JPH0588892B2 - - Google Patents
Info
- Publication number
- JPH0588892B2 JPH0588892B2 JP63128659A JP12865988A JPH0588892B2 JP H0588892 B2 JPH0588892 B2 JP H0588892B2 JP 63128659 A JP63128659 A JP 63128659A JP 12865988 A JP12865988 A JP 12865988A JP H0588892 B2 JPH0588892 B2 JP H0588892B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- epoxy resin
- resin
- group
- modified polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 19
- 239000009719 polyimide resin Substances 0.000 claims description 19
- 229920003986 novolac Polymers 0.000 claims description 10
- 239000002841 Lewis acid Substances 0.000 claims description 7
- -1 Lewis acid compound Chemical class 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 239000002966 varnish Substances 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052794 bromium Inorganic materials 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 150000001491 aromatic compounds Chemical class 0.000 description 6
- 125000005462 imide group Chemical group 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
本発明はエポキシ変性ポリイミド樹脂を用いた
電気絶縁用積層板に関する。
The present invention relates to an electrically insulating laminate using an epoxy-modified polyimide resin.
従来よりポリイミド樹脂は、耐熱性ポリマーと
して汎用されているが、溶媒可溶性及び溶融成形
性を向上させるために耐熱性が犠牲にされてい
る。又、ポリイミド樹脂は吸水率が高いという欠
点もある。このためポリイミド樹脂にエポキシ樹
脂を配合させて耐熱性を向上させると共に吸水率
の低下も図られているが、耐熱性が向上し、吸水
率も低下するものの、密着力及び難燃性が低下し
てしまい、多層積層板とか電子部品封止用材料と
しては採用できないものであつた。
そこで、本発明者等はエポキシ樹脂の配合量を
増す代わりに、エポキシ樹脂とポリイミド樹脂を
つなぐ働きをする成分を配合すれば樹脂間の密着
力が高まることを見出した。即ち、分子内にイミ
ド基とアミノ基を各々複数個有する芳香族系化合
物にエポキシ樹脂を反応させて得られるエポキシ
変性ポリイミド樹脂を開発しており、この樹脂に
よれば層間密着力及び耐湿性の向上がもたらされ
る。
Polyimide resins have conventionally been widely used as heat-resistant polymers, but heat resistance has been sacrificed in order to improve solvent solubility and melt moldability. Additionally, polyimide resin has a drawback of high water absorption. For this reason, attempts have been made to improve heat resistance and reduce water absorption by blending epoxy resin with polyimide resin, but although heat resistance is improved and water absorption is reduced, adhesion and flame retardancy are reduced. Therefore, it could not be used as a multilayer laminate or a material for encapsulating electronic components. Therefore, the present inventors have found that instead of increasing the amount of epoxy resin blended, if a component that functions to connect the epoxy resin and polyimide resin is blended, the adhesion between the resins can be increased. Specifically, we have developed an epoxy-modified polyimide resin obtained by reacting an epoxy resin with an aromatic compound having multiple imide groups and amino groups in the molecule, and this resin has excellent interlayer adhesion and moisture resistance. Improvements are brought about.
しかしながら、分子内にイミド基とアミノ基を
各々複数個有する芳香族系化合物とエポキシ樹脂
の二種の物質を反応させるだけでは、未反応のイ
ミド基が残留して、高温に長期間さらされると、
ミクロなクラツクが生じ、耐電圧特性が劣化する
など耐熱性に悪影響を与えてしまつている。
本発明は上記事情に鑑みて為されたものであ
り、その目的とするところは耐熱性に優れ、密着
力が強く、しかも吸水率が低く、難燃性に優れた
電気絶縁用積層板を提供することにある。
However, if only two substances, an aromatic compound and an epoxy resin, each having a plurality of imide groups and amino groups in the molecule, are reacted, unreacted imide groups will remain, and if exposed to high temperatures for a long period of time, ,
Microcracks occur, which adversely affects heat resistance, such as deterioration of withstand voltage characteristics. The present invention was made in view of the above circumstances, and its purpose is to provide a laminate for electrical insulation that has excellent heat resistance, strong adhesion, low water absorption, and excellent flame retardancy. It's about doing.
