JPH059274B2 - - Google Patents
Info
- Publication number
- JPH059274B2 JPH059274B2 JP61309638A JP30963886A JPH059274B2 JP H059274 B2 JPH059274 B2 JP H059274B2 JP 61309638 A JP61309638 A JP 61309638A JP 30963886 A JP30963886 A JP 30963886A JP H059274 B2 JPH059274 B2 JP H059274B2
- Authority
- JP
- Japan
- Prior art keywords
- resin body
- thermosetting resin
- layer
- laser
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 238000010330 laser marking Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 5
- 238000001723 curing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/30—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used using chemical colour formers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Heat Sensitive Colour Forming Recording (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Duplication Or Marking (AREA)
- Details Of Resistors (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は熱硬化性樹脂体へのレーザマーキング
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for laser marking a thermosetting resin body.
従来、樹脂体へのレーザマーキングは主として
粉末材料をトランスフア成形した樹脂体について
行われていた。最近トランスフア成形樹脂体上の
レーザマーキングを修理する場合に既にマーキン
グされた文字を液状の熱硬化成樹脂体にて隠蔽
し、樹脂体を硬化させた後に再度レーザマーキン
グを施すなど液状熱硬化樹脂体を硬化させた樹脂
体にレーザマーキングを施す必要が生じて来た。
しかしながら液状熱硬化性樹脂体を硬化させる過
程で表面近くの硬化剤が蒸発したり吸湿すること
によつて劣化し内部は完全に硬化しても表面近傍
は未硬化の状態のままで、この表面にレーザマー
キングを施すためにレーザ光を照射しても熱によ
つて表面が溶解するのみで鮮明なマーキングは得
られなかつた。
Conventionally, laser marking on resin bodies has mainly been performed on resin bodies formed by transfer molding of powdered materials. Recently, when repairing laser markings on transfer molded resin bodies, the characters that have already been marked are covered up with liquid thermosetting resin, and after the resin body has hardened, laser marking is applied again. It has become necessary to perform laser marking on hardened resin bodies.
However, during the process of curing a liquid thermosetting resin body, the curing agent near the surface evaporates or absorbs moisture and deteriorates, and even if the inside is completely cured, the area near the surface remains uncured. Even if a laser beam was irradiated to apply laser marking to the surface, the surface would only be melted by the heat and clear markings could not be obtained.
〔発明が解決しようとする問題点〕
上述したように、従来の液状の熱硬化性樹脂体
は硬化させる過程で表面近くの硬化剤が蒸発した
り吸湿することによつて劣化し、内部は完全に硬
化しても表面近傍は未硬化の状態のままで、この
表面にレーザ光を照射しても熱によつて表面が溶
解するのみで鮮明なマーキングは得られないとい
う問題点があつた。[Problems to be Solved by the Invention] As mentioned above, conventional liquid thermosetting resin bodies deteriorate due to the curing agent near the surface evaporating or absorbing moisture during the curing process, and the interior is completely damaged. Even after hardening, the vicinity of the surface remains uncured, and even if this surface is irradiated with laser light, the surface will only be melted by heat, resulting in a problem in that a clear marking cannot be obtained.
本発明の目的は、熱硬化性樹脂体の表面にレー
ザ光を照射し鮮明なマーキングを得る熱硬化性樹
脂体へのマーキング方法を提供することにある。 An object of the present invention is to provide a method for marking a thermosetting resin body by irradiating the surface of the thermosetting resin body with laser light to obtain clear markings.
本発明の熱硬化性樹脂体へのマーキング方法
は、液状樹脂を硬化させた樹脂体表面を研磨して
未硬化層を除去する工程と、前記樹脂体の表面に
レーザ光を選択的に照射し変質させてマーキング
する工程とを含んで構成されている。
The method for marking a thermosetting resin body of the present invention includes a step of polishing the surface of the resin body obtained by hardening a liquid resin to remove an uncured layer, and selectively irradiating the surface of the resin body with a laser beam. The method includes a step of altering the quality and marking it.
次に、本発明の実施例を図面を参照して説明す
る。
Next, embodiments of the present invention will be described with reference to the drawings.
第１図ａ〜ｃは本発明の第１の実施例を説明す
るための工程順に示した樹脂体の表面近傍の断面
図である
トランスフア成形樹脂体１表面に黒色液状樹脂
組成物を塗布し硬化させる。黒色の熱硬化性樹脂
体２は、硬化する過程で硬化剤が蒸発したり吸湿
劣化するために生じた未硬化層４と完全に硬化し
た内部の硬化層３により構成されている。表面の
未硬化層４を研磨することにより除去し完全に硬
化した内部の硬化層３を表面に露出する。完全に
硬化した黒色の硬化層３の表面にYAG（イツトリ
ウム・アルミニウム・ガーネツト）レーザマーキ
ング機からレーザ光を照射しマーキングを行う。
黒色の硬化層３はレーザ光の照射により文字に相
当する部分の硬化層３中の顔料が酸化または分解
して白色変質層５に変化する。そのためレーザ光
の照射部と非照射部に良好なコントラスが生じ鮮
明なマークが得られる。 1A to 1C are cross-sectional views near the surface of a resin body shown in the order of steps for explaining the first embodiment of the present invention.A black liquid resin composition is applied to the surface of a transfer molded resin body 1. Let it harden. The black thermosetting resin body 2 is composed of an uncured layer 4 which is formed due to evaporation of the curing agent or deterioration due to moisture absorption during the curing process, and an internal cured layer 3 which is completely cured. The unhardened layer 4 on the surface is removed by polishing, and the completely hardened internal hardened layer 3 is exposed on the surface. The surface of the completely hardened black hardened layer 3 is marked by irradiating laser light from a YAG (yttrium aluminum garnet) laser marking machine.
