JPH0590332A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make if possible to ensure the dimensional accuracy necessary for a product part when an inspection part is separated from the product part in after-processes, both parts being formed on a tape carrier. CONSTITUTION:When a film-shaped substrate 2 is stamped on a tape carrier 1, a product part 3 on which a semiconductor element 9 is to be mounted is isolated from an inspection part 4 which branches lead patterns 7 to be connected to the semiconductor element, and the inspection part and the product part are connected to each other with a cut part 5 sandwiched therebetween. Since the product part 3 is separated from the inspection part 4 along this cut part 5, it is possible to ensure a sufficient dimension of a part which requires the dimensional accuracy of the product part 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a product section and an inspection section are provided on one tape carrier.

[0002]

2. Description of the Related Art Conventionally, as electronic devices have become smaller and thinner, higher density semiconductor devices have been required. As a manufacturing method of this semiconductor device, TAB (Tape Automated Bondin
g) There is a method.

This TAB method can (i) supply components mounted with a semiconductor element such as an IC chip in a tape form. (Ii) When mounting a semiconductor element, a plurality of contacts can be connected at one time, leading to a reduction in time. It is widely adopted in each field because of its advantages.

In recent years, semiconductor devices have been downsized, and not only the semiconductor element itself is downsized, but also the pitch of inner leads for bump-connecting the semiconductor element is reduced, and the pattern pitch on the tape carrier is also reduced. As a result of the demand, the inspection after mounting the semiconductor elements has become extremely difficult for high density, and particularly, the inspection work becomes more difficult because the substrate is a film.

Therefore, a product portion and an inspection portion having a size that is easy to inspect to some extent are provided on the tape carrier in advance, and a pattern requiring inspection is branched to this inspection portion to perform inspection after mounting. For the sake of simplicity, a technique has been adopted in which after the inspection is finished, the inspection part is cut and only the product part is used as a substrate.

[0006]

However, since the work of cutting the inspection portion is performed after the semiconductor element is mounted, the dimensional accuracy is extremely poor. That is, in general, a mold is taken from a tape carrier by using a guide hole or the like formed in the tape carrier as a reference, and thus high dimensional accuracy can be obtained. However, a semiconductor element is mounted and incorporated in a device. At the previous stage, the tape carrier has already been die-cut, so there is no guide hole for reference, and even if a jig or the like is used, the dimensional accuracy at the time of cutting cannot be guaranteed.

In a recent semiconductor device in which the packaging density of product parts is high due to miniaturization, unless the dimensional accuracy of the cut portion provided on the substrate is guaranteed, the lead pattern near the cut portion is erroneously cut, or This causes inconveniences such as difficulty in incorporating the semiconductor device in a device designed as a rigid.

The present invention has been made in view of the above circumstances, and even if the inspection part is cut from the product part by post-processing, the necessary dimensional accuracy in the product part can be sufficiently ensured and the product quality can be improved. It is an object of the present invention to provide a semiconductor device that can guarantee the above.

[0009]

In order to achieve the above object, the present invention provides a tape carrier with a product part on which a semiconductor element is mounted via a conductor, and an inspection part which is connected to the product part via a cutting part. In the semiconductor device in which at least a part of the conductor is branched to the inspection part, the cutting part is separated from a part of the product part where the semiconductor element is mounted, and a part protruding laterally of the product part. It is provided.

[0010]

[Operation] In the above configuration, the product part in which the semiconductor element is mounted from the tape carrier via the conductor and the inspection part connected to the product part via the cutting part are die-cut, and then branched to this inspection part. A predetermined inspection is performed on at least a part of the conductor.

After the inspection is completed, the inspection section is cut from the product section by the cutting section.

Since the cutting portion is provided in a portion of the product portion which is separated from the portion where the semiconductor is mounted and which projects to the side of the product portion, the inspection portion is cut within a relatively loose dimensional accuracy. However, this does not adversely affect the semiconductor mounting portion that requires strict dimensional accuracy.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 show a first embodiment of the present invention,
FIG. 1 is a plan view of a semiconductor device provided on a tape carrier,
FIG. 2 is an enlarged view of a main part of FIG.

Reference numeral 1 in the drawing is a tape carrier, and the tape carrier 1 is provided with a roll (not shown) provided in an upward direction by rotationally driving a spool engaged with guide holes 1a formed at predetermined intervals on both sides thereof. It is supplied sequentially from ().

On this tape carrier 1, film substrates 2 are die-cut at predetermined intervals. The film substrate 2 is composed of a product section 3 and an inspection section 4, and the product section 3 and the inspection section 4 are continuously provided via a cutting section 5, and
The product portion 3 and the inspection portion 4 are supported on the tape carrier 1 side via the support portions 6a and 6b.

A plurality of lead patterns 7 are attached to the surface of the film-like substrate 2 on the product part 3 side, and a part of the lead pattern 7 is a device hole formed on one side in the longitudinal direction of the product part 3. The bump connecting portion 7 is extended to 3a.
a is configured.

