部材２０、さら
にはクサビ２１に対してワイヤ列５の入側となる位置に
配置されたスリットノズル２２によって供給されるよう
になっている。The L-shaped dummy member 20 includes a bottom plate portion 20-1.
And a side plate portion 20-2, and is fixed, for example, by adhesion, on a steel base 9 fixed to the work lifting table 10 of the wire saw with a tightening screw 11. The work 6 has a flat surface 6 on a part thereof, such as a single crystal silicon ingot.
-3 has a cylindrical shape, and when set, the L-shaped dummy member 20 with the flat surface 6-3 facing downward from the viewpoint of stability.
Is placed on the bottom plate portion 20-1 and the one side surface 6-4 of the work 6 is brought into contact with the side plate portion 20-2 over the entire length. When the width w of the flat surface 6-3 of the work 6 is small and unstable, or in the case of a cylindrical work having no flat surface, for example, a wedge 21 is used to prevent the work from rolling to the right. Good. In this case, the wedge 21 does not necessarily have to be bonded to the dummy member. The material of the L-shaped dummy member 20 and the wedge 21 is not particularly limited, but is preferably made of a brittle material such as glass or ceramics that can be easily cut by abrasive grains. The polishing liquid is supplied by a slit nozzle 22 which is arranged at a position on the entry side of the wire row 5 with respect to the work 6, the dummy member 20, and the wedge 21.
【００１１】ワーク６の研削に際しては、矢印イ方向に
走行するワイヤ列５にスリットノズル２２より砥液が供
給されながらワーク押上台１０が徐々に上昇し、ワイヤ
列５がワーク６の頂上部に接触し始めた時点から切断が
行われていく。図２は切断途中の状態を示す。すなわ
ち、走行するワイヤ列５によって砥液２３はワーク６の
切断部に持ち込まれ、切断部には矢印ロ方向に研削力が
作用するが、ワーク６はＬ字形ダミー部材２０の側板部
２０−２で支持されているので、研削力によりワーク６
が左方向に動くことはなく、静止した状態が保たれる。
また、ワーク６が平坦面６−１のない円柱形状であって
も、矢印ロ方向の研削力は極めて小さいので、ワークが
ダミー部材の上で転動することもない。When grinding the work 6, the work pushing-up base 10 gradually rises while the abrasive liquid is supplied from the slit nozzle 22 to the wire train 5 traveling in the direction of arrow A, and the wire train 5 is brought to the top of the work 6. Cutting is performed from the time when the contact is started. FIG. 2 shows a state in the middle of cutting. That is, the abrasive wire 23 is brought into the cutting portion of the work 6 by the traveling wire row 5, and a grinding force acts on the cutting portion in the direction of arrow B, but the work 6 causes the side plate portion 20-2 of the L-shaped dummy member 20 to work. The workpiece 6 is supported by the grinding force.
Does not move to the left and remains stationary.
Further, even if the work 6 has a cylindrical shape without the flat surface 6-1, the work is not rolled on the dummy member because the grinding force in the arrow B direction is extremely small.
【００１２】図２の状態からワーク押上台１０がさらに
上昇していくと、ワーク６と同時にダミー部材の側板部
２０−２も切断され、クサビ２１も同時に切断される。
そして、ワイヤによる切り込みがＬ字形ダミー部材２０
の底板部２０−１に達してワーク６が完全に切断されワ
イヤ列５が底板部２０−１まで切り込んだ時点でワーク
押上台１０の上昇とワイヤの走行を停止する。図３はこ
の時点の状態を示すもので、（Ａ）はワーク切断部の正
面図、（Ｂ）は図（Ａ）のｂーｂ線上の縦断側面図、
（Ｃ）は図（Ｂ）の一部拡大側面図である。すなわち、
ワイヤ列がＬ字形ダミー部材の底板部２０−１まで切り
込まれると、ワーク６は多数の製品ウエハ６−１と両端
の余長部６−２に切断分離されている。このとき各切断
溝２４には研削液と砥粒が詰まっており、その吸着力に
よって製品ウエハ６−１および余長部６−２は倒れずに
あたかも一体物のごとく直立したままの状態を保ってい
る。When the work lifting platform 10 further rises from the state of FIG. 2, the side plate portion 20-2 of the dummy member is cut at the same time as the work 6, and the wedge 21 is cut at the same time.