The black hardened layer 3 changes into a white altered layer 5 by oxidizing or decomposing the pigment in the hardened layer 3 in the portion corresponding to the characters by laser beam irradiation. Therefore, a good contrast is created between the laser beam irradiated area and the non-irradiated area, resulting in a clear mark.
第２図は本発明の第２の実施例を説明するため
の半導体装置の断面図である。 FIG. 2 is a sectional view of a semiconductor device for explaining a second embodiment of the present invention.
半導体素子８を直接熱硬化性樹脂体２で封止す
る。絶縁基板６の表面に金属のアイランド９及び
金属配線７を設け、半導体素子８をアイランド９
に固着し、結線する。そして黒色の熱硬化性樹脂
体２で半導体素子８を封止し熱硬化する。この熱
硬化過程で硬化剤が蒸発したり、吸湿劣化するた
めに生じた未硬化層を研磨除去し硬化層を表面に
露出させ、YAGレーザマーキング機からレーザ
光を照射し白色の変質層５を形成させることによ
り鮮明なマークが得られる。 The semiconductor element 8 is directly sealed with the thermosetting resin body 2. A metal island 9 and metal wiring 7 are provided on the surface of the insulating substrate 6, and the semiconductor element 8 is placed on the island 9.
Attach and connect the wires. Then, the semiconductor element 8 is sealed with the black thermosetting resin body 2 and thermally cured. During this thermal curing process, the uncured layer that is generated due to evaporation of the curing agent or deterioration due to moisture absorption is removed by polishing, the hardened layer is exposed on the surface, and the white altered layer 5 is irradiated with laser light from a YAG laser marking machine. By forming a clear mark, a clear mark can be obtained.
以上説明したように、本発明は、液状樹脂組成
物を硬化させた熱硬化性樹脂体表面の未硬化層を
研磨した後レーザ光を照射してマーキングするこ
とにより、鮮明なマークが得られる。
As explained above, in the present invention, a clear mark can be obtained by polishing the uncured layer on the surface of a thermosetting resin body made of a cured liquid resin composition and then irradiating it with laser light to mark it.
なお、熱硬化性樹脂体の顔料は黒色に限らず色
または黄色とコントラストの良い暗色系の顔料で
あれば同様の効果が得られる。 Incidentally, the pigment of the thermosetting resin body is not limited to black, but the same effect can be obtained as long as it is a dark-colored pigment with good contrast with color or yellow.
第１図ａ〜ｃは本発明の第１の実施例を説明す
るための工程順に示した樹脂体の表面近傍の断面
図、第２図は本発明の第２の実施例を説明するた
めの半導体装置の断面図である。
１……トランスフア成形樹脂体、２……熱硬化
性樹脂体、３……硬化層、４……未硬化層、５…
…変質層、６……絶縁基板、７……金属配線、８
……半導体素子、９……アイランド、１０……ボ
ンデイングワイヤ。
1A to 1C are cross-sectional views near the surface of a resin body shown in the order of steps for explaining the first embodiment of the present invention, and FIG. 2 is a cross-sectional view for explaining the second embodiment of the present invention. FIG. 2 is a cross-sectional view of a semiconductor device. DESCRIPTION OF SYMBOLS 1... Transfer molded resin body, 2... Thermosetting resin body, 3... Cured layer, 4... Uncured layer, 5...
...Altered layer, 6...Insulating substrate, 7...Metal wiring, 8
...Semiconductor element, 9...Island, 10...Bonding wire.
Claims (1)
て未硬化層を除去する工程と、前記樹脂体の表面
にレーザ光を選択的に照射し変質させてマーキン
グする工程とを含むことを特徴とする熱硬化性樹
脂体へのレーザマーキング方法。1. Features include a step of polishing the surface of a resin body made of hardened liquid resin to remove an uncured layer, and a step of selectively irradiating the surface of the resin body with a laser beam to change its quality and mark it. A method of laser marking a thermosetting resin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61309638A JPS63162289A (en) | 1986-12-26 | 1986-12-26 | Laser marking method to thermosetting resin body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61309638A JPS63162289A (en) | 1986-12-26 | 1986-12-26 | Laser marking method to thermosetting resin body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63162289A JPS63162289A (en) | 1988-07-05 |
| JPH059274B2 true JPH059274B2 (en) | 1993-02-04 |
Family
ID=17995447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61309638A Granted JPS63162289A (en) | 1986-12-26 | 1986-12-26 | Laser marking method to thermosetting resin body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162289A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2539839Y2 (en) * | 1991-03-15 | 1997-07-02 | ソニー株式会社 | Molded IC package with marking |
| JPH0817951A (en) * | 1994-06-27 | 1996-01-19 | Nec Corp | Semiconductor device |
| JP2006344994A (en) * | 2006-08-28 | 2006-12-21 | Oki Electric Ind Co Ltd | Manufacturing method of semiconductor device |
-
1986
- 1986-12-26 JP JP61309638A patent/JPS63162289A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63162289A (en) | 1988-07-05 |
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