本発明の電気絶縁用積層板は、一般式 The electrical insulating laminate of the present invention has the general formula
【化】
（式中、Ｘは末端官能基を表し、Ar1、Ar2は
２価の芳香族基、R1は水素原子、炭素数１〜10
のアルキル基、R2は水素原子、炭素数１〜20の
アルキル基、アルコキシ基あるいは水酸基を表
し、ｍは０又は正の整数を示す）で表される分子
内にイミド基を複数個有する芳香族系化合物に、
一般式[Chemical formula] (In the formula, X represents a terminal functional group, Ar 1 and Ar 2 are divalent aromatic groups, R 1 is a hydrogen atom, and has a carbon number of 1 to 10
an alkyl group, R2 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group, or a hydroxyl group, and m represents 0 or a positive integer). For group-based compounds,
general formula
【化】
（式中、ｒは正の整数）
で表されるブロム化エポキシ樹脂を含むエポキシ
樹脂をルイス酸化合物としてフエノールノボラツ
ク又はクレゾールノボラツクの存在下で反応させ
てエポキシ変性ポリイミド樹脂を調製し、このエ
ポキシ変性ポリイミド樹脂のワニスを基材に含浸
させ、乾燥させてプリプレグを形成し、このプリ
プレグを複数枚積層成形して成るものであり、こ
の構成により上記課題が解決されたものである。
本発明における分子内にイミド基を複数個有す
る芳香族系化合物としては、例えば、特開昭62−
29584号公報に開示されているようにEpoxy-modified polyimide resin is prepared by reacting an epoxy resin containing a brominated epoxy resin represented by [formula] (where r is a positive integer) as a Lewis acid compound in the presence of phenol novolak or cresol novolak. However, this epoxy-modified polyimide resin varnish is impregnated into a base material, dried to form a prepreg, and multiple sheets of this prepreg are laminated and molded, and this structure solves the above problems. . In the present invention, aromatic compounds having a plurality of imide groups in the molecule include, for example, JP-A-62-
As disclosed in Publication No. 29584
【化】
（式中、Ｘは末端官能基を表し、Ar1、Ar2は
２価の芳香族基、R1は水素原子、炭素数１〜10
のアルキル基、R2は水素原子、炭素数１〜20の
アルキル基、アルコキシ基あるいは水酸基を表
し、ｍは０又は正の整数を示す）
で表される末端官能型イミド樹脂である。
又、本発明においてエポキシ樹脂に含有させる
ブロム化エポキシ樹脂としては一般式[Chemical formula] (In the formula, X represents a terminal functional group, Ar 1 and Ar 2 are divalent aromatic groups, R 1 is a hydrogen atom, and has a carbon number of 1 to 10
R2 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group, or a hydroxyl group, and m represents 0 or a positive integer). In addition, in the present invention, the brominated epoxy resin contained in the epoxy resin has the general formula
【化】
（式中、ｒは正の整数）
で表されるブロム化ノボラツクエポキシ樹脂であ
る。
このブロム化エポキシ樹脂に含まれる臭素は全
樹脂分に対して６〜20重量％の範囲にあるのが好
ましい。６重量％未満であると、充分な難燃性を
確保できず、一方20重量％を超えると耐熱性が低
下する傾向にある。
エポキシ樹脂成分は芳香族化合物に対して重量
比で３：１〜６の範囲で使用される。この範囲を
逸脱してエポキシリツチの場合は、吸水率が低下
し、密着性は向上するが耐熱性が低下してしまう
ものである。
硬化剤として作用するルイス酸化合物としては
式、It is a brominated novolak epoxy resin represented by the following formula (where r is a positive integer). The bromine contained in this brominated epoxy resin is preferably in the range of 6 to 20% by weight based on the total resin content. If it is less than 6% by weight, sufficient flame retardancy cannot be ensured, while if it exceeds 20% by weight, heat resistance tends to decrease. The epoxy resin component is used in a weight ratio of 3:1 to 6 to the aromatic compound. If the epoxy content is outside this range, the water absorption rate will decrease, and although the adhesion will improve, the heat resistance will decrease. The Lewis acid compound that acts as a curing agent has the formula:
【化】 （式中、ｓは正の整数） であらわされるフエノールノボラツクや式、[ka] (In the formula, s is a positive integer) The phenol novolak or formula represented by
【化】
（式中、ｒは正の整数）
で表されるクレゾールノボラツクである。このル
イス酸化合物は芳香族化合物に対して好ましくは
重量比で１〜４：10の範囲で使用される。ルイス
酸化合物の量がこの範囲よりも多くなると、耐熱
性が低下し吸水率が高くなる傾向にある。これら
芳香族化合物、エポキシ樹脂成分及びルイス酸化
合物は混合され、100℃以下で反応させてエポキ
シ変性ポリイミド樹脂が製造される。このように
ルイス酸化合物の存在下で反応させることにより
エポキシ樹脂とアミノ基の反応率を高めることが
でき、未反応のアミノ基の残留を抑制して層間密
着性に優れたエポキシ変性ポリイミド樹脂が得ら
れるのである。
このエポキシ変性ポリイミド樹脂ワニスにガラ
ス布、不織布、紙などの基材が含浸され、乾燥さ
れてプリプレグが製造される。このプリプレグが
複数枚積層成形され、その片面又は両面に銅箔、
アルミニウム箔などの金属箔が貼着されて金属箔
張り積層板が製造される。
又、このエポキシ変性ポリイミド樹脂に硬化
剤、シリカ等の充填剤、ガラス繊維、カツプリン
グ剤、着色剤、ステアリン酸カルシウム等の離型
剤、希釈剤などが添加されて電子部品封止用材料
が製造される。この封止用材料の配合割合として
は、例えばエポキシ変性ポリイミド樹脂30重量
部、シリカ70重量部、離型剤0.05重量部である。
次に本発明の実施例を具体的に説明する。以下
において部とあるのは重量部を示す。
（実施例）
末端官能型イミド樹脂（商品名「TMS−20」、
住友化学(株)製）236部、エポキシ樹脂成分として
液状エポキシ樹脂（商品名「Ｒ−140Q」、三井化
学(株)製）162部とブロム化ノボラツク樹脂（臭素
含有量36重量％、商品名「BREN（Ｍ−80）」、日
本化薬(株)製）175部、オルソクレゾールノボラツ
ク（商品名「Ｄ−５」、東都化成(株)製）56部を混
合し、常温下、30分かけて反応させてエポキシ変
性ポリイミド樹脂を製造した。このもののTgは
220℃であつた。未反応のイミド基は殆ど存在し
なかつた。
このエポキシ変性ポリイミド樹脂ワニスをガラ
ス布に含浸させ、乾燥させてプリプレグを製造し
た。
このプリプレグを複数枚積層成形して厚み0.4
mmの積層板を製造した。
この積層板の層間密着力、吸水率（５cm×５cm
で厚み0.4mmの試料片を23℃の水中に24時間浸
漬）、長期耐熱性（200℃、24hr）、難燃性（UL
94 Ｖ−０）を測定した。結果を第１表に示す。
（比較例 １）
イミド樹脂成分として実施例と同一の末端官能
型イミド樹脂426部、エポキシ樹脂成分として実
施例と同一の液状エポキシ樹脂231部と実施例と
同一のブロム化ノボラツク樹脂259部を混合し、
常温下、30分かけて反応させてエポキシ変性ポリ
イミド樹脂を製造した。このもののTgは230℃で
あつた。
次いで、実施例と同様にして積層板を製造し、
同様の測定を行つた。結果を第１表に示す。
（比較例 ２）
Tgが250℃のポリイミミド樹脂ワニスを使用し
た以外は実施例と同様にして積層板を製造し、同
様の測定を行つた。結果を第１表に示す。
（比較例 ３）
Tgが150℃のエポキシ樹脂ワニスを使用した以
外は実施例と同様にして積層板を製造し、同様の
測定を行つた。結果を第１表に示す。It is a cresol novolak represented by the following formula (where r is a positive integer). The Lewis acid compound is preferably used in a weight ratio of 1 to 4:10 to the aromatic compound. When the amount of Lewis acid compound exceeds this range, heat resistance tends to decrease and water absorption rate tends to increase. These aromatic compounds, epoxy resin components, and Lewis acid compounds are mixed and reacted at 100° C. or lower to produce an epoxy-modified polyimide resin. By reacting in the presence of a Lewis acid compound, the reaction rate between the epoxy resin and amino groups can be increased, suppressing the residual unreacted amino groups and producing epoxy-modified polyimide resins with excellent interlayer adhesion. You can get it. A base material such as glass cloth, nonwoven fabric, or paper is impregnated with this epoxy-modified polyimide resin varnish and dried to produce a prepreg. Multiple sheets of this prepreg are laminated and molded, with copper foil on one or both sides.