Then, the L-shaped dummy member 20 is cut by the wire.
When the work 6 is completely cut to reach the bottom plate portion 20-1 and the wire row 5 is cut to the bottom plate portion 20-1, the lifting of the work lifting platform 10 and the traveling of the wire are stopped. FIG. 3 shows the state at this time, (A) is a front view of the work cutting portion, (B) is a vertical side view taken along line bb of FIG.
FIG. 6C is a partially enlarged side view of FIG. That is,
When the wire row is cut into the bottom plate portion 20-1 of the L-shaped dummy member, the work 6 is cut and separated into a large number of product wafers 6-1 and extra length portions 6-2 at both ends. At this time, each cutting groove 24 is filled with a grinding liquid and abrasive grains, and the suction force keeps the product wafer 6-1 and the extra length portion 6-2 from standing upright as if they were one piece without falling. ing.
【００１３】このＬ字形ダミー部材２０上の製品ウエハ
６−１および余長部６−２の取出しは、もとよりワーク
自体がＬ字形ダミー部材上に接着されていないため簡単
である。例えば、端部から数十枚ずつまとめて手作業で
取外す方法、あるいは図４に示すごとく二股状の治具２
５を用いて全ウエハを一括して持ち上げて取出す方法等
により簡単に取出すことができる。The removal of the product wafer 6-1 and the extra length portion 6-2 on the L-shaped dummy member 20 is easy because the work itself is not bonded to the L-shaped dummy member. For example, a method of manually removing dozens of pieces from the end part by hand or a bifurcated jig 2 as shown in FIG.
5, all the wafers can be easily taken out by a method such as lifting and taking out all the wafers at once.
【００１４】全ウエハをダミー部材から取外した後は、
ワーク押上台１０を降下させてワイヤ列５をダミー部材
２０から離脱させる。その後、前回と同様の切断を行う
場合は、新たなワークを使用済みのＬ字形ダミー部材２
０にセットすればよい。使用済みのＬ字形ダミー部材２
０には初回の切断で多数の切込み溝が形成されている
が、ワイヤ列５はその切込み溝に入り込むので全く支障
はなく、何回も繰り返して使用することができる。ま
た、初回の切断でクサビ２１をダミー部材底板部２０−
１に接着して使用した場合には、ワーク６の寸法が変わ
らなければそのまま使用することができる。なお、Ｌ字
形ダミー部材２０の前記切込み溝は初回の切断で形成さ
れるが、同じ溝を事前に該ダミー部材に形成しておくこ
とも可能である。After removing all the wafers from the dummy member,
The work lifting platform 10 is lowered to separate the wire row 5 from the dummy member 20. After that, when performing the same cutting as the previous time, a new work is used and the L-shaped dummy member 2
You can set it to 0. Used L-shaped dummy member 2
A large number of cut grooves are formed in 0 at the first cutting, but since the wire row 5 is inserted into the cut groove, there is no problem at all and it can be repeatedly used many times. Further, the wedge 21 is removed by the first cutting to remove the dummy member bottom plate portion 20-.
When used by adhering to No. 1, the work 6 can be used as it is as long as the dimensions of the work 6 are not changed. The cut groove of the L-shaped dummy member 20 is formed by the first cutting, but the same groove can be formed in the dummy member in advance.
【００１５】Ｌ字形ダミー部材２０は底板部２０−１と
側板部２０−２が一体物に限らず、例えば図５に示すよ
うに、底板部２０−１と側板部２０−２を分離し、それ
ぞれをベース９に接着してもよく、また一体構造とする
場合には図６に示すように底板部２０−１と側板部２０
−２を接着して組み立てて使用することもできる。ま
た、ワークの安定性をよくするために、図７に示すごと
く底板部２０−１と側板部２０−２とがなす角度θを９
０度より僅かに小さくしてもよい。すなわちこの場合
は、ワーク６が常に側板部２０−２にもたれかかるので
ワーク６が安定し、クサビ２１を省略することもでき
る。In the L-shaped dummy member 20, the bottom plate portion 20-1 and the side plate portion 20-2 are not limited to a single body. For example, as shown in FIG. 5, the bottom plate portion 20-1 and the side plate portion 20-2 are separated, Each of them may be adhered to the base 9, and in the case of an integrated structure, as shown in FIG. 6, the bottom plate portion 20-1 and the side plate portion 20 are
It is also possible to bond and assemble -2 for use. Further, in order to improve the stability of the work, the angle θ formed by the bottom plate portion 20-1 and the side plate portion 20-2 is set to 9 as shown in FIG.