A semiconductor element 9 such as an IC is set in the device hole 3a from the back side, and the electrode of the semiconductor element 9 is connected to the bump connecting portion 7a through a bump (not shown) by means of thermocompression bonding or the like. Has been done.

The other part of the lead pattern 7 extends from the longitudinal edge of the product part 3 of the film substrate 2 to form another bump connecting part 7b. The electrodes of the solid-state imaging device 10 are connected to the bump connecting portions 7b from the back side of the product portion 3 via the bumps.

Another part of the lead pattern 7 attached to the front side of the product section 3 is extended to the other side in the longitudinal direction to form an external lead connecting section 7c.

Further, a through hole 11 is formed in the external lead connecting portion 7c, and the lead pattern 1 attached to the back side of the film substrate 2 through the through hole 11.
2 is connected to the external lead connecting portion 7c.

The lead pattern 12 is extended toward the inspection portion 4 side of the film substrate 2 to be the inspection pattern 12a.
Is formed.

The disconnecting section 5 connecting the product section 3 and the inspection section 4 is located on one side of the product section 3 away from the mounting position of the semiconductor element 9, that is, the external lead connection in the figure. It is provided on the end face of the protruding portion 5a protruding near the portion 7c.

When the product section 3 is assembled in a rigid-designed device, the semiconductor device 9 and the solid-state image sensor 1 are assembled.
Since the mounting density of 0 is high, the width w is strictly regulated compared to the other portions. On the other hand, the external lead connecting portion 7c on which no electronic component is mounted has a relatively small dimension, the cutting portion 5 has a low dimensional accuracy, and the bending stress at the time of cutting affects the lead pattern of the product portion 3 and the like. It is provided at a position that does not reach the above, that is, at a position apart from the component mounting position, and at a position that projects laterally.

Further, the protrusion 5 having the cut portion 5 on the end surface
In a, a fixing hole 5b is formed which is mounted and fixed to a pin or the like (not shown) in the device when assembled.

(Operation) Next, the operation of the embodiment having the above-mentioned structure will be described.

First, the procedure of manufacturing the semiconductor device will be described. The tape carrier 1 is sequentially rolled from a roll (not shown) via spools (not shown) which engage with guide holes 1a formed on both sides of the tape carrier 1. Send out. Then, a film-shaped substrate 2 is formed on the tape carrier 1 thus fed out by die cutting.

After that, the lead patterns 7 and 12 are attached to the film substrate 2 and the through holes 11 are formed.

Next, the semiconductor device 9 and the solid-state image pickup device 10
Each electrode of the bump pattern 7a of the lead pattern 7
7b is connected in a predetermined manner via bumps and wired.

After electronic components are mounted on the film substrate 2 in a predetermined manner, the film substrate 2 is supported by the guide portion 1a formed in the tape carrier 1.
Separate from a and 6b.

After the film substrate 2 separated from the tape carrier 1 is subjected to other necessary processing, the inspection unit 4 of the film substrate 2 inspects the product unit 3. When the predetermined inspection is completed, the product section 3 to the inspection section 4
Are cut at the cutting portion 5 to complete the semiconductor component.

By the way, when the film substrate 2 is separated from the supporting portions 6a and 6b of the tape carrier 1, the guide hole 1a is used as a reference position, so that the film substrate 2 can be cut accurately. On the other hand, when the inspection unit 4 is separated from the product unit 3 of the film substrate 2, components are mounted on the product unit 3, the reference hole cannot be set, and even if a jig or the like is used, the accuracy is high. You cannot cut it.

In this embodiment, the cutting portion 5 is a portion separated from the semiconductor element 9 and the solid-state image pickup element 10, that is,
Since the dimensional accuracy is relatively low, the required dimensional accuracy of the product portion 3 after cutting can be ensured. Also,
Since the cutting portion 5 is the end surface of the protrusion 5a, the lead pattern 7 of the product portion 3 is not accidentally cut. Furthermore, bending stress is not applied to the lead pattern 7 in the vicinity at the time of cutting.

(Second Embodiment) FIG. 3 shows a second embodiment of the present invention, where (a) is a plan view of a film substrate in which a product section and an inspection section are connected, and (b) is a product. It is a top view of the film-like board | substrate in the state which cut | disconnected the inspection part from the part.

In this embodiment, the projecting portion 5a is formed when the inspection portion 4 is cut from the product portion 3 of the film-like substrate 2, and other configurations, operations and effects are the same as those of the first embodiment. Same as the example.

(Third Embodiment) FIG. 4 and subsequent drawings show a third embodiment of the present invention. FIG. 4 is a development view of a film substrate, FIG. 5 is a side view of a completed semiconductor device, and FIG. Plan view, FIG.
5 is a bottom view of FIG. 5, FIG. 8 shows a base member, (a) is a side view, (b) is a bottom view, and (c) is a right side view.

