JPH0593292A - Method and device for partial plating - Google Patents

Abstract

PURPOSE:To prevent the plating boundary region of a member to be treated from being corroded by the corrosive atmosphere and mist generated from the surface of a plating soln. without decreasing the deposition efficency and to improve productivity by using this device wherein a part of the member is dipped in the soln. and plated. CONSTITUTION:The requisite part of a member to be treated connected to a grounding potential is dipped in a plating soln. 25, in which an electrode plate 22 connected to an anode potential is dipped, and plated. When the member 1 is plated, an inert gas or air kept at the temp. equivalent to that of the plating soln. surface is injected toward the member 1 close to the plating soln. surface from a nozzle 31a' positioned close to the upper opening of a plating tank 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial plating method in which a part of a member to be treated is immersed in a plating solution and the structure of the apparatus, and particularly plating generated from the surface of the plating solution without lowering the deposition efficiency. A part that aims to improve productivity by preventing corrosion in the plating boundary area of the processed material due to mist that adheres to the surface of the processed material as bubbles due to the corrosive atmosphere caused by the liquid or bubbles during electrolysis The present invention relates to a plating method and its equipment.

A partial plating method in which a part of a member to be processed is immersed in a plating solution is generally used because a large amount of the member to be processed can be efficiently subjected to the partial plating process with a simple apparatus. There is.

[0003]

2. Description of the Related Art In the drawings, as an example, a case is described in which a member to be plated is a connector terminal continuously formed in a hoop material in a comb-like shape, and a part of the tip end side of the connector terminal is plated.

FIG. 2 is a conceptual diagram for explaining a conventional partial plating apparatus and plating method. (2-1) is a principle view showing the apparatus configuration, and (2-2) is the apparatus as seen from the direction of arrow A. FIG.
In the figure, a terminal member 1a as a member to be processed is punched and formed in a comb blade shape with a constant pitch interval on the hoop material 1 by a continuous press machine or the like.

The partial plating apparatus 2 for plating a part of the tip of the terminal member 1a has a bottomed box-shaped plating tank 21.
And an electrode plate 22 arranged on the bottom surface side thereof in parallel with the bottom surface, two bar electrodes 23 arranged in parallel in the vicinity of the upper opening of the plating tank 21 by engaging with a moving mechanism portion (not shown), and If necessary, an exhaust duct 24 arranged around the upper opening of the plating tank 21 is configured as a main constituent member.

21 located near the bottom of the plating tank 21
Reference numeral a is a plating liquid control unit that controls the plating liquid to a predetermined temperature, and includes a liquid temperature sensor 21a ', a heater (not shown), a stirring device, and the like.

Therefore, the plating solution 25 is poured into the plating tank 21 to a predetermined depth, and the plating solution control section 21a sets the plating solution 25 to a predetermined temperature. The bar electrodes 23 are hooked with the ears 1'provided at both ends of the connecting portion of the hoop material 1 in the longitudinal direction thereof.
Is moved into the plating tank 21 and set, the terminal member 1a as the member to be treated of the hoop material 1 is immersed in the plating solution 25 to a predetermined depth.

Therefore, by applying a predetermined potential between the electrode plate 22 and the bar electrode 23 and by extension the hoop material 1 as described above, a required plating treatment is applied to the plating liquid immersion area of the terminal member 1a, that is, the tip required area. be able to.

Particularly in this case, since the plating liquid 25 is agitated by the plating liquid control section 21a while maintaining the same temperature, uniform plating can be efficiently applied to the required area of the tip of the terminal member 1a and the exhaust duct 24 Since the corrosive atmosphere and mist due to the plating solution generated from the surface of the plating solution are removed, there is an advantage that corrosion in the plating boundary region of the member to be treated can be suppressed.

[0010]

However, as the demand for cost reduction increases, the precision of the plating thickness is improved and the required plating area is limited, and at the same time, the density of the member to be treated per unit area on the surface of the plating solution is increased. As a result, the corrosive gas and mist generated from the liquid surface of the plating solution tend to stay around the processed material, and the effect of the corrosive atmosphere and mist on the corrosion of the processed material can be ignored. It's gone.

On the other hand, in order to ensure the removal of the corrosive atmosphere and the mist, there is a means for strengthening the exhaust in the exhaust duct, but in this case, the temperature drop of the plating liquid surface accompanying the exhaust occurs. Causes a decrease in the deposition efficiency of the plating material in the required plating area near the liquid surface, which has a demerit that the plating thickness easily varies.