It may be slightly smaller than 0 degrees. That is, in this case, since the work 6 always leans on the side plate portion 20-2, the work 6 is stable, and the wedge 21 can be omitted.
【００１６】なお、ここでは円形断面のワークを例にと
り説明したが、円形断面に限らず、他の任意断面形状の
ものにも適用できることはいうまでもない。Although the work having a circular cross section has been described as an example here, it is needless to say that the present invention is not limited to the circular cross section and can be applied to other arbitrary cross sectional shapes.
【００１７】[0017]
【実施例２】図１において、厚さＴ１＝２０ｍｍ、幅Ｗ
１＝１８０ｍｍ、長さＬ１＝２２０ｍｍの底板部２０−
１と、厚さＴ２＝２０ｍｍ、高さＨ１＝１５０ｍｍの側
板部２０−２を有するガラス製のＬ字形ダミー部材２０
を接着したベース９をワーク押上台１０にセットし、直
径２００ｍｍ、長さ２００ｍｍ、幅ｗ約６０ｍｍの平坦
面６−３を有するシリコンインゴット（ワーク）を、該
ワークの側面６−４がダミー部材の側板部２０−２に当
接するごとく底板部２０−１上に載置した後、直径０．
１８ｍｍのワイヤを１．１５ｍｍピッチで張設したワイ
ヤ列５を一方向に毎分４００ｍの速度で走行させなが
ら、グリーンカーボランダムの＃６００の砥粒を含有す
る研削液をワイヤ入側のワイヤ列５上に供給し、ワーク
押上台１０を上昇させてワーク６を厚さ０．９ｍｍのウ
エハ１７０枚に切断した。切断後、ウエハを３０〜４０
枚ずつダミー部材から取外したことにより、所要時間１
分で全ウエハをワイヤソーから取出すことができた。勿
論、得られたウエハはすべて切断面にソーマークのない
高品質のものであった。Example 2 In FIG. 1, thickness T 1 = 20 mm, width W
1 = 180 mm, length L 1 = 220 mm bottom plate portion 20-
1 and a glass L-shaped dummy member 20 having a side plate portion 20-2 having a thickness T 2 = 20 mm and a height H 1 = 150 mm.
The base 9 to which is adhered is set on the work lifting table 10, and a silicon ingot (work) having a flat surface 6-3 having a diameter of 200 mm, a length of 200 mm, and a width w of about 60 mm is provided, and the side surface 6-4 of the work is a dummy member. After being placed on the bottom plate portion 20-1 so as to come into contact with the side plate portion 20-2, the diameter of 0.
While running a wire row 5 in which 18 mm wires are stretched at a pitch of 1.15 mm in one direction at a speed of 400 m / min, a grinding fluid containing green carborundum # 600 abrasive grains is fed into the wire row on the wire entry side. 5, the work push-up table 10 was raised, and the work 6 was cut into 170 wafers having a thickness of 0.9 mm. After cutting, the wafer is 30-40
1 time required by removing from the dummy member one by one
In minutes all wafers could be removed from the wire saw. Of course, all the obtained wafers were of high quality with no saw mark on the cut surface.
【００１８】一方、比較のため、図８、図９に示す従来
の切断方法により上記と同じワークを切断した。すなわ
ち、セラミックス製のダミー板８をワーク６に接着し、
該ダミー板８を鋼製ベース９に接着し、上記と同じワイ
ヤソーにて同一切断条件で切断した。その際、ワークの
切断に続いてダミー板の途中まで切込んだ時点でワイヤ
の走行を停止し、しかる後、灯油にてウエハ間の砥粒を
洗浄除去し、端のワーク余長部から順に製品ウエハを吸
着パッドで１枚ずつ吸着して折り取った。このウエハ採
取に要した時間は６０分であった。On the other hand, for comparison, the same work as above was cut by the conventional cutting method shown in FIGS. That is, the ceramic dummy plate 8 is bonded to the work 6,
The dummy plate 8 was bonded to a steel base 9 and cut with the same wire saw as above under the same cutting conditions. At that time, following the cutting of the work, the wire travel is stopped at the time when the dummy plate is cut halfway, and then the abrasive grains between the wafers are removed by washing with kerosene, in order from the work surplus portion at the end. The product wafers were sucked by the suction pads one by one and then broken off. The time required to collect the wafer was 60 minutes.
