JPH0596436A - Cutting device for fine depth of cut - Google Patents

Abstract

PURPOSE:To form a part where no cutting is performed in a very short distance in order to form a mirror mark, in the case of grooving work for a magneto- optical disk metal mold. CONSTITUTION:A cutting tool 1 is mounted to a point end part to arrange a mirror mark forming single-layer piezoelectric element 2 just behind coaxially with the cutting tool, and further a vibration driving multilayer piezoelectric element 4 is arranged rearward of the single-layer piezoelectric element through a tool bed part 3. Parallel spring parts 5 are formed axially symmetrically on both sides of the tool bed part 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device for performing precise groove processing with a cutting amount of .mu.m order accuracy, and more particularly to a minute cutting cutting device suitable for groove processing of a magneto-optical disk die. .

[0002]

2. Description of the Related Art As a cutting device for fine cutting as described above, for example, the one disclosed in Japanese Utility Model Laid-Open No. 1-110048 filed by the present applicant is known. This cutting device for minute cutting uses a parallel spring mechanism that bends in the direction of the work material due to the pressing force of the piezoelectric element generated corresponding to the magnitude of the applied voltage, and the cutting edge of the cutting tool for the work material is The pressing force generated at the time of contact is changed to an electromotive force by another piezoelectric element, and the electromotive force is detected to detect that the cutting edge of the cutting tool has come into contact with the work material to make a cut of 0.02 μm or less. It is intended to obtain quantitative resolution.

By the way, in the above-mentioned cutting device for micro-cutting, the driving piezoelectric element for bending the parallel spring structure has a large displacement amount and a low driving voltage. A laminated type of 100 layers is used. As described above, since the parallel spring structure and the multi-layer structure are adopted, it is almost impossible to control the vibration of the tool at a high frequency, and particularly, 10 μm or less is provided in the middle of the groove formed by cutting. It was not possible to perform a process in which cutting was interrupted at a short distance to leave the mirror mark portion where no groove was formed. Further, in order to interrupt the processing at the shortest distance possible, the cutting efficiency is lowered rather than the cutting speed being slowed.

The present invention has been made in view of the above-mentioned conventional technical problems so as to effectively solve them.
Therefore, it is an object of the present invention to provide a cutting device for micro-cutting, which is convenient for forming a mirror mark, because cutting can be interrupted at a short distance of 10 μm or less without reducing the cutting speed.

[0005]

The cutting device for micro-cutting according to the present invention has the following structure in order to solve the problems of the prior art as described above and to achieve the object. That is, it has a parallel spring structure capable of bending in the cutting direction, and a tool mounting portion having a cutting tool attached to the tip end thereof via the first piezoelectric element and a movement of the cutting tool in the cutting direction. A second end having a multi-layer structure of tens to hundreds of layers, one end of which is in contact with the base end of the tool mounting portion
And a piezoelectric element, and the first piezoelectric element is composed of a single layer or several layers.

[0006]

In the cutting device for microcutting according to the present invention, the expansion and contraction of the second piezoelectric element is controlled by an applied voltage different from that of the first piezoelectric element. Therefore, even if the second piezoelectric element that drives the cutting operation of the tool can be controlled only at a low frequency, the first piezoelectric element has a small number of layers, and therefore can respond to high frequency control. As a result, the time required for the second piezoelectric element to respond to the high frequency control and shrink as much as necessary to form the portion where cutting is not performed can be shortened, for example, 10 μm.
Mirror marks with a short distance of about m can also be formed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A cutting device for micro-cutting according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2. The outline of the tool section of the apparatus of this embodiment is configured as shown in FIG. A cutting tool 1 is attached to the tip, a single-layer piezoelectric element 2 for forming a mirror mark is arranged immediately behind the coaxial center of the cutting tool 1, and a single-layer piezoelectric element 2 for forming a mirror mark is further arranged behind the tool base 3 for vibration driving. The multilayer piezoelectric element 4 is arranged. Parallel spring parts 5 are arranged on both sides of the tool base part 3 in an axially symmetrical arrangement.
Are formed. Reference numeral 6 indicates a lead wire for applying a voltage to the multilayer piezoelectric element 4.

FIG. 2 is a schematic configuration diagram of a cutting device for micro-cutting according to the present embodiment, which uses the tool portion shown in FIG. A voltage is applied from the control computer 7 to the multilayer piezoelectric element 4 via the first piezoelectric element drive power source 8. At that time, when a relative position detection signal between the tool 1 and the work material 10 obtained from the displacement meter 9 is taken into the control computer 7 via the displacement meter amplifier 11, and a predetermined tool edge movement amount is detected. The control computer 7 controls the applied voltage value to the multilayer piezoelectric element 4 so that the value of the signal of the displacement meter 9 is always maintained with this cut amount. In FIG. P. F
Is a low-pass filter.

Here, a voltage of a predetermined value is applied to the single-layer piezoelectric element 2 in advance before the control is started so that the amount of expansion thereof is larger than the target cut amount.
This voltage is applied to the single-layer piezoelectric element 2 from the second piezoelectric-element drive power source 13 in synchronization with the rotation control board 12 to form a single-layer piezoelectric element drive waveform as shown in FIG. That is, the applied voltage temporarily becomes 0, at which time the single-layer piezoelectric element 2 instantly contracts to its original length, and the tool 1 is pulled upward to form a portion where the cutting depth is 0, that is, a portion where the groove is not processed. It This portion can be formed at a predetermined position by synchronizing with a rotation angle detection signal obtained from the rotation control board 12, and for example, a mirror mark or the like required for a mold for a magneto-optical disk can be formed.

The above-mentioned single-layer piezoelectric element does not necessarily have to be a single layer, but may have a plurality of layers as long as it can be controlled at a sufficiently high frequency. In that case, a large displacement can be obtained at a lower voltage. Therefore,
Such a piezoelectric element is effective for interrupting machining that is not extremely short.

Further, the drive waveform of the single-layer piezoelectric element does not need to be a rectangular waveform as shown in FIG. 2, but it can be used to change the predetermined cut amount by changing the drive waveform. Since the deformation of the piezoelectric element involves a change in the voltage applied to both ends of the piezoelectric element, it can be used as a reaction force detecting sensor.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a tool unit in an embodiment according to a cutting device for micro-cutting of the present invention.

FIG. 2 is a schematic configuration diagram of a cutting device for micro-cutting according to the present embodiment using the tool unit of FIG.

[Explanation of symbols]

 1 Cutting Tool 2 Single Layer Piezoelectric Element 3 Tool Platform 4 Multilayer Piezoelectric Element 5 Parallel Spring

Claims (1)

[Claims] 1. A tool attachment part (3, 5) having a parallel spring structure capable of bending in a cutting direction, and having a cutting tool (1) attached to a tip end portion thereof via a first piezoelectric element (2), In order to drive the movement of the cutting tool (1) in the cutting direction, one end of the cutting tool (1) abuts the base end portion of the tool mounting portion (3, 5) and is composed of several tens to several hundreds of layers. A cutting device for microcutting, comprising a piezoelectric element (4), wherein the first piezoelectric element (2) is composed of a single layer or several layers.