A metal foil-clad laminate is manufactured by pasting a metal foil such as aluminum foil. In addition, a curing agent, a filler such as silica, glass fiber, a coupling agent, a coloring agent, a mold release agent such as calcium stearate, a diluent, etc. are added to this epoxy modified polyimide resin to produce a material for encapsulating electronic components. Ru. The blending ratio of this sealing material is, for example, 30 parts by weight of epoxy-modified polyimide resin, 70 parts by weight of silica, and 0.05 parts by weight of mold release agent. Next, embodiments of the present invention will be specifically described. In the following, parts indicate parts by weight. (Example) Terminal functional imide resin (product name "TMS-20",
Sumitomo Chemical Co., Ltd.) 236 parts, liquid epoxy resin (product name "R-140Q", Mitsui Chemicals Co., Ltd.) 162 parts and brominated novolac resin (bromine content 36% by weight, product name) as epoxy resin components. 175 parts of "BREN (M-80)", manufactured by Nippon Kayaku Co., Ltd., and 56 parts of orthocresol novolac (trade name "D-5", manufactured by Toto Kasei Co., Ltd.) were mixed, and the mixture was heated for 30 minutes at room temperature. Epoxy-modified polyimide resin was produced by reacting over several minutes. The Tg of this thing is
It was 220℃. Almost no unreacted imide groups were present. Glass cloth was impregnated with this epoxy-modified polyimide resin varnish and dried to produce a prepreg. This prepreg is laminated and molded to a thickness of 0.4
mm laminates were produced. The interlayer adhesion and water absorption rate of this laminate (5cm x 5cm
), long-term heat resistance (200℃, 24hr), flame retardancy (UL
94 V-0) was measured. The results are shown in Table 1. (Comparative Example 1) 426 parts of the same terminal functional imide resin as in the example as the imide resin component, 231 parts of the same liquid epoxy resin as in the example as the epoxy resin component, and 259 parts of the same brominated novolac resin as in the example were mixed. death,
An epoxy-modified polyimide resin was produced by reacting at room temperature for 30 minutes. The Tg of this product was 230°C. Next, a laminate was manufactured in the same manner as in the example,
Similar measurements were made. The results are shown in Table 1. (Comparative Example 2) A laminate was manufactured in the same manner as in the example except that a polyimide resin varnish having a Tg of 250°C was used, and the same measurements were performed. The results are shown in Table 1. (Comparative Example 3) A laminate was manufactured in the same manner as in the example except that an epoxy resin varnish having a Tg of 150° C. was used, and the same measurements were performed. The results are shown in Table 1.