【００１９】[0019]
【実施例３】図１において、厚さＴ１＝２０ｍｍ、幅Ｗ
１＝１８０ｍｍ、長さＬ１＝２２０ｍｍの底板部と、厚
さＴ２＝２０ｍｍ、高さＨ１＝５０ｍｍの側板部を有す
るガラス製のＬ字形ダミー部材を接着した鋼製ベースを
ワーク押上台にセットし、１００ｍｍ角、長さ２１０ｍ
ｍの石英インゴット（ワーク）２本をダミー部材の側板
部に当接するごとく並列に密着せしめて底板部上に載置
した後、直径０．１８ｍｍのワイヤを２．０ｍｍピッチ
で張設したワイヤ列を一方向に毎分６００ｍの速度で走
行させながら実施例２と同様にして該ワークを厚さ１．
７ｍｍのウエハ２０６枚に切断し、切断後、そのウエハ
を３０枚前後ずつ取出した。この全ウエハの取出しに要
した時間は実施例２と同様、僅か１．５分であった。勿
論、本実施例の場合も、得られた全ウエハは切断面に全
くソーマークのない高品質のものであった。Third Embodiment In FIG. 1, thickness T 1 = 20 mm, width W
1 = 180 mm, and the bottom plate portion of the length L 1 = 220 mm, thickness T 2 = 20 mm, height H 1 = 50 mm steel base work pushing stand bonding the glass L-shaped dummy member having a side plate portion of the Set to 100 mm square, length 210 m
Wires in which two quartz ingots (workpieces) having a diameter of m are closely attached in parallel so as to be in contact with the side plates of the dummy member and placed on the bottom plate, and then wires having a diameter of 0.18 mm are stretched at a pitch of 2.0 mm. The thickness of the work is 1. in the same manner as in Example 2 while traveling in one direction at a speed of 600 m / min.
The wafer was cut into 206 7 mm wafers, and after cutting, about 30 wafers each were taken out. The time required to take out all the wafers was only 1.5 minutes as in Example 2. Of course, also in the case of this example, all the obtained wafers were of high quality with no saw marks on the cut surface.
【００２０】一方、比較のため、同じワークを図８、図
９に示す従来の方法で切断した。その際、ワークの切断
に続いてダミー板の途中まで切込んだ時点でワークの押
上を停止し、ワイヤ列の走行速度を毎分１００ｍに低下
し、押上台を降下させてワイヤ列をワークから抜取り、
鋼製ベースを押上台から取出し、ウエハを端部から順に
折り取った。この方法は、全ウエハの取出しに２時間要
し非能率的であるばかりでなく、押上台を降下させる過
程でウエハの切断面にソーマークが確認されたものがあ
り、ソーマークが著しいものは廃却せざるを得なかっ
た。On the other hand, for comparison, the same work was cut by the conventional method shown in FIGS. At that time, following the cutting of the work, the pushing of the work is stopped at the time when the dummy plate is cut halfway, and the traveling speed of the wire row is reduced to 100 m / min. Sampling
The steel base was taken out from the push-up base, and the wafer was folded in order from the end. Not only is this method inefficient because it takes two hours to take out all the wafers, but some saw marks are found on the cut surface of the wafer during the process of lowering the push-up base, and those with significant saw marks are discarded. I had to do it.
【００２１】[0021]
【発明の効果】以上説明したごとく、この発明方法によ
れば、ワークをダミー部材の上に載置するだけで切断を
行うことができるので、マルチワイヤソーへのワークの
セッティングおよびワーク切断後のウエハの取出しを極
めて能率的に行うことができるとともに、ソーマーク皆
無の高品質のウエハを得ることができる。また、同じダ
ミー部材でワークの切断を繰返すことも可能であるた
め、ウエハ取出し時間の短縮効果と合わせてマルチワイ
ヤソーの稼働率を著しく向上させることができる。ま
た、この発明のダミー部材は構造が簡単であるから、コ
スト的に高くつくことがない上、既存のマルチワイヤソ
ーに容易に適用できる利点がある等、ウエハの製造に多
大な効果をもたらすものである。As described above, according to the method of the present invention, the work can be cut simply by placing it on the dummy member. Therefore, the work is set on the multi-wire saw and the wafer after the work is cut. Can be taken out very efficiently, and a high quality wafer without saw marks can be obtained. Further, since it is possible to repeat cutting of the work with the same dummy member, it is possible to remarkably improve the operation rate of the multi-wire saw together with the effect of shortening the wafer take-out time. Further, since the dummy member of the present invention has a simple structure, it is not expensive in cost, and has an advantage that it can be easily applied to the existing multi-wire saw. is there.
