JPH0587985B2 - - Google Patents

Info

Publication number
JPH0587985B2
JPH0587985B2 JP2155567A JP15556790A JPH0587985B2 JP H0587985 B2 JPH0587985 B2 JP H0587985B2 JP 2155567 A JP2155567 A JP 2155567A JP 15556790 A JP15556790 A JP 15556790A JP H0587985 B2 JPH0587985 B2 JP H0587985B2
Authority
JP
Japan
Prior art keywords
chip
piston
refrigerant
circuit module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2155567A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330458A (ja
Inventor
Maachin Kuraisuraa Guregorii
Chaoofuan Chu Richaado
Edowaado Saimonzu Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH0330458A publication Critical patent/JPH0330458A/ja
Publication of JPH0587985B2 publication Critical patent/JPH0587985B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/73—
    • H10W40/774—
    • H10W40/776—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2155567A 1989-06-15 1990-06-15 チツプ冷却用回路モジユール Granted JPH0330458A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/366,945 US4928207A (en) 1989-06-15 1989-06-15 Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston
US366945 1994-12-29

Publications (2)

Publication Number Publication Date
JPH0330458A JPH0330458A (ja) 1991-02-08
JPH0587985B2 true JPH0587985B2 (cg-RX-API-DMAC10.html) 1993-12-20

Family

ID=23445278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2155567A Granted JPH0330458A (ja) 1989-06-15 1990-06-15 チツプ冷却用回路モジユール

Country Status (4)

Country Link
US (1) US4928207A (cg-RX-API-DMAC10.html)
EP (1) EP0402614B1 (cg-RX-API-DMAC10.html)
JP (1) JPH0330458A (cg-RX-API-DMAC10.html)
DE (1) DE69014420T2 (cg-RX-API-DMAC10.html)

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US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
FR2664684A1 (fr) * 1990-07-10 1992-01-17 Metal Process Dispositif de controle de la temperature d'une piece par contacts multiples.
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
JPH05141831A (ja) * 1991-11-15 1993-06-08 Nec Corp 液体冷媒循環量制御構造
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
US5241131A (en) * 1992-04-14 1993-08-31 International Business Machines Corporation Erosion/corrosion resistant diaphragm
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5412536A (en) * 1994-03-28 1995-05-02 International Business Machines Corporation Local condensation control for liquid impingement two-phase cooling
US5463872A (en) * 1994-09-08 1995-11-07 International Business Machines Corporation High performance thermal interface for low temperature electronic modules
US5916259A (en) * 1995-09-20 1999-06-29 Sun Microsystems, Inc. Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
US6244056B1 (en) 1995-09-20 2001-06-12 Sun Microsystems, Inc. Controlled production of ammonia and other gases
CN1196788A (zh) * 1995-09-20 1998-10-21 Fmc有限公司 吸收剂对制冷系统
US5873258A (en) * 1995-09-20 1999-02-23 Sun Microsystems, Inc Sorption refrigeration appliance
US5855119A (en) 1995-09-20 1999-01-05 Sun Microsystems, Inc. Method and apparatus for cooling electrical components
US5842356A (en) * 1995-09-20 1998-12-01 Sun Microsystems, Inc. Electromagnetic wave-activated sorption refrigeration system
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
JP4141613B2 (ja) * 2000-03-09 2008-08-27 富士通株式会社 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器
US7003979B1 (en) 2000-03-13 2006-02-28 Sun Microsystems, Inc. Method and apparatus for making a sorber
US7267357B2 (en) * 2001-02-15 2007-09-11 Miller Sports International, Inc. Multi-function binding system
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
JP3847691B2 (ja) * 2002-09-26 2006-11-22 三菱電機株式会社 電力用半導体装置
US6943444B2 (en) 2003-10-30 2005-09-13 International Business Machines Corporation Cooling of surface temperature of a device
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US20060169438A1 (en) * 2005-01-28 2006-08-03 Malone Christopher G Thermally conductive cover directly attached to heat producing component
US7264041B2 (en) * 2005-06-14 2007-09-04 International Business Machines Corporation Compliant thermal interface structure with vapor chamber
EP1892810B1 (de) * 2006-08-25 2011-05-18 Abb Research Ltd. Kühleinrichtung für ein elektrisches Betriebsmittel
US7567090B2 (en) * 2006-10-23 2009-07-28 International Business Machines Corporation Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
CN101252089B (zh) * 2008-03-20 2010-10-06 上海交通大学 利用微汽泡喷射沸腾冷却微电子芯片的方法
TWI559843B (zh) 2008-04-21 2016-11-21 液體冷卻解決方案股份有限公司 用於電子裝置液體浸沒冷卻之陣列連接式殼體及機架系統
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8964384B2 (en) * 2012-07-27 2015-02-24 Hewlett-Packard Development Company, L.P. Component cooling
US9096079B2 (en) * 2012-10-11 2015-08-04 Eastman Kodak Company Dryer impinging heating liquid onto moistened medium
US20170321966A1 (en) * 2014-12-03 2017-11-09 Ge Intelligent Platforms, Inc. Combined energy dissipation apparatus and method
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN109755199B (zh) * 2019-02-20 2020-11-06 合肥工业大学 一种微小通道射流散热器
US10964625B2 (en) 2019-02-26 2021-03-30 Google Llc Device and method for direct liquid cooling via metal channels
JP7195542B2 (ja) * 2019-04-05 2022-12-26 富士電機株式会社 冷却器、半導体モジュール
WO2020257923A1 (en) * 2019-06-27 2020-12-30 Hypertechnologie Ciara Inc. Microgap system for cooling electronics with direct contact
CN113257759A (zh) * 2020-02-10 2021-08-13 华为技术有限公司 散热器、单板、电子设备及制造方法
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US12302497B2 (en) 2020-03-11 2025-05-13 Peter C. Salmon Densely packed electronic systems
US11769710B2 (en) * 2020-03-27 2023-09-26 Xilinx, Inc. Heterogeneous integration module comprising thermal management apparatus
US20220015262A1 (en) * 2020-07-09 2022-01-13 Intel Corporation Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US11776876B2 (en) * 2021-01-25 2023-10-03 International Business Machines Corporation Distributing heatsink load across a processor module with separable input/output (I/O) connectors
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US12376254B2 (en) 2022-02-25 2025-07-29 Peter C. Salmon Water cooled server
US12136576B1 (en) 2023-06-22 2024-11-05 Peter C. Salmon Microelectronic module
US12469754B2 (en) 2023-09-07 2025-11-11 Peter C. Salmon Hermetic microelectronic module using a sheath
WO2025107255A1 (en) * 2023-11-23 2025-05-30 Xilinx, Inc. Thermo-mechanical device for computing system
US12255122B1 (en) 2023-12-13 2025-03-18 Peter C. Salmon Water-cooled electronic system

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JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
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US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US4765397A (en) * 1986-11-28 1988-08-23 International Business Machines Corp. Immersion cooled circuit module with improved fins

Also Published As

Publication number Publication date
DE69014420D1 (de) 1995-01-12
DE69014420T2 (de) 1995-05-24
EP0402614A1 (en) 1990-12-19
US4928207A (en) 1990-05-22
EP0402614B1 (en) 1994-11-30
JPH0330458A (ja) 1991-02-08

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