【表】
長期耐熱性 ○ × ○ ×
難燃性 ○ ○ × ○
[Table] Long-term heat resistance ○ × ○ ×
Flame retardant ○ ○ × ○
Claims (1)
２価の芳香族基、R1は水素原子、炭素数１〜10
のアルキル基、R2は水素原子、炭素数１〜20の
アルキル基、アルコキシ基あるいは水酸基を表
し、ｍは０又は正の整数を示す）で表される分子
内にイミド基を複数個有する芳香族系化合物に、
一般式 【化】 （式中、ｒは正の整数）で表されるブロム化エ
ポキシ樹脂を含むエポキシ樹脂をルイス酸化合物
としてフエノールノボラツク又はクレゾールノボ
ラツクの存在下で反応させてエポキシ変性ポリイ
ミド樹脂を調製し、このエポキシ変性ポリイミド
樹脂のワニスを基材に含浸させ、乾燥させてプリ
プレグを形成し、このプリプレグを複数枚積層成
形して成ることを特徴とする電気絶縁用積層板。 ２ ブロム化エポキシ樹脂に含まれる臭素が全樹
脂分に対して６〜20重量％であることを特徴とす
る請求項１記載の電気絶縁用積層板。[Claims] 1 General formula: (wherein, X represents a terminal functional group, Ar 1 and Ar 2 are divalent aromatic groups, R 1 is a hydrogen atom, and has 1 to 10 carbon atoms)
an alkyl group, R2 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group, or a hydroxyl group, and m represents 0 or a positive integer). For group-based compounds,
An epoxy resin containing a brominated epoxy resin represented by the general formula [formula] (where r is a positive integer) is reacted as a Lewis acid compound in the presence of phenol novolak or cresol novolak to produce an epoxy-modified polyimide resin. A laminate for electrical insulation, characterized in that a base material is impregnated with a varnish of this epoxy-modified polyimide resin, dried to form a prepreg, and a plurality of prepregs are laminated and molded. 2. The electrically insulating laminate according to claim 1, wherein the bromine contained in the brominated epoxy resin is 6 to 20% by weight based on the total resin content.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865988A JPH01103632A (en) | 1987-07-06 | 1988-05-26 | Electrical insulating laminated plate and sealing material for electronic component |
| JP4054075A JPH0795481B2 (en) | 1988-05-26 | 1992-03-13 | Electronic component encapsulation material |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-168219 | 1987-07-06 | ||
| JP16821987 | 1987-07-06 | ||
| JP12865988A JPH01103632A (en) | 1987-07-06 | 1988-05-26 | Electrical insulating laminated plate and sealing material for electronic component |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4054075A Division JPH0795481B2 (en) | 1988-05-26 | 1992-03-13 | Electronic component encapsulation material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103632A JPH01103632A (en) | 1989-04-20 |
| JPH0588892B2 true JPH0588892B2 (en) | 1993-12-24 |
Family
ID=26464268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12865988A Granted JPH01103632A (en) | 1987-07-06 | 1988-05-26 | Electrical insulating laminated plate and sealing material for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01103632A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU760838B2 (en) | 1999-04-30 | 2003-05-22 | Kawasaki Jukogyo Kabushiki Kaisha | Powder and granular material feeding device for closed system |
| JP6818123B2 (en) * | 2016-08-08 | 2021-01-20 | エルジー・ケム・リミテッド | Polymerizable composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650934A (en) * | 1979-10-04 | 1981-05-08 | Mitsubishi Electric Corp | Heat-resistant prepreg |
| JPS579011A (en) * | 1980-06-18 | 1982-01-18 | Mitsubishi Electric Corp | Refractory prepreg insulator |
| JPS60210640A (en) * | 1984-10-05 | 1985-10-23 | Hitachi Chem Co Ltd | Production of laminated sheet |
-
1988
- 1988-05-26 JP JP12865988A patent/JPH01103632A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650934A (en) * | 1979-10-04 | 1981-05-08 | Mitsubishi Electric Corp | Heat-resistant prepreg |
| JPS579011A (en) * | 1980-06-18 | 1982-01-18 | Mitsubishi Electric Corp | Refractory prepreg insulator |
| JPS60210640A (en) * | 1984-10-05 | 1985-10-23 | Hitachi Chem Co Ltd | Production of laminated sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01103632A (en) | 1989-04-20 |
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