【図１Ａ】この発明の一実施例を示す図で、ワーク切断
部の正面図である。FIG. 1A is a view showing an embodiment of the present invention and is a front view of a work cutting unit.
【図１Ｂ】図１Ａの側面図である。FIG. 1B is a side view of FIG. 1A.
【図２】同上実施例におけるワーク切断途中の状態を示
す正面図である。FIG. 2 is a front view showing a state in which the work is being cut in the above embodiment.
【図３Ａ】同上実施例における切断完了時の状態を示す
図で、ワーク切断部の正面図である。FIG. 3A is a view showing a state at the time of completion of cutting in the embodiment, which is a front view of a work cutting unit.
【図３Ｂ】図２Ａのｂ−ｂ線上の縦断側面図である。FIG. 3B is a vertical sectional side view taken along the line bb of FIG. 2A.
【図３Ｃ】図３Ｂの一部拡大側面図である。FIG. 3C is a partially enlarged side view of FIG. 3B.
【図４】同上実施例における切断後のワーク取出し手段
の一例を示す斜視図である。FIG. 4 is a perspective view showing an example of a work taking-out means after cutting in the embodiment.
【図５】同上実施例におけるダミー部材の他の例を示す
正面図である。FIG. 5 is a front view showing another example of the dummy member in the same embodiment.
【図６】同上実施例におけるダミー部材の他の例を示す
斜視図である。FIG. 6 is a perspective view showing another example of the dummy member in the same embodiment.
【図７】同上実施例におけるダミー部材の他の例を示す
斜視図である。FIG. 7 is a perspective view showing another example of the dummy member in the same embodiment.
【図８】一般的なマルチワイヤソーの切断部を例示した
斜視図である。FIG. 8 is a perspective view illustrating a cutting portion of a general multi-wire saw.
【図９Ａ】同上マルチワイヤソーにおける切断完了時の
状態を示す拡大図で、ワーク全体の斜視図である。FIG. 9A is an enlarged view showing a state at the time of completion of cutting in the above multi-wire saw, and a perspective view of the entire work.
【図９Ｂ】図９Ａの一部を拡大して示す側面図である。9B is a side view showing an enlarged part of FIG. 9A. FIG.
１、２、３ 溝ローラ ４ ワイヤ ５ ワイヤ列 ６ ワーク ６−１ 製品ウエハ ６−２ 余長部 ６−３ 平坦面 ６−４ 側面 ９ ベース １０ ワーク押上台 ２０ Ｌ字形ダミー部材 ２０−１ 底板部 ２０−２ 側板部 1, 2, 3 Groove Roller 4 Wire 5 Wire Row 6 Work 6-1 Product Wafer 6-2 Extra Length 6-3 Flat Surface 6-4 Side 9 Base 10 Work Pushing Platform 20 L-shaped Dummy Member 20-1 Bottom Plate 20-2 Side plate part
Claims (3)
含む加工液を供給し、当該ワイヤが形成する所定ピッチ
のワイヤ列に被切断物を押しつけながら研削作用によっ
て多数のウエハに切断するマルチワイヤソーにおいて、
被切断物押上台に装着されたベースに底板部と側板部と
からなるＬ字形断面のダミー部材を固定し、該Ｌ字形ダ
ミー部材の上に前記被切断物を載置し、該被切断物に作
用する研削抵抗をこのダミー部材の側板部で支持しつつ
切断を行い、ダミー部材底板部までワイヤにて切込み切
断した後、ウエハをダミー部材から取出すことを特徴と
するマルチワイヤソーによる切断方法。1. A cutting fluid is supplied between a traveling wire and an object to be cut, and the object to be cut is ground into a number of wafers by a grinding action while pressing the object to be cut against a wire row of a predetermined pitch formed by the wire. In the multi-wire saw
A dummy member having an L-shaped cross section composed of a bottom plate portion and a side plate portion is fixed to a base mounted on a workpiece push-up base, and the workpiece is placed on the L-shaped dummy member. A method for cutting with a multi-wire saw, characterized in that cutting is performed while supporting a grinding resistance acting on the dummy member by a side plate portion of the dummy member, cutting is performed by cutting to a bottom plate portion of the dummy member with a wire, and then the wafer is taken out from the dummy member.
