JPH0593009U - Electronic component terminal structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a terminal structure of an electronic component that can reduce the size of the entire component, improve the mounting density on a printed circuit board, and avoid the influence on electrical characteristics. [Structure] An electronic component element 3 is housed in a case 2, and an input / output terminal 12 and a ground terminal 13 are attached to the component element 3.
And connect the terminals 12 and 13 to the opening 16 of the case 2.
The terminals 12 and 13 are arranged so as to be substantially flush with the outer surface of the case 2 when being led out to the outside.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a terminal structure for an electronic component, which can reduce the size of the entire component, improve the mounting density on a printed circuit board, and avoid the influence on the electrical characteristics.

[0002]

[Prior Art]

 Electronic parts, such as non-reciprocal circuit elements, have the function of passing signals only in the transmission direction and blocking transmission in the opposite direction, and are essential parts for mobile communication devices such as mobile phones and car phones. This non-reciprocal circuit element is mainly configured to accommodate a ferrite element and a permanent magnet in a magnetic metal case, and apply a DC magnetic field to the ferrite element by the magnet. As a terminal structure of such a non-reciprocal circuit device, there is a conventional structure shown in FIGS. 5 (a) and 5 (b), for example. As shown in FIG. 5 (a), one end of the input / output terminal 31 is connected to one end of each central conductor of a ferrite element (not shown) housed in the metal case 30, and the other end 31a of the terminal 31 is connected. The case 30 is formed by projecting outward from the opening 30a of the case 30, connecting the other end of each of the central conductors to the case 30, and integrally forming a ground terminal 30b on the case 30. In addition, as shown in FIG. 5 (b), an input / output terminal 32 is connected to one end of each of the central conductors, and a ground terminal 33 is connected to the other end thereof, and the terminals 32 and 33 are connected to the opening 34a of the metal case 34. It is configured to project outward from. As shown in FIG. 6, the non-reciprocal circuit element is mounted on a printed circuit board 37 together with other circuit components 35 and 36, and the wiring of the circuit element and the terminals 32 and 33 are soldered and mounted. Be done.

[0003]

[Problems to be solved by the device]

 However, in the above-mentioned conventional structure, since the input / output terminals 31, 32 and the ground terminals 30b, 33 are projected from the metal cases 30, 34, there is a problem that the size of the entire component is increased accordingly. When mounting this on the printed circuit board 37, a space S for soldering the terminals 32 and 33 is required, and a gap is created between the terminals 32 and 33 and other circuit components 35 and 36. There is a problem that it cannot be improved. Further, in the case of the conventional non-reciprocal circuit device, since each terminal is projected, it is likely to cause unnecessary radiation of a high frequency electromagnetic field, which adversely affects the electrical characteristics, or causes EMI (electromagnetic interference) to affect the surrounding components. There is also a problem that it may lead to malfunctions such as.

The present invention has been made in order to solve the above-mentioned conventional problems, and can reduce the size of parts and improve the mounting density, and further suppress unnecessary radiation of electromagnetic fields to improve the characteristics. It is intended to provide a terminal structure of an electronic component that can avoid the influence.

[0005]

[Means for Solving the Problems]

 Therefore, the present invention relates to a terminal structure of an electronic component, wherein an electronic component element is housed in a case, a terminal is connected to the component element, and the terminal is led out from an opening of the case. Is arranged so as to be substantially flush with the outer surface of the case.

Here, as the method of forming the terminal, a metal terminal is insert-formed on a resin member, or a terminal electrode is formed on the surface of insulating ceramics or resin by metallization, thick film, thin film, plating, or adhesion. Or a ceramic or resin member on which lands are formed by the above method, and metal terminals are soldered to the lands, which are inserted into the case to expose the terminals through the openings of the case. Method can be adopted.

[0007]

[Action]

 According to the terminal structure of the electronic component of the present invention, the terminal is disposed so as to be substantially flush with the outer surface of the case, so that the size of the entire component can be reduced by the protruding amount of the conventional terminal, and the printed circuit board can be made smaller. Since the soldering space at the time of mounting can be reduced, the gap with other circuit components can be reduced, and the mounting density can be improved accordingly. Further, in the present invention, since the terminals do not protrude outward, when applied to, for example, a non-reciprocal circuit element, unnecessary radiation of a high frequency electromagnetic field can be suppressed to a minimum, and the resulting electromagnetic field can be suppressed. It is possible to avoid the influence on the characteristics due to the leakage of.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are views for explaining a terminal structure of an electronic component according to an embodiment of the present invention. In the present embodiment, the case of application to an isolator will be described as an example. In the figure, 1 is a lumped-constant type isolator, in which a ferrite element 3 is housed in a magnetic metal case 2 consisting of a case body 2a and a case lid 2b, and a permanent magnet is provided on the back surface of the case lid 2b. 4 is attached, and a DC magnetic field is applied to the ferrite element 4 by the magnet 4.