As shown in FIG. 4, the product portion 3 of the film substrate 2 on which the components in the first embodiment described above are mounted in a predetermined manner is elongated and has a bent portion 2a at substantially the center thereof, and one end thereof is provided. A device hole 3a for mounting the semiconductor element 9 is formed on the side of the portion, and a land 7d for mounting the capacitor 21 is formed on the other end side. This film-like substrate 2 is used by folding it back in a U-shape centering on the bent portion 2a, and is arranged so that the semiconductor element 9 mounted in the device hole 3a and the capacitor 21 mounted in the land 7d face each other. It is installed (see Figure 5). In the figure, each lead pattern 7, 7a
7d are hatched.

The midpoints of the ground-side bump connecting portions 7a exposed to the device holes 3a pass over the landless through holes 3b formed in the film substrate 2, respectively. This landless through hole 3b
Are provided corresponding to the respective ground side bump connecting portions 7a. By selectively cutting and opening the bump connecting portions 7a exposed from the landless through holes 3b, variations in the characteristics of the fixed image pickup device 10 can be achieved. Set the correction value to correct.

Since each landless through hole 3b is formed corresponding to each lead pattern 7, the other lead patterns 7 are not accidentally cut, and only the necessary lead patterns 7 are accurately cut. can do.

The landless through holes 3b may be landless side through holes.

Further, as shown in FIG. 5, a base member 22 is interposed between the facing surfaces of the film substrate 2 in a state where electronic components are mounted and folded back in a predetermined manner. As shown in FIG. 8, the base member 22 is formed of an insulating resin or the like as a material, and the escape portion 22 for escaping the semiconductor element 9 and the capacitor 21 mounted on the film substrate 2 is provided.
a and 22b are formed, and a positioning step portion 22c for hooking the end surface of the film substrate 2 is formed on the lower part of the front surface.

Further, a receiving surface 22d for abutting the center of the bent portion 2a of the film substrate 2 on the rear portion of the base member 22 and a contact surface 22 for abutting both ends of the bent portion 2a.
e is formed, and the bent portion 2a is formed on the receiving surface 2
It is bent in a U-shape along 2d and the contact surface 22e, and is fixed via an adhesive or the like.

A color filter 23 is mounted on the front surface of the solid-state image pickup device 10 connected to the bump connection portion 7b of the film substrate 2. Further, reference numeral 24 is a binding portion of the signal line and the power supply line.

In this embodiment, the end surface of the film substrate 2 is brought into contact with the step portion 22c of the base member 22, and the bottom surface of the base member 22 is brought into contact with the bottom portion of the base member 22 in sequence toward the rear. Bottom side contact surface 2 of the base member 22
The end portion side below the bent portion 2a of the film substrate 2 is fixed to 2e with an adhesive or the like. Next, a receiving surface 22d in which the central portion of the bent portion 2a is provided on the back surface of the base member 22.
Bend adhesive etc. to the side.

Thereafter, the upper end side of the bent portion 2a is bent to the upper contact surface 22e of the base member 22,
The solid-state imaging device 10 fixed by an adhesive or the like and connected to the tip side of the film substrate 2 is exposed to the front surface of the base member 22.

As described above, the base member 22 also serves as a positioning jig when the film substrate 2 is bent, so that it is easy to assemble. Moreover, since the base member 22 serves as a reinforcing material for the film substrate 2, the strength is increased. Furthermore, since the whole film-shaped substrate 2 can be configured, it is possible to realize downsizing and thinning.

Further, since the bent portion 2a is located away from the semiconductor element 9, the solid-state image pickup device 10 and the capacitor 21, the bump connecting portions 7a and 7b do not break when bent.

[0048]

As described above, according to the present invention,
Since the cutting portion that connects the product portion and the inspection portion is provided at the portion of the product portion that is separated from the portion on which the semiconductor is mounted and that projects to the side of the product portion, the inspection portion is formed from the product portion by post-processing. Even if it is cut, the dimensional accuracy required in this product part can be sufficiently ensured, and the excellent quality of the product can be guaranteed.

[Brief description of drawings]

1 and 2 show a first embodiment of the present invention, and FIG. 1 is a plan view of a semiconductor device provided on a tape carrier.

FIG. 2 is an enlarged view of a main part of FIG.

3A and 3B show a second embodiment of the present invention, FIG. 3A is a plan view of a film substrate in which a product unit and an inspection unit are connected, and FIG. 3B is a view in which the inspection unit is separated from the product unit. Plan view of the film-like substrate

4 shows the third embodiment of the present invention, and FIG. 4 shows a development view of a film substrate.

FIG. 5 is a side view of the completed semiconductor device.

6 is a plan view of FIG.

7 is a bottom view of FIG.

FIG. 8 shows a base member, (a) is a side view, (b) is a bottom view, and (c) is a right side view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Tape carrier 3 ... Product part 4 ... Inspection part 5 ... Cutting part 5a ... Projection 7a ... Conductor 9 ... Semiconductor element A ... Semiconductor device

Claims (1)

[Claims] 1. A tape carrier is provided with a product part on which a semiconductor element is mounted via a conductor and an inspection part continuous with the product part via a cut part, and at least a part of the conductor is branched to the inspection part. In the semiconductor device described above, the cutting portion is provided in a portion of the product portion that is separated from a portion on which the semiconductor element is mounted and that projects laterally of the product portion.