Ｌ字形ダミー部材を用いることを特徴とする請求項１記
載のマルチワイヤソーによる切断方法。2. The method for cutting with a multi-wire saw according to claim 1, wherein an L-shaped dummy member having a structure in which a bottom plate portion and a side plate portion are separated from each other is used.
り小さいＬ字形ダミー部材を用いることを特徴とする請
求項１記載のマルチワイヤソーによる切断方法。3. The method for cutting with a multi-wire saw according to claim 1, wherein an L-shaped dummy member having an angle between the bottom plate portion and the side plate portion of less than 90 degrees is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283520A JP2765307B2 (en) | 1991-10-03 | 1991-10-03 | Cutting method with multi-wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283520A JP2765307B2 (en) | 1991-10-03 | 1991-10-03 | Cutting method with multi-wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0596461A true JPH0596461A (en) | 1993-04-20 |
| JP2765307B2 JP2765307B2 (en) | 1998-06-11 |
Family
ID=17666603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3283520A Expired - Lifetime JP2765307B2 (en) | 1991-10-03 | 1991-10-03 | Cutting method with multi-wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2765307B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6381830B1 (en) | 1998-09-01 | 2002-05-07 | Sumitomo Special Metals Co., Ltd. | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| US6408840B2 (en) | 1999-12-14 | 2002-06-25 | Sumitomo Special Metals Co., Ltd. | Method and apparatus for cutting a rare earth alloy |
| WO2006061043A1 (en) * | 2004-12-10 | 2006-06-15 | Freiberger Compound Materials Gmbh | Workpiece holder and method for wire sawing |
| JP2011020261A (en) * | 2010-10-28 | 2011-02-03 | Freiberger Compound Materials Gmbh | Wire saw and wire sawing method |
| US9950379B2 (en) | 2009-09-24 | 2018-04-24 | Mitsubishi Electric Corporation | Wire electric discharge machining apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145390A1 (en) | 2010-05-18 | 2011-11-24 | 三菱電機株式会社 | Processing object retainer, wire electric discharge processing device, thin sheet production method, and semiconductor wafer production method |
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|---|---|---|---|---|
| JPS61182761A (en) * | 1985-02-07 | 1986-08-15 | Sumitomo Metal Ind Ltd | Wafer take out method of wire saw |
| JPH0199561U (en) * | 1987-12-22 | 1989-07-04 |
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1991
- 1991-10-03 JP JP3283520A patent/JP2765307B2/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182761A (en) * | 1985-02-07 | 1986-08-15 | Sumitomo Metal Ind Ltd | Wafer take out method of wire saw |
| JPH0199561U (en) * | 1987-12-22 | 1989-07-04 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6381830B1 (en) | 1998-09-01 | 2002-05-07 | Sumitomo Special Metals Co., Ltd. | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| US6505394B2 (en) | 1998-09-01 | 2003-01-14 | Sumitomo Special Metals Co., Ltd. | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| US6408840B2 (en) | 1999-12-14 | 2002-06-25 | Sumitomo Special Metals Co., Ltd. | Method and apparatus for cutting a rare earth alloy |
| WO2006061043A1 (en) * | 2004-12-10 | 2006-06-15 | Freiberger Compound Materials Gmbh | Workpiece holder and method for wire sawing |
| JP2008522838A (en) * | 2004-12-10 | 2008-07-03 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Work holder and wire sawing method |
| US8061345B2 (en) | 2004-12-10 | 2011-11-22 | Freiberger Compound Materials Gmbh | Method for wire sawing |
| JP4874262B2 (en) * | 2004-12-10 | 2012-02-15 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Wire sawing method |
| US9950379B2 (en) | 2009-09-24 | 2018-04-24 | Mitsubishi Electric Corporation | Wire electric discharge machining apparatus |
| JP2011020261A (en) * | 2010-10-28 | 2011-02-03 | Freiberger Compound Materials Gmbh | Wire saw and wire sawing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2765307B2 (en) | 1998-06-11 |
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