The ferrite element 3 is configured by arranging three central conductors 7 on a top surface of a disk-shaped ferrite 5 with an insulating sheet 6 therebetween at an angle of 120 degrees in a cross shape. The ferrite element 3 is arranged in a recess 8a formed in the center of the electrode substrate 8, and a port electrode 9a and a ground electrode 9b are alternately formed on the peripheral edge of the recess 8a at a predetermined interval. Has been done. One end of each center conductor 7 is connected to each port electrode 9a, and the other end of the center conductor 7 is connected to each ground electrode 9b.

One electrode of the chip capacitor 10 is connected to each of the two port electrodes 9 a, and the other electrode is connected to the case via an earth electrode 9 c formed on the outer edge of the electrode substrate 8. It is connected to the main body 2a. Further, one electrode of a chip capacitor (not shown) is connected to one end of the remaining port electrode 9a, and the other electrode is connected to a ground electrode. Furthermore, one electrode of the chip resistor 11 is connected to the other end of the remaining port electrode 9a, and the other electrode is connected to the ground electrode 9d formed on the corner edge of the electrode substrate 8. There is.

A resin block 15 is provided between the bottom wall of the case body 2 a and the electrode substrate 8. A part of the resin block 15 is provided on both left and right side surfaces of the case 2. It is exposed through the formed opening 16. An input / output terminal 12 and a ground terminal 13 are provided in a portion of the resin block 15 that faces the openings 16, and a metal member corresponding to the terminals 12 and 13 is inserted into the resin block 15. It is made and manufactured. The two port electrodes 9a of the electrode substrate 8 are connected to the input / output terminals 12 through through holes, and the ground electrodes 9d are connected to the ground terminals 13.

The input / output terminals 12 and the ground terminal 13 are substantially flush with the left and right side surfaces of the case 2, so that the terminals 12 and 13 are exposed through the openings 16 of the case 2. is doing.

Next, the function and effect of this embodiment will be described. According to this embodiment, the input / output terminal 12 and the ground terminal 13 are exposed from the opening 16 of the metal case 2, and the terminals 12 and 13 are substantially flush with the left and right side surfaces of the case 2. Since it is arranged, the size of the entire component can be reduced by eliminating the protrusion of the terminals, and the soldering space for mounting on the printed circuit board can be reduced, which enables higher packaging density.

Further, in this embodiment, since the protrusions of the terminals 12 and 13 are eliminated, the portion through which the high frequency signal passes can be minimized, and unnecessary radiation of the electromagnetic field can be suppressed to that extent, which in turn reduces the electromagnetic field. It is possible to prevent the characteristics from being leaked and adverse effects on other parts of the equipment in which this isolator is mounted.

In the above-described embodiment, the metal member is insert-formed in the resin block 15 to form the input / output terminal 12 and the ground terminal 13. However, the present invention uses the resin block to metalize the input / output electrode and the ground electrode. The coating may be formed by, and is not particularly limited.

In the above embodiment, the case where the input / output terminal 12 and the ground terminal 13 are led out to the left and right side surfaces of the case 2 has been described as an example, but the present invention is as shown in FIG. 3, for example. The input / output terminal 21 and the ground terminal 22 may be led out to the side surface 20a and the bottom surface 20b of the metal case 20. Furthermore, as shown in FIG. 4, the input / output terminal 24 and the ground terminal 25 may be led out only on the bottom surface 23a of the metal case 23, and in this case, the same effect as that of the above-described embodiment can be obtained.

Further, in the above embodiment, the isolator is taken as an example, but the terminal structure of the present invention is not limited to this, and can be applied to other electronic parts.

[0018]

[Effect of the device]

 As described above, according to the terminal structure of the electronic component of the present invention, the terminals are arranged so as to be substantially flush with the outer surface of the case, so that the size of the entire component can be reduced and the mounting density can be improved. There is also an effect that the influence on the electrical characteristics can be avoided.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a terminal structure of an electronic component according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view showing the inside of the electronic component of the above embodiment.

FIG. 3 is a perspective view showing a terminal structure according to another example of the above embodiment.

FIG. 4 is a perspective view showing a terminal structure according to another example of the above embodiment.

FIG. 5 is a perspective view showing a conventional terminal structure.

FIG. 6 is a plan view for explaining a conventional problem.

[Explanation of symbols]

 1 Isolator (electronic component) 2,20,23 Case 3 Ferrite element (electronic component element) 12,21,24 Input / output terminal 13,22,25 Ground terminal 16 Case opening

Continued Front Page (72) Inventor Keiji Okamura 2 26-10 Tenjin Tenjin, Nagaokakyo City, Kyoto Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A terminal structure of an electronic component, wherein an electronic component element is housed in a case, a terminal is connected to the component element, and the terminal is led out from an opening of the case. A terminal structure for an electronic component, wherein the terminal structure is arranged so as to be substantially flush with the outer surface of the case.