In particular, in a member to be treated whose required plating area is finely limited, the required plating area is located only near the plating liquid surface, which makes it difficult to perform a plating treatment of a predetermined thickness.

Therefore, it is possible to secure the precision of the plating thickness without deteriorating the deposition efficiency of the plating material and corresponding to the members to be treated which are finely limited in the required plating area and arranged at a high density with respect to the plating liquid surface. There is a problem that the plating method cannot be realized.

[0014]

Means for Solving the Problems The above-mentioned problems are solved by plating a part of a required plating area of a member to be processed, which is connected to a ground potential, with a plating solution in which an electrode plate connected to an anode potential is immersed. A partial plating method for performing a treatment, wherein during the plating treatment of a member to be treated, a temperature equal to the surface temperature of the plating liquid is applied from a nozzle located in the vicinity of the upper opening of the plating tank toward a direction near the surface of the plating liquid of the member to be treated. This is achieved by a partial plating method in which an inert gas or air is jetted.

Further, it is a partial plating apparatus for performing a plating treatment on a required plating area by immersing a required plating area of a member to be treated, which is connected to the ground potential, in a plating solution in which an electrode plate connected to the anode potential is immersed. A plating tank having an opening above the nozzle for ejecting an inert gas or air having a temperature equal to the surface temperature of the plating liquid during the plating treatment of the member to be treated toward the vicinity of the plating liquid surface of the member to be treated. This is achieved by a partial plating device provided near the opening of the plating tank.

[0016]

[Function] When a gas having a temperature equal to the temperature of the plating solution is sprayed onto the surface of the plating solution during the plating treatment, the temperature drop of the surface of the plating solution can be suppressed and the corrosive atmosphere or mist generated from the surface of the plating solution can be easily generated. It can be removed.

According to the present invention, nitrogen (N ₂ ) having a temperature equal to the temperature of the plating solution is supplied from a nozzle provided around the upper opening of the plating tank.
A predetermined plating treatment is applied to a member to be treated set in the plating tank in a state where an inert gas such as argon (Ar) is ejected toward the plating liquid surface.

In this case, since the temperature of the plating liquid surface is not lowered by the inert gas flowing between the members to be treated which are densely arranged, it is possible to prevent the deposition efficiency of the plating material from being lowered, and the plating liquid can be eliminated. The corrosive atmosphere and mist generated from the surface can be easily removed, and the corrosion in the vicinity of the liquid surface of the member to be treated can be suppressed.

Therefore, it is possible to realize a partial plating method in which the required plating area is finely limited and the entire surface of the required area can be uniformly plated even with the members to be processed which are arranged at a high density with respect to the plating liquid surface.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view for explaining the partial plating method according to the present invention together with the apparatus therefor, (1-1) is an external view of the apparatus, and (1-
2) is a sectional view as seen from the direction of arrow A similar to FIG.

For the sake of easy understanding, the outline of the apparatus configuration will be described first. However, in the figure, the same object members as those in FIG. Is represented.

In FIG. 1, the partial plating apparatus 3 is a heat exchanger for controlling the nozzle portion 31 for injecting an inert gas into the partial plating apparatus 2 described in FIG. 2 and the inert gas ejected from the nozzle portion 31. 32, solenoid valve 33, plating liquid surface temperature sensor
34 and a controller 35 are added and configured.
The other configuration is exactly the same as that of FIG.

Therefore, explanations other than those relating to the present invention are omitted to avoid duplication. This nozzle part
Reference numeral 31 denotes a pipe 31a fixed around the opening of the plating tank 21 of the partial plating apparatus 2 described with reference to FIG. By injecting a high-pressure inert gas into the pipe 31a, the inert gas is jetted from the nozzles 31a 'toward the plating liquid surface side.

The inert gas from the cylinder 36 via the electromagnetic valve 33 is introduced into the nozzle portion 31 at a predetermined temperature in the heat exchanger 32. The temperature of the inert gas set by means of, for example, a signal sent from the plating liquid surface temperature sensor 34 fixed to the nozzle portion 31 to the heat exchanger 32 via the controller 35 so as to be equal to the plating liquid surface temperature. Is becoming

A slight temperature difference between the inert gas temperature and the plating liquid surface temperature causes the signal of a gas temperature sensor (not shown) arranged near the nozzle 31a 'of the nozzle portion 31 to be delivered to the controller 35. It is configured to be adjustable with.

The electromagnetic valve 33 is opened and closed by a signal from the controller 35. Therefore, the electromagnetic valve 33 and the heat exchanger 32 are operated by a signal from the controller 35, and an inert gas having a temperature equal to the plating liquid surface temperature is ejected from each nozzle 31a ′ of the nozzle portion 31 inside the plating tank 21. When the hoop material 1 located at the position is plated as described in FIG. 2, the plating liquid surface temperature is not lowered by the inert gas having a temperature equal to the plating liquid surface temperature flowing between the terminal members 1a. The corrosive atmosphere and mist generated from the liquid surface can be removed.

The inert gas ejected from the nozzle 31a 'can be easily removed by the exhaust duct 24 described with reference to FIG. This means that a decrease in the deposition efficiency of the plating material in the vicinity of the plating liquid surface can be suppressed, so that a plating treatment with a predetermined thickness can be performed, and at the same time, corrosion in the vicinity of the liquid surface of the terminal member 1a can be suppressed. ..

Therefore, it is possible to realize a required partial plating method and apparatus capable of performing uniform plating on the entire surface of the required area, even if the area of the object to be processed is such that the required area for plating is minutely limited and the density of the surface of the plating solution is high. can do.

For example, when the rod-shaped member made of 52 alloy having a diameter of 0.6 mm was plated with rhodium (Rh), the plating solution was a rhodium sulfate acidic plating solution, and the plating solution temperature was 45 ° C. The flat area of the tank is 25 cm x 18
when about cm, precipitation amount P of the Rh ²⁺ when formed into a 100 theoretical amount of precipitation of the number N and Rh ²⁺ mist reservoir by corrosion pitting of plating solution per workpiece member unit area, prior In the case of the plating method and its apparatus, N is 12 and P is 72, whereas nitrogen gas heated to 45 ° C. which is the same as the plating solution temperature is ejected from the nozzle at a rate of 2 liters / minute. It has been experimentally confirmed that the plating method and the apparatus have N of 4 and P of 76, and that the corrosion holes of the member to be treated are reduced and the deposition efficiency of the plating material is improved.

This means that the sulfuric acid-based corrosive atmosphere generated from the plating solution (sulfuric acid rhodium plating solution) was removed by nitrogen gas, and the plating solution surface temperature did not decrease. ..

In the case of a plating method and an apparatus using an ammonia-based plating solution such as palladium (Pd) plating, it is not necessary to consider the influence of oxidation by the gas to be ejected, so that an inert gas such as nitrogen or argon can be used. The same effect can be obtained by using normal air instead of gas.

[0032]

As described above, according to the present invention, the productivity can be improved by preventing the corrosion in the plating boundary region of the member to be treated due to the corrosive atmosphere or mist generated from the surface of the plating solution without lowering the deposition efficiency. It is possible to provide the intended partial plating method and its apparatus.

In the description of the present invention, the case where the member to be processed is the terminal member formed in the hoop material in the shape of a comb blade is taken as an example, but the same effect can be obtained regardless of the shape of the member to be processed. Can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a partial plating method according to the present invention together with an apparatus therefor.

FIG. 2 is a conceptual diagram illustrating a conventional partial plating apparatus and plating method.

[Explanation of symbols]

1 Hoop material 21 Plating tank 21a Plating liquid control part 21a 'Liquid temperature sensor 22 Electrode plate 23 Bar electrode 24 Exhaust duct 25 Plating liquid 31 Nozzle part 31a Pipe 31a' Nozzle 32 Heat exchanger 33 Electromagnetic valve 34 Plating liquid surface temperature sensor 35 Controller 36 cylinder

Claims (2)

[Claims] 1. A partial plating method, in which a part of a required plating area of a member to be processed which is connected to a ground potential is immersed in a plating solution in which an electrode plate which is connected to an anodic potential is immersed to perform a plating treatment on the required plating area. During the plating process on the member to be processed (1), the member to be processed is discharged from the nozzle (31a ') located near the upper opening of the plating tank (21).
The partial plating method characterized in that an inert gas or air having a temperature equal to the surface temperature of the plating solution is jetted toward the vicinity of the plating solution surface of (1). 2. A partial plating apparatus for performing a plating process on a required plating area by immersing a part of a required plating area of a member to be processed connected to ground potential in a plating solution in which an electrode plate connected to an anode potential is immersed. The plating tank (21) having an opening at the top allows an inert gas or air having a temperature equal to the surface temperature of the plating liquid during the plating treatment of the member to be treated (1) to be near the plating liquid surface of the member to be treated (1). A partial plating apparatus comprising a nozzle (31a ') for ejecting in a direction in the vicinity of an opening of the plating tank (21).