JPH0595005U - Chip type semi-fixed resistor - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object of the present invention to provide a chip type semi-fixed resistor which has good dimensional accuracy of the product and which is easy to adjust the resistance value at a low price. An insulating substrate 1 having a resistance pattern 7 formed on an upper surface thereof and a solderable electrode pattern 3 continuing from an end portion of the resistance pattern 7 to a rear surface thereof, and the resistance pattern 7 of the insulating substrate 1 are provided. A slider 5 provided with a contactor 6 that slides on the upper surface while maintaining a contact state, and an insulating substrate 1 and a slider 5 penetrating the insulating substrate 1 from the back surface of the insulating substrate 1 A slider fixing member 4 formed of a non-soldered material that rotatably engages with, and an electrode pattern 3 having a bottom surface formed on the back surface of the insulating substrate 1 at an end of the slider fixing member 4. At least the bottom surface fixed by caulking at 11 positions so as to be substantially flush with each other is made of a metal plate 10 formed of a solderable material, and the mounting substrate 60 has an electrode pattern 3
Also, it is possible to fix the connection by soldering at the position of the metal plate 10.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip type semi-fixed resistor.

[0002]

[Prior Art]

 With the development of electronic technology in recent years, the electric components used have been downsized. Along with this, various products incorporating a wide range of electric parts have appeared. Along with this, even for semi-fixed resistors, small chip type resistors have been required.

This type of chip-type product is used by being directly mounted on a substrate by soldering or the like. That is, in the case of this type of product, when it is mounted on a substrate or the like, the electrode portion is directly soldered to the base plate to obtain an electrical conduction state, and the product is fixed to the mounting substrate or the like. The structure of a general chip-type semi-fixed resistor is shown in FIG. In the figure, 51 is a ceramic insulating substrate, and 52 is a space between fixed terminal electrodes 53 arranged at one end of the insulating substrate 51 at a predetermined interval along the outer edge of the insulating substrate 51. A resistance pattern 53 arranged in a horseshoe shape, 53 is bent from the end of the resistance pattern 52 to a lower portion of the insulating substrate 51, and is a fixed electrode for connecting and fixing the conductive pattern on the mounting substrate 60 by soldering or the like. Reference numeral 54 denotes an intermediate terminal electrode member which is electrically connected to the slider 55 and is fixedly connected to the conductor pattern on the mounting substrate 60 by soldering or the like. The vicinity of the substantially central portion of the member 54 is ceramic insulating. A slider 55 is mounted on a ceramic insulating substrate 51 and a hole disposed near the central portion of the substrate 51. The slider 55 is positioned and mounted on the ceramic insulating substrate 51 so that the central portion coincides with the hole. Arranged in Penetrates to the hole, the cylindrical protrusion 54b for rotatably engaging is provided a sliding Doko 55 to ceramic insulating substrate 51.

Reference numeral 55 is a slider provided with a contactor 56 that slides on the resistance pattern 52 while maintaining an electrically connected state. The slider 55 is an intermediate terminal electrode as described above. The electrode member 54 is rotatably caulkedly fixed to the insulating substrate 51 via the spacer 57 by the cylindrical protrusion 54b. The contactor 56 provided on the slider 55 rotates with the rotation of the slider 55 while being pressed against the resistance pattern 52 with a predetermined contact pressure. The contact 56 and the slider 55 are made of a conductive material like the intermediate terminal electrode member 54, and the contact 56 is electrically connected to the intermediate terminal electrode member 54. Then, in order to mount the semi-fixed resistor having such a configuration on the substrate 60, it is necessary to avoid soldering parts other than the electrodes. Therefore, the fixed terminal electrode 53 may be formed of a solderable material, but if the intermediate terminal electrode member 54 is formed of a solderable material, the soldering area becomes very large and the soldering The reliability is reduced, the influence of heat cannot be ignored, and the wiring pattern and the like cannot be arranged under the intermediate terminal electrode portion, greatly impairing the degree of freedom in pattern design. For this reason, it has been necessary to avoid forming the intermediate terminal electrode member 54 from a solderable material. Conventionally, the intermediate terminal electrode member 54 is integrally formed of a material that does not have solder (such as SUS), and the intermediate terminal electrode portion 54 is formed into a predetermined shape by press bending from the direction shown by arrow B in FIG. However, by soldering only the mounting surface of the electrode portion 54a shown by xx ... in FIG. 4, only that portion can be soldered.

[0005]

[Problems to be solved by the device]

 However, the partial plating that applies soldering to a material that does not have solder is very expensive, and the price of the resistor is also high because of this partial soldering. In addition, since the bending process of the press is performed for forming the electrode part, the bending process part is rounded and the dimensional accuracy varies. For this reason, when soldered to a mounting board or the like, the product may be tilted, which makes it extremely difficult to adjust the resistance value.

When the right angle property in press molding is calculated in order to solve the above-mentioned drawback, there is a drawback that the portion is broken.

[0007]

[Means for Solving the Problems]

 The present invention has been made for the purpose of solving the above-mentioned problems, and an object thereof is to provide a chip type semi-fixed resistor which has good dimensional accuracy of the product and which is easy to adjust the resistance value at low cost. To do. Then, the following configuration is provided as one means for achieving the purpose.

That is, a resistance pattern is formed on the upper surface, and an insulating substrate provided with a solderable electrode pattern continuous from the end of the resistance pattern to the rear surface is in contact with the insulating substrate on the resistance pattern. A slider provided with a contactor that slides while maintaining, and a slider rotatably locked to the insulating substrate by penetrating the insulating substrate and the slider from the back surface of the insulating substrate. A slider fixing member made of a material without solder was fixed to the end of the slider fixing member so that the bottom surface was substantially flush with the electrode pattern formed on the back surface of the insulating substrate. At least the bottom surface includes an electrode member formed of a solderable material.

[0009]

[Action]

 With the above configuration, it is possible to provide a chip type semi-fixed resistor which has good dimensional accuracy of the product and which is easy to adjust the resistance value at low cost.

[0010]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of an embodiment according to the present invention, and FIG. 2 is a bottom view seen from the mounting surface. Note that FIG. 1 shows a cross section taken along the line XX of FIG. In the figure, 1 is an electrically insulating ceramic insulating substrate having a predetermined thickness, which is an alumina substrate of a sintered body of 96% alumina in this embodiment. 2 is a resistance pattern arranged in a substantially horseshoe shape along the vicinity of the outer edge of the upper surface of the insulating base plate 1 between the fixed terminal electrodes 3 arranged at one end on the ceramic insulating substrate 1 with a predetermined interval. Is a fixed electrode that is bent from the end of the resistance pattern 2 to the lower part of the insulating substrate 1 and is fixed to the conductor pattern on the mounting substrate 60 by soldering or the like. It is a slider fixing member that is electrically connected and fixed to the conductor pattern on the mounting substrate 60 via the metal plate 10 by soldering or the like.

A cylindrical protruding portion 4 a is arranged near the substantially central portion of the member 4, and the cylindrical granular material 4 a is a hole portion provided near the substantially central portion of the ceramic insulating substrate 1. The central portion of the ceramic insulating substrate 1 is positioned and mounted so as to coincide with the hole, and penetrates to the hole provided in the slider 5 via a ring-shaped spacer 7, for example. The child 5 is rotatably clamped to the ceramic insulating substrate 1 by a method such as caulking. That is, the hollow cylindrical shaft 4a penetrates the ceramic insulating substrate 1, the spacer 7 and the slider 5 to form a hollow rotary shaft which is fastened in the stacking direction.

Reference numeral 5 denotes a slider provided with a contactor 6 that slides on the resistance pattern 2 while maintaining an electrically connected state. The slider 5 is fixed to the slider as described above. The cylindrical protrusion 4 a of the member 4 is rotatably caulked and fixed to the insulating substrate 1 via the spacer 7. The contactor 6 provided on the slider 5 rotates with the rotation of the slider 5 while being pressed against the resistance pattern 2 with a predetermined contact pressure. The contactor 6 and the slider 5 are made of a conductive material like the slider fixing member 4, and the contactor 6 is electrically connected to the slider fixing member 4. Reference numeral 10 denotes a metal plate having at least a surface which can be soldered and which is fixed to the slider fixing member 4 as indicated by 11 in FIG.

The metal plate 10 may be made of a conductive material that can be soldered, such as iron, or at least the surface of the metal plate 10 may be coated with a material that can be soldered by an overall plating that is inexpensive to manufacture. You can buy it. For example, the surface of a hard plastic or the like may be a conductive material that can be soldered, such as nickel, gold or silver.

The slider fixing member 4 of the present embodiment can be made of a conductive material that does not have solder, such as stainless. Then, a metal plate 10 having a substantially L-shaped cross section, which is a different conductive material that can be soldered as it is, is caulked to one end portion, or is fixed by an arbitrary method such as crimping. That is, in the present embodiment, the end portions of the slider fixing member 4 are formed by pressing or the like, and complicated steps such as partially forming the forming place are unnecessary, and the end portions are simply made of different conductivity. The semi-fixed resistor can be manufactured by a simple process of simply fixing the metal plate 10 made of a material.

Moreover, the solderable metal plate 10 that comes into contact with the mounting substrate does not need to be an integral member with the slider fixing member 4, and the thickness of the plate can be freely selected to facilitate dimensional control. Become. In addition, the surface to be soldered can be easily made flat, and a high level of precision with the mounting board can be obtained. When mounting the chip type semi-fixed resistor of the present embodiment having the above-mentioned configuration on the mounting board, as shown in FIG. Just solder it. In the present embodiment, the electrode 3 described above may be formed of any material such as silver-palladium system, silver, gold-palladium system, silver-platinum system, nickel or copper. The resistance pattern 7 can be formed by using a ruthenium oxide (RuO ₂ ) based thick film paste and sintering the paste.

Further, the ceramic substrate 10 described above is not limited to a substrate formed of pure alumina, and may be a laminate of green sheets of alumina or the like. The resistor pattern 7 is not limited to the horseshoe shape, and may have any shape as long as the resistance value between the metal plate 10 and the electrode 3 changes when the slider 5 is rotated.

The method of rotatably locking the slider to the insulating substrate 1 is not limited to the method using the hollow rotary shaft, and the slider can be rotatably locked to the insulating substrate 1. For example, it may be locked by any method. According to the embodiment described above, the end portion of the slider fixing member 4 is molded by pressing or the like, and a complicated process such as partially molding the molding place is not required, and the end portion of the slider can be simply soldered. A semi-fixed resistor can be manufactured by a simple process of simply fixing the metal plate 10 formed of various different conductive materials.

Moreover, the solderable metal plate 10 that comes into contact with the mounting substrate does not need to be an integral member with the slider fixing member 4, and the thickness of the plate can be freely selected to facilitate dimensional control. Become. In addition, it is possible to provide a chip-type semi-fixed resistor which can be easily made to be flat on the surface to be soldered, has a high level of precision with the mounting board, is easy to mount on the mounting board, and can be manufactured at low cost.

[0019]

[Effect of the device]

 As described above, according to the present invention, it is possible to provide a chip type semi-fixed resistor which has good dimensional accuracy of the product and which is easy to adjust the resistance value at low cost.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of an embodiment according to the present invention.

FIG. 2 is a bottom view of the present embodiment.

FIG. 3 is a cross-sectional view showing a configuration of a general chip semi-fixed resistor.

FIG. 4 is a diagram showing a detailed configuration of a soldered portion of the general chip semi-fixed resistor shown in FIG. 3 to a mounting substrate.

[Explanation of symbols]

 1,51 Insulating substrate 2,52 Resistance pattern 3,53 Electrode pattern 4 Sliding element fixing member 5,55 Sliding element 6,56 Contact element 7,57 Spacer 10 Metal plate 20 Solder 54 Intermediate terminal electrode member 54b Cylindrical protrusion Part 60 Mounting board

Claims (1)

[Scope of utility model registration request] 1. An insulating substrate on which a resistance pattern is formed on an upper surface thereof and a solderable electrode pattern which is continuous from the end portion of the resistance pattern to the back surface is provided, and a contact state is maintained on the resistance pattern of the insulating substrate. A slider provided with a contactor that slides while maintaining the same, and the slider is rotatably locked to the insulating substrate by penetrating the insulating substrate and the slider from the back surface of the insulating substrate. A slider fixing member formed of a material without solder, and fixed to the end of the slider fixing member such that the bottom surface is substantially flush with the electrode pattern formed on the back surface of the insulating substrate. A chip-type semi-fixed resistor having at least a bottom surface and an electrode member formed